KR20170034450A - Substrate processing device - Google Patents

Abstract

The substrate processing apparatus includes a first processing chamber for accommodating a plurality of processing units for performing processing on a substrate formed in a band shape and a first processing unit capable of executing a common subprocess in a plurality of processing units, A second processing chamber for accommodating the second processing portion, and a transporting portion for transporting the substrate to each of the first processing chamber and the second processing chamber.

Description

[0001] SUBSTRATE PROCESSING DEVICE [0002]

The present invention relates to a substrate processing apparatus.

The present application claims priority based on Japanese Patent Application No. 2011-097122 filed on April 25, 2011, the contents of which are incorporated herein by reference.

As a display element constituting a display device such as a display device, for example, a liquid crystal display element and an organic electroluminescence (organic EL) element are known. At present, active devices (active devices) forming thin film transistors (TFTs) on the surface of a substrate corresponding to each pixel are becoming mainstream in these display devices.

BACKGROUND ART [0002] In recent years, a technique of forming a display element on a sheet-like substrate (for example, a film member or the like) has been proposed. As such a technique, for example, a technique called a roll-to-roll method (hereinafter simply referred to as "roll method") is known (see, for example, Patent Document 1). In the roll system, a single sheet-like substrate (for example, a strip-shaped film member) wound on a supply roller on a substrate supply side is fed out, And a desired processing is performed on the substrate by a processing unit (unit) provided between the supply roller and the rotation roller while being wound on the substrate.

Then, the substrate is transported, for example, by using a plurality of transport rollers or the like, until the substrate is fed out and then wound, and the gate electrode, the gate insulating film, the semiconductor film, the source Drain electrodes, and the like, and the constituent elements of the display element are sequentially formed on the surface of the substrate to be processed.

[Patent Document 1] International Publication No. 2006/100868 pamphlet

However, in the above-described process, a long conveyance path of several hundred meters in total length may be required. For example, it is required to efficiently arrange each processing unit in a limited space such as a factory.

It is an object of the present invention to provide a substrate processing apparatus capable of efficiently disposing a processing section.

According to an aspect of the present invention, there is provided a substrate processing apparatus including: a plurality of processing sections each for performing processing on a substrate formed in a band shape; a first processing chamber for accommodating a first processing section capable of executing a common subprocess in a plurality of processing sections; A second processing chamber that accommodates the second processing unit among the processing units of the first processing chamber and the second processing chamber, and a transport unit that transports the substrates to the first processing chamber and the second processing chamber, respectively.

According to the aspect of the present invention, the space of the processing section can be efficiently used.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the entire configuration of a substrate processing apparatus according to the embodiment; Fig.
2 is a sectional view showing a configuration of a substrate processing section of the substrate processing apparatus according to the embodiment;
3 is a sectional view showing a configuration of a heating unit according to the present embodiment.
4 is a perspective view showing a configuration of a heating unit according to the present embodiment.
5 is a perspective view showing a configuration of a heating apparatus according to the present embodiment.
6 is a view showing an example of a layout of a heating apparatus disposed in a treatment chamber according to the embodiment;
7 is a comparative view showing an example of the layout of the heating apparatus.
8 is a side view showing a configuration of a vibration removing apparatus according to the present embodiment.
9 is a side view showing another configuration of the vibration removing device.
10 is a side view showing another configuration of the vibration removing device.
11 is a side view showing another configuration of the vibration removing device.
12 is a side view showing another configuration of the vibration removing device.
13 is a side view showing another configuration of the vibration removing device.
Fig. 14 is a view showing a structure between the treatment chambers according to the embodiment; Fig.
15 is a view showing a configuration of a fluid removing apparatus according to the present embodiment.

Hereinafter, the present embodiment will be described with reference to the drawings.

Fig. 1 is a diagram showing a configuration of a substrate processing apparatus 100 according to an embodiment of the present invention.

1, the substrate processing apparatus 100 includes a substrate supply section 2 for supplying a strip-shaped substrate (for example, a sheet-like film member) S, A substrate recovery unit 4 for recovering the substrate S, and a control unit CONT for controlling these parts. The substrate processing section 3 performs various processes on the surface of the substrate S until the substrate S is delivered from the substrate supply section 2 and then the substrate S is collected by the substrate collecting section 4 And a substrate processing apparatus 100 for executing the substrate processing apparatus. This substrate processing apparatus 100 can be used when forming a display element (electronic device) such as an organic EL element or a liquid crystal display element on the substrate S. [

In the present embodiment, an XYZ coordinate system is set as shown in Fig. 1, and an explanation will be given below using this XYZ coordinate system as appropriate. In the XYZ coordinate system, for example, the X axis and the Y axis are set along the horizontal plane, and the Z axis is set upward in the vertical direction. Further, the substrate processing apparatus 100 conveys the substrate S from the minus side (- side) to the plus side (+ side) along the X axis as a whole. At this time, the width direction (short-length direction) of the band-shaped substrate S is set in the Y-axis direction.

