KR20170101099A - 액냉형 냉각장치 - Google Patents
액냉형 냉각장치 Download PDFInfo
- Publication number
- KR20170101099A KR20170101099A KR1020160171551A KR20160171551A KR20170101099A KR 20170101099 A KR20170101099 A KR 20170101099A KR 1020160171551 A KR1020160171551 A KR 1020160171551A KR 20160171551 A KR20160171551 A KR 20160171551A KR 20170101099 A KR20170101099 A KR 20170101099A
- Authority
- KR
- South Korea
- Prior art keywords
- radiator
- tank
- disposed
- fan
- liquid
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2016-035568 | 2016-02-26 | ||
JP2016035568A JP2017152614A (ja) | 2016-02-26 | 2016-02-26 | 液冷型冷却装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20170101099A true KR20170101099A (ko) | 2017-09-05 |
Family
ID=59721507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160171551A KR20170101099A (ko) | 2016-02-26 | 2016-12-15 | 액냉형 냉각장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2017152614A (zh) |
KR (1) | KR20170101099A (zh) |
CN (1) | CN107132891A (zh) |
TW (1) | TW201731371A (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109475065A (zh) * | 2017-09-08 | 2019-03-15 | 泽鸿(广州)电子科技有限公司 | 多散热器液冷系统 |
CN107949242B (zh) * | 2017-11-17 | 2020-08-28 | 珠海诚然科技服务有限公司 | 一种环保设备用双排散热器 |
JP7131312B2 (ja) * | 2018-11-07 | 2022-09-06 | 日本電産株式会社 | 冷却装置 |
CN109743869B (zh) * | 2019-01-30 | 2020-04-14 | 全亿大科技(佛山)有限公司 | 液冷散热器及伺服器系统 |
CN111854290A (zh) * | 2020-07-16 | 2020-10-30 | 西安交通大学 | 一种液冷工质输送系统及其设计方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2591667Y (zh) * | 2002-10-22 | 2003-12-10 | 罗云 | 一种计算机冷却装置 |
CN2762216Y (zh) * | 2004-12-27 | 2006-03-01 | 夏宏 | 计算机用高效液冷散热装置 |
JP2006207881A (ja) * | 2005-01-26 | 2006-08-10 | Matsushita Electric Ind Co Ltd | 冷却装置及びそれを備えた電子機器 |
CN101295202B (zh) * | 2007-04-28 | 2010-05-19 | 佛山市顺德区顺达电脑厂有限公司 | 水冷式散热器 |
US8358505B2 (en) * | 2010-10-28 | 2013-01-22 | Asetek A/S | Integrated liquid cooling system |
TWI438388B (zh) * | 2011-05-20 | 2014-05-21 | Wistron Corp | 液冷式散熱裝置 |
-
2016
- 2016-02-26 JP JP2016035568A patent/JP2017152614A/ja active Pending
- 2016-09-09 CN CN201610815330.5A patent/CN107132891A/zh active Pending
- 2016-09-13 TW TW105129782A patent/TW201731371A/zh unknown
- 2016-12-15 KR KR1020160171551A patent/KR20170101099A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
TW201731371A (zh) | 2017-09-01 |
JP2017152614A (ja) | 2017-08-31 |
CN107132891A (zh) | 2017-09-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |