JP2012252296A - Proximity exposure apparatus, method for applying exposure light of proximity exposure apparatus, and method for manufacturing display panel substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve parallelism of exposure light to be applied to a mask and improve the exposure accuracy by suppressing flexure of a top board of a negative pressure chamber and correcting the parallelism of the exposure light by a plane mirror in a condition close to that at a time of the exposure.SOLUTION: Before a mask 2 is retained on the lower part of an opening of a mask holder 20, while pushing from top portions of a top board 21 protruding from wall parts 20b, by a first pressing force with a plurality of pressing devices 23, the position of a retainer 62a is adjusted by an adjuster of each of support mechanisms 60 of a plane mirror support device 50, a position where a support member 61 supports the back face of a second plane mirror 38 is changed, and the parallelism of the light reflected by the second plane mirror 38 is corrected. The mask 2 is retained on the lower part of the opening of the mask holder 20 to form a negative pressure chamber 20c between the top board 21 and the mask 2. When the air in the negative pressure chamber 20c is removed, the plurality of pressing devices 23 press the portions of the top board 21 protruding from the wall parts 20b by a second pressing force that is larger than the first pressing force.

Description

  The present invention relates to a proximity exposure apparatus that exposes a substrate using a proximity method in manufacturing a display panel substrate such as a liquid crystal display device, an exposure light irradiation method for the proximity exposure apparatus, and a display using the same. The present invention relates to a method of manufacturing a panel substrate, and in particular, a negative pressure chamber is provided above the mask, and the negative beam is applied to the negative pressure chamber to suppress the deflection of the mask, and the light that has been made into a parallel light beam using a concave mirror is reflected by a plane mirror. The present invention relates to a proximity exposure apparatus that reflects and irradiates a mask, an exposure light irradiation method of the proximity exposure apparatus, and a method of manufacturing a display panel substrate using them.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  The proximity exposure apparatus includes a chuck that supports a substrate, a mask holder that holds a mask, and an exposure light irradiation device that irradiates exposure light, and includes a mask held by the mask holder and a substrate supported by the chuck. Exposure is performed very close. In proximity exposure equipment, in order to stably support and hold a large substrate and mask, exposure is generally performed by horizontally supporting the substrate. The mask is vacuum-adsorbed at the periphery by a mask holder. Then, the substrate is held facing the substrate above the substrate. Therefore, the mask is bent due to its own weight. In particular, the larger the substrate with a larger display panel, the larger the mask and the greater the deflection due to its own weight. When the mask is bent, the pattern is not baked uniformly on the substrate.

  2. Description of the Related Art Conventionally, as described in Patent Document 1, for example, a method of suppressing the deflection of a mask has been performed by providing a negative pressure chamber above a mask and applying a negative pressure to the negative pressure chamber. The negative pressure chamber includes a mask, a mask holder, and a transparent top plate such as a quartz glass plate provided above an opening through which exposure light from the mask holder passes.

JP 2003-131388 A

  In the proximity method, the mask pattern is transferred to the substrate on a one-to-one basis, and the same size exposure is performed. Therefore, the exposure light irradiation device of the proximity exposure device is provided with an optical component for converting the exposure light into a parallel light beam. ing. Conventionally, collimation lens groups and concave mirrors are known as optical components for creating a parallel light beam. As the exposure area increases with the increase in screen size of the display panel, these optical components also increase in size, but the collimation lens group becomes expensive when it is particularly large, so the proximity that mainly exposes large substrates is used. In the exposure apparatus, a concave mirror is often used. The light that has been made into a parallel beam by the concave mirror is reflected by the plane mirror and applied to the mask.

  A plane mirror used in an exposure light irradiation apparatus of a proximity exposure apparatus is configured by depositing a reflective film made of aluminum or the like on the surface of a glass material made of soda glass or the like. In order to efficiently arrange a light source such as a lamp, a lens group such as a fly-eye lens that uniformizes the illuminance of exposure light, a concave mirror, and other optical components in a plane mirror in the exposure light irradiation device, It is often installed in an upright position rather than horizontally. Therefore, the plane mirror is distorted by its own weight, and unless the distortion is corrected, the exposure light is distorted and the exposure accuracy is lowered.

  Further, when the exposure light having a parallel light beam is created using a concave mirror, the light reflected by the concave mirror does not become an ideal parallel light and includes spherical aberration and coma aberration components. Therefore, when the exposure light is reflected by the plane mirror and applied to the mask, it is necessary to correct the parallelism of the exposure light by the plane mirror.

  In a proximity exposure apparatus that provides a negative pressure chamber above the mask, even when no negative pressure is applied to the negative pressure chamber, the top plate of the negative pressure chamber deflects downward due to its own weight, and negative pressure is applied to the negative pressure chamber. The top plate of the negative pressure chamber bends further downward due to negative pressure. When the top plate of the negative pressure chamber bends, there is a problem that when exposure light irradiated from the exposure light irradiation device passes through the top plate, the parallelism of the exposure light is reduced and the exposure accuracy is reduced.

  Conventionally, the adjustment of the plane mirror has been performed by detecting a shift in the position of light irradiated from the plane mirror. At this time, in a state where the mask is mounted on the mask holder, a part of the light irradiated from the plane mirror is blocked by the mask pattern, and the positional deviation of the light irradiated from the plane mirror can be detected at a desired location. Can not. Therefore, the adjustment of the plane mirror has been performed in a state where only the top plate of the negative pressure chamber is mounted on the mask holder or in a state where the top plate and mask of the negative pressure chamber are not mounted on the mask holder. In a state where only the top plate of the negative pressure chamber is mounted on the mask holder, the negative pressure chamber is not formed, and therefore the amount of deflection of the top plate differs from that during exposure in which negative pressure is applied to the negative pressure chamber. In addition, when the top plate and the mask of the negative pressure chamber are not attached to the mask holder, the light reflected by one point of the plane mirror is irradiated when the light reflected by the plane mirror is not completely parallel. Is different from that during exposure passing through the top plate and mask of the negative pressure chamber. For this reason, it has been impossible to correct the parallelism of the exposure light by the plane mirror under the same conditions as during exposure.