As the substrate S to be processed in the substrate processing apparatus 100, for example, a foil (foil) such as a resin film or stainless steel can be used. For example, the resin film may be formed of a resin such as polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, Can be used.

It is preferable that the substrate S has a small coefficient of thermal expansion so that the dimension does not change even if it receives heat of, for example, about 200 캜. For example, an inorganic (inorganic) filler can be mixed with a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.

The dimension of the substrate S in the width direction (the short direction) is, for example, about 1 m to 2 m, and the dimension in the length direction (long direction) is, for example, 10 m or more. Of course, this dimension is merely an example, and is not limited to this. For example, the dimension of the substrate S in the Y direction may be 50 cm or less, and it may be 2 m or more. The size of the substrate S in the X direction may be 10 m or less.

The substrate S is formed to have flexibility. Here, the flexibility refers to a property that the substrate can be rolled without being sheared or fractured even when a force of about its own weight is applied to the substrate. Also, the property of flexing by the force of the degree of self weight is included in flexibility. In addition, the flexibility varies depending on the material, size, thickness, temperature, etc. of the substrate. As the substrate S, a single strip-shaped substrate may be used, but a plurality of unit substrates may be connected to form a strip.

The substrate feeding section 2 feeds the substrate S wound, for example, in the form of a roll to the substrate processing section 3 for supply. In this case, the substrate supply unit 2 is provided with a shaft for winding the substrate S or a rotation driving device for rotating the shaft. In addition, a cover portion for covering the substrate S wound, for example, in the form of a roll may be provided. The substrate feeding part 2 is not limited to the mechanism for feeding the substrate S rolled up in a roll shape but may be a device including a mechanism for sequentially feeding the band-like substrate S in the longitudinal direction thereof.

The substrate collecting unit 4 collects the substrate S having passed through the substrate processing apparatus 100 provided in the substrate processing unit 3, for example, in the form of a roll. Like the substrate supplying unit 2, the substrate collecting unit 4 is provided with a shaft for winding the substrate S, a rotation driving source for rotating the shaft, a cover unit for covering the recovered substrate S, and the like. When the substrate S is cut in the form of a panel in the substrate processing section 3, the substrate S is recovered in a stacked state, for example, It is also possible to adopt a configuration in which the recovery is performed.

The substrate processing section 3 transports the substrate S supplied from the substrate supply section 2 to the substrate collection section 4 and performs processing on the processed surface Sa of the substrate S in the course of transport . The substrate processing section 3 has a processing apparatus 10 and a transfer apparatus (transfer section)

The processing apparatus 10 has various apparatuses for forming, for example, an organic EL element with respect to an object surface Sa of the substrate S. Examples of such devices include a barrier-wall forming apparatus for forming barrier ribs on an object surface Sa, an electrode forming apparatus for forming electrodes, and a light-emitting layer forming apparatus for forming a light-emitting layer. More specifically, the present invention can be applied to a coating apparatus such as a droplet applying apparatus (e.g., an inkjet type coating apparatus), a film forming apparatus (e.g., a plating apparatus, a deposition apparatus, a sputtering apparatus) An apparatus, a developing apparatus, a surface modifying apparatus, a cleaning apparatus, and the like. Each of these devices is appropriately provided along the conveying path of the substrate S. In this embodiment, as the processing apparatus 10, for example, a coating apparatus 41, heating apparatuses 51 to 53, an exposure apparatus EX, a developing apparatus 42, a cleaning apparatus 43, 44) (which will be described in detail later on with reference to FIG. 2) will be described as an example.

The conveying device 20 has a plurality of guide rollers (guide portions) R (only two rollers in FIG. 1) for guiding the substrate S in the substrate processing portion 3. [ The guide roller R is disposed along the conveying path of the substrate S. At least a part of the guide rollers R of the plurality of guide rollers R is equipped with a rotation drive mechanism (not shown). In the present embodiment, the length of the conveying path in the conveying device 20 is, for example, a total length of several hundred meters.

Fig. 2 is a cross-sectional view showing a configuration of a part of the substrate processing section 3. Fig.

