KR20170101504A - Method for aligning substrate using electrostatic chuck - Google Patents
Method for aligning substrate using electrostatic chuck Download PDFInfo
- Publication number
- KR20170101504A KR20170101504A KR1020160024096A KR20160024096A KR20170101504A KR 20170101504 A KR20170101504 A KR 20170101504A KR 1020160024096 A KR1020160024096 A KR 1020160024096A KR 20160024096 A KR20160024096 A KR 20160024096A KR 20170101504 A KR20170101504 A KR 20170101504A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- electrostatic chuck
- attaching
- mask
- unit
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 251
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000003825 pressing Methods 0.000 claims description 17
- 238000001816 cooling Methods 0.000 description 8
- 230000008020 evaporation Effects 0.000 description 8
- 238000001704 evaporation Methods 0.000 description 8
- 238000000151 deposition Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000007665 sagging Methods 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
- H01L21/447—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428 involving the application of pressure, e.g. thermo-compression bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
The present invention relates to a method for aligning a substrate using an electrostatic chuck.
2. Description of the Related Art Flat panel displays such as a liquid crystal display (LCD), a plasma display panel (PDP) and an organic light emitting diode (OLED) are widely used as display devices have. Such a flat panel display device is manufactured through a series of processes such as a deposition process for depositing a metal thin film or an organic thin film in a predetermined pattern on a glass substrate.
The deposition of a metal thin film or an organic thin film can be performed by a vacuum thermal deposition method. In the vacuum thermal deposition method, a substrate is placed in a vacuum chamber, a mask and a substrate having a predetermined pattern are aligned and adhered, And heat is applied to the evaporation source containing the material to evaporate the evaporation material sublimated in the evaporation source onto the substrate.
Therefore, the step of aligning the substrate and the mask is a cornerstone in the subsequent deposition process, and therefore, it is very important to improve the accuracy.
However, in order to deposit a metal thin film or an organic thin film on a glass substrate, both ends of the glass substrate must be supported so as to expose the deposition surface of the glass substrate. Recently, as the flat panel display device has become larger, the glass substrate becomes larger, There is a problem that an error may occur in the alignment process between the substrate and the mask, thereby reducing the accuracy of the deposition and lowering the yield of the organic light emitting device.
The present invention relates to a substrate using an electrostatic chuck capable of increasing alignment accuracy by attaching a substrate to an electrostatic chuck in a state in which a substrate is raised with respect to sag occurring when a substrate is loaded, Lt; / RTI >
According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: loading the substrate into a substrate holder such that both ends of the substrate are respectively supported; Providing a upwardly directed chamber in the substrate; Attaching the substrate to the electrostatic chuck by lowering the electrostatic chuck on the substrate; Aligning the substrate and the mask of the electrostatic chuck; A method for aligning a substrate using an electrostatic chuck, comprising the step of cementing the substrate and the mask.
The substrate holder includes: a support point for supporting both ends of the substrate so that both ends of the substrate protrude outward; Wherein the step of applying upward pressure to the substrate may include pressing the pressure unit so that the pressure unit presses both ends of the substrate, Desc /
The support point may include a wedge-shaped camber point having an upward oblique surface from the end of the substrate toward the center.
The step of attaching the substrate to the electrostatic chuck may include a step of raising the pressing unit after the electrostatic chuck is lowered.
The step of attaching the substrate to the electrostatic chuck may be performed such that the electrostatic chuck is sequentially attached in the outward direction at the center of the substrate.
The electrostatic chuck may include a plurality of unit electrostatic chuck modules arranged in a lattice pattern. In this case, the step of attaching the substrate to the electrostatic chuck may include sequentially forming the unit electrostatic chuck The chuck module may be turned on.
The electrostatic chuck may include a plurality of unit electrostatic chuck modules arranged correspondingly from one end to the other end of the substrate, and the step of attaching the substrate to the electrostatic chuck includes: The unit electrostatic chucking module may be sequentially turned on.
The step of attaching the substrate and the mask may be performed by lowering a magnet plate that provides a magnetic force onto a plate positioned on the substrate, and attaching the magnet plate and the mask.
The step of providing the substrate with upward upward may include applying a load to the substrate upwardly from a lower portion of the substrate.
The step of applying a load to the substrate may be performed by applying a load to a dummy area of the substrate.
