KR20170101099A - Liquid cooling type cooling apparatus - Google Patents

Abstract

Provided is a technology which can implement high cooling performance and high density mounting for a liquid cooling type cooling apparatus. The liquid cooling type cooling apparatus comprises: a water heating unit (1); a pump (2); a plate-shaped heat radiation module (8); and a pipe (6) connecting between the plate-shaped heat radiation module and the water heating unit and between the pump and the heat radiation module to form a path through which a coolant flows. The heat radiation module (8) includes: a fan (5); a heat radiation unit including a plurality of heat radiators arranged around the fan; and a tank unit arranged among the plurality of heat radiators.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a cooling apparatus,

The present invention relates to a liquid-cooled cooling device technology.

BACKGROUND ART [0002] When a cooling means is provided in a narrow space in a conventional electronic apparatus, an air-cooled type heat sink or the like is frequently used. BACKGROUND ART [0002] Electronic devices such as notebook PCs are increasing in heat density due to downsizing and thinning. Therefore, higher cooling performance is required for the cooling means of the electronic apparatus.

And a liquid-cooling type cooling apparatus as a cooling means of an electronic apparatus. The liquid cooling type cooling device can realize a relatively high cooling performance by a combination of water cooling and air cooling. The liquid cooling type cooling device includes, as components, a heat receiving portion, a pump, a tank, a heat dissipating portion, a fan, and a pipe connecting these components.

As an example of the prior art relating to the liquid-cooling type cooling apparatus, Japanese Patent Application Laid-Open No. 2006-207881 (Patent Document 1) is cited. Patent Document 1 discloses a cooling device for realizing cooling performance improvement and downsizing. In this cooling system, two radiators are arranged on both sides of the fan. In the middle of the piping connecting the one radiator and the water collecting part, a tank is provided close to and integral with a side surface of a part of the fan.

JP 2006-207881 A

In the conventional liquid cooling type cooling apparatus, the volume of the entire apparatus is relatively large for the arrangement of components including pipes and tanks. Therefore, the conventional liquid-cooling type cooling apparatus is difficult to be mounted in a case where the liquid type cooling apparatus is mounted on an electronic device having a limited mounting space, such as a notebook PC. That is, it is difficult to put the liquid cooling type cooling device in the mountable space. The volume of the entire system including the electronic apparatus and the liquid-cooled cooling apparatus becomes large even when the liquid-cooled cooling apparatus can be mounted on the electronic apparatus. That is, it is difficult for the electronic device to realize reduction in thickness and miniaturization.

Particularly, in the case of an electronic apparatus such as a notebook PC, the electronic apparatus has a flat plate shape, and a mountable space for installing the cooling means is generally flat. Therefore, conventionally, a heat sink or the like is mounted in such a mountable space. However, it only lacks heat dissipation capacity and cooling efficiency. In such an electronic device, when the CPU is operated at full power, there is a possibility that the upper limit temperature of the part is exceeded due to insufficient cooling performance. Therefore, in such an electronic device, it is necessary to suppress the ability of the CPU and to use the performance as much as possible.

As described above, the existing liquid cooling type cooling apparatus has room for improvement from the viewpoint of downsizing and thinning. In the case of mounting a liquid cooling type cooling device on an electronic device such as a notebook PC, it is intended not only to realize a high cooling performance but also to realize a high density mounting with a small size and a thin shape so that the volume and thickness of the whole system become small.

An object of the present invention is to provide a technique capable of realizing high cooling performance and high density mounting in a liquid cooling type cooling apparatus.

A representative embodiment of the present invention is characterized in that the liquid-cooling type cooling apparatus has the following configuration.

A liquid cooling type cooling apparatus according to one embodiment of the present invention is a liquid cooling type cooling apparatus comprising a water storage portion, a pump, a flat plate heat dissipation module, and a pipe connecting the water storage portion, the pump, and the heat dissipation module, And the heat dissipation module includes a heat dissipation unit including a fan, a plurality of heat dissipators disposed around the fan, and a tank unit disposed between the plurality of heat dissipators.

According to the exemplary embodiment of the present invention, it is possible to realize mounting of high cooling performance and miniaturization in the liquid-cooling type cooling apparatus.

1 is a perspective view showing a configuration of a liquid cooling type cooling device according to a first embodiment of the present invention.
2 is a perspective view showing an example of the mounting configuration of the liquid-cooling type cooling apparatus of the first embodiment.
3 is a perspective view showing a structure of a heat dissipation module of the liquid-cooling type cooling apparatus according to the first embodiment.
4 is a plan view showing the definition of a region and the like for the purpose of describing the liquid cooling type cooling apparatus of the first embodiment.
5 is a plan view showing the main plan configuration of the heat dissipation module of the liquid cooling type cooling apparatus of the first embodiment.
6 is a perspective view showing a configuration of an integral part of the liquid cooling type cooling apparatus of the first embodiment.
7 is a perspective view showing the structure of a radiator of the liquid cooling type cooling apparatus of the first embodiment.
8 is a plan view showing a configuration of a side surface of a radiator of the liquid cooling type cooling apparatus of the first embodiment.
9 is a perspective view showing a configuration of a heat dissipation module of a liquid cooling type cooling apparatus according to a second embodiment of the present invention.
10 is a plan view showing the main plan configuration of the heat dissipation module of the liquid cooling type cooling apparatus of the second embodiment.
11 is a plan view showing a main plan configuration of the heat dissipation module of the liquid cooling type cooling apparatus according to the third embodiment of the present invention.
12 is a plan view showing a configuration of a main plane of a heat dissipation module of a liquid cooling type cooling apparatus according to a fourth embodiment of the present invention.
13 is a plan view showing a configuration of a main plane of a heat dissipation module of a liquid cooling type cooling apparatus according to a fifth embodiment of the present invention.
Fig. 14 is a plan view showing a configuration of a main plane of a heat dissipation module of a liquid cooling type cooling apparatus according to a sixth embodiment of the present invention. Fig.
15 is a perspective view showing the structure of a liquid-cooling type cooling apparatus of a comparative example.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the entire drawings for explaining the embodiments, the same parts are denoted by the same reference numerals in principle, and the repetitive description thereof will be omitted. In the drawings, X, Y, and Z are used as explanatory directions. The X direction and the Y direction constitute a horizontal plane and intersect in two directions, and the Z direction is a vertical direction.

[Comparative Example]

The above-described problems will be supplementarily explained. To this end, as a comparative example to the embodiment, the structure of a conventional general liquid cooling type cooling apparatus will be described. The liquid cooling type cooling device is mounted on an electronic device such as a PC to be cooled to constitute a system including an electronic device and a liquid cooling type cooling device.

Fig. 15 shows the structure of a liquid-cooling type cooling apparatus of a comparative example. The liquid-cooling type cooling apparatus of the comparative example includes a water heat portion 91, a pump 92, a tank 93, a heat dissipation portion 94, a fan 95 and a pipe 96 {96a, 96b, 96c, 96d} Respectively.

The water collection portion 91 is a portion provided in a heat generating portion of the electronic device and performing heat exchange. The water collection portion 91 is connected to the pump 92 by a pipe 96a. A direction 901 indicates a direction in which the cooling liquid flows in the pipe 96a.

The pump 92 circulates liquid, which is a refrigerant, as a cooling liquid in a path including the pipe 96. The pump 92 is connected to the tank 93 by a pipe 96b.

The tank 93 is a portion for accumulating the cooling liquid in preparation for reduction due to volatilization of the cooling liquid in the path. The tank 93 is connected to the heat dissipating portion 94 by a pipe 96c.

The heat dissipation unit 94 is a radiator or the like and is a heat dissipation unit that dissipates the heat of the cooling liquid to the outside, including a tube portion through which the cooling liquid flows and a fin touching the tube portion. In the case of the heat dissipation unit 94 of Fig. 15, the heat dissipation unit 94 has a quadrangular flat plate shape, and a plurality of fins are provided on a main plane thereof. The heat dissipating unit 94 is connected to the heat sink 91 by a pipe 96d. A direction 902 indicates a direction in which the cooling liquid flows in the pipe 96d.

