KR20180055668A - 전자 부품 실장 시스템 및 전자 부품 실장 방법 - Google Patents

전자 부품 실장 시스템 및 전자 부품 실장 방법 Download PDF

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Publication number
KR20180055668A
KR20180055668A KR1020170059909A KR20170059909A KR20180055668A KR 20180055668 A KR20180055668 A KR 20180055668A KR 1020170059909 A KR1020170059909 A KR 1020170059909A KR 20170059909 A KR20170059909 A KR 20170059909A KR 20180055668 A KR20180055668 A KR 20180055668A
Authority
KR
South Korea
Prior art keywords
substrate
printing
electronic component
screen mask
group
Prior art date
Application number
KR1020170059909A
Other languages
English (en)
Korean (ko)
Inventor
히데노리 오타
Original Assignee
한화에어로스페이스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한화에어로스페이스 주식회사 filed Critical 한화에어로스페이스 주식회사
Priority to CN201810133397.XA priority Critical patent/CN108882553A/zh
Publication of KR20180055668A publication Critical patent/KR20180055668A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020170059909A 2016-11-17 2017-05-15 전자 부품 실장 시스템 및 전자 부품 실장 방법 KR20180055668A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810133397.XA CN108882553A (zh) 2016-11-17 2018-02-09 电子部件贴装系统及电子部件贴装方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-224371 2016-11-17
JP2016224371A JP2018082095A (ja) 2016-11-17 2016-11-17 電子部品実装システム及び電子部品実装方法

Publications (1)

Publication Number Publication Date
KR20180055668A true KR20180055668A (ko) 2018-05-25

Family

ID=62199039

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170059909A KR20180055668A (ko) 2016-11-17 2017-05-15 전자 부품 실장 시스템 및 전자 부품 실장 방법

Country Status (3)

Country Link
JP (1) JP2018082095A (zh)
KR (1) KR20180055668A (zh)
CN (1) CN108882553A (zh)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3656542B2 (ja) * 2000-10-25 2005-06-08 松下電器産業株式会社 電子部品実装システムおよび電子部品実装方法
JP5679399B2 (ja) * 2008-11-25 2015-03-04 富士機械製造株式会社 スクリーン印刷機および印刷ユニット
JP2010177253A (ja) * 2009-01-27 2010-08-12 Shinko Electric Ind Co Ltd はんだボール搭載方法
JP5954959B2 (ja) * 2011-11-09 2016-07-20 富士機械製造株式会社 印刷機
JP6074656B2 (ja) * 2012-12-03 2017-02-08 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置における印刷部材のセット正否判定システムおよび印刷部材のセット正否判定方法
JP6114922B2 (ja) * 2013-12-27 2017-04-19 パナソニックＩｐマネジメント株式会社 スクリーン印刷機
JP6785404B2 (ja) * 2016-06-23 2020-11-18 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置及び部品実装ライン

Also Published As

Publication number Publication date
CN108882553A (zh) 2018-11-23
JP2018082095A (ja) 2018-05-24

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