According to the embodiment of the present invention, it is possible to increase the alignment accuracy by aligning the substrate and the mask by attaching the substrate to the electrostatic chuck in a state in which the substrate is raised while giving upward camber against the deflection generated when the substrate is loaded .
1 is a flow chart of a method of aligning a substrate using an electrostatic chuck according to an embodiment of the present invention.
FIGS. 2 to 6 are flowcharts for explaining a substrate aligning method using an electrostatic chuck according to an embodiment of the present invention. FIG.
7 is a view for explaining a process of attaching an electrostatic chuck and a substrate according to an embodiment of the present invention.
6 is a view showing an electrostatic chuck used in a substrate aligning method using an electrostatic chuck according to an embodiment of the present invention.
9 is a view showing a modified example of the electrostatic chuck of Fig.
10 and 11 are diagrams for explaining a substrate aligning method using an electrostatic chuck according to an embodiment of the present invention, which is applied to another example of substrate deflection.
12 to 14 are diagrams for explaining a substrate aligning method using an electrostatic chuck according to another embodiment of the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
Hereinafter, a method for aligning a substrate using an electrostatic chuck according to the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same or corresponding components are denoted by the same reference numerals A duplicate description thereof will be omitted.
FIG. 1 is a flowchart of a substrate aligning method using an electrostatic chuck according to an embodiment of the present invention. FIGS. 2 to 6 are flowcharts for explaining a substrate aligning method using an electrostatic chuck according to an embodiment of the present invention. to be. 7 is a view for explaining an attaching process of an electrostatic chuck and a substrate according to an embodiment of the present invention. FIG. 6 is a view showing an electrostatic chuck used in a method of aligning a substrate using an electrostatic chuck according to an embodiment of the present invention, and FIG. 9 is a view showing a modification of the correction chuck shown in FIG.
2 to 9, a
The method for aligning a substrate using an electrostatic chuck according to the present embodiment includes the steps of loading a
Before describing a method of aligning a substrate using an electrostatic chuck, a deposition apparatus will be described first. The deposition apparatus includes a vacuum chamber (not shown) in which the interior is kept in a vacuum state, a
Hereinafter, a method of aligning a substrate using the electrostatic chuck according to the present embodiment will be described in detail with reference to FIGS. 2 to 6. FIG.
First, as shown in FIG. 2, the
The
Next, as shown in FIG. 3, a chamber S 'is given upwardly to the substrate 10 (S200). The
A load must be applied so as to generate a negative moment on the
2, when the
When the distance between the fulcrums 18 is short, a bulge S 'may occur in a convex shape as shown in Fig. 3 due to the pressing of the
The supporting point 18 may include a wedge shaped
3, the
Next, as shown in FIG. 4, the
The
The
For example, when the
In this embodiment, the
5, when the central portion of the
Next, the
Next, as shown in Fig. 6, the
As described above, since the alignment of the
7 is a view for explaining an attaching process of the
The
8 shows an
9 is a modification of the
10 and 11 are views for explaining a substrate aligning method using an electrostatic chuck according to an embodiment of the present invention, which is applied to another example of deflection of the
As described above, when the distance between the fulcrums 18 is short, it may occur in a convex shape as shown in Fig. 3 due to the pressing of the
11, when the
12 to 14 are views for explaining a substrate aligning method using an electrostatic chuck according to another embodiment of the present invention. 12 to 14 show a
This embodiment applies a load to the
The lower surface of the
12, when the
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the appended claims. And changes may be made without departing from the spirit and scope of the invention.
10: substrate 12: substrate holder
14: substrate supporting part 16: pressing unit
18: Support point 20:
22: Camber point 24: Electrostatic chuck
26: cooling plate 28: magnet plate
30: mask 32: mask holder
34: unit electrostatic chuck module 36: deflection compensation section
38: Support rod
Claims (10)
Providing a upwardly directed chamber in the substrate;
Attaching the substrate to the electrostatic chuck by lowering the electrostatic chuck on the substrate;
Aligning the substrate and the mask of the electrostatic chuck;
And bonding the substrate and the mask. ≪ RTI ID = 0.0 > 11. < / RTI >
Wherein the substrate holder comprises:
A support point for supporting both ends of the substrate so that both ends of the substrate protrude outward;
And a pressing unit that presses both ends of the substrate at an upper portion of the substrate,
The step of imparting an upward upwardly-
And lowering the pressing unit such that the pressing unit presses both ends of the substrate, respectively.