The fan 95 is disposed adjacent to the heat dissipating unit 94 and facilitates heat dissipation of the heat dissipating unit 94 by intake and exhaust. The fan 95 shown in Fig. 15 has a rectangular flat plate shape, and is disposed so as to overlap with the main plane of the quadrangle of the heat dissipation portion 94. The fan 95 in Fig. 15 is an axial-flow fan, and performs intake and exhaust in the Y direction.

The piping 96 is an element constituting a path through which the cooling liquid circulates by connecting components. The pipe 96 is composed of, for example, a pipe made of metal or a tube made of a polymer material. The piping 96 is flexible in the case of a tube made of a polymer material such as rubber or plastic. Such a pipe 96 is often used because it can bend the path along the space of the system including the electronic equipment.

However, the piping 96 made of a polymer material generally has some degree of liquid permeability. That is, for a long period of time, the cooling liquid is volatilized to the outside from the piping 96 itself, the connecting portion between the piping 96 and other components, and the like. Then, the amount of cooling liquid present in the path decreases while changing from the initial state to a state after a long period of time.

Thus, a tank 93 is provided in the middle of the path in order to supply and maintain a sufficient amount of cooling liquid from the beginning in the path. The tank 93 is, in other words, a cooling liquid accumulating portion. The tank 93 has a certain volume to some extent for accumulating the cooling liquid. In the system including the electronic device, it is necessary to dispose the tank 93 and the piping 96 (96b, 96c) connected thereto. Therefore, the volume of the liquid-cooled cooling apparatus and the entire system becomes relatively large. In the case where a system in which a liquid cooling type cooling apparatus is mounted on a high density in an electronic apparatus is constructed, the tank 93 and the piping 96 are obstructed.

(First Embodiment)

The liquid-cooling type cooling apparatus according to the first embodiment of the present invention will be described with reference to Figs. 1 to 8. Fig. The liquid cooling type cooling device of the first embodiment is mounted on an electronic device such as a notebook PC as a cooling target to constitute a system including an electronic device and a liquid cooling type cooling device.

[Liquid cooling type cooling device]

Fig. 1 shows a configuration of a liquid-cooling type cooling apparatus according to the first embodiment. The liquid cooling type cooling device of the first embodiment has a water collection portion 1, a pump 2, a heat dissipation module 8, and piping 6: 6a, 6b, 6c. The heat dissipation module (8) includes a fan (5) and an integral part (7). The integral part (7) includes a tank (3) and a heat radiating part (40). The radiator 40 includes a plurality of radiators 4 as a radiator 4A and a radiator 4B as radiators 4.

Referring to Fig. 1, the liquid cooling type cooling device of the first embodiment has a thin, generally flat heat dissipating module 8. In the heat dissipating module 8, a plurality of radiators 4 are disposed around the fan 5, and a tank 3 is disposed at the corner. The integral part 7 of the heat dissipation module 8 is a part in which the heat dissipation part 40 and the tank 3 are integrated. Then, the liquid-cooling type cooling device of the first embodiment has a smaller total volume and thickness than the conventional liquid-cooled type cooling device (for example, the comparative example), and high-density packaging can be realized for electronic devices. The liquid cooling type cooling apparatus of the first embodiment eliminates the need for a separate tank 93 and a pipe 96 connecting the same in the middle of the path and reduces the overall volume accordingly.

The water collection portion 1 is a portion which is attached to a heat generation portion such as a CPU of an electronic apparatus and receives heat from the heat generation portion and performs heat exchange with the heat generation portion, and is called a jacket or the like. 1, the lower surface of the water receiver 1 is provided close to the upper surface of the heat generating portion. In the water storage portion 1, there is a space through which the cooling liquid flows. The water collection portion 1 is connected to the pump 2 by a pipe 6a. One end of the pipe 6a is connected to a part of the side surface of the water receiver 1, and another end of the pipe 6c is connected to the other part. The direction 101 indicates the direction in which the cooling liquid flows in the pipe 6a. The direction 102 indicates the direction in which the cooling liquid flows in the pipe 6c.

The pump (2) circulates a liquid, which is a refrigerant, as a cooling liquid in a path including the pipe (6). The pump 2 is connected to the radiator 4A of the heat dissipating module 8 by a pipe 6b. The other end of the pipe 6a is connected to a part of the upper surface of the pump 2 and the other end of the pipe 6b is connected to the other part.

In the heat dissipating module 8, the fan 5, the heat radiating portion 40, and the tank 3 are arranged in parallel in the X-Y plane so as to be accommodated in the plate-shaped region having a constant thickness in the Z direction. The thickness of the heat dissipation module 8 in the Z direction is, for example, about 12 mm. In the heat dissipating module 8, the path is connected from the piping 6b to the piping 6c in the order of the radiator 4A, the tank 3, and the radiator 4B.

The fan (5) promotes heat dissipation in the heat radiation portion (4) by intake and exhaust. The fan 5 is a blower fan and performs intake by at least one of the upper side and the lower side in the Z direction, and basically performs exhaust in the entire direction of the X-Y plane. The exhaust from the fan 5 flows out to the outside through the inside of the radiator 4 of the heat dissipating unit 40. The fan 5 has a generally rectangular flat plate shape in plan view as seen from the Z direction.

A plurality of heat radiators (4) of the heat radiating portion (40) are arranged adjacent to the fan (5) in the XY plane. In the first embodiment, two heat radiators 4 of the heat radiating portion 40 are disposed in the vicinity of the two sides of the fan 5 in the X direction and the Y direction. The radiator 4A is arranged in a region close to one side face of the fan 5 in the X direction. The radiator 4B is disposed in an area close to one side of the fan 5 in the Y direction. The radiator 4 is not disposed on the other two side surfaces of the fan 5.

In the heat radiating portion 40, the radiator 4A and the radiator 4B, which are the radiator 4, are radiators and perform heat exchange for radiating the heat of the cooling liquid to the outside. The radiator 4 has a rectangular planar shape in plan view as viewed in the Z direction. The radiator 4A is long in the Y direction and the radiator 4B is long in the X direction. The radiator 4 includes, as will be described later, a tube portion through which the cooling liquid flows in the housing, a fin contacted with the tube portion, and the like.

The tank 3 is a portion having a function of storing a cooling liquid in order to sufficiently supply and maintain the cooling liquid from the beginning in preparation for reduction due to volatilization of the cooling liquid in the path and the like, and is a cooling liquid accumulating portion. The tank 3 has a predetermined volume for accumulating the cooling liquid. The tank 3 is disposed at an edge portion between the radiator 4A and the radiator 4B. The tank 3 physically connects the radiator 4A and the radiator 4B. The tank 3 constitutes a part of the path. The corner portion is the corner portion for the fan 5 in the X-Y plane, and the corner portion in the heat dissipating module 8 and the integral portion 7. The tank 3 has a flat plate shape that is square in a plan view seen from the Z direction.

The piping 6 is an element constituting a flow path for connecting the components such as the water receiver 1 and the like and circulating the cooling liquid. The pipe 6 is made of a tube made of a polymer material such as rubber or plastic and has flexibility. The piping 6 is disposed such that it is bent properly within a mountable space of the electronic apparatus.

Further, in the modified example, the pipe 6 may be made of a metal material having rigidity and not having flexibility. As the pipe 6, a combination of a metal material part and a polymer material part may be used. For example, in the case where the cooling liquid leakage preventing performance is emphasized at the connection position with the components such as the pump 2, piping made of metal material parts may be used at the connection position.

[Path of Coolant]

The cooling liquid is a predetermined liquid containing water or another substance as a refrigerant, and is an antifreeze liquid having properties such as corrosion prevention as well as cooling characteristics.

The path of the cooling liquid is as follows. The path is branched from the water collection part 1 in the same order as the piping 6a, the pump 2, the pipe 6b, the radiator 4A, the tank 3, the radiator 4B and the pipe 6c, 1).