  The conventional flat mirror support device has a frame for fixing the outer peripheral portion of the flat mirror and a plurality of adjustment screws attached to the back surface of the flat mirror, and a plurality of adjustments with the outer peripheral portion of the flat mirror fixed to the frame. The back surface of the plane mirror was pushed and pulled with a screw to correct the distortion of the plane mirror. However, since the outer peripheral portion of the plane mirror is fixed to the frame, it is difficult to correct the distortion with high accuracy near the fixed outer peripheral portion. In addition, when the back surface of the plane mirror is pushed and pulled with a plurality of adjusting screws, excessive stress is applied to the portion fixed to the frame, and the plane mirror may be broken and damaged from the portion fixed to the frame.

  The object of the present invention is to suppress the deflection of the top plate of the negative pressure chamber and correct the parallelism of the exposure light by a plane mirror under conditions close to the time of exposure, thereby increasing the parallelism of the exposure light irradiated to the mask, It is to improve the exposure accuracy. Another object of the present invention is to accurately correct distortion over the entire surface of the plane mirror. Furthermore, an object of the present invention is to prevent the flat mirror from being damaged due to excessive stress when the distortion of the flat mirror is corrected. Furthermore, an object of the present invention is to manufacture a high-quality display panel substrate.

  The proximity exposure apparatus of the present invention includes a chuck that supports a substrate, a mask holder that holds a mask, and an exposure light irradiation device that includes a light source and a concave mirror that converts light generated from the light source into parallel light bundles, and a mask. In a proximity exposure apparatus in which a minute gap is provided between the substrate and the mask is irradiated with exposure light of a parallel light beam from the exposure light irradiation apparatus, and the mask pattern is transferred to the substrate, the exposure light irradiation apparatus is a concave mirror. A plane mirror that reflects and irradiates the mask with light that has been collimated by a parallel beam, and a plane mirror support device that supports the plane mirror. The plane mirror support device can rotate the support member that supports the back surface of the plane mirror, and the support member. A plurality of support mechanisms each having a holding tool and an adjusting tool that adjusts the position of the holding tool in a direction perpendicular to the surface of the plane mirror. Adjust the position of the holder of the holding mechanism, change the position where the support member of each support mechanism supports the back surface of the plane mirror, correct the parallelism of the light reflected by the plane mirror, the mask holder, the exposure light An opening that passes through, a wall portion that is continuously arranged around the periphery of the opening, a transparent top plate that is larger than the wall portion mounted on the wall portion, and a portion that protrudes from the wall portion of the top plate from above A plurality of pressing devices for pressing, holding a mask below the opening, forming a negative pressure chamber between the top plate and the mask, and a plurality of pressing devices for the mask holder holding the mask by the mask holder Before the plane mirror support device corrects the parallelism of the light reflected by the plane mirror, the portion that protrudes from the wall of the top plate with the first pressure is pushed from above, and the mask holder holds the mask and negatively When the air in the pressure chamber is evacuated, the second pressurization is greater than the first pressurizing force. In those pressing the protruded portion from the wall of the top plate from above.

  Further, the exposure light irradiation method of the proximity exposure apparatus of the present invention includes a chuck that supports a substrate, a mask holder that holds a mask, and a light source and a concave mirror that converts light generated from the light source into parallel light flux. Proximity exposure equipment exposure that includes a device, provides a minute gap between the mask and the substrate, irradiates the mask with exposure light of a parallel beam from the exposure light irradiation device, and transfers the mask pattern to the substrate In the light irradiation method, the exposure light irradiation device is provided with a plane mirror that reflects the light collimated by the concave mirror and irradiates the mask, and a plane mirror support device that supports the plane mirror. A plurality of support machines, comprising: a support member that supports the back surface of the support member; a holder that rotatably supports the support member; and an adjustment tool that adjusts the position of the holder in a direction perpendicular to the surface of the plane mirror. An opening through which exposure light passes, a wall portion arranged continuously around the entire periphery of the opening, a transparent top plate larger than the wall portion mounted on the wall portion, and a top plate And a plurality of pressing devices for pressing the portion protruding from the wall portion from above, and holding the mask below the opening of the mask holder, the plurality of pressing devices of the mask holder allows the mask holder to be applied with the first pressure force. The position of the holder of each support mechanism is adjusted by the adjuster of each support mechanism of the plane mirror support device while pushing the part protruding from the wall of the top plate from above, and the support member of each support mechanism is the back surface of the plane mirror The position to support is changed, the parallelism of the light reflected by the plane mirror is corrected, the mask is held below the opening of the mask holder, and the negative pressure chamber is placed between the top plate of the mask holder and the mask. When forming and evacuating the negative pressure chamber, mask The plurality of pressing device holder, in which pressing the portion where protruding from the wall of the top plate of the mask holder with a large second pressure than the first pressure from above.

  When the plane mirror support device corrects the parallelism of the light reflected by the plane mirror, the top plate whose portion protruding from the wall portion is pushed from above with the first pressure force is bent upward so that the center portion is raised. The force to bend upwards and the force to bend downwards by its own weight are balanced, and the deflection is suppressed. When the air in the negative pressure chamber is extracted, the top plate pushed from above with a second pressure greater than the first pressure at the part protruding from the wall tries to bend upward so that the center is raised. The force to bend upward and the force to be pulled downward by the negative pressure in the negative pressure chamber are balanced to suppress the deflection. The pressure applied to push the part protruding from the wall of the top plate from above is increased when the air in the negative pressure chamber is extracted rather than when correcting the parallelism of the exposure light. In the exposure, the change in the deflection of the top plate of the negative pressure chamber is reduced, and the parallelism of the exposure light is corrected by the plane mirror under the conditions close to the exposure.

  Furthermore, the plane mirror support device that supports the plane mirror includes a support member that supports the back surface of the plane mirror, a holder that rotatably supports the support member, and an adjustment tool that adjusts the position of the holder in a direction perpendicular to the surface of the plane mirror. Since the position of the support member of each support mechanism supports the back surface of the plane mirror is changed by adjusting the position of the support tool of each support mechanism with the adjustment tool of each support mechanism. Distortion can be accurately corrected over the entire surface of the plane mirror. In addition, since the support member is rotatably held by the holder, when the position of the holder is adjusted, an excessive stress is not applied to a portion where the support member supports the back surface of the plane mirror, and the plane mirror is prevented from being damaged.