As shown in FIG. 2, the substrate processing section 3 has three processing chambers 11 to 13. The treatment chambers 11 to 13 are divided by the partitioning portion 14. [

The partitioning portion 14 has a partition member 14a constituting a bottom portion of the treatment chamber 11, a partition member 14b constituting a ceiling portion of the treatment chamber 11 and a bottom portion of the treatment chamber 12, A partition member 14c constituting a ceiling portion and a bottom portion of the treatment chamber 13 and a partition member 14d constituting a ceiling portion of the treatment chamber 13. [

The treatment chamber 11 is disposed at the lowermost part (the most-Z side) in the gravity direction in the plurality of treatment chambers. The processing chamber 11 forms a processing space for performing processing (wet processing) using liquid on the substrate S. As shown in FIG. 2, for example, the processing chamber 10 is provided with a coating apparatus 41 having a resist solution container 41a for containing a resist solution to be coated on the substrate S A developing device 42 having a developer accommodating container 42a for accommodating a developer for carrying out development processing on the substrate S and a cleaning liquid container 43a for accommodating the cleaning liquid for cleaning the substrate S, A plating apparatus 44 having a plating liquid container 44a for containing a plating liquid for forming a pattern on the substrate S after the cleaning process is provided. In addition, the processing chamber 11 is not limited to the above-described liquid, and it is possible to accommodate a processing apparatus using various liquids.

The application device 41 is disposed inside the application device 41 and guides the substrate S from the application device 41 to the processing chamber 41 through the guide roller R2 for guiding the substrate S and the substrate S, And a guide roller R3 for guiding the sheet bundle 11 to the outside. A guide roller R1 for guiding the substrate S supplied from the substrate supply section 2 to the coating device 41 is disposed on the upstream side of the guide roller R2 in the carrying direction of the substrate S. [ The developing device 42 is provided with a guide roller R20 for guiding the substrate S and a substrate S having undergone the developing process from the inside of the developing device 42 to the processing chamber 11). A guide roller R20 for guiding the substrate S from the heating device 52 of the processing chamber 12 to the developing device 42 through a guide roller R17 is provided on the upstream side of the guide roller R20, (R18 and R19) are disposed.

Guide rollers R22 and R23 for guiding the substrate S from the developing device 42 to the cleaning device 43 are disposed on the downstream side of the guide roller R21 in the transport direction of the substrate S. [ The guide rollers R1, R18, R19, R22, and R23 are disposed in the process chamber 11. [

The cleaning device 43 is provided with a guide roller R24 for guiding the substrate S and a substrate S which has been subjected to the cleaning process are disposed inside the cleaning device 43 from the inside of the cleaning device 43 to the processing chamber 11 which are provided in the guide rails R25 and R25. The plating device 44 is provided with a guide roller R28 disposed inside the plating device 44 for guiding the substrate S and a substrate S from which the plating process has been completed is transferred from the plating device 44 to the processing chamber 11) for guiding the sheet to the outside.

The partition member 14a is provided with a plurality of collecting tubes (a waste liquid collecting section, collecting section) 45 constituting a part of a waste liquid collecting passage connected to a collecting device not shown. One end of the recovery pipe 45 is connected to each of the application device 41, the developing device 42 and the cleaning device 43 and the other end is connected to a waste liquid recovery flow passage (not shown) connected to the recovery device. Each recovery pipe 45 discharges the resist solution, the developing solution and the cleaning solution, which have become the waste solution, in the application device 41, the developing device 42 and the cleaning device 43 through the waste solution return flow path to the recovery device. The return pipe 45 is provided with an open / close valve (not shown). The control unit CONT can control the timing of opening and closing the opening / closing valve. In the present embodiment, since the apparatus for wet treatment is provided in the treatment chamber 11 at the bottommost portion in the gravity direction, the length of the flow path system (flow path system) of the waste liquid recovery flow path between these devices and the recovery device can be suppressed .

The treatment chamber 12 is disposed on the upper side (+ Z side) of the treatment chamber 11. The processing chamber 12 forms a processing space for performing heat treatment on the substrate S. The processing chamber 12 is provided with heating devices 51 to 53 for heating the substrate S as the processing device 10. The heating device 51 heats the substrate S coated with the resist solution by the application device 41 to dry the resist solution. The heating apparatus 52 heats the substrate S having passed through the exposure apparatus EX of the processing chamber 13 again to dry the resist solution. The heating device 52 heats the substrate S to a temperature different from the heating temperature of the heating device 51, for example, a temperature higher than the heating temperature of the heating device 51. [ The heating device 53 heats the substrate S after development processing by the developing device 42 and cleaning by the cleaning device 43 to dry the surface of the substrate S.