The cooling liquid heated by the heat exchange in the water storage portion 1 flows to the pump 2 through the pipe 6a and flows from the pump 2 to the radiator 4A through the pipe 6b by the action of the pump 2. [ Lt; / RTI > The cooling liquid flowing into the radiator 4A flows into the tank 3 while cooling through the pipe portion in the radiator 4A. The cooling liquid introduced into the tank 3 flows into the radiator 4B. The cooling liquid introduced into the radiator 4B flows out of the radiator 4B while flowing through the tube portion of the radiator 4B. The discharged cooling liquid returns to the water collection portion 1 through the pipe 6c.

In the first embodiment, the basic policy of the path design of the cooling liquid is as follows. The tank 3 is incorporated in the heat dissipating module 8, and there is no independent tank 93 as in the comparative example. The pipings 96 (96b and 96c) on both sides of the tank 93 of the comparative example are integrated into one pipe 6b in the first embodiment. On both sides of the tank 3 of the first embodiment. Is not a pipe 6 but a radiator 4. In the heat dissipating module 8, there is a tank 3 between the two radiators 4, and the tank 3 is followed by the radiator 4B. Therefore, the cooling liquid cooled by the radiator 4B is supplied to the water storage portion 1. In the first embodiment, the number of parts is smaller and the connection position by the piping is smaller than that of the conventional liquid cooling type cooling device, and the total length of the piping can be reduced.

[Example of mounting configuration]

Fig. 2 shows an example of the mounting configuration of the liquid-cooling type cooling device according to the first embodiment of Fig. 1, and shows the configuration of the liquid-cooling type cooling device in a case where a system is constituted by high- The space 10 is a roughly flat plate-shaped space including the entire liquid-cooled cooling apparatus. The electronic device to be mounted is thin like a notebook PC or the like, and the space that can be mounted is the flat plate-shaped space 10. The liquid-cooling type cooling apparatus of the first embodiment is capable of high-density mounting in this space 10. The liquid cooling type cooling apparatus of the first embodiment and the electronic apparatus for mounting the same can realize a thin shape. The total volume of the system including the liquid-cooled cooling apparatus and the electronic apparatus is relatively small.

In the example of the mounting configuration of Fig. 2, the component is contained in the space 10 in a predetermined thickness in the Z direction. In the case of the plan view viewed from the Z direction, the heat dissipating module 8 and the pipe 6c are contained in the region of one half of the Y direction, for example, in the X-Y plane as the main plane. The water collection portion 1, the pipe 6a, the pump 2, and the pipe 6b are contained in the other half region in the Y direction. In the other half area in the Y direction, the water collection part 1 is arranged in one area in the X direction and the pump 2 is arranged in the other area in the X direction. In Fig. 2, the pump 2 is of a thin type so as to have a thickness in the Z direction. The pipe 6a is arranged in a bent form. The piping 6b is arranged in a linear shape of a short length. The pipe 6c is arranged in a straight line. The components are disposed such that the total length of the pipe 6 is minimized.

As an example of the mounting configuration of the liquid-cooled cooling device, various modifications are possible according to the configuration of Fig. 1 in accordance with the configuration of the electronic device. The positional relationship of the water receiver 1, the pump 2, and the heat dissipation module 8 can be changed. The position of the connection port between the radiator 4 and the pipe 6 and the length and shape of the pipe 6 can be changed.

[Heat dissipation module 1]

3 is a perspective view showing the configuration of the heat dissipating module 8 in the liquid cooling type cooling apparatus according to the first embodiment of Fig. The fan 5 sucks in at least one of upward and downward from the shaft portion 51 in the Z direction. Air by intake air is exhausted from the shaft portion 51 toward the entire side in the X-Y plane, toward the side surface of the fan 5. The exhaust direction of the fan 5 includes a direction 301 and a direction 302. The exhaust in the direction 301 is exhaust toward one side in the X direction from the shaft portion 51 and passes through the first side of the fan 5 and the radiator 4A. The exhaust in the direction 302 is exhaust toward one side in the Y direction from the shaft portion 51 and passes through the second side of the fan 5 and the radiator 4B. Of the four side faces of the fan 5, the first side face on one side in the X direction and the second side face on the other side in the Y direction are opened to allow exhaust. Of the four side faces of the fan 5, the third side face on the other side in the X direction and the fourth side face on the other side in the Y direction are closed sides so as not to exhaust the exhaust gas.

One end of the radiator 4A in the Y direction has an inlet 41A and the other end of the pipe 6b is connected to the connection port 42A of the inlet 41A. One side of the tank 3 is joined to the opposite end of the radiator 4A in the Y direction. One end of the radiator 4B in the X direction has an outflow portion 41B and the other end of the pipe 6c is connected to the connection port 42B of the outflow portion 41B. The other side of the tank 3 is joined to the opposite end of the radiator 4B in the X direction.

In the radiator 4, the side surface close to the side surface of the fan 5 is open for passing the exhaust gas. The side surface of the radiator 4A is close to the first side surface of the fan 5. The side surface of the radiator 4B is close to the second side surface of the fan 5.

The radiator 4A and the radiator 4B are components having the same shape, and their placement directions are different. The radiator 4A is a first radiator, and is arranged as a rectangular parallelepiped extending in the Y direction. The radiator 4B is arranged as a rectangular parallelepiped extending in the X direction in the second radiator. The radiator 4A is provided with an inflow portion 41A because the coolant flows into the inflow portion 41A. The radiator 4B is provided with the outflow portion 41B since the coolant flows out.

An inlet 41A is joined to one end of the housing in the Y direction of the radiator 4A and one side of the tank 3 is connected to the other end. The outflow portion 41B is joined to one end portion of the housing of the radiator 4B in the X direction and the other side surface of the tank 3 is joined to the other end portion.

The inflow portion 41A is a portion for introducing the cooling liquid from the pipe 6b into the tube portion in the housing of the radiator 4A. The connection port 42A of the inflow section 41A is provided at a position facing the Y direction. The outflow portion 41B is a portion for allowing the cooling liquid from the pipe portion in the housing of the radiator 4B to flow out to the pipe 6c. And the connection port 42B of the outflow portion 41B is provided at a position facing the X direction.

At the connection positions of the respective components and the pipe 6 including the connection between the connection port 42A and the pipe 6b and the connection between the connection port 42B and the pipe 6c, The connection is made by sealing or the like.

3, the connection port 42B of the outflow portion 41B of the radiator 4B is provided in the X direction. 2, the connection port 42B of the outflow portion 41B of the radiator 4B is provided in the Y direction in consideration of the high density mounting, in the example of the mounting structure of the heat dissipation module 8 . Thus, the position of the connection port and the like can be appropriately changed depending on the mounting.

[Heat dissipation module 2]

4 is a plan view showing the definition of a region and the like for the purpose of describing the liquid cooling type cooling apparatus of the first embodiment. Fig. 4 shows a region around the region corresponding to the fan 5 of the heat dissipating module 8 at the center in the X-Y plane. Further, such a region has a constant thickness in the Z direction.

The outline of the fan 5 in the plan view is a square here. The exhaust in the entire direction from the shaft portion 51 of the fan 5 is indicated by an arrow. On one of four sides of the outer shape of the fan 5, one side in the X direction is referred to as a first side, the other side is referred to as a third side, one side in the Y direction is referred to as a second side, Four sides.

There is a quadrangular-rim region around the fan 5. This edge shape region has four side regions and four corner portions. In the region of the rim shape, a region close to the first side face of the fan 5 is defined as a first side region. Likewise, the region adjacent to the second side is referred to as the second side region, the region adjacent to the third side as the third side region, and the region close to the fourth side as the fourth side region. The first side area and the third side area opposed thereto are rectangular areas having long sides in the Y direction. The second side area and the opposed fourth side area are rectangular areas having long sides in the X direction.

And has a first corner portion at the upper right position with respect to the region of the fan 5, between the first side region and the second side region. And a second corner portion at a lower right position with respect to the region of the fan 5, between the second side region and the third side region. And a third corner portion at the lower left position with respect to the region of the fan 5, between the third side region and the fourth side region. And has a fourth corner portion at the upper left position with respect to the region of the fan 5, between the fourth side region and the first side region.

