JP2017527889A5 - - Google Patents

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Publication number
JP2017527889A5
JP2017527889A5 JP2017503108A JP2017503108A JP2017527889A5 JP 2017527889 A5 JP2017527889 A5 JP 2017527889A5 JP 2017503108 A JP2017503108 A JP 2017503108A JP 2017503108 A JP2017503108 A JP 2017503108A JP 2017527889 A5 JP2017527889 A5 JP 2017527889A5
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JP
Japan
Prior art keywords
thermoelectric cooler
chip
temperature difference
thermoelectric
soc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017503108A
Other languages
English (en)
Japanese (ja)
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JP2017527889A (ja
Filing date
Publication date
Priority claimed from US14/446,258 external-priority patent/US10101756B2/en
Application filed filed Critical
Publication of JP2017527889A publication Critical patent/JP2017527889A/ja
Publication of JP2017527889A5 publication Critical patent/JP2017527889A5/ja
Pending legal-status Critical Current

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JP2017503108A 2014-07-29 2015-07-22 統合熱電冷却を用いるシステムオンチップのリーク電力を低減させるためのシステムおよび方法 Pending JP2017527889A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/446,258 US10101756B2 (en) 2014-07-29 2014-07-29 Systems and methods for reducing leakage power of a system on chip with integrated thermoelectric cooling
US14/446,258 2014-07-29
PCT/US2015/041629 WO2016018699A1 (en) 2014-07-29 2015-07-22 Systems and methods for reducing leakage power of a system on chip with integrated thermoelectric cooling

Publications (2)

Publication Number Publication Date
JP2017527889A JP2017527889A (ja) 2017-09-21
JP2017527889A5 true JP2017527889A5 (https=) 2018-08-16

Family

ID=53801177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017503108A Pending JP2017527889A (ja) 2014-07-29 2015-07-22 統合熱電冷却を用いるシステムオンチップのリーク電力を低減させるためのシステムおよび方法

Country Status (6)

Country Link
US (1) US10101756B2 (https=)
EP (1) EP3175317A1 (https=)
JP (1) JP2017527889A (https=)
KR (1) KR20170037609A (https=)
CN (1) CN106663662B (https=)
WO (1) WO2016018699A1 (https=)

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US11169583B2 (en) * 2018-08-07 2021-11-09 Western Digital Technologies, Inc. Methods and apparatus for mitigating temperature increases in a solid state device (SSD)
KR20220096437A (ko) * 2020-12-31 2022-07-07 삼성전자주식회사 전력 관리 방법 및 장치
US11930625B2 (en) 2021-03-26 2024-03-12 Baidu Usa Llc Thermal management system and method for power optimization for cooling an electronic rack
US12327774B1 (en) * 2021-05-24 2025-06-10 Marvell Asia Pte Ltd Meeting performance and temperature requirements in electronic circuits
KR20230132112A (ko) 2022-03-08 2023-09-15 에스케이하이닉스 주식회사 발열 관리 회로 및 그 동작 방법, 이를 포함하는 전자 장치 및 데이터 처리 장치
US20250087554A1 (en) * 2023-09-12 2025-03-13 Nxp Usa, Inc. Thermal apparatus for an integrated circuit and methods of operation

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US6809538B1 (en) 2001-10-31 2004-10-26 Intel Corporation Active cooling to reduce leakage power
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US6825687B2 (en) 2002-08-29 2004-11-30 Intel Corporation Selective cooling of an integrated circuit for minimizing power loss
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