A guide roller R4 for guiding the substrate S having passed through the coating device 41 in the treatment chamber 11 to the heating device 51 is provided on the upstream side of the heating device 51 with respect to the conveying direction of the substrate S Respectively. On the downstream side of the heating device 51 relating to the conveying direction of the substrate S, guide rollers R5, R6 and R7 are arranged along the conveying path, and these guide rollers R5, The substrate S is guided by the exposure apparatus EX in the exposure apparatus EX.

The substrate S having passed through the exposure apparatus EX of the processing chamber 13 is guided to the heating device 52 through the guide roller R13 on the upstream side of the heating device 52 in the carrying direction of the substrate S The guide rollers R14, R15 and R16 are arranged along the conveying path. A guide roller R17 for guiding the substrate S through the guide rollers R18 and R19 to the developing device 42 of the treatment chamber 11 is provided on the downstream side of the heating device 52 in the conveying direction of the substrate S, Respectively.

A guide roller R26 for guiding the substrate S to the heating device 53 is provided on the upstream side of the heating device 53 with respect to the conveying direction of the substrate S, Respectively. A guide roller R27 for guiding the substrate S to the plating device 44 in the treatment chamber 11 is disposed downstream of the heating device 53 in the conveying direction of the substrate S. [ On the + X side of the guide roller R27, a guide roller R30 for guiding the substrate S is disposed in the next step. These guide rollers R4, R5, R6, R7, R14, R15, R16, R17, R26, R27 and R30 are disposed in the process chamber 12. [

The partition member 14b is provided with a plurality of connection portions 15 to 19 for passing the substrate S between the process chamber 11 and the process chamber 12. [ The connecting portions 15 to 19 are, for example, through holes penetrating the partitioning member 14b in the Z direction. Each of the connecting portions 15 to 19 is formed in such a dimension that the substrate S can pass therethrough. The substrate S moves between the processing chamber 11 and the processing chamber 12 by passing through the connecting portions 15 to 19. [

The guide roller R3 and the guide roller R4 guide the substrate S through the connection portion 15. [ The guide roller R17 and the guide roller R18 guide the substrate S to pass through the connection portion 16. The guide roller R25 and the guide roller R26 guide the substrate S to pass through the connecting portion 17. The guide roller R27 and the guide roller R28 guide the substrate S to pass through the connection portion 18. The guide roller R29 and the guide roller R30 guide the substrate S to pass through the connecting portion 19. Thus, the transfer apparatus 20 guides the substrate S so that the substrate S passes through the connection portions 15-19.

The guide rollers R3, R4, R17, R18, and R25 to R30 disposed above the connecting portions 15 to 19 are provided with a temperature control device for adjusting the temperature of the substrate S It may be a configuration. With this configuration, it is possible to adjust the temperature of the substrate S before and after the heating apparatuses 51 to 53.

Next, the detailed configuration of the heating apparatuses 51 to 53 will be described. Each of the heating devices 51 to 53 has one or a plurality of heating units 50. 3 is a side sectional view showing a configuration of the heating unit 50. As shown in Fig. Fig. 4 is a perspective view showing a configuration of the heating unit 50. Fig.

As shown in Figs. 3 and 4, the heating unit 50 has a case 60 and a heating unit 70 for heating the inside of the case 60. Fig.

The case 60 is formed by a pair of first wall portions 60d and 60c and a pair of second wall portions 60f and 60e, And is a rectangular annular shape. The inner space formed in the case 60 functions as a substrate accommodating chamber (accommodating chamber) 62. (Inlet port) 61 is formed in one of the first wall portions (left side wall portion) 60c of the case 60 and the other first wall portion (right side wall portion) 60d are formed with a substrate transfer port (transfer port) 63. One end face (end face on the -Y side) of the case 60 is used as the first opening end 60a and the other end face (end face on the Y side) of the case 60 is connected to the second opening end 60b ). The first opening end 60a and the second opening end 60b of the case 60 are provided with connecting portions (not shown) for connecting the plurality of heating units 50.

The first opening end 60a and the second opening end 60b of the case 60 are configured such that a lid for sealing the substrate accommodating chamber 62 can be mounted. Therefore, when only one heating unit 50 is used, it is possible to form a closed space by closing the end faces of the opening ends 60a and 60b. Further, by connecting the plurality of heating units 50, a larger sealed space can be formed than in the case of using a single heating unit 50. In this case, the end face of the heating unit 50 disposed at the end of the connection direction can be closed with the lid part.