The support point
And a wedge-shaped camber point having an upward oblique surface from the end of the substrate toward the center thereof.
Wherein the step of attaching the substrate to the electrostatic chuck comprises:
And raising the pressure unit after the electrostatic chuck is lowered. ≪ RTI ID = 0.0 > 11. < / RTI >
Wherein the step of attaching the substrate to the electrostatic chuck comprises:
Wherein the electrostatic chuck is carried out to be sequentially attached outwardly from a central portion of the substrate.
Wherein the electrostatic chuck comprises:
And a plurality of unit electrostatic chuck modules arranged in a lattice,
Wherein the step of attaching the substrate to the electrostatic chuck comprises:
And the unit electrostatic chuck module is sequentially turned on from a central portion of the electrostatic chuck to an outward direction.
Wherein the electrostatic chuck comprises:
And a plurality of unit electrostatic chuck modules arranged correspondingly from one end to the other end of the substrate,
Wherein the step of attaching the substrate to the electrostatic chuck comprises:
And the unit electrostatic chuck module is sequentially turned on from a central portion of the electrostatic chuck to an outward direction.
Wherein the step of attaching the substrate and the mask comprises:
And lowering a magnet plate that provides a magnetic force to a plate located on an upper portion of the substrate, and attaching the magnet plate to the mask.
The step of imparting an upward upwardly-
And applying a load to the substrate upwardly from a lower portion of the substrate.
The step of applying a load to the substrate may include:
And performing a load on the dummy area of the substrate by applying a load to the dummy area of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160024096A KR101853889B1 (en) | 2016-02-29 | 2016-02-29 | Method for aligning substrate using electrostatic chuck |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160024096A KR101853889B1 (en) | 2016-02-29 | 2016-02-29 | Method for aligning substrate using electrostatic chuck |
Publications (2)
Publication Number | Publication Date |
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KR20170101504A true KR20170101504A (en) | 2017-09-06 |
KR101853889B1 KR101853889B1 (en) | 2018-05-02 |
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KR1020160024096A KR101853889B1 (en) | 2016-02-29 | 2016-02-29 | Method for aligning substrate using electrostatic chuck |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101954539B1 (en) * | 2017-11-29 | 2019-03-05 | 캐논 톡키 가부시키가이샤 | Film forming apparatus, film forming method and manufacturing method of organic el display device using the same |
JP2019117924A (en) * | 2017-12-27 | 2019-07-18 | キヤノントッキ株式会社 | Electrostatic chuck, film forming apparatus, substrate suction method, film forming method, and manufacturing method of electronic device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4553124B2 (en) * | 2004-12-16 | 2010-09-29 | 株式会社日立ハイテクノロジーズ | Vacuum deposition method and EL display panel |
JP4510609B2 (en) * | 2004-12-21 | 2010-07-28 | 株式会社アルバック | Substrate and mask alignment method, organic thin film deposition method, and alignment apparatus |
JP2012252296A (en) * | 2011-06-07 | 2012-12-20 | Hitachi High-Technologies Corp | Proximity exposure apparatus, method for applying exposure light of proximity exposure apparatus, and method for manufacturing display panel substrate |
-
2016
- 2016-02-29 KR KR1020160024096A patent/KR101853889B1/en active IP Right Grant
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101954539B1 (en) * | 2017-11-29 | 2019-03-05 | 캐논 톡키 가부시키가이샤 | Film forming apparatus, film forming method and manufacturing method of organic el display device using the same |
CN109837505A (en) * | 2017-11-29 | 2019-06-04 | 佳能特机株式会社 | The manufacturing method of film formation device, film build method and organic EL display device |
JP2019099914A (en) * | 2017-11-29 | 2019-06-24 | キヤノントッキ株式会社 | Film deposition device, film deposition method and production method of organic el display device using the same |
CN109837505B (en) * | 2017-11-29 | 2022-03-29 | 佳能特机株式会社 | Film forming apparatus, film forming method, and method for manufacturing organic EL display device |
JP2019117924A (en) * | 2017-12-27 | 2019-07-18 | キヤノントッキ株式会社 | Electrostatic chuck, film forming apparatus, substrate suction method, film forming method, and manufacturing method of electronic device |
Also Published As
Publication number | Publication date |
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KR101853889B1 (en) | 2018-05-02 |
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