The first side area is bent in the X direction at 90 degrees from the Y direction via the first corner, and is connected to the second side area. The second side area is bent in the Y direction at 90 degrees from the X direction via the second corner, and is connected to the third side area. The third side area is bent in the Y direction at 90 degrees from the X direction via the third corner, and is connected to the fourth side area.

[Heat dissipation module 3]

Fig. 5 schematically shows the configuration in the X-Y plane in the case of the plan view seen from the Z direction as the main plane of the heat dissipation module 8 of Fig. The exhaust in the direction 301 in the X direction of the fan 5 comes out of the first side which is the opening and flows into the side of one opening of the radiator 4A in the first side area. The exhaust passes through the tube portion 43A of the radiator 4A and the fins to be air-cooled and flows out to the outside from the side of the other opening of the radiator 4A. The exhaust in the direction 302 in the Y direction of the fan 5 comes out from the second side which is the opening and flows into the side of one opening of the radiator 4B in the second side area. The exhaust passes through the tubular portion 43B of the radiator 4B and the fin to be air-cooled and then flows out to the outside from the side of the other opening of the radiator 4B.

On the four sides of the fan 5, on the other hand, the two side surfaces, i.e., the third side and the fourth side, on which the radiator 4 is absent, are blocked by the wall portion 52. With respect to these two sides, the exhaust in the direction including the direction 303 and the direction 304 is controlled to be changed by the wall portion 52. The thus controlled exhaust is converted into exhaust in the first lateral direction 301 and the second lateral direction 302, which are the two sides of the opening.

The configuration of the fan 5 is not limited to the above configuration. As the liquid cooling device of the modified example, all four sides of the fan 5 may be formed as the sides of the opening.

The coolant flows from the connection port 42A of the inflow portion 41A of the radiator 4A and flows into the tube portion 43A of the radiator 4A as indicated by the direction 311 and flows into the tank 3 do. The cooling liquid flows from the inside of the tank 3 into the pipe section 43B of the radiator 4B and flows through the pipe section 43B and flows from the connection port 42B of the outlet section 41B of the radiator 4B in the direction 312 ), As shown in FIG. 5, the connection port 42B of the outflow portion 41B is provided at a position facing the Y direction in correspondence with Fig.

[All in one]

6 is a perspective view showing the configuration of the integral part 7 which is a part of the heat dissipation module 8 of Fig. 3 except for the fan 5. Fig. In Fig. 6, a part of the outer shape is removed so that the inside of the tank 3 can be seen. The portion including the radiator 4A, the tank 3 and the radiator 4B is referred to as the integral portion 7 in the sense of the radiator-tank integral component which is a component in which the radiator 4 and the tank 3 are integrated.

According to the plan view, the integral portion 7 has the following shape as a first shape in the X-Y plane. The first shape of the integral portion 7 is a shape of a region including the first side region, the first corner portion, and the second side region in Fig. 4 in the region around the fan 5. In other words, the first shape of the integral part 7 is an L-shaped one bent at 90 degrees.

The upper and lower surfaces of the radiator 4A in the Z direction are side plates which are closed housings. A tube portion 43A extending in the Y direction is disposed in the housing of the radiator 4A. The tube portion 43A is a flat tube having a generally flat shape in the X-Y plane. At one side end of the radiator 4A in the Y direction, one end of the tube portion 43A passes through and comes to the side of the inflow portion 41A. At the side of the other end of the radiator 4A in the Y direction, the other end of the tube portion 43A penetrates to the side of one end of the tank 3. In other words, the other open end of the tube portion 43A is provided on one side surface of the tank 3 facing the Y direction.

Likewise, the upper and lower surfaces of the radiator 4B in the Z direction are side plates which are closed housings. A tube portion 43B extending in the X direction is disposed in the housing of the radiator 4B. The tube portion 43B is a flat tube having a generally flat plate shape in the X-Y plane. At one side end of the radiator 4B in the X direction, one end of the tube portion 43B penetrates through the side surface of the outflow portion 41B. At the side of the other end of the radiator 4B in the X direction, the other end of the tube portion 43B penetrates to the other side of the tank 3. In other words, the other side surface of the tank 3 facing the X direction has the other open end of the tube portion 43B.

The tube portion 43A and the tube portion 43B are arranged at the center positions of the radiator 4 and the tank 3 in the Z direction. The positions of the tube portion 43A and the tube portion 43B in the Z direction can be applied without being limited thereto. For example, the arrangement position of the tube portion 43A and the tube portion 43B in the Z direction may be a position lower than the center position. This position is appropriately designed in consideration of the amount of the cooling liquid and the like.

In the housing of the radiator 4A, the fins 44A are arranged on the upper side and the lower side in the Z direction with respect to the tube portion 43A. The fin 44A has a waveform shape viewed from the side X direction, and has a plurality of waveform portions in the Y direction. The fins 44A can be formed by, for example, processing a flat plate into a waveform. Then, the fin 44A has a surface area for increasing air cooling efficiency. The radiator 4B also has a fin 44B of the same construction. The fins 44A and fins 44B are not limited to such a configuration and can be applied. For example, a configuration in which a plurality of protrusions are formed on the surface of the housing or the tube portion of the radiator 4 may be employed.

The integral part (7) is mostly composed of one part by integral molding or the like as a manufacturing method. The housing, the inlet portion 41A, the tube portion 43A and the fins 44A of the radiator 4A can be constituted by one piece by integral molding. Likewise, the housing, the outflow portion 41B, the tube portion 43B and the fins 44B of the radiator 4B can be constituted by one piece by integral molding. In addition, the radiator 4A, the radiator 4B, the tank 3, and the like can be integrally formed with the integral part 7 as one component. The integral part 7 can be formed by integral molding using a metal such as aluminum, for example.

The joining portion of the radiator 4 and the tank 3 and the joining portion of the radiator 4A and the inlet portion 41A have a high effect of preventing leakage of the cooling liquid when the manufacturing method of integral molding is used.

The inside of the tank (3) is a substantially rectangular parallelepiped space, and has a space having a sufficient volume to store the cooling liquid. In the tank 3, the cooling liquid is accumulated at least to a position higher than the center position in the Z direction. The tank 3 includes a space portion having a coolant and a space portion having air thereon.

Since the tank 3 is disposed between the radiator 4A and the radiator 4B, the tank 3 is affected by the cooling in the fan 5 and the radiator 4, Or more. That is, the tank 3 also has a certain degree of heat radiation function. The integral structure 7 contributes to the improvement of the cooling performance.

[Radiator]

7 and 8 show the structure of the radiator 4 constituting the radiator 40 among the radiator modules 8 of Fig. Fig. 7 particularly shows the configuration of the radiator 4B corresponding to the example of the mounting configuration of Fig. Fig. 7 is a perspective view of the radiator 4B when viewed from the outlet 41B side. 7, the connection port 42B of the outflow portion 41B is provided at a position facing the Y direction from the side surface of the outflow portion 41B. Fig. 8 shows a configuration of the side surface of the opening of the radiator 4B in Fig. 7 as an X-Z plane configuration.

The radiator 4 has a housing 45, an inflow or outflow section 41, a connection port 42, a tube section 43, and a fin 44. 7, the radiator 4B has a housing 45B, an outlet 41B, a connection port 42B, a tube portion 43B, and a fin 44B.

Though not shown, the physical configuration of the radiator 4A is the same as that of the radiator 4B, and thus the description thereof is omitted. The radiator 4A has a housing 45A, an inlet 41A, a connection port 42A, a tube portion 43A, and a fin 44A.

The housing 45B includes upper and lower side plates in the Z direction and both side surfaces in the X direction, and both side surfaces in the Y direction are openings. In the housing 45B, a tube portion 43B, which is a flat tube at a central position in the Z direction, is arranged so as to extend in the X direction. In the housing 45B, warps 44B are arranged above and below the tube portion 43B in the Z direction. At both side surfaces in the X direction, both ends of the tube portion 43B penetrate.

