JP2017527889A - 統合熱電冷却を用いるシステムオンチップのリーク電力を低減させるためのシステムおよび方法 - Google Patents

統合熱電冷却を用いるシステムオンチップのリーク電力を低減させるためのシステムおよび方法 Download PDF

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JP2017527889A
JP2017527889A JP2017503108A JP2017503108A JP2017527889A JP 2017527889 A JP2017527889 A JP 2017527889A JP 2017503108 A JP2017503108 A JP 2017503108A JP 2017503108 A JP2017503108 A JP 2017503108A JP 2017527889 A JP2017527889 A JP 2017527889A
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chip
thermoelectric cooler
thermoelectric
soc
operating point
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JP2017527889A5 (https=
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ラジャット・ミッタル
ヒー・ジュン・パク
ヨン・フン・カン
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クアルコム，インコーポレイテッド
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1917—Control of temperature characterised by the use of electric means using digital means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3206—Monitoring of events, devices or parameters that trigger a change in power modality
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H10D89/105—Integrated device layouts adapted for thermal considerations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Power Sources (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2017503108A 2014-07-29 2015-07-22 統合熱電冷却を用いるシステムオンチップのリーク電力を低減させるためのシステムおよび方法 Pending JP2017527889A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/446,258 US10101756B2 (en) 2014-07-29 2014-07-29 Systems and methods for reducing leakage power of a system on chip with integrated thermoelectric cooling
US14/446,258 2014-07-29
PCT/US2015/041629 WO2016018699A1 (en) 2014-07-29 2015-07-22 Systems and methods for reducing leakage power of a system on chip with integrated thermoelectric cooling

Publications (2)

Publication Number Publication Date
JP2017527889A true JP2017527889A (ja) 2017-09-21
JP2017527889A5 JP2017527889A5 (https=) 2018-08-16

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ID=53801177

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JP2017503108A Pending JP2017527889A (ja) 2014-07-29 2015-07-22 統合熱電冷却を用いるシステムオンチップのリーク電力を低減させるためのシステムおよび方法

Country Status (6)

Country Link
US (1) US10101756B2 (https=)
EP (1) EP3175317A1 (https=)
JP (1) JP2017527889A (https=)
KR (1) KR20170037609A (https=)
CN (1) CN106663662B (https=)
WO (1) WO2016018699A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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JP2022084840A (ja) * 2021-03-26 2022-06-07 バイドゥ ユーエスエイ エルエルシー 電子ラックを冷却するための熱管理システム、情報技術部品冷却方法、非一時的な機械読み取り可能な媒体およびコンピュータプログラム

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US11169583B2 (en) * 2018-08-07 2021-11-09 Western Digital Technologies, Inc. Methods and apparatus for mitigating temperature increases in a solid state device (SSD)
KR20220096437A (ko) * 2020-12-31 2022-07-07 삼성전자주식회사 전력 관리 방법 및 장치
US12327774B1 (en) * 2021-05-24 2025-06-10 Marvell Asia Pte Ltd Meeting performance and temperature requirements in electronic circuits
KR20230132112A (ko) 2022-03-08 2023-09-15 에스케이하이닉스 주식회사 발열 관리 회로 및 그 동작 방법, 이를 포함하는 전자 장치 및 데이터 처리 장치
US20250087554A1 (en) * 2023-09-12 2025-03-13 Nxp Usa, Inc. Thermal apparatus for an integrated circuit and methods of operation

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JP2003332641A (ja) * 2002-05-16 2003-11-21 Seiko Instruments Inc ペルチェ素子駆動回路
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022084840A (ja) * 2021-03-26 2022-06-07 バイドゥ ユーエスエイ エルエルシー 電子ラックを冷却するための熱管理システム、情報技術部品冷却方法、非一時的な機械読み取り可能な媒体およびコンピュータプログラム
US11930625B2 (en) 2021-03-26 2024-03-12 Baidu Usa Llc Thermal management system and method for power optimization for cooling an electronic rack

Also Published As

Publication number Publication date
WO2016018699A9 (en) 2016-03-24
KR20170037609A (ko) 2017-04-04
CN106663662B (zh) 2019-11-12
US20160033975A1 (en) 2016-02-04
US10101756B2 (en) 2018-10-16
EP3175317A1 (en) 2017-06-07
WO2016018699A1 (en) 2016-02-04
CN106663662A (zh) 2017-05-10

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