KR20170103689A - 플라즈마 프로세싱 시스템들을 위한 고순도 sp3 결합들을 가진 화학적 기상 증착 (cvd) 다이아몬드 코팅을 포함한 에지 링들과 같은 컴포넌트들 - Google Patents
플라즈마 프로세싱 시스템들을 위한 고순도 sp3 결합들을 가진 화학적 기상 증착 (cvd) 다이아몬드 코팅을 포함한 에지 링들과 같은 컴포넌트들 Download PDFInfo
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- KR20170103689A KR20170103689A KR1020170027531A KR20170027531A KR20170103689A KR 20170103689 A KR20170103689 A KR 20170103689A KR 1020170027531 A KR1020170027531 A KR 1020170027531A KR 20170027531 A KR20170027531 A KR 20170027531A KR 20170103689 A KR20170103689 A KR 20170103689A
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- diamond coating
- plasma
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
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- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220029212A KR102556603B1 (ko) | 2016-03-03 | 2022-03-08 | 플라즈마 프로세싱 시스템들을 위한 고순도 sp3 결합들을 가진 화학적 기상 증착 (cvd) 다이아몬드 코팅을 포함한 에지 링들과 같은 컴포넌트들 |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662303091P | 2016-03-03 | 2016-03-03 | |
| US62/303,091 | 2016-03-03 | ||
| US201662310993P | 2016-03-21 | 2016-03-21 | |
| US62/310,993 | 2016-03-21 | ||
| US15/428,744 US11008655B2 (en) | 2016-03-03 | 2017-02-09 | Components such as edge rings including chemical vapor deposition (CVD) diamond coating with high purity SP3 bonds for plasma processing systems |
| US15/428,744 | 2017-02-09 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020220029212A Division KR102556603B1 (ko) | 2016-03-03 | 2022-03-08 | 플라즈마 프로세싱 시스템들을 위한 고순도 sp3 결합들을 가진 화학적 기상 증착 (cvd) 다이아몬드 코팅을 포함한 에지 링들과 같은 컴포넌트들 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20170103689A true KR20170103689A (ko) | 2017-09-13 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020170027531A Ceased KR20170103689A (ko) | 2016-03-03 | 2017-03-03 | 플라즈마 프로세싱 시스템들을 위한 고순도 sp3 결합들을 가진 화학적 기상 증착 (cvd) 다이아몬드 코팅을 포함한 에지 링들과 같은 컴포넌트들 |
| KR1020220029212A Active KR102556603B1 (ko) | 2016-03-03 | 2022-03-08 | 플라즈마 프로세싱 시스템들을 위한 고순도 sp3 결합들을 가진 화학적 기상 증착 (cvd) 다이아몬드 코팅을 포함한 에지 링들과 같은 컴포넌트들 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020220029212A Active KR102556603B1 (ko) | 2016-03-03 | 2022-03-08 | 플라즈마 프로세싱 시스템들을 위한 고순도 sp3 결합들을 가진 화학적 기상 증착 (cvd) 다이아몬드 코팅을 포함한 에지 링들과 같은 컴포넌트들 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11008655B2 (enExample) |
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| KR20210038993A (ko) * | 2018-08-28 | 2021-04-08 | 램 리써치 코포레이션 | 연장된 수명을 갖는 한정 링 |
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| US10784091B2 (en) * | 2017-09-29 | 2020-09-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Process and related device for removing by-product on semiconductor processing chamber sidewalls |
| US11538713B2 (en) * | 2017-12-05 | 2022-12-27 | Lam Research Corporation | System and method for edge ring wear compensation |
| CN109994351B (zh) * | 2018-01-02 | 2021-07-13 | 台湾积体电路制造股份有限公司 | 离子布植机及离子布植机腔室的制造方法 |
| CN111819679A (zh) | 2018-03-13 | 2020-10-23 | 应用材料公司 | 具有等离子体喷涂涂层的支撑环 |
| KR102305539B1 (ko) * | 2019-04-16 | 2021-09-27 | 주식회사 티씨케이 | SiC 엣지 링 |
| JP7412923B2 (ja) * | 2019-08-23 | 2024-01-15 | 東京エレクトロン株式会社 | エッジリング、プラズマ処理装置及びエッジリングの製造方法 |
| CN112899662A (zh) * | 2019-12-04 | 2021-06-04 | 江苏菲沃泰纳米科技股份有限公司 | Dlc制备装置和制备方法 |
| CN112853482B (zh) * | 2020-12-31 | 2022-09-27 | 武汉大学深圳研究院 | 一种微波等离子体-磁控溅射复合气相沉积原位制备100面金刚石的方法及设备 |