And the outflow portion 41B is joined to the side surface of one end of the housing 45B. The outflow portion 41B has a rectangular parallelepiped shape, and the size in the Y direction and the Z direction is the same as that of the housing 45B. The outflow portion 41B is provided with a connection port 42B on one side. On the side surface of the outflow portion 41B which is joined to the housing 45B, one open end of the tube portion 43B is provided at the center position in the Z direction.

In the outflow portion 41B, there is a space in which the cooling liquid can exist. The cooling liquid flowing from the tank 3 into the tube portion 43B flows in the tube portion 43B in the X direction and flows into the outlet portion 41B and flows out to the pipe 6c through the connection port 42B. Since the exhausted portion in the direction 302 flows upward and downward in the Z direction in the tubular portion 43B, heat radiation is promoted by heat exchange and the cooling liquid is cooled. Since the tube portion 43B is in contact with the fins 44B on the upper surface and the lower surface in the Z direction, the heat radiation is promoted by the heat conduction.

The flat pipe used as the tube portion 43A and the tube portion 43B can have higher cooling performance than a tube having a circular section. Also, the connection of the flattened tube to the fins 44, that is, physical bonding or contact, is also easy. The tube 43 is not limited to a flat tube but may be a tube having a circular cross section as a modified example. Further, in this case, a plurality of pipes are arranged in the housing of the radiator 4.

The general characteristics of the heat dissipation performance of the radiator as the radiator 4 will be described as follows. The temperature of the refrigerant flowing into the radiator 4 is T1 and the ambient temperature of the radiator 4 is T2. The temperature difference between the temperature T1 and the temperature T2 is referred to as? T (? T = | T2-T1 |). The larger the temperature difference? T, the higher the heat dissipation performance and the cooling efficiency.

[Effects, etc.]

According to the liquid-cooling type cooling apparatus of the first embodiment as described above, it is possible to realize high cooling performance, miniaturization and thinning of equipment, and high-density mounting of electronic equipment. In the case of constructing a system by mounting the liquid cooling type cooling apparatus of the first embodiment to an electronic apparatus such as a notebook PC, the volume of the whole is small with high cooling performance, so that a thin high density mounting can be realized. Such an electronic apparatus not only can realize thinness, but also can sufficiently exhibit the capabilities of a CPU or the like. The liquid-cooling type cooling apparatus of the first embodiment is particularly suited for mounting in electronic equipment such as a notebook PC because the thickness in the Z direction can be made thinner.

In the first embodiment, a thin high-density mounting can be realized by using the heat dissipation module 8 having a thin flat plate as a portion including the fan 5, the heat radiation portion 40, and the tank 3. [ In the first embodiment, the tank 3 is provided as a part of the heat dissipation module 8. This makes it unnecessary to independently install the tank 93 in the middle of the pipe 96 connecting, for example, the pump 92 and the heat dissipating unit 94, as in the comparative example. Therefore, in the first embodiment, the number of components and the total length of the piping can be reduced, and the volume of the entire apparatus can be reduced, and the cost can be reduced. Piping between the radiator 4 and the tank 3 is unnecessary by the integral part 7, and volatilization and leakage of the cooling liquid can be reduced by reducing piping. This also contributes to a reduction in the volume required for the tank 3.

As a modified example, an independent tank 93 may be provided separately from the tank 3 of the heat dissipating module 8. [ In this case, since the volume required for the cooling liquid can be separated into the tank 3 and the tank 93, the volume of the independent tank 93 can be reduced.

In the first embodiment, the tank 3 is provided at the corner between the plurality of radiators 4. Accordingly, in the first embodiment, unlike the comparative example, a part of the exhaust gas from the fan 5 hits the side surface of the tank 3, so that the cooling performance can be improved.

[Comparison with prior art example]

The effect specific to the liquid cooling type cooling device of the first embodiment will be supplemented by comparison with the cooling device of the prior art example such as Patent Document 1.

In the cooling device of Patent Document 1, a tank is provided on one side of the fan in the middle of the piping between the radiator, the heat receiver and the pump. In the cooling device of Patent Document 1, there are two radiators around the fan, and only pipes are arranged at corner portions between the two radiators. Two bent pipes are arranged at the corners. The pipe at this corner has only a function of transporting the coolant. That is, the corner portion has a dead space and is not effectively used effectively. In this corner portion, the performance of accumulation and heat radiation of the cooling liquid is low. The volume of this corner portion is also a square space in terms of mounting density.

On the other hand, in the liquid-cooling type cooling apparatus of the first embodiment, the tank 3 is provided in a space corresponding to the corner portion between the two radiators 4, and the space of this corner portion is effectively utilized. And the space of the corner portion has a function of accumulating cooling liquid and heat radiation. The volume of the corner portion is effectively used also from the viewpoint of thinned high-density packaging.

The cooling device of Patent Document 1 has a structure in which a fan and a tank are integrated. On the other hand, the first embodiment has a structure in which the radiator 4 and the tank 3 are integrated as the integral part 7. The integral part (7) is simple in shape and structure, and is easy to manufacture, as compared with a configuration in which the fan and the tank are integrated.

In the cooling device of Patent Document 1, the water collection portion and the tank are disposed at positions relatively close to each other. On the other hand, in the first embodiment, the water collection portion 1 and the tank 3 are disposed at a further apart position. The tank 3 is less affected by heat generation near the water receiver 1, and the cooling liquid in the tank 3 is hard to be heated. Therefore, it is also advantageous in terms of cooling performance.

In the cooling device of Patent Document 1, since the fan and the tank are integrally close to each other, if there is leakage of the cooling liquid from the tank, there is a fear of causing an electrical failure to the drive circuit of the fan. On the other hand, in the first embodiment, the radiator 4 and the tank 3, which are parts for handling liquids, are integrally formed, and the fan 5 and the tank 3 are separate parts. Therefore, in the first embodiment, even if the cooling liquid leaks from the tank 3, there is a low possibility that the driving circuit of the fan 5 causes an electrical failure or the like. That is, reliability can be enhanced.

In the cooling device of Patent Document 1, a tank is integrally disposed on a part of the side surface of the fan. Therefore, a component such as a radiator can not be disposed at the side of the fan. That is, the configuration of Patent Document 1 is disadvantageous when it is desired to realize a high cooling performance by using a large number of radiators. On the other hand, in the first embodiment, the heat radiating portion 40 is disposed around the fan 5, and the tank 3 is disposed at the corner portion. Some side surfaces of the fan 5 are empty. As in other embodiments described later, the required number and quantity of radiators 4 can be disposed around the fan 5 in accordance with the required cooling performance, and the degree of freedom is high. Further, the various tanks 3 may be arranged accordingly, or the volume of the entire tank, that is, the accumulating amount of the cooling liquid may be increased.

In the cooling device of Patent Document 1, the path of the cooling fluid is composed of two radiators, a pipe, a tank, a water receiver, and a pump in that order. On the other hand, in the first embodiment, the path of the cooling liquid is in the order of the radiator 4A, the tank 3, the radiator 4B, the pipe 6c, and the water receiver 1 in this order. In other words, as described above, the cooling water is cooled by the radiator 4B after the tank 3, and is returned to the water collection portion 1. From the difference in the path, the first embodiment is advantageous in terms of cooling performance.

[Modifications]

As a modification of the first embodiment, the following is possible. The integral part 7 is not limited to the integral molding production method, and various configurations are applicable. The integrally formed portion 7 may be constituted by joining of these components, in which the radiator 4A, the tank 3 and the radiator 4B are manufactured or prepared as discrete components, respectively. Also, the radiator 4 can be manufactured or prepared as individual components such as the housing 45, the tubular section 43, the fins 44, the inflow section or the outflow section 41, .

It is also possible to provide another connecting part corresponding to the inflow part or the outflow part at the joining position of the radiator 4 and the tank 3 in the integral part 7. Such a connecting part may be a part of the radiator 4 or a part of the tank 3. The joining position of each component is not limited to the integral molding, and means such as screw fixing may be applied.