The substrate inlet port 61 and the substrate outlet port 63 are formed so that the substrate S can pass therethrough. That is, the dimensions of the substrate inlet port 61 and the substrate outlet port 63 in the Z direction are formed larger than the thickness of the substrate S. The dimensions of the substrate inlet port 61 and the substrate exit port 63 in the Y direction are formed to be larger than the dimensions of the substrate S in the short (shorter), shorter (shorter) direction.

The substrate holding chamber 62 is provided with folding rollers (folding back portions) 64 to 67 for guiding the substrate S therein. The folding back rollers 64 to 67 are rotatably supported on the case 60 by a support member (not shown). The folding rollers 64 and 66 are disposed on the + X side end of the substrate accommodation chamber 62, that is, on the right side wall portion 60d side. The folding rollers 65 and 67 are disposed on the -X side end of the substrate accommodation chamber 62, that is, on the left side wall portion 60c side. The folding rollers 64, 65, 66 and 67 are arranged in this order from the upper portion (+ Z side) to the lower portion (-Z side) of the case 60.

The folding back roller 64 is fed from the substrate inlet port 61 and folds back the substrate S advancing in the + X direction in the -X direction. The folding back roller 65 is folded back by the folding roller 64 to fold the substrate S moving in the -X direction back in the + X direction. The folding roller 66 is folded back by the folding roller 64 to fold the substrate S moving in the + X direction back in the -X direction. The folding back roller 65 is folded back by the folding roller 64 to fold the substrate S moving in the -X direction back in the + X direction.

Therefore, when viewed in the Z direction, the substrate S guided by the folding rollers 64 to 67 overlap each other with the folded back portions (portions) of the substrate S, and the folded sheets are not contacted with each other . Therefore, the substrate S is efficiently accommodated in the substrate accommodation chamber 62 while maintaining the state of the surface S of the substrate S to be processed.

At least one of the folding rollers 64 to 67 is connected to a rotation driving mechanism (not shown) such as a motor. The control section CONT is capable of adjusting the number of revolutions and the timing of rotation of the rotary drive mechanism. Therefore, the conveying speed of the substrate S can be adjusted for each heating unit 50. [

Further, at least one of the folding rollers 64 to 67 may be movable in either the X direction, the Y direction, or the Z direction. In this case, the control unit CONT controls the movement of the folding rollers 64 to 67, so that the conveyance path of the substrate S can be adjusted for each heating unit 50. In the present embodiment, four folding rollers are disposed in the case 60, but it is also possible to increase or decrease the number of folding rollers in accordance with the heating time of the substrate S.

Fig. 5 is a diagram illustrating the configuration of the heating devices 51 to 53. Fig.

As shown in Fig. 5, the heating devices 51 to 53 have a plurality of heating units 50 arranged in a plurality of rows in the Y direction. The plurality of heating units 50 are in a state where the adjacent heating units 50 are connected to each other. In Fig. 5, the lid of the first opening end 60a of the heating unit 50 is omitted.

By connecting the heating unit 50, the substrate accommodation chambers 62 communicate with each other. Therefore, by connecting the heating unit 50, it is possible to constitute one heating furnace in which a plurality of conveying paths of the substrate S are provided. The heating unit 70 may be provided in common to the plurality of heating units 50, or may be provided separately for each of the heating units 50.

When the heating section 70 is provided in common to a plurality of the heating units 50, the heating section 70 can collect a plurality of substrate containing chambers 62 formed as one heating furnace and heat them. Therefore, the plurality of substrates S conveyed through the other conveyance path are collected and heated by the heating unit 70 in one heating furnace. Therefore, the efficiency of the heat treatment can be improved. In the case where the heating unit 70 is provided for each heating unit 50, the heating temperature and the timing of heating may be adjusted for each heating unit 50. As the heating unit 70, a heating unit or an irradiation unit (not shown) for irradiating electromagnetic waves can be used.

Fig. 6 is a diagram showing the arrangement of the heating devices 51 and 52 in the process chamber 12. Fig.

In the configuration shown in Fig. 6, a plurality of (three) heating devices 51 connected to a plurality of heating units 50 in the process chamber 12 are arranged in the Y direction. 7 is arranged in the X direction by arranging the heating unit 50 or the heating unit 51 arranged in the Y direction as described above, the space of the processing chamber 12 . ≪ / RTI >

Returning to Fig. 2, the processing chamber 13 is disposed on the upper side (+ Z side) of the processing chamber 12. The processing chamber 13 is a processing space for performing exposure processing on the substrate S. In the treatment chamber 13, the exposure apparatus EX is provided as the treatment apparatus 10. [ The exposure apparatus EX irradiates the resist layer coated on the substrate S in the coating apparatus 41 with exposure light through a pattern of a mask. The treatment chamber 13 is provided with guide rollers R10 and R11 for guiding the substrate S to a position where exposure light of the exposure apparatus EX is irradiated.