  Furthermore, in the proximity exposure apparatus of the present invention, each support mechanism of the plane mirror support apparatus is arranged at the positions of the apexes of a plurality of equilateral triangles arranged adjacent to each other. Moreover, the exposure light irradiation method of the proximity exposure apparatus of this invention arrange | positions each support mechanism of a plane mirror support apparatus in the position of the vertex of several equilateral triangles located adjacent. The plane mirrors can be supported in a smooth curved surface by the support mechanisms arranged at the positions of the apexes of a plurality of adjacent equilateral triangles arranged adjacent to each other, and the correction of the parallelism of the exposure light is effectively performed.

  Furthermore, in the proximity exposure apparatus of the present invention, the holder of each support mechanism of the plane mirror support device passes the light reflected by the plane mirror through a pinhole provided in a measurement jig having the same material and thickness as the mask. The light is received at a plurality of positions by the image acquisition device, and the position in the direction perpendicular to the surface of the plane mirror is adjusted by the adjusting tool of each support mechanism based on the shift of the position of the received light. Also, the exposure light irradiation method of the proximity exposure apparatus of the present invention allows light reflected by a plane mirror to pass through pinholes provided in a measurement jig having the same material and thickness as the mask at a plurality of locations by an image acquisition device. Based on the shift of the position of the received light, the position in the direction perpendicular to the surface of the plane mirror of the holder of each support mechanism is adjusted by the adjuster of each support mechanism.

  Since the light reflected by the plane mirror is received through a pinhole provided in a measuring jig of the same material and thickness as the mask, the positional deviation of the light reflected by the plane mirror is detected under conditions close to the time of exposure. Correction of the parallelism of the exposure light is performed with high accuracy.

  Alternatively, in the proximity exposure apparatus of the present invention, the holder of each support mechanism of the plane mirror support apparatus irradiates the plane mirror from a plurality of locations on the chuck side through the measurement jig having the same material and thickness as the mask. The laser beam reflected by the plane mirror is received by the measuring device, and the position in the direction perpendicular to the surface of the plane mirror is adjusted by the adjustment tool of each support mechanism based on the positional deviation of the received laser beam. is there. Further, the exposure light irradiation method of the proximity exposure apparatus of the present invention irradiates a laser beam from a plurality of locations on the chuck side through a measuring jig having the same material and thickness as the mask, and is reflected by the plane mirror. Light is received by a measuring instrument, and the position in the direction perpendicular to the surface of the plane mirror of the holder of each support mechanism is adjusted by the adjuster of each support mechanism based on the positional deviation of the received laser light. .

  As the light source of the exposure light irradiation device, a discharge type lamp in which a high-pressure gas is enclosed in a bulb, such as a mercury lamp, a halogen lamp, a xenon lamp, etc., is used. It takes time for the illuminance to stabilize, and the generated light has a high illuminance and a large amount of heat. Laser light is emitted from a plurality of locations on the chuck side to the plane mirror, the laser beam reflected by the plane mirror is received by the measuring instrument, and each support mechanism adjuster is used to adjust the position of the received laser beam. Since the position of the support mechanism holder in the direction perpendicular to the surface of the plane mirror is adjusted, the exposure light collimation correction operation using the plane mirror can be performed safely in a short time without turning on the light source of the exposure light irradiation device. Can do. In addition, since the laser beam is irradiated to the plane mirror through a measurement jig of the same material and thickness as the mask, the positional deviation of the light reflected by the plane mirror is detected under conditions close to the time of exposure, and the parallelism of the exposure light by the plane mirror is detected. Correction is performed with high accuracy.

  The method for producing a display panel substrate of the present invention exposes the substrate using any one of the above-described proximity exposure apparatuses, or uses the exposure light irradiation method of any one of the above-described proximity exposure apparatuses. Exposure is performed. By using the above-described proximity exposure apparatus or the exposure light irradiation method of the proximity exposure apparatus, the parallelism of the exposure light applied to the mask is increased and the exposure accuracy is improved, so that a high-quality display panel substrate is manufactured. The

  According to the proximity exposure apparatus and the exposure light irradiation method of the proximity exposure apparatus of the present invention, the deflection of the top plate of the negative pressure chamber is suppressed, and the parallelism of the exposure light by the plane mirror is corrected under conditions close to the time of exposure. This can increase the parallelism of the exposure light applied to the mask and improve the exposure accuracy.

  Furthermore, the plane mirror support device that supports the plane mirror includes a support member that supports the back surface of the plane mirror, a holder that rotatably supports the support member, and an adjustment tool that adjusts the position of the holder in a direction perpendicular to the surface of the plane mirror. And by adjusting the position of the holding member of each support mechanism by the adjustment tool of each support mechanism, and changing the position where the support member of each support mechanism supports the back surface of the plane mirror The distortion can be accurately corrected over the entire surface of the plane mirror. In addition, by holding the support member rotatably with the holder, when the position of the holder is adjusted, the place where the support member supports the back surface of the plane mirror is prevented from being excessively stressed to prevent the plane mirror from being damaged. be able to.

  Furthermore, according to the proximity exposure apparatus and the exposure light irradiation method of the proximity exposure apparatus of the present invention, by arranging each support mechanism of the plane mirror support apparatus at the positions of the apexes of a plurality of adjacent regular triangles. Thus, it is possible to effectively correct the parallelism of the exposure light.

  Furthermore, according to the proximity exposure apparatus and the exposure light irradiation method of the proximity exposure apparatus of the present invention, the light reflected by the plane mirror is passed through a pinhole provided in a measurement jig having the same material and thickness as the mask. By receiving light at a plurality of locations by the image acquisition device and adjusting the position in the direction perpendicular to the surface of the plane mirror of the holder of each support mechanism based on the shift of the position of the received light By detecting the positional deviation of the light reflected by the plane mirror under conditions close to that at the time of exposure, the parallelism of the exposure light by the plane mirror can be corrected with high accuracy.

