JP2017152614A - 液冷型冷却装置 - Google Patents

液冷型冷却装置 Download PDF

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Publication number
JP2017152614A
JP2017152614A JP2016035568A JP2016035568A JP2017152614A JP 2017152614 A JP2017152614 A JP 2017152614A JP 2016035568 A JP2016035568 A JP 2016035568A JP 2016035568 A JP2016035568 A JP 2016035568A JP 2017152614 A JP2017152614 A JP 2017152614A
Authority
JP
Japan
Prior art keywords
radiator
tank
fan
disposed
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016035568A
Other languages
English (en)
Japanese (ja)
Inventor
鋭彦 渡慶次
Toshihiko Tokeiji
鋭彦 渡慶次
博徳 花島
Hironori Hanashima
博徳 花島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Information and Telecommunication Engineering Ltd
Original Assignee
Hitachi Information and Telecommunication Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Information and Telecommunication Engineering Ltd filed Critical Hitachi Information and Telecommunication Engineering Ltd
Priority to JP2016035568A priority Critical patent/JP2017152614A/ja
Priority to CN201610815330.5A priority patent/CN107132891A/zh
Priority to TW105129782A priority patent/TW201731371A/zh
Priority to KR1020160171551A priority patent/KR20170101099A/ko
Publication of JP2017152614A publication Critical patent/JP2017152614A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2016035568A 2016-02-26 2016-02-26 液冷型冷却装置 Pending JP2017152614A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016035568A JP2017152614A (ja) 2016-02-26 2016-02-26 液冷型冷却装置
CN201610815330.5A CN107132891A (zh) 2016-02-26 2016-09-09 液冷式冷却装置
TW105129782A TW201731371A (zh) 2016-02-26 2016-09-13 液冷式冷卻裝置
KR1020160171551A KR20170101099A (ko) 2016-02-26 2016-12-15 액냉형 냉각장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016035568A JP2017152614A (ja) 2016-02-26 2016-02-26 液冷型冷却装置

Publications (1)

Publication Number Publication Date
JP2017152614A true JP2017152614A (ja) 2017-08-31

Family

ID=59721507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016035568A Pending JP2017152614A (ja) 2016-02-26 2016-02-26 液冷型冷却装置

Country Status (4)

Country Link
JP (1) JP2017152614A (zh)
KR (1) KR20170101099A (zh)
CN (1) CN107132891A (zh)
TW (1) TW201731371A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020076530A (ja) * 2018-11-07 2020-05-21 日本電産株式会社 冷却装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109475065A (zh) * 2017-09-08 2019-03-15 泽鸿(广州)电子科技有限公司 多散热器液冷系统
CN107949242B (zh) * 2017-11-17 2020-08-28 珠海诚然科技服务有限公司 一种环保设备用双排散热器
CN109743869B (zh) * 2019-01-30 2020-04-14 全亿大科技（佛山）有限公司 液冷散热器及伺服器系统
CN111854290A (zh) * 2020-07-16 2020-10-30 西安交通大学 一种液冷工质输送系统及其设计方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2591667Y (zh) * 2002-10-22 2003-12-10 罗云 一种计算机冷却装置
CN2762216Y (zh) * 2004-12-27 2006-03-01 夏宏 计算机用高效液冷散热装置
JP2006207881A (ja) * 2005-01-26 2006-08-10 Matsushita Electric Ind Co Ltd 冷却装置及びそれを備えた電子機器
CN101295202B (zh) * 2007-04-28 2010-05-19 佛山市顺德区顺达电脑厂有限公司 水冷式散热器
US8358505B2 (en) * 2010-10-28 2013-01-22 Asetek A/S Integrated liquid cooling system
TWI438388B (zh) * 2011-05-20 2014-05-21 Wistron Corp 液冷式散熱裝置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020076530A (ja) * 2018-11-07 2020-05-21 日本電産株式会社 冷却装置
JP7131312B2 (ja) 2018-11-07 2022-09-06 日本電産株式会社 冷却装置

Also Published As

Publication number Publication date
KR20170101099A (ko) 2017-09-05
TW201731371A (zh) 2017-09-01
CN107132891A (zh) 2017-09-05

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