An opening 90 is formed in the partition member 14c. The opening 90 is formed through the partition member 14c in the Z direction. The substrate S is guided from the processing chamber 12 to the processing chamber 13 through the opening portion 90 by the guide rollers R8 and R9. The substrate S is guided from the processing chamber 13 to the processing chamber 12 through the opening portion 90 by the guide rollers R12 and R13. Thus, the opening 90 is a portion through which the substrate S passes.

A vibration removing device (adjusting mechanism) 91 for removing the vibration of the substrate S guided by the conveying device 20 (for example, the guide rollers R8 to R13) is provided inside the opening 90 Lt; / RTI > The vibration removing device 91 is configured to remove the vibration transmitted to the substrate S by reducing the tension of the substrate S and lowering the achievement of the vibration before the vibration of the substrate S. Therefore, the vibration removing device 91 in the present embodiment has tension releasing mechanisms 92 and 93 for relieving the tension of the substrate S. Further, the vibration removing device 91 need only completely eliminate the vibration of the substrate S, and can reduce the vibration to such an extent as to allow the processing device. Therefore, the tension releasing mechanism can also be referred to as a tension reducing mechanism.

The tension relieving mechanism 92 is disposed upstream of the exposure apparatus EX (guide roller R10) in the conveying direction of the substrate S. More specifically, the tension releasing mechanism 92 is disposed between the guide roller R8 and the guide roller R9. The tension releasing mechanism 93 is disposed downstream of the exposure apparatus EX (guide roller R11) in the conveying direction of the substrate S. [ More specifically, the tension releasing mechanism 93 is disposed between the guide roller R12 and the guide roller R13.

8 is a view showing the structure of the tension releasing mechanisms 92 and 93. Fig.

8, the tension releasing mechanisms 92 and 93 are connected to the nip rollers 95a and 95b (the nip portion 95) and the nip rollers 95a and 95b (direction switching portion 94) Lt; / RTI > The direction changing rollers 94a and 94b switch the conveying direction of the substrate S so that the substrate S is loosened in the gravity direction (-Z direction). Specifically, the portion Sb between the direction changing roller 94a and the direction changing roller 94b in the substrate S is loosened. A temperature adjusting mechanism (substrate temperature adjusting section) 94c is provided on the direction changing roller 94a. The temperature of the portion of the substrate S which contacts the direction switching roller 94a is adjusted by the temperature adjusting mechanism 94c. The temperature adjusting mechanism 94c may be omitted.

The nip roller 95a is provided at a position where the substrate S is sandwiched between the nip roller 95a and the direction changing roller 94a. The nip roller 95b is provided at a position where the substrate S is sandwiched between the nip roller 95b and the direction changing roller 94b. The nip rollers 95a and 95b are connected to the rotation drive unit 96. [ The rotation drive unit 96 individually adjusts the timing and the rotation speed of the nip rollers 95a and 95b. Therefore, the substrate S can be transported in a state where the loosened portion Sb is formed.

Between the portion of the substrate S held between the direction changing roller 94a and the nip roller 95a and the portion of the substrate S sandwiched between the nip roller 95b and the direction changing roller 94b, The substrate S can be transported at a different speed. Therefore, the substrate S can be transported while adjusting the dimension of the loosened portion Sb.

By thus releasing the tension of the substrate S by forming the loosened portion Sb in the tension releasing mechanisms 92 and 93 as described above, the vibration from the upstream side of the direction changing roller 94a and the nip roller 95a is reduced . Therefore, transmission of the vibration of the substrate S is suppressed between the processing chamber 12 and the processing chamber 13 between which the tension canceling mechanisms 92 and 93 are disposed. Therefore, in the exposure apparatus EX disposed in the processing chamber 13, the exposure processing is performed without being affected by the vibrations in the processing chamber 11 and the processing chamber 12. Since such tension relieving mechanisms 92 and 93 are disposed in the partition member 14c, the space of the processing chambers 11 to 13 of the substrate processing section 3 can be efficiently utilized.

Next, a step of manufacturing a display element (electronic device) such as an organic EL element or a liquid crystal display element by using the substrate processing apparatus 100 configured as described above will be described. The substrate processing apparatus 100 manufactures the display element under the control of the control unit CONT.