  Alternatively, according to the proximity exposure apparatus and the exposure light irradiation method of the proximity exposure apparatus of the present invention, the laser beam is irradiated from a plurality of locations on the chuck side to the plane mirror, and the laser beam reflected by the plane mirror is received by the measuring instrument. Then, the light source of the exposure light irradiation apparatus is adjusted by adjusting the position in the direction perpendicular to the surface of the plane mirror of the holder of each support mechanism by the adjustment tool of each support mechanism based on the positional deviation of the received laser beam. Without turning on the light, the correction work of the parallelism of the exposure light by the plane mirror can be performed safely in a short time. In addition, by irradiating the plane mirror with a laser beam through a measuring jig of the same material and thickness as the mask, the positional deviation of the light reflected by the plane mirror under conditions close to the time of exposure is detected, and the parallel exposure light by the plane mirror is detected. The degree can be corrected with high accuracy.

  According to the method for manufacturing a display panel substrate of the present invention, the parallelism of the exposure light applied to the mask can be increased and the exposure accuracy can be improved, so that a high-quality display panel substrate can be manufactured.

It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. It is the figure which looked at arrangement | positioning of a 1st plane mirror, a concave mirror, and a 2nd plane mirror from upper direction. 3A is a top view of the mask holder, and FIG. 3B is a partial cross-sectional side view of the AA portion of FIG. 3A. It is a side view of a pressing device. It is a figure explaining operation | movement of a press apparatus. 6A is a rear view of the plane mirror support device, and FIG. 6B is a partial cross-sectional side view of the BB portion of FIG. 6A. FIG. 7A is a side view of the support mechanism, and FIG. 7B is a front view of the support mechanism. FIG. 8A is a top view of the support member, and FIG. 8B is a cross-sectional view taken along the line CC in FIG. 8A. It is a front view of a support member and a holder. It is a partial cross section side view of the DD section of FIG. It is a figure explaining an example of the procedure which adjusts the position of the holder of each support mechanism. It is a figure explaining the other example of the procedure which adjusts the position of the holder of each support mechanism. It is a figure explaining the other example of the procedure which adjusts the position of the holder of each support mechanism. It is a figure which shows arrangement | positioning of the support point of a 2nd plane mirror. It is a figure which shows an example of the support point of the 2nd plane mirror of the state which correct | amended the parallelism of exposure light. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. The proximity exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck support 9, a chuck 10, a mask holder 20, and an exposure light irradiation device 30. It is configured. In addition to these, the proximity exposure apparatus includes a substrate transfer robot that loads the substrate 1 into the chuck 10 and unloads the substrate 1 from the chuck 10, a temperature control unit that performs temperature management in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  In FIG. 1, the chuck 10 is at an exposure position where the substrate 1 is exposed. A mask holder 20 for holding the mask 2 is installed above the exposure position. The mask holder 20 is provided with an opening through which exposure light passes, and the mask 2 is mounted below the opening. A suction groove is provided around the opening on the lower surface of the mask holder 20, and the mask holder 20 holds the peripheral portion of the mask 2 by vacuum suction using the suction groove. An exposure light irradiation device 30 is disposed above the mask 2 held by the mask holder 20. At the time of exposure, exposure light from the exposure light irradiation device 30 passes through the mask 2 and is irradiated onto the substrate 1, whereby the pattern of the mask 2 is transferred to the surface of the substrate 1 and a pattern is formed on the substrate 1. .

  The chuck 10 is moved to the load / unload position away from the exposure position by the X stage 5 and the Y stage 7. At the load / unload position, the substrate 1 is carried into the chuck 10 and the substrate 1 is carried out of the chuck 10 by a substrate transfer robot (not shown). The loading of the substrate 1 onto the chuck 10 and the unloading of the substrate 1 from the chuck 10 are performed using a plurality of push-up pins provided on the chuck 10. The push-up pin is housed inside the chuck 10 and is lifted from the inside of the chuck 10 to receive the substrate 1 from the substrate transfer robot and unload the substrate 1 from the chuck 10 when loading the substrate 1 onto the chuck 10. In doing so, the substrate 1 is delivered to the substrate transfer robot. The chuck 10 supports the back surface of the substrate 1 by vacuum suction.

  The chuck 10 is mounted on the θ stage 8 via the chuck support 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves along the X guide 4 in the X direction (the horizontal direction in FIG. 1). The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves along the Y guide 6 in the Y direction (the depth direction in FIG. 1). The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support 9 is mounted on the θ stage 8 and supports the chuck 10 at a plurality of locations.

  The chuck 10 is moved between the load / unload position and the exposure position by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. At the load / unload position, the substrate 1 mounted on the chuck 10 is pre-aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Is done. At the exposure position, the X stage 5 is moved in the X direction and the Y stage 7 is moved in the Y direction, whereby the substrate 1 mounted on the chuck 10 is stepped in the XY direction. Further, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction (the vertical direction in FIG. 1) by a Z-tilt mechanism (not shown). Then, the substrate 1 is aligned by the movement of the X stage 5 in the X direction, the movement of the Y stage 7 in the Y direction, and the rotation of the θ stage 8 in the θ direction.

  In the present embodiment, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction. However, the chuck support base 9 is provided with a Z-tilt mechanism, The gap between the mask 2 and the substrate 1 may be adjusted by moving and tilting the chuck 10 in the Z direction.

  The exposure light irradiation device 30 includes a light source 31, a condensing mirror 32, a first plane mirror 33, a fly-eye lens 34, a shutter 35, a concave mirror 37, a second plane mirror 38, an illuminance sensor 39, a light source control device 40, a power source 41, and a later-described. The flat mirror support device 50 is configured to be included. As the light source 31, a discharge type lamp in which a high-pressure gas is enclosed in a bulb, such as a mercury lamp, a halogen lamp, or a xenon lamp, is used. A condensing mirror 32 that condenses the light generated from the light source 31 is provided around the light source 31. The light generated from the light source 31 is collected by the collecting mirror 32 and irradiated to the first plane mirror 33.

  FIG. 2 is a view of the arrangement of the first plane mirror, the concave mirror, and the second plane mirror as viewed from above. The shutter 35 is opened when the substrate 1 is exposed, and is closed when the substrate 1 is not exposed. When the shutter 35 is open, the light reflected by the first plane mirror 33 enters the fly-eye lens 34. Then, the light transmitted through the fly-eye lens 34 is reflected by the concave mirror 37 and becomes a parallel light beam. In FIG. 1, the light that has been reflected by the concave mirror 37 to become a parallel light beam is reflected by the second plane mirror 38 and irradiated onto the mask 2. A flat mirror support device 50 to be described later supports the second flat mirror 38 in a state where it is tilted as shown in FIG. The pattern of the mask 2 is transferred to the substrate 1 by the exposure light applied to the mask 2, and the substrate 1 is exposed. When the shutter 35 is closed, the light irradiated from the first plane mirror 33 to the fly-eye lens 34 is blocked by the shutter 35 and the substrate 1 is not exposed.

