KR20170037609A - 통합된 열전 냉각으로 시스템 온 칩의 누설 전력을 감소시키기 위한 시스템들 및 방법들 - Google Patents

통합된 열전 냉각으로 시스템 온 칩의 누설 전력을 감소시키기 위한 시스템들 및 방법들 Download PDF

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Publication number
KR20170037609A
KR20170037609A KR1020177002228A KR20177002228A KR20170037609A KR 20170037609 A KR20170037609 A KR 20170037609A KR 1020177002228 A KR1020177002228 A KR 1020177002228A KR 20177002228 A KR20177002228 A KR 20177002228A KR 20170037609 A KR20170037609 A KR 20170037609A
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South Korea
Prior art keywords
chip
thermoelectric
soc
operating point
temperature difference
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Withdrawn
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KR1020177002228A
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English (en)
Korean (ko)
Inventor
라자트 미탈
희준 박
영훈 강
Original Assignee
퀄컴 인코포레이티드
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Application filed by 퀄컴 인코포레이티드 filed Critical 퀄컴 인코포레이티드
Publication of KR20170037609A publication Critical patent/KR20170037609A/ko
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1917—Control of temperature characterised by the use of electric means using digital means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3206—Monitoring of events, devices or parameters that trigger a change in power modality
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • H01L23/38—
    • H01L25/0652—
    • H01L25/0655—
    • H01L25/072—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H10D89/105—Integrated device layouts adapted for thermal considerations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Power Sources (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020177002228A 2014-07-29 2015-07-22 통합된 열전 냉각으로 시스템 온 칩의 누설 전력을 감소시키기 위한 시스템들 및 방법들 Withdrawn KR20170037609A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/446,258 US10101756B2 (en) 2014-07-29 2014-07-29 Systems and methods for reducing leakage power of a system on chip with integrated thermoelectric cooling
US14/446,258 2014-07-29
PCT/US2015/041629 WO2016018699A1 (en) 2014-07-29 2015-07-22 Systems and methods for reducing leakage power of a system on chip with integrated thermoelectric cooling

Publications (1)

Publication Number Publication Date
KR20170037609A true KR20170037609A (ko) 2017-04-04

Family

ID=53801177

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177002228A Withdrawn KR20170037609A (ko) 2014-07-29 2015-07-22 통합된 열전 냉각으로 시스템 온 칩의 누설 전력을 감소시키기 위한 시스템들 및 방법들

Country Status (6)

Country Link
US (1) US10101756B2 (https=)
EP (1) EP3175317A1 (https=)
JP (1) JP2017527889A (https=)
KR (1) KR20170037609A (https=)
CN (1) CN106663662B (https=)
WO (1) WO2016018699A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200016785A (ko) * 2018-08-07 2020-02-17 웨스턴 디지털 테크놀로지스, 인코포레이티드 솔리드 스테이트 디바이스(ssd)에서의 온도 증가를 완화시키기 위한 방법 및 장치
US12405649B2 (en) 2022-03-08 2025-09-02 SK Hynix Inc. Heat management circuit, method for operating the same, and electronic device and data processing apparatus including the same

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KR20220096437A (ko) * 2020-12-31 2022-07-07 삼성전자주식회사 전력 관리 방법 및 장치
US11930625B2 (en) 2021-03-26 2024-03-12 Baidu Usa Llc Thermal management system and method for power optimization for cooling an electronic rack
US12327774B1 (en) * 2021-05-24 2025-06-10 Marvell Asia Pte Ltd Meeting performance and temperature requirements in electronic circuits
US20250087554A1 (en) * 2023-09-12 2025-03-13 Nxp Usa, Inc. Thermal apparatus for an integrated circuit and methods of operation

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US6548894B2 (en) 2000-11-30 2003-04-15 International Business Machines Corporation Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication
US6809538B1 (en) 2001-10-31 2004-10-26 Intel Corporation Active cooling to reduce leakage power
JP2003332641A (ja) * 2002-05-16 2003-11-21 Seiko Instruments Inc ペルチェ素子駆動回路
US6825687B2 (en) 2002-08-29 2004-11-30 Intel Corporation Selective cooling of an integrated circuit for minimizing power loss
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CN100542045C (zh) 2003-06-10 2009-09-16 西门子公司 用于电力生产过程数据的过程数据管理方法和系统
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KR100629679B1 (ko) 2004-07-01 2006-09-29 삼성전자주식회사 열전 냉각 소자를 갖는 반도체 칩 패키지
WO2007001291A2 (en) * 2005-06-24 2007-01-04 Carrier Corporation A device for controlling a thermo-electric system
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200016785A (ko) * 2018-08-07 2020-02-17 웨스턴 디지털 테크놀로지스, 인코포레이티드 솔리드 스테이트 디바이스(ssd)에서의 온도 증가를 완화시키기 위한 방법 및 장치
US12405649B2 (en) 2022-03-08 2025-09-02 SK Hynix Inc. Heat management circuit, method for operating the same, and electronic device and data processing apparatus including the same

Also Published As

Publication number Publication date
WO2016018699A9 (en) 2016-03-24
CN106663662B (zh) 2019-11-12
US20160033975A1 (en) 2016-02-04
US10101756B2 (en) 2018-10-16
EP3175317A1 (en) 2017-06-07
WO2016018699A1 (en) 2016-02-04
JP2017527889A (ja) 2017-09-21
CN106663662A (zh) 2017-05-10

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