KR20170101099A - 액냉형 냉각장치 - Google Patents

액냉형 냉각장치 Download PDF

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Publication number
KR20170101099A
KR20170101099A KR1020160171551A KR20160171551A KR20170101099A KR 20170101099 A KR20170101099 A KR 20170101099A KR 1020160171551 A KR1020160171551 A KR 1020160171551A KR 20160171551 A KR20160171551 A KR 20160171551A KR 20170101099 A KR20170101099 A KR 20170101099A
Authority
KR
South Korea
Prior art keywords
radiator
tank
disposed
fan
liquid
Prior art date
Application number
KR1020160171551A
Other languages
English (en)
Korean (ko)
Inventor
토시히코 토케시
히로노리 하나시마
Original Assignee
주식회사 히타치 정보통신 엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 히타치 정보통신 엔지니어링 filed Critical 주식회사 히타치 정보통신 엔지니어링
Publication of KR20170101099A publication Critical patent/KR20170101099A/ko

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254Cold plates transferring heat from heat source to coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020160171551A 2016-02-26 2016-12-15 액냉형 냉각장치 KR20170101099A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-035568 2016-02-26
JP2016035568A JP2017152614A (ja) 2016-02-26 2016-02-26 液冷型冷却装置

Publications (1)

Publication Number Publication Date
KR20170101099A true KR20170101099A (ko) 2017-09-05

Family

ID=59721507

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160171551A KR20170101099A (ko) 2016-02-26 2016-12-15 액냉형 냉각장치

Country Status (4)

Country Link
JP (1) JP2017152614A (zh)
KR (1) KR20170101099A (zh)
CN (1) CN107132891A (zh)
TW (1) TW201731371A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109475065A (zh) * 2017-09-08 2019-03-15 泽鸿(广州)电子科技有限公司 多散热器液冷系统
CN107949242B (zh) * 2017-11-17 2020-08-28 珠海诚然科技服务有限公司 一种环保设备用双排散热器
JP7131312B2 (ja) * 2018-11-07 2022-09-06 日本電産株式会社 冷却装置
CN109743869B (zh) * 2019-01-30 2020-04-14 全亿大科技(佛山)有限公司 液冷散热器及伺服器系统
CN111854290A (zh) * 2020-07-16 2020-10-30 西安交通大学 一种液冷工质输送系统及其设计方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2591667Y (zh) * 2002-10-22 2003-12-10 罗云 一种计算机冷却装置
CN2762216Y (zh) * 2004-12-27 2006-03-01 夏宏 计算机用高效液冷散热装置
JP2006207881A (ja) * 2005-01-26 2006-08-10 Matsushita Electric Ind Co Ltd 冷却装置及びそれを備えた電子機器
CN101295202B (zh) * 2007-04-28 2010-05-19 佛山市顺德区顺达电脑厂有限公司 水冷式散热器
US8358505B2 (en) * 2010-10-28 2013-01-22 Asetek A/S Integrated liquid cooling system
TWI438388B (zh) * 2011-05-20 2014-05-21 Wistron Corp 液冷式散熱裝置

Also Published As

Publication number Publication date
TW201731371A (zh) 2017-09-01
JP2017152614A (ja) 2017-08-31
CN107132891A (zh) 2017-09-05

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A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application