  An illuminance sensor 39 is disposed in the vicinity of the back side of the second plane mirror 38. The second plane mirror 38 is provided with a small opening that allows a part of the exposure light to pass therethrough. The illuminance sensor 39 receives the light that has passed through the opening of the second plane mirror 38 and measures the illuminance of the exposure light. The measurement result of the illuminance sensor 39 is input to the light source control device 40. The light source control device 40 controls the power supplied from the power source 41 to the light source 31 based on the measurement result of the illuminance sensor 39 to adjust the illuminance of the exposure light.

  The exposure light irradiation method of the proximity exposure apparatus according to this embodiment will be described below. 3A is a top view of the mask holder, and FIG. 3B is a partial cross-sectional side view of the AA portion of FIG. 3A. In FIG. 3 (a), the mask holder 20 is provided with an opening 20a through which exposure light passes, and a continuous wall is provided around the opening 20a on the upper surface of the mask holder 20 over the entire periphery of the opening 20a. A portion 20b is provided. In FIG. 3B, the wall portion 20 b is a stepped portion that is raised from the other portion of the upper surface of the mask holder 20.

  A top plate 21 having a dimension in the vertical direction of FIG. 3A (the horizontal direction of FIG. 3B) larger than the wall 20b is mounted on the wall 20b. The top plate 21 is made of a transparent material such as quartz glass. As shown in FIG. 3B, when the mask 2 is mounted on the lower surface of the mask holder 20, a negative pressure is applied above the mask 2 by the mask 2, the wall portion 20 b of the mask holder 20, and the top plate 21. A chamber 20c is formed. The mask holder 20 suppresses the deflection due to the weight of the mask 2 by drawing air in the negative pressure chamber 20c from an air passage (not shown) and applying a negative pressure to the negative pressure chamber 20c.

  In FIG. 3A, a plurality of support bases 22 are installed on the upper surface of the mask holder 20 near the two opposing sides of the top plate 21, and a pressing device 23 is provided on each support base 22. Each is attached. FIG. 4 is a side view of the pressing device. The pressing device 23 includes an air cylinder 24, a connecting member 25, and a pressing member 26. A pressing member 26 is attached to the rod 24 a of the air cylinder 24 via a connecting member 25. The pressing device 23 extends the rod 24 a of the air cylinder 24 downward, and pushes the portion protruding from the wall portion 20 b of the top plate 21 from above by the tip of the pressing member 26. A direct acting motor may be used instead of the air cylinder 24.

  FIG. 5 is a diagram for explaining the operation of the pressing device. FIG. 5A shows a state where the mask 2 is not attached to the mask holder 20. The top plate 21 is bent downward by its own weight. In this state, each pressing device 23 pushes the portion protruding from the wall portion 20b of the top plate 21 from above with the first pressurizing force. FIG. 5B shows a state where a portion protruding from the wall portion 20b of the top plate 21 is pushed from above with a first pressure force. The top plate 21 in which the portion protruding from the wall portion 20b is pressed from above by the pressing force by each pressing device 23 tries to bend upward so that the central portion is raised, and tries to bend upward. The force balances with the force to bend downward due to its own weight, the deflection is suppressed, and it becomes almost flat.

  FIG. 5C shows a state in which the mask 2 is mounted on the mask holder 20 and the air in the negative pressure chamber 20c has not been removed yet. In this state, each pressing device 23 pushes the portion protruding from the wall portion 20b of the top plate 21 from above with a second pressing force larger than the first pressing force. The top plate 21 in which the portion protruding from the wall portion 20b is pushed from above by the pressing force by each pressing device 23 is a force that causes the force to bend upward by its own weight. Defeated and bent upwards so that the center part rises.

  FIG. 5D shows a state in which the air in the negative pressure chamber 20c has been removed. When the air in the negative pressure chamber 20c is evacuated and negative pressure is applied to the negative pressure chamber 20c, the top plate 21 that has been bent upward so that the center portion is raised is pulled downward by the negative pressure in the negative pressure chamber 20c. The force to bend upward is balanced with the force to be pulled downward by the negative pressure, so that the deflection is suppressed and almost flat.

  In the present invention, in the state shown in FIG. 5B, the flat mirror support device 50 described later corrects the distortion of the second flat mirror 38 and corrects the parallelism of the exposure light by the second flat mirror 38. Since the pressing force that pushes the portion protruding from the wall portion 20b of the top plate 21 from above is larger when the air in the negative pressure chamber 20c is extracted than when correcting the parallelism of the exposure light, the parallelism of the exposure light is increased. The degree of deflection of the top plate 21 of the negative pressure chamber 20c is reduced between the correction of the degree and the exposure, and the parallelism of the exposure light by the second plane mirror 38 is corrected under the conditions close to the exposure.

  6A is a rear view of the plane mirror support device, and FIG. 6B is a partial cross-sectional side view of the BB portion of FIG. 6A. The plane mirror support device 50 includes a vertical frame 51, a horizontal frame 52, and a support mechanism 60. As shown in FIG. 6A, two vertical frames 51 are connected by a plurality of horizontal frames 52 to form a frame. As shown in FIGS. 6A and 6B, each horizontal frame 52 is provided with a plurality of support mechanisms 60. The plane mirror support device 50 supports the back surface of the second plane mirror 38 at a plurality of locations by a plurality of support mechanisms 60. The second plane mirror 38 is configured by depositing a reflective film made of aluminum or the like on the surface of a glass material made of soda glass or the like.

  FIG. 7A is a side view of the support mechanism, and FIG. 7B is a front view of the support mechanism. The support mechanism 60 includes a support member 61, a holding tool 62, a set pin 63, a nut 64, and an adjustment tool. The support member 61 is attached to the back surface of the second plane mirror 38 and supports the back surface of the second plane mirror 38. FIG. 8A is a top view of the support member, and FIG. 8B is a cross-sectional view taken along the line CC in FIG. 8A. The support member 61 is provided with a circular flat support portion 61a as viewed from above and two receiving portions 61b protruding from the upper surface of the support portion 61a. The lower surface of the support portion 61 a is attached to the back surface of the second plane mirror 38. Each receiving portion 61b is provided with a through hole 61c as shown in FIG. 8 (b).