First, the substrate S wound around a roller (not shown) is mounted on the substrate supply unit 2. [ The control unit CONT rotates a roller (not shown) so that the substrate S is fed from the substrate supply unit 2 from this state. Then, the substrate S having passed through the substrate processing section 3 is wound by a roller (not shown) provided in the substrate recovery section 4. Then,

The control section CONT controls the substrate S to be transported by the transport apparatus 20 of the substrate processing section 3 until the substrate S is delivered from the substrate supply section 2 and then taken up by the substrate collection section 4. [ And is appropriately transported in the substrate processing section 3. The control unit CONT first loads the substrate S into the processing chamber 11 of the substrate processing unit 3. Then, Hereinafter, the operation of the control unit CONT will be described.

The substrate S carried into the treatment chamber 11 is carried into the coating apparatus 41 via the guide roller R1 shown in Fig. In the coating device 41, the substrate S is transported in the + X direction by the guide roller R2. A coating film of a photosensitive agent is formed on the surface Sa to be processed of the substrate S. The substrate S subjected to the treatment in the coating device 41 is conveyed to the treatment chamber 12 through the connection portion 15 by the guidance of the guide roller R3.

The substrate S carried into the processing chamber 12 is transferred from the substrate inlet port 61 of the heating apparatus 51 to the substrate containing chamber 62 via the guide roller R4 (see FIG. 3). In the substrate accommodating chamber 62, the substrate S is heated while the substrate S is bent a plurality of times, and the substrate S is heated in this conveying state. Therefore, the heat treatment using the space of the substrate accommodation chamber 62 is performed efficiently. In the heating device 51, the coating film formed on the substrate S is dried by heating. After the heating process is performed, the substrate S carried out from the substrate transfer opening 63 is conveyed to the opening 90 through the guide rollers R5, R6 and R7.

The substrate S arriving at the opening 90 is carried into the tension releasing mechanism 92 by the guide roller R8. The tension eliminating mechanism 92 changes the conveying speed between the portion sandwiched by the direction changing roller 94a and the nip roller 95a and the portion sandwiched by the nip roller 95b and the direction changing roller 94b The loosened portion Sb is formed on the substrate S.

After the loosened portion Sb is formed, the conveying speed of the substrate S by the direction changing rollers 94a and 94b and the nip rollers 95a and 95b is made equal. With this operation, the substrate S is carried out of the tension releasing mechanism 92 in a state where the loosened portion Sb is formed. The substrate S is conveyed to the processing chamber 13 via the guide roller R9.

The vibration transmitted through the substrate S from the processing chamber 12 side is removed from the loosened portion Sb of the substrate S. [ Therefore, transmission of vibration to the processing chamber 13 through the substrate S is suppressed. When the temperature adjusting mechanism 94c is provided on the direction changing roller 94a, the temperature of the substrate S is adjusted by the direction changing roller 94a. Here, for example, the temperature is adjusted to a suitable temperature for the exposure process.

The substrate S carried into the treatment chamber 13 is conveyed by the guide rollers R10 and R11. The substrate S is subjected to exposure processing by the exposure apparatus EX. A predetermined area of the coating film formed on the work surface Sa of the substrate S is exposed by the exposure processing. After the exposure process is completed, the substrate S is inserted into the opening 90 and then carried into the tension releasing mechanism 93 via the guide roller R12.

In the tension releasing mechanism 93, the loosened portion Sb is formed on the substrate S, similarly to the tension releasing mechanism 92 described above. Therefore, the vibration transmitted through the substrate S from the processing chamber 12 side is removed from the loosened portion Sb of the substrate S. On the other hand, as described above, the tension releasing mechanism 92 also has a loosened portion Sb. Therefore, the portion of the substrate S disposed in the processing chamber 13 is in a state in which transmission of vibration from the processing chamber 12 is removed from both the tension releasing mechanism 92 and the tension releasing mechanism 93.

When the vibrations of the guide rollers R8 to R13 and the heating devices 51 and 52 are transmitted to the substrate S, there is a case where the substrate S and other portions are vibrated at the exposure light exposure position of the exposure apparatus EX There is a possibility that the exposure accuracy is lowered. Therefore, by eliminating the vibration of the substrate S at the portion where the vibration eliminating device 91 is used to place the exposure apparatus EX, the lowering of the exposure accuracy is suppressed.

The substrate S conveyed from the processing chamber 13 to the processing chamber 12 is carried into the heating apparatus 52 through the guide rollers R14, R15, and R16. In the heating device 52, the photosensitive film is subjected to a heat treatment. After the heat treatment is performed, the substrate S carried out of the heating device 52 is inserted into the connection portion 16 through the guide roller R17, and is transported to the treatment chamber 11 via the connection portion 16.