(Second Embodiment)

Referring to Figs. 9 and 10, a liquid-cooling type cooling apparatus according to a second embodiment of the present invention will be described. The basic configuration of the second embodiment is the same as that of the first embodiment. Hereinafter, constituent parts different from the first embodiment in the second embodiment will be described. The second embodiment shows a modification of the heat dissipation module 8 of the first embodiment.

[Heat dissipation module 1]

FIG. Showing a configuration of the heat dissipation module 8 of the liquid cooling type cooling apparatus of the second embodiment. The heat dissipation module 8 of the second embodiment has a configuration in which the number of the radiator 4 and the tank 3 is increased as compared with the first embodiment. The heat dissipation module 8 of the second embodiment has the heat dissipation portion 40 and the tank portion 30 around the fan 5. [ Three radiators 4 constituting the radiator 40 include a radiator 4A, a radiator 4B and a radiator 4C. As the two tanks constituting the tank portion 30, there are a tank 3A and a tank 3B. Each of the radiator 4 and the tank 3 are arranged alternately. The other constituent elements of the second embodiment are the same as those of the first embodiment.

The integrally formed portion 7 has, in the X-Y plane, a second shape as follows. The second shape of the integrally formed portion 7 is a shape bent at 90 degrees twice in the region of the square rim around the fan 5, in other words, a shape having three sides with one side of the square removed. The integral part 7 is connected and disposed in the order of the radiator 4A, the tank 3A, the radiator 4B, the tank 3B, and the radiator 4C.

In the first side region close to the first side of the fan 5, a radiator 4A which is a first radiator is disposed. And is connected to a second side region extending in the X direction from the first side region extending in the Y direction through the first corner portion at 90 degrees. In the second side region close to the second side of the fan 5, a radiator 4B, which is a second radiator, is disposed. A tank 3A, which is a first tank, is disposed at a first corner between the first side region and the second side region.

And is connected to a third side area that is bent at 90 degrees from the second side area through the second corner and extends in the Y direction. In the third side region close to the third side of the fan 5, a radiator 4C, which is a third radiator, is disposed. A tank 3B, which is a second tank, is disposed at a second corner portion between the second side region and the third side region.

The side surface of one end of the radiator 4A has an inflow portion 41A and the inflow portion 41A has a connection port 42A. As indicated by the direction 311, the cooling liquid flows from the connection port 42A. One end of the radiator 4C has an outflow portion 41C and the outflow portion 41C has a connection port 42C. As indicated by the direction 312, the cooling liquid flows out from the connection port 42C. A pipe 6c is connected to the connection port 42C. The side surface of one end of the radiator 4B is joined to one side surface of the tank 3B in the X direction. The other side surface of the tank 3B in the Y direction is joined to the side surface of the other end of the radiator 4C.

[Heat dissipation module 2]

Fig. 10 shows a configuration of the X-Y plane which is the main plane of the heat dissipation module 8 of Fig. The cooling liquid flows into the tank 3B via the radiator 4A, the tank 3A, and the radiator 4B. The cooling liquid flows into the tube portion 43C of the radiator 4C from the inside of the tank 3B. The cooling liquid flows into the outlet portion 41C while flowing through the tube portion 43C of the radiator 4C and cooled. The cooling liquid flows out from the connection port 42C of the outlet 41C to the pipe 6c.

The radiator 4 and the like are not disposed on the fourth side surface of the fan 5. [ On the fourth side face of the fan 5, a wall portion 52 is formed and closed so as not to exhaust the exhaust gas. The exhaust of the fan 5 in the direction 304 from the shaft portion 51 is blocked by the wall portion 52 and the direction is controlled so that the exhausted air in the direction 301 or the direction 303 corresponding to the X direction .

The direction 301, the direction 302, and the direction 303 as the exhaust direction of the fan 5 in the X-Y plane. The direction 303 is the exhaust toward the other side in the X direction which is the direction opposite to the direction 301. The exhaust in the direction 303 exits from the third side of the opening of the fan 5 and flows into the side of one opening of the radiator 4C. The exhaust gas flows out from the side of the other opening of the radiator 4C to the outside while cooling the tube portion 43C and the fins 44C in the radiator 4C.

[Effects, etc.]

According to the liquid-cooling type cooling apparatus of the second embodiment as described above, it is possible to achieve high cooling performance, miniaturization and thinning of equipment, and high-density mounting of electronic equipment as in the first embodiment. Since the second embodiment has more radiators 4 than the first embodiment, it is possible to further increase the cooling performance instead of increasing the mounting volume. Since the second embodiment has more tanks 3 than the first embodiment, it is possible to increase the accumulation amount of the cooling liquid instead of increasing the mounting volume. Further, the increase in the mounting volume can be increased without difficulty according to the area of the mountable space of the electronic apparatus by suppressing the increase in the area in the X-Y plane direction.

(Third Embodiment)

A liquid cooling type cooling apparatus according to a third embodiment of the present invention will be described with reference to Fig. The basic configuration of the third embodiment is the same as that of the first embodiment. Hereinafter, in the third embodiment, constituent parts different from the first embodiment will be described. The third embodiment shows a modification of the heat dissipation module 8 of the first embodiment.

[Heat dissipation module]

11 shows the X-Y plane configuration, which is the main plane of the heat dissipation module 8 of the liquid cooling type cooling apparatus of the third embodiment. The heat dissipation module 8 of the third embodiment has a configuration in which the number of the radiator 4 and the tank 3 is increased more than in the second embodiment. The heat dissipation module 8 of the third embodiment has a heat dissipation portion 40 and a tank 30 around the fan 5. The radiator 4A, the radiator 4B, the radiator 4C, and the radiator 4D are the four radiators 4 constituting the radiating portion 40. [ The tanks 3A, 3B, and 3C are the three tanks that constitute the tank section 30. [

The integral part 7 has the following shape in the X-Y plane as follows. The third shape of the integral part 7 is a shape bent at 90 degrees three times in the region of the square rim around the fan 5, in other words, a shape having four sides of a quadrangle. The integral part 7 is connected and arranged in the order of the radiator 4A, the tank 3A, the radiator 4B, the tank 3B, the radiator 4C, the tank 3C, and the radiator 4D.

The configurations of the heat radiator 4A, the tank 3A, the radiator 4B and the tank 3B in the integrated portion 7 are the same as those in the second embodiment. And is connected to a fourth side area extending in the X direction from the third side area extending in the Y direction by 90 degrees through the third corner part. A radiator 4D, which is a fourth radiator, is disposed in a fourth side region close to the fourth side face of the fan 5. [ A tank 3C, which is a third tank, is disposed at a third corner portion between the third side region and the fourth side region.

One side of the tank 3C in the Y direction is joined to the side surface of the other end of the radiator 4C. The side surface of the other end of the radiator 4D is joined to the other side surface of the tank 3C in the X direction. The radiator 4D has an outlet 41D at the side of one end and a connection port 42D at the outlet 41D. As indicated by the direction 312, the cooling liquid flows out from the connection port 42D. A pipe 6c is connected to the connection port 42D. In Fig. 11, a connection port 42D is provided at a position facing the Y direction on one side of the outflow section 41D.

11, the inflow portion 41A is contained in the first side region, the outflow portion 41D is contained in the fourth side region, and the constituent elements are arranged in the fourth corner portion.

The cooling liquid flows into the tank 3C via the radiator 4A, the tank 3A, the radiator 4B, the tank 3B, and the radiator 4C. The cooling liquid flows into the pipe portion 43D of the radiator 4D from the inside of the tank 3C. The cooling liquid flows through the tube portion 43D of the radiator 4D and flows into the outlet portion 41D while being cooled. The cooling liquid flows out from the connection port 42D of the outlet portion 41D to the pipe 6c.

A radiator (4) is disposed on all four sides of the fan (5). Four sides of the fan 5 are open. And includes a direction 304 in the direction of exhaust from the shaft portion 51 of the fan 5. The direction 304 is the exhaust toward the other side in the Y direction which is the opposite direction of the direction 302. The exhaust in the direction 304 exits from the fourth side which is the opening of the fan 5 and flows into the side of one opening of the radiator 4D. The exhaust gas flows out from the side of the other opening of the radiator 4D to the outside while cooling the tube portion 43D and the fins 44D in the radiator 4D.