  FIG. 9 is a front view of the support member and the holder. FIG. 10 is a partial cross-sectional side view of the DD portion of FIG. The holder 62 includes an inner ring 62a, an outer ring 62b, and a holder 62c. In FIG. 9, the inner ring 62 a has a shape obtained by partially cutting the top and bottom of a sphere, and is provided with a through hole having substantially the same size as the through hole 61 c of the support member 61. The inner ring 62 a is inserted between the two receiving portions 61 b of the support member 61, and is fixed to the support member 61 by a stop pin 63 and a bolt 64. An outer ring 62b and a holder 62c are provided on the outer side of the inner ring 62a. A curved surface along the surface of the inner ring 62a is provided on the inner surface of the outer ring 62b, and the outer ring 62b rotates while contacting the curved surface with the surface of the inner ring 62a. As a result, the holder 62 holds the support member 61 to which the inner ring 62a is fixed so as to be rotatable in the direction indicated by the arrows in FIGS.

  7A and 7B, the adjustment tool includes a bolt 65, a nut 66, and a washer 67. The bolt 65 is screwed into a screw hole provided in the horizontal frame 52 and is fixed to the horizontal frame 52 by a nut 66 and a washer 67. A holder 62 c of the holder 62 is attached to one end of the bolt 65. The nut 66 is loosened, the screwing amount of the bolt 65 is adjusted, the position of the holder 62 in the direction perpendicular to the surface of the second plane mirror 38 is adjusted, and the support member 61 of each support mechanism 60 is the back surface of the second plane mirror 38. By changing the position for supporting the second plane mirror 38, the distortion of the second plane mirror 38 is corrected, and the parallelism of the exposure light by the second plane mirror 38 is corrected.

  The plane mirror support device 50 has a support member 61 that supports the back surface of the second plane mirror 38, a holder 62 that rotatably supports the support member 61, and a position of the holder 62 in a direction perpendicular to the surface of the second plane mirror 38. A plurality of support mechanisms 60 each having an adjustment tool for adjusting the position of the support mechanism 60, the position of the holding tool 62 of each support mechanism 60 is adjusted by the adjustment tool of each support mechanism 60, and the support member 61 of each support mechanism 60 is Since the position for supporting the back surface of the two-plane mirror 38 is changed, the distortion can be accurately corrected over the entire surface of the second plane mirror 38. In addition, since the support member 61 is rotatably held by the holder 62, when the position of the holder 62 is adjusted, excessive stress is not applied to the portion where the support member 61 supports the back surface of the second plane mirror 38, Breakage of the two-plane mirror 38 is prevented.

  FIG. 11 is a diagram illustrating an example of a procedure for adjusting the position of the holder of each support mechanism. A measuring jig 70 having the same material and thickness as the mask and having a pinhole pattern provided on the lower surface is set at the same height as the mask 2 at the time of exposure, as shown in FIG. . The CCD camera 71 is installed so that the center of the light receiving surface coincides with the pin pole of the pattern of the measurement jig 70, and the focus of the CCD camera 71 is adjusted to the height of the lower surface of the measurement jig 70. Then, the light reflected by the second plane mirror 38 is received by the CCD camera 71 through the pinhole of the pattern of the measuring jig 70. An image taken by the CCD camera 71 is displayed on the monitor 72.

  FIG. 11B shows an example of the screen of the monitor 72. The screen of the monitor 72 is provided with a scale 72a extending in the XY direction from the center of the screen. An image 34 a of a part of the fly-eye lens 34 appears on the screen of the monitor 72 by the light received by the CCD camera 71 through the pinhole of the pattern of the measuring jig 70. When the light reflected by the second plane mirror 38 is completely parallel, the center of the image 34 a coincides with the center of the screen of the monitor 72. As shown in FIG. 11B, when the center of the image 34a is shifted from the center of the screen of the monitor 72, the shift amount (dX, dY) of the center position of the image 34a is measured using the scale 72a. This measurement is performed at a plurality of locations, and the position of the holder 62 of each support mechanism 60 is adjusted so that the shift amount (dX, dY) of the center position of the image 34a is minimized. Since the light reflected by the second plane mirror 38 is received through the pinhole provided in the measuring jig 70 having the same material and thickness as the mask 2, the light reflected by the second plane mirror 38 under conditions close to those at the time of exposure. The positional deviation is detected, and the correction of the parallelism of the exposure light by the second plane mirror 38 is performed with high accuracy.

  12 and 13 are diagrams illustrating another example of the procedure for adjusting the position of the holder of each support mechanism. In the present embodiment, the light source 31 of the exposure light irradiation device 30 is not turned on, and the second plane mirror 38 is irradiated with laser light from a plurality of locations on the chuck 10 side, and the position of the holder 62 of each support mechanism 60 is determined. adjust. First, as shown in FIG. 12A, a laser light source 80, a beam expander 81, a mirror 82, and a translucent plate 84 are installed on the surface of the chuck 10, and the mirror 83 is placed above the chuck 10 and the surface of the chuck 10. Install in parallel with. Then, the beam diameter of the laser light generated from the laser light source 80 is expanded by the beam expander 81 and irradiated to the mirror 82 through the translucent plate 84. The laser beam reflected by the mirror 82 is reflected by the mirror 83, returns to the mirror 82, is reflected by the mirror 82 again, and is irradiated on the semitransparent plate 84. The position of the laser beam irradiated from the beam expander 81 to the semitransparent plate 84 and the position of the laser beam irradiated by the mirror 83 and irradiated to the semitransparent plate 84 are matched on the semitransparent plate 84. The angles of the laser light source 80, the beam expander 81, and the mirror 82 are adjusted so that the optical axis of the laser light reflected upward from the mirror 82 is vertical.