| CN114318287B (zh) * | 2021-12-23 | 2023-11-03 | 深圳技术大学 | 金刚石自支撑膜的制备方法和金刚石自支撑膜 |
| US12354842B2 (en) | 2023-01-19 | 2025-07-08 | Tokyo Electron Limited | In-situ focus ring coating |
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| US5190823A (en) * | 1989-07-31 | 1993-03-02 | General Electric Company | Method for improving adhesion of synthetic diamond coatings to substrates |
| US5167714A (en) * | 1989-09-29 | 1992-12-01 | Nordson Corporation | Powder coating system with configurable controller and dew point detection |
| US5952060A (en) * | 1996-06-14 | 1999-09-14 | Applied Materials, Inc. | Use of carbon-based films in extending the lifetime of substrate processing system components |
| US6508911B1 (en) * | 1999-08-16 | 2003-01-21 | Applied Materials Inc. | Diamond coated parts in a plasma reactor |
| US6605352B1 (en) * | 2000-01-06 | 2003-08-12 | Saint-Gobain Ceramics & Plastics, Inc. | Corrosion and erosion resistant thin film diamond coating and applications therefor |
| US6537429B2 (en) * | 2000-12-29 | 2003-03-25 | Lam Research Corporation | Diamond coatings on reactor wall and method of manufacturing thereof |
| JP4028274B2 (ja) * | 2002-03-26 | 2007-12-26 | 住友大阪セメント株式会社 | 耐食性材料 |
| US7247348B2 (en) * | 2004-02-25 | 2007-07-24 | Honeywell International, Inc. | Method for manufacturing a erosion preventative diamond-like coating for a turbine engine compressor blade |
| EP1719801A4 (en) * | 2004-02-26 | 2008-09-24 | Daikin Ind Ltd | ELASTOMERIC FLUORINE COMPOSITION |
| US7658802B2 (en) * | 2005-11-22 | 2010-02-09 | Applied Materials, Inc. | Apparatus and a method for cleaning a dielectric film |
| GB2449388B (en) * | 2006-03-06 | 2011-08-17 | Diamond Innovations Inc | Prosthesis for joint replacement |
| US20090029067A1 (en) * | 2007-06-28 | 2009-01-29 | Sciamanna Steven F | Method for producing amorphous carbon coatings on external surfaces using diamondoid precursors |
| US7629031B2 (en) * | 2007-07-13 | 2009-12-08 | Sub-One Technology, Inc. | Plasma enhanced bonding for improving adhesion and corrosion resistance of deposited films |
| JP2009123795A (ja) * | 2007-11-13 | 2009-06-04 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法及び基板処理装置 |
| DE102010054875B4 (de) * | 2010-12-17 | 2012-10-31 | Eagleburgmann Germany Gmbh & Co. Kg | Reibungsarmer Gleitring mit kostengünstiger Diamantbeschichtung |
| US9059678B2 (en) | 2011-04-28 | 2015-06-16 | Lam Research Corporation | TCCT match circuit for plasma etch chambers |
| US10242848B2 (en) * | 2014-12-12 | 2019-03-26 | Lam Research Corporation | Carrier ring structure and chamber systems including the same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210038993A (ko) * | 2018-08-28 | 2021-04-08 | 램 리써치 코포레이션 | 연장된 수명을 갖는 한정 링 |
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| TWI737686B (zh) | 2021-09-01 |
| CN113506719A (zh) | 2021-10-15 |
| CN113506719B (zh) | 2024-06-04 |
| TW202217038A (zh) | 2022-05-01 |
| KR102556603B1 (ko) | 2023-07-17 |
| KR20220036924A (ko) | 2022-03-23 |
| TW201800596A (zh) | 2018-01-01 |
| JP2017166065A (ja) | 2017-09-21 |
| CN107393797B (zh) | 2021-06-08 |
| US20170253974A1 (en) | 2017-09-07 |
| US11008655B2 (en) | 2021-05-18 |
| TWI793701B (zh) | 2023-02-21 |
| CN107393797A (zh) | 2017-11-24 |
| SG10201701713TA (en) | 2017-10-30 |
| SG10202008553TA (en) | 2020-10-29 |
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