The substrate S conveyed to the process chamber 11 is conveyed to the developing device 42 via the guide rollers R18 and R19. In the developing device 42, the substrate S is conveyed by the guide roller R20 while being immersed in the developer, and development processing is performed in the process of conveyance. The substrate S subjected to the developing process is taken out of the developing device 42 by the guide roller R21 and brought into the cleaning device 43 through the guide rollers R22 and R23.

In the cleaning device 43, the substrate S is conveyed by the guide roller R24 while being immersed in the cleaning liquid, and the cleaning process is performed in the course of the conveyance. The substrate S subjected to the cleaning process is taken out of the cleaning device 43 by the guide roller R25 and then transported to the processing chamber 12 through the connection portion 17. [

The substrate S conveyed to the process chamber 12 is conveyed to the heating device 53 through the guide roller R26. In the heating device 52, a heating process for drying the cleaned substrate S, a heating process for heating the coating film, and the like are performed. After the heating process is performed, the substrate S carried out of the heating device 53 is conveyed to the process chamber 11 via the connection portion 18 by the guidance of the guide roller R27.

The substrate S conveyed to the processing chamber 11 is carried into the plating apparatus 44. [ In the plating apparatus 44, the substrate S is conveyed by the guide roller R28 while being immersed in the plating liquid, and plating is performed in the course of the conveyance. A predetermined pattern is formed on the substrate S subjected to the plating process. The substrate S after the plating process is taken out of the plating apparatus 44 by the guide roller R29 and is conveyed to the processing chamber 12 through the connection portion 19. [ In the treatment chamber 12, a heating process is carried out by a heating device (not shown) through a guide roller R30.

As described above, according to the present embodiment, the processing section 3 for performing different kinds of processing to the substrate S is disposed, and among the processing sections (common sub-process) Is arranged in the same processing chamber. The substrate S is transferred to the processing chambers 11 to 13 so that the substrate S can be transported through the processing chambers 11 to 13 and the substrate S is transported to and from the processing chambers 11 to 13 a plurality of times. It is possible to efficiently utilize the space of the substrate processing section 3 because the transfer device 20 for transferring the substrate is provided.

For example, in the case of forming the constituent elements of the display element as in the present embodiment, since the heat treatment is frequently performed, a large number of heating apparatuses are provided. In the case where the heating apparatuses are collectively arranged in one processing chamber 12 as in the present embodiment, thermal energy can be efficiently used. The treatment chamber 12 in which the heating device is disposed is arranged in the middle layer in the Z direction and the treatment chamber 11 (wet treatment) and the treatment chamber 13 (exposure treatment) are disposed with the treatment chamber 12 interposed therebetween So that it is easy to access the heating apparatus. Therefore, the conveyance path of the substrate S in the whole apparatus can be shortened. In addition, in the treatment chamber 12, since the plurality of heating devices are arranged so as to overlap with the X direction and the Y direction, the space of the treatment chamber 12 can be saved. Therefore, the area of the site required for installing the substrate processing apparatus 100 can be suppressed.

2, a combination of a coating device, a heating device, an exposure device, a developing device, a cleaning device, and a plating device has been described as an example of the processing device 10, but the present invention is not limited to this combination. A plurality of the processing apparatuses 10 may be arranged in the X direction or the Y direction. That is, by carrying the substrate S to the coating device of the other processing apparatus 10 through the guide roller R30 and repeating the above operation, the constituent elements of the display element are sequentially formed on the substrate S . In this case, when a plurality of processing apparatuses 10 are arranged in plural, the exposure precision and resolution of the plurality of exposure apparatuses EX may be different from each other.

When a plurality of the processing apparatuses 10 are arranged in the Y direction, a configuration in which a plurality of heating units 50 shown in Fig. 5, that is, a structure in which adjacent heating units 50 are connected as described above can be used.

The technical scope of the present invention is not limited to the above embodiment, and can be appropriately changed within the scope of the present invention.

For example, in the above-described embodiment, the structure of the vibration removing device 91 is configured to use the tension releasing mechanisms 92 and 93 shown in Fig. 8, but the present invention is not limited to this. The vibration removing device 91 may be constituted as shown in Figs. 9 to 11, for example.

9 shows vibration absorbing mechanisms 192 and 193 as other structural examples of the tension relieving mechanisms 92 and 93 in the vibration removing device 91. As shown in Fig.

The vibration absorbing mechanisms 192 and 193 have the direction changing rollers 194a and 194b (direction switching section 194) and the vibration absorbing section 196. [

The vibration absorbing portion 196 has a roller 