  Subsequently, the mirror 83 and the translucent plate 84 are removed, and a measuring jig 85 having the same material and thickness as the mask 2 is set to the same height as the mask 2 at the time of exposure, as shown in FIG. Install. Further, as shown in FIG. 13, the measuring device 86 is installed in front of the fly-eye lens 34 of the exposure light irradiation device 30. Then, the laser beam reflected by the mirror 82 is irradiated to the second plane mirror 38 via the measuring jig 85 and the top plate 21. The measuring device 86 is provided with a target mark at a position corresponding to the position where the mirror 82 is installed, and the holder 62 of each support mechanism 60 is arranged so that the laser beam irradiated to the measuring device 86 overlaps the target mark. Adjust the position. This operation is performed at a plurality of locations on the chuck 10 as indicated by broken lines in FIG.

  Note that the measuring device 86 is not limited to the target mark, and may be provided with a laser beam position shifter such as a grid scale. Further, an image acquisition device such as a CCD camera may be used as the measuring device 86, and the positional deviation of the laser beam received by the image acquisition device may be detected by image processing.

  As the light source 31 of the exposure light irradiation device 30, a discharge type lamp in which high pressure gas is enclosed in a bulb, such as a mercury lamp, a halogen lamp, a xenon lamp, etc., is used. It takes time for the illuminance to stabilize after the start, and the illuminance of the generated light is high and the amount of heat is large. The laser beam is irradiated to the second plane mirror 38 from a plurality of locations on the chuck 10 side, the laser beam reflected by the second plane mirror 38 is received, and based on the displacement of the position of the received laser beam, each support mechanism 60 Since the position of the holder 62 is adjusted, the work for correcting the parallelism of the exposure light by the second plane mirror 38 can be performed safely in a short time without turning on the light source 31 of the exposure light irradiation device 30. Further, since the second plane mirror 38 is irradiated with the laser light through the measuring jig 85 having the same material and thickness as the mask 2, the positional deviation of the light reflected by the second plane mirror 38 is detected under conditions close to the exposure time. Correction of the parallelism of the exposure light by the second plane mirror 38 is performed with high accuracy.

  In FIG. 6A, each support mechanism 60 is disposed at the apex position of a plurality of equilateral triangles arranged adjacent to each other. FIG. 14 is a diagram showing the arrangement of the support points of the second plane mirror. As shown in FIG. 14, the support member 61 of each support mechanism 60 supports the back surface of the second plane mirror 38 and is connected by a broken line as shown in FIG. It can be seen that it is arranged at the position of the vertex. FIG. 15 is a diagram illustrating an example of a support point of the second plane mirror in a state where the parallelism of the exposure light is corrected. The support mechanisms 60 arranged at the positions of the apexes of a plurality of adjacent equilateral triangles can support the second plane mirror 38 in a smooth curved surface, effectively correcting the parallelism of exposure light. Done.

  According to the embodiment described above, the deflection of the top plate 21 of the negative pressure chamber 20c is suppressed, and the parallelism of the exposure light by the second plane mirror 38 is corrected under conditions close to the time of exposure to the mask 2. It is possible to increase the parallelism of the exposure light to be irradiated and improve the exposure accuracy.

  Further, the plane mirror support device 50 has a support member 61 that supports the back surface of the second plane mirror 38, a holder 62 that rotatably supports the support member 61, and a direction perpendicular to the surface of the second plane mirror 38 of the holder 62. A plurality of support mechanisms 60 each having an adjustment tool for adjusting the position of the support mechanism 60, the position of the holding tool 62 of each support mechanism 60 is adjusted by the adjustment tool of each support mechanism 60, and the support member 61 of each support mechanism 60. However, by changing the position at which the back surface of the second plane mirror 38 is supported, it is possible to correct distortion over the entire surface of the second plane mirror 38 with high accuracy. In addition, by holding the support member 61 rotatably by the holder 62, when the position of the holder 62 is adjusted, excessive stress is applied to the portion where the support member 61 supports the back surface of the second plane mirror 38 and the second member 38 is supported. It is possible to prevent the two-plane mirror 38 from being damaged.

  Further, by arranging the support mechanisms 60 of the plane mirror support device 50 at the positions of the apexes of a plurality of adjacent regular triangles, it is possible to effectively correct the parallelism of the exposure light.

  Furthermore, according to the embodiment shown in FIG. 11, the light reflected by the second plane mirror 38 is passed through the pinhole pattern provided in the measuring jig 70 having the same material and thickness as the mask 2 and then the CCD camera. 71, light is received at a plurality of locations, and the position of the holder 62 of each support mechanism 60 is adjusted by the adjustment tool of each support mechanism 60 based on the shift of the position of the received light. The misalignment of the light reflected by the two plane mirror 38 can be detected, and the parallelism of the exposure light by the second plane mirror 38 can be corrected with high accuracy.

  Alternatively, according to the embodiment shown in FIGS. 12 and 13, the laser beam is irradiated to the second plane mirror 38 from a plurality of locations on the chuck 10 side, and the laser beam reflected by the second plane mirror 38 is measured by the measuring device 86. The light source 31 of the exposure light irradiation device 30 is adjusted by adjusting the position of the holder 62 of each support mechanism 60 by the adjustment tool of each support mechanism 60 based on the positional deviation of the received laser light. Without turning on the light, the correction work of the parallelism of the exposure light by the second plane mirror 38 can be performed safely in a short time. In addition, by irradiating the second plane mirror 38 with laser light through a measuring jig 85 having the same material and thickness as the mask 2, the positional deviation of the light reflected by the second plane mirror 38 is detected under conditions close to the time of exposure. Thus, the correction of the parallelism of the exposure light by the second plane mirror 38 can be performed with high accuracy.

  The substrate is exposed using the proximity exposure apparatus of the present invention, or the substrate is exposed using the exposure light irradiation method of the proximity exposure apparatus of the present invention, whereby the parallelism of the exposure light irradiated to the mask And the exposure accuracy can be improved, so that a high-quality display panel substrate can be manufactured.