[Effects, etc.]

According to the liquid-cooling type cooling apparatus of the third embodiment as described above, it is possible to achieve high cooling performance, miniaturization and thinning of equipment, and high-density mounting of electronic equipment as in the first embodiment. Since the third embodiment has more radiators 4 than the second embodiment, it is possible to further increase the cooling performance instead of increasing the mounting volume. Since the third embodiment has more tanks 3 than the second embodiment, it is possible to increase the accumulation amount of the cooling liquid instead of increasing the mounting volume.

The following modifications are possible as modifications of the first to third embodiments. The tank 3 is applicable without being limited to a rectangular shape in plan view. The tank 3 may have a tapered shape by a straight line or a curved line on the side surface farther from the fan 5 in the plan view. Further, the tank 3 may be triangular in plan view, or may have a fan shape of four quarters.

The shape of the integrally formed portion 7 is not limited to a shape having a plurality of sides among the rims of a quadrangle, and may be a shape having a plurality of sides among the rims of a polygon such as a hexagon.

As a modified example, the integral unit 7 may have the following configuration. A component obtained by joining one radiator (4) and one tank (3) is manufactured or prepared as one unit component. A plurality of unit parts are prepared according to the necessary cooling performance and are joined together to constitute the integral part 7 of the second embodiment or the third embodiment, for example. In this case, various kinds of mounting configurations can be relatively easily realized based on the same unit parts.

(Fourth Embodiment)

The liquid-cooled cooling apparatus according to the fourth embodiment of the present invention will be described with reference to Fig. The basic configuration of the fourth embodiment is the same as that of the first embodiment. Hereinafter, constituent parts different from the first embodiment in the fourth embodiment will be described. The fourth embodiment shows a modification of the heat dissipation module 8 of the first embodiment.

[Heat dissipation module]

12 shows the X-Y plane configuration, which is the main plane of the heat dissipation module 8 of the liquid cooling type cooling apparatus of the fourth embodiment. The heat dissipation module 8 of the fourth embodiment differs from the first embodiment mainly in the configuration of the integral part 7 in the vicinity of the tank 3 mainly. The integral part 7, like the first shape, is generally L-shaped and has a radiator 4A, a tank 3D and a radiator 4B. A radiator 4A is disposed in a first side area close to the first side of the fan 5 and a radiator 4B is disposed in a second side area close to the second side. A tank 3D is disposed between the radiator 4A and the radiator 4B at the first corner.

The tank 3D has a curved shape including a side surface 401 and a side surface 402 of a curved surface in the shape of a top view of the X-Y plane. The side surface 401 is an inner side surface closer to the fan 5, and has an arc-shaped curved surface of four quarters. The side surface 402 is an outer side surface farther from the fan 5, and has a circular curved surface of a quadrant. The side surface 402 corresponds to a shape provided with a curved surface taper at a right angle corner. The flow of the cooling liquid can be made more smooth by the side surface of the curved surface.

The side surface 401 of the tank 3D is arranged close to one side of the opening of the fan 5. [ This side surface 401 makes contact with part of the exhaust from the fan 5. The exhaust in the diagonally right upper direction 305 from the shaft portion 51 of the fan 5 comes out of one side of the opening and contacts the side surface 401 of the tank 3D, And joins the exhaust in the exhaust or direction 302. Then, the tank 3D has a function of dissipating heat from the cooling liquid to some extent or more.

The tank 3D is larger in size in the X-Y plane than the tank 3 of the first embodiment, and has a large volume. The length of the side in the X direction and the direction in the Y direction corresponds to the distance 1201 and the distance 1202 with respect to the lengths of the sides of the tank 3 in the X direction and the Y direction, . The length of the long sides of the radiator 4A and the radiator 4B is shorter than that of the first embodiment by the distance 1201 and the distance 1202. [

[Effects, etc.]

According to the liquid-cooling type cooling apparatus of the fourth embodiment as described above, it is possible to achieve high cooling performance, miniaturization and thinning of the apparatus, and high-density mounting of electronic apparatuses, as in the first embodiment. In the fourth embodiment, the accumulation amount of the cooling liquid can be increased by the tank 3D, and the heat can be released from the cooling liquid in the tank 3D.

As a modification of the fourth embodiment, the following are possible. The side surface 401 and the side surface 402 of the tank 3 are not limited to the curved surface but may be a side surface having a straight surface inclined at 45 degrees with respect to the X direction and the Y direction. Further, the side surface 401 may be a side surface formed by two straight lines bent at 90 degrees. Further, the distance 1201 and the like may be further expanded to make the area of the side surface 401 larger.

(Fifth Embodiment)

Referring to Fig. 13, a liquid-cooling type cooling apparatus according to a fifth embodiment of the present invention will be described. The basic configuration of the fifth embodiment is the same as that of the first embodiment. Hereinafter, constituent parts different from the first embodiment in the fifth embodiment will be described. The fifth embodiment shows a modification of the heat dissipation module 8 of the first embodiment.

[Heat dissipation module]

13 shows the X-Y plane configuration, which is the main plane of the heat dissipation module 8 of the liquid cooling type cooling apparatus of the fifth embodiment. The heat dissipation module 8 of the fifth embodiment is disposed in the circumferential region around the fan 5 having a circular shape in the plan view and the heat dissipation portion 40 and the tank 3E of the integral portion 7 are arranged. The shape of the integral portion 7 is a shape in which a part of the circumferential region, in other words, the ring-shaped region, is removed. The integral part 7 has a radiator 4A, a tank 3E and a radiator 4B, all of which are generally circular in shape and have a curved side surface.

The radiator 4A and the radiator 4B are disposed in a circumferential region close to one side of the fan 5, respectively. The side surface 1301 of the opening of the radiator 4A is a curved side surface corresponding to the arc. The side surface 1302 of the opening of the radiator 4B is a side surface of a curved surface corresponding to an arc.

The tank 3E is disposed between the radiator 4A and the radiator 4B. The tank 3E is disposed in a circumferential region close to one side of the fan 5. [ The inner side surface 501 of the tank 3E adjacent to one side of the fan 5 is a curved surface side corresponding to an arc.

During the exhaust from the shaft portion 51 of the fan 5, the exhaust in the direction 301 passes through the radiator 4A and the exhaust in the direction 302 passes through the radiator 4B. The exhaust in the direction 305 contacts the side surface 501 of the tank 3E and is divided therefrom into the exhaust in the direction 301 and the direction 302. [ Since the tank 3E comes in contact with the side surface 501 of the exhaust gas, the tank 3E has a heat radiation function to some extent.

On the side surface of the fan 5, a wall portion 52 is provided on a side surface corresponding to a region where the radiator 4 and the tank 3 are not disposed around the fan 5. The exhaust in the direction of the wall portion 52 such as the direction 303 or the direction 304 during the exhaust of the fan 5 is blocked by the wall portion 52 so that the direction is controlled and the direction in which the radiator 4 (301) and the direction (303).

[Effects, etc.]

According to the liquid-cooling type cooling apparatus of the fifth embodiment as described above, it is possible to achieve high cooling performance, miniaturization and thinning of equipment, and high-density mounting of electronic equipment, as in the fourth embodiment. In the fifth embodiment, the outer shape of the heat dissipation module 8 can be made substantially circular, and the exhaust in the entire direction of the fan 5 can be used, so that the cooling performance can be enhanced.

The following is also possible as a modification of the fifth embodiment. The length in the circumferential direction of the radiator 4 or the side surface of the tank 3 can be increased or decreased according to the required performance in the circumferential region around the fan 5. [ For example, the side surface 1301 of the radiator 4A and the side surface 1302 of the radiator 4B are made longer than the state of Fig. 13, so that the integral portion 7 can be made closer to a circular shape. In this case, the inflow portion 41A of the radiator 4A and the outflow portion 41B of the radiator 4B are disposed closer to each other. In addition, for example, the side surface 501 of the tank 3E may be longer than the condition shown in Fig. In this case, the volume of the tank 3E can be increased and the heat radiation function of the tank 3E can be improved.

