CN106663662B - 用于使用集成热电冷却来减少片上系统的泄漏功率的系统和方法 - Google Patents

用于使用集成热电冷却来减少片上系统的泄漏功率的系统和方法 Download PDF

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Publication number
CN106663662B
CN106663662B CN201580041267.8A CN201580041267A CN106663662B CN 106663662 B CN106663662 B CN 106663662B CN 201580041267 A CN201580041267 A CN 201580041267A CN 106663662 B CN106663662 B CN 106663662B
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CN
China
Prior art keywords
chip
thermoelectric
thermoelectric coolers
temperature difference
coolers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201580041267.8A
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English (en)
Chinese (zh)
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CN106663662A (zh
Inventor
R·米塔尔
H·J·朴
Y·H·康
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Qualcomm Inc
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Qualcomm Inc
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Publication date
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Publication of CN106663662A publication Critical patent/CN106663662A/zh
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Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1917—Control of temperature characterised by the use of electric means using digital means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3206—Monitoring of events, devices or parameters that trigger a change in power modality
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H10D89/105—Integrated device layouts adapted for thermal considerations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Power Sources (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201580041267.8A 2014-07-29 2015-07-22 用于使用集成热电冷却来减少片上系统的泄漏功率的系统和方法 Expired - Fee Related CN106663662B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/446,258 US10101756B2 (en) 2014-07-29 2014-07-29 Systems and methods for reducing leakage power of a system on chip with integrated thermoelectric cooling
US14/446,258 2014-07-29
PCT/US2015/041629 WO2016018699A1 (en) 2014-07-29 2015-07-22 Systems and methods for reducing leakage power of a system on chip with integrated thermoelectric cooling

Publications (2)

Publication Number Publication Date
CN106663662A CN106663662A (zh) 2017-05-10
CN106663662B true CN106663662B (zh) 2019-11-12

Family

ID=53801177

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580041267.8A Expired - Fee Related CN106663662B (zh) 2014-07-29 2015-07-22 用于使用集成热电冷却来减少片上系统的泄漏功率的系统和方法

Country Status (6)

Country Link
US (1) US10101756B2 (https=)
EP (1) EP3175317A1 (https=)
JP (1) JP2017527889A (https=)
KR (1) KR20170037609A (https=)
CN (1) CN106663662B (https=)
WO (1) WO2016018699A1 (https=)

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US11169583B2 (en) * 2018-08-07 2021-11-09 Western Digital Technologies, Inc. Methods and apparatus for mitigating temperature increases in a solid state device (SSD)
KR20220096437A (ko) * 2020-12-31 2022-07-07 삼성전자주식회사 전력 관리 방법 및 장치
US11930625B2 (en) 2021-03-26 2024-03-12 Baidu Usa Llc Thermal management system and method for power optimization for cooling an electronic rack
US12327774B1 (en) * 2021-05-24 2025-06-10 Marvell Asia Pte Ltd Meeting performance and temperature requirements in electronic circuits
KR20230132112A (ko) 2022-03-08 2023-09-15 에스케이하이닉스 주식회사 발열 관리 회로 및 그 동작 방법, 이를 포함하는 전자 장치 및 데이터 처리 장치
US20250087554A1 (en) * 2023-09-12 2025-03-13 Nxp Usa, Inc. Thermal apparatus for an integrated circuit and methods of operation

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CN1890878A (zh) * 2003-10-10 2007-01-03 英特尔公司 具有受控冷却的计算机系统
CN102082133A (zh) * 2009-11-30 2011-06-01 华为技术有限公司 一种温控散热装置

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US6548894B2 (en) 2000-11-30 2003-04-15 International Business Machines Corporation Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication
US6809538B1 (en) 2001-10-31 2004-10-26 Intel Corporation Active cooling to reduce leakage power
JP2003332641A (ja) * 2002-05-16 2003-11-21 Seiko Instruments Inc ペルチェ素子駆動回路
US6825687B2 (en) 2002-08-29 2004-11-30 Intel Corporation Selective cooling of an integrated circuit for minimizing power loss
US7228323B2 (en) 2003-06-10 2007-06-05 Siemens Aktiengesellschaft HIS data compression
CN100542045C (zh) 2003-06-10 2009-09-16 西门子公司 用于电力生产过程数据的过程数据管理方法和系统
US8237386B2 (en) * 2003-08-15 2012-08-07 Apple Inc. Methods and apparatuses for operating a data processing system
US7401644B2 (en) * 2004-03-26 2008-07-22 Hewlett-Packard Development Company, L.P. Computer systems and related methods for cooling such systems
KR100629679B1 (ko) 2004-07-01 2006-09-29 삼성전자주식회사 열전 냉각 소자를 갖는 반도체 칩 패키지
WO2007001291A2 (en) * 2005-06-24 2007-01-04 Carrier Corporation A device for controlling a thermo-electric system
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JPH0831994A (ja) * 1994-07-18 1996-02-02 Fujitsu Ltd マルチチップモジュール
CN1890878A (zh) * 2003-10-10 2007-01-03 英特尔公司 具有受控冷却的计算机系统
CN102082133A (zh) * 2009-11-30 2011-06-01 华为技术有限公司 一种温控散热装置

Also Published As

Publication number Publication date
WO2016018699A9 (en) 2016-03-24
KR20170037609A (ko) 2017-04-04
US20160033975A1 (en) 2016-02-04
US10101756B2 (en) 2018-10-16
EP3175317A1 (en) 2017-06-07
WO2016018699A1 (en) 2016-02-04
JP2017527889A (ja) 2017-09-21
CN106663662A (zh) 2017-05-10

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