  For example, FIG. 16 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 17 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 16, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 17, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure processing, the proximity exposure apparatus or the exposure light irradiation method of the proximity exposure apparatus of the present invention can be applied.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Chuck support stand 10 Chuck 20 Mask holder 20a Opening 20b Wall part 21 Top plate 22 Support stand 23 Pressing device 24 Air cylinder 24a Rod 25 Connecting member 26 Pressing member 30 Exposure light irradiation device 31 Light source 32 Condensing mirror 33 First plane mirror 34 Fly eye lens 35 Shutter 37 Concave mirror 38 Second plane mirror 39 Illuminance sensor 40 Light source control device 41 Power supply 50 Plane mirror support device 51 Vertical frame 52 Horizontal Frame 60 Support mechanism 61 Support member 62 Holder 63 Stop pin 64, 66 Nut 65 Bolt 67 Washer 70, 85 Measuring jig 71 CCD camera 72 Monitor 72a Scale 80 Laser light source 81 Beam expander 82, 83 Mirror 84 Semi-transparent Plate 86 measuring instrument

Claims (10)

A chuck that supports the substrate, a mask holder that holds the mask, and an exposure light irradiation device that includes a light source and a concave mirror that converts the light generated from the light source into a parallel beam bundle, and a minute gap between the mask and the substrate. In a proximity exposure apparatus that irradiates a mask with exposure light of a parallel light beam from the exposure light irradiation apparatus and transfers the pattern of the mask to the substrate,
The exposure light irradiating apparatus includes a plane mirror that reflects the light made into a parallel light beam by the concave mirror and irradiates the mask, and a plane mirror support apparatus that supports the plane mirror,
The plane mirror support device includes a support member that supports the back surface of the plane mirror, a holder that rotatably supports the support member, and an adjustment tool that adjusts the position of the holder in a direction perpendicular to the surface of the plane mirror. A plurality of support mechanisms, and by adjusting the position of the holding mechanism of each support mechanism with the adjustment tool of each support mechanism, changing the position where the support member of each support mechanism supports the back surface of the plane mirror, Correct the parallelism of the light reflected by the plane mirror,
The mask holder includes an opening through which exposure light passes, a wall portion arranged continuously around the entire periphery of the opening, a transparent top plate larger than the wall portion mounted on the wall portion, A plurality of pressing devices that push the portion of the top plate protruding from the wall from above, holding the mask below the opening, forming a negative pressure chamber between the top plate and the mask,
When the plane mirror support device corrects the parallelism of the light reflected by the plane mirror before the mask holder holds the mask, the plurality of pressing devices of the mask holder is configured to apply the first pressing force to the top plate. When the portion protruding from the wall portion is pushed from above, and the mask holder holds the mask and vents the air in the negative pressure chamber, the wall portion of the top plate with a second pressure greater than the first pressure force A proximity exposure apparatus that pushes a protruding portion from above.   2. The proximity exposure apparatus according to claim 1, wherein each of the support mechanisms is arranged at the position of a vertex of a plurality of equilateral triangles arranged adjacent to each other.   The holder of each support mechanism of the plane mirror support device receives the light reflected by the plane mirror at a plurality of locations by the image acquisition device through pinholes provided in a measurement jig having the same material and thickness as the mask. 3. The proximity according to claim 1, wherein the position in the direction perpendicular to the surface of the plane mirror is adjusted by the adjustment tool of each support mechanism based on the shift of the position of the received light. Exposure device.   The holder of each support mechanism of the plane mirror support device irradiates the plane mirror with laser light from a plurality of locations on the chuck side through the measurement jig having the same material and thickness as the mask, and is reflected by the plane mirror The light is received by a measuring instrument, and the position in the direction perpendicular to the surface of the plane mirror is adjusted by the adjustment tool of each support mechanism based on the displacement of the position of the received laser beam. The proximity exposure apparatus according to claim 2. A chuck that supports the substrate, a mask holder that holds the mask, and an exposure light irradiation device that has a concave mirror that converts the light generated from the light source into parallel light bundles, and a minute gap is formed between the mask and the substrate. An exposure light irradiation method of a proximity exposure apparatus that irradiates a mask with exposure light of a parallel light beam from an exposure light irradiation apparatus and transfers a mask pattern to a substrate,
The exposure light irradiation device is provided with a plane mirror that reflects the light made into a parallel light beam by the concave mirror and irradiates the mask, and a plane mirror support device that supports the plane mirror,
A plurality of supports having a support member that supports the back surface of the plane mirror, a holder that rotatably supports the support member, and an adjustment tool that adjusts the position of the holder in a direction perpendicular to the surface of the plane mirror. Provided a mechanism,
The mask holder has an opening through which exposure light passes, a wall portion arranged continuously around the entire periphery of the opening, a transparent top plate larger than the wall portion mounted on the wall portion, and a wall portion of the top plate Provided with a plurality of pressing devices to push the protruding part from above,
Before holding the mask below the opening of the mask holder, while pressing the portion protruding from the top wall of the mask holder from above with a plurality of pressing devices of the mask holder,
Adjust the position of the holder of each support mechanism with the adjustment tool of each support mechanism of the plane mirror support device, change the position where the support member of each support mechanism supports the back surface of the plane mirror, and the light reflected by the plane mirror Correct the parallelism,
Holding the mask below the opening of the mask holder, forming a negative pressure chamber between the mask holder top plate and the mask,
When extracting the air in the negative pressure chamber, a plurality of pressing devices of the mask holder push a portion protruding from the top wall of the mask holder from above with a second pressing force larger than the first pressing force. An exposure light irradiation method for a proximity exposure apparatus.   6. The exposure light irradiation method of a proximity exposure apparatus according to claim 5, wherein each support mechanism of the plane mirror support device is arranged at the apex positions of a plurality of equilateral triangles arranged adjacent to each other.   The light reflected by the plane mirror is received at multiple locations by the image acquisition device through pinholes provided in a measurement jig of the same material and thickness as the mask, and each support is based on the misalignment of the received light. 7. The exposure light irradiation method for a proximity exposure apparatus according to claim 5, wherein the position of the holder of each support mechanism in the direction perpendicular to the surface of the plane mirror is adjusted by the mechanism adjustment tool.   Laser light is radiated from multiple locations on the chuck side to the plane mirror through a measurement jig with the same material and thickness as the mask, and the laser beam reflected by the plane mirror is received by the measuring instrument. The proximity exposure apparatus according to claim 5 or 6, wherein the position of the holder of each support mechanism in the direction perpendicular to the surface of the plane mirror is adjusted by the adjuster of each support mechanism based on the above. Exposure light irradiation method.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the proximity exposure apparatus according to any one of claims 1 to 4.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure light irradiation method of the proximity exposure apparatus according to any one of claims 5 to 8.

Images