Further, in the circumferential region around the fan 5, the number of the radiator 4 and the tank 3 as the integrated portion 7 can be further increased. That is, three or more radiators 4 and two or more tanks 3 may be arranged.

(Sixth Embodiment)

Referring to Fig. 14, a liquid cooling type cooling apparatus according to a sixth embodiment of the present invention will be described. The basic configuration of the sixth embodiment is the same as that of the first embodiment. Hereinafter, constituent parts different from the first embodiment in the sixth embodiment will be described. The sixth embodiment shows a modification of the heat dissipation module 8 of the first embodiment.

[Heat dissipation module]

Fig. 14 shows the X-Y plane configuration of the heat dissipation module 8 of the liquid cooling type cooling apparatus of the sixth embodiment, which is the main plane. In the heat dissipation module 8 of the sixth embodiment, the shape of the integral part 7 is a shape having three sides of a rectangular rim bent at 90 degrees twice as in the second embodiment. The integral part 7 has a radiator 4A, a tank 3F, and a radiator 4B.

In the area of the square rim shape around the fan (5). A radiator 4A is disposed in a first side area extending in the Y direction and a radiator 4B is disposed in a third side area opposite to the first side area in the X direction. A tank 3F is disposed in a second side area close to the second side of the fan 5 so as to connect the radiator 4A and the radiator 4B. The tank 3F is disposed in a region extending over the first corner portion, the second side region, and the second corner portion, and has a rectangular shape elongated in the X direction in the plan view.

The radiator 4A has an inlet 41A at its one end and the side of the other end is joined to a portion of one side of the side 1400 of the tank 3F in the X direction, An opening section is provided. An outflow portion 41B is provided at one end of the radiator 4B and a side surface of the other end is joined to a portion of the other side in the X direction of the side surface 1400 of the tank 3F, Is provided.

The first corner portion is an area at one end in the X direction of the tank 3F and the second corner portion is an area at the opposite end in the X direction of the tank 3F. The cooling liquid flows from the pipe section 43A of the radiator 4A into the region of one end in the X direction of the tank 3F and flows from the one side to the other side in the X direction of the tank 3F, To the tube portion 43B of the radiator 4B.

The tank 3F has a larger size in the X direction and a larger volume than the tank 3 of the first embodiment.

The exhaust gas in the direction 301 on one side in the X direction passes through the radiator 4A and the exhaust gas in the direction 303 on the other side in the X direction passes through the radiator 4B. The exhaust in the direction 304 on the other side in the Y direction is blocked by the wall portion 52 to control the direction and is converted into the exhaust in the direction 301 and the direction 303. [ The exhaust in the direction 302 on one side of the fan 5 in the Y direction is in contact with the side surface 1400 of the tank 3F. The exhaust contacting the side surface 1400 is divided into both sides in the X direction and joined to the exhaust in the direction 301 and the direction 303. [ The tank 3F has a function of dissipating heat to some extent because the exhaust is in contact.

[Effects, etc.]

According to the liquid-cooling type cooling apparatus of the sixth embodiment as described above, it is possible to realize high cooling performance, miniaturization and thinning of equipment, and high-density mounting of electronic equipment as in the first embodiment. In the sixth embodiment, the accumulation amount of the cooling liquid is increased by the tank 3F, and heat can be released from the cooling liquid in the tank 3F.

As a modification of the sixth embodiment, the following are possible. In the sixth embodiment, a part of the tank 3F is disposed at the first corner portion and the second corner portion. The present invention is not limited to this, and a part of the radiator 4A may be disposed at the first corner, and a part of the radiator 4B may be disposed at the second corner. That is, the length of the radiator 4 in the Y direction can be extended by that much, and the length of the tank 3F in the X direction can be shortened. The tank 3F may be disposed only in the second side area.

While the present invention has been described in detail with reference to the above embodiments, the present invention is not limited to the above-described embodiments, and various modifications are possible without departing from the gist of the invention.

1 ... water collection part, 2 ... pump
3 ... tank, 4, 4A, 4B ... radiator
5 ... fan, 6 ... piping
7 ... integral part, 8 ... heat dissipation module
10 ... space, 40 ... heat sink

Claims (9)

A liquid-liquid cooling apparatus,
A water-
A pump,
A heat dissipation module having a flat plate shape,
And a piping portion connecting the water collection portion, the pump, and the heat dissipation module to constitute a path through which the cooling liquid flows,
The heat dissipation module
The fan,
A heat dissipation unit including a plurality of heat dissipators disposed around the fan,
And a tank portion disposed between the plurality of radiators,
Liquid cooling device. The liquid-cooled cooling apparatus according to claim 1, wherein the entire unit including the water collection unit, the pump, the heat dissipation module, and the piping unit is disposed in a flat plate-shaped space. The method according to claim 1,
The fan has a first side and a second side through which the exhaust passes,
Wherein the plurality of radiators have a first radiator and a second radiator,
Wherein the first radiator is disposed in a first side area close to the first side,
Wherein the second radiator is disposed in a second side area close to the second side,
Wherein the tank portion is disposed in a space between the first radiator and the second radiator,
A tube portion in the first radiator, a space in the tank portion, and a tube portion in the second radiator are connected as the path,
Liquid cooling device. The method according to claim 1,
The fan has a first side, a second side and a third side through which the exhaust passes,
A first radiator, a second radiator, and a third radiator as the plurality of radiators,
A first tank and two tanks as the tank portion,
Wherein the first radiator is disposed in a first side area close to the first side,
The second radiator is disposed in a second side area close to the second side,
Wherein the third radiator is disposed in a third side area close to the third side,
Wherein the first tank is disposed in a space between the first radiator and the second radiator,
The second tank is disposed in a space between the second radiator and the third radiator,
And a tube portion in the first radiator, a space in the first tank, a tube portion in the second radiator, a space in the second tank, and a tube portion in the third radiator are connected as the path,
Liquid cooling device. The method according to claim 1,
The fan has a first side, a second side, a third side and a fourth side through which the exhaust passes,
A plurality of radiators each having a first radiator, a second radiator, a third radiator, and a fourth radiator,
Wherein the tank portion has a first tank, a second tank, and a third tank,
Wherein the first radiator is disposed in a first side area close to the first side,
The second radiator is disposed in a second side area close to the second side,
Wherein the third radiator is disposed in a third side area close to the third side,
Wherein the fourth radiator is disposed in a fourth side area close to the fourth side,
Wherein the first tank is disposed in a space between the first radiator and the second radiator,
The second tank being disposed in a space between the second radiator and the third radiator,
The third tank is disposed in a space between the third radiator and the fourth radiator,
A space in the first radiator, a space in the first radiator, a tube portion in the second radiator, a space in the second tank, a tube portion in the third radiator, a space in the third tank, 4 A pipe section in the radiator is connected as said path,
Liquid cooling device. The method according to claim 1,
Wherein the tank portion has a side surface to which a part of the exhaust of the fan contacts,
Liquid cooling device. The method according to claim 1,
The fan has a circular shape in a plan view, a side surface of a curved surface,
Wherein the heat dissipation portion and the tank portion are disposed in a circumferential region close to a side surface of the curved surface,
Liquid cooling device. The method according to claim 1,
The fan has a first side, a second side and a third side through which the exhaust passes,
Wherein the plurality of radiators have a first radiator and a second radiator,
Wherein the first radiator is disposed in a first side area close to the first side,
Wherein the second radiator is located at a position opposite to the first side area and is disposed in a third side area close to the third side,
Wherein the tank portion is an area between the first side area and the third side area and is disposed in a second side area close to the second side,
A tube portion in the first radiator, a space in the tank portion, and a tube portion in the second radiator are connected as the path,
Liquid cooling device. The liquid-cooled cooling device according to claim 1, wherein each of the heat radiators in the plurality of radiators has a side through which the exhaust of the fan passes, a flat tube as a tube portion, and a fin in contact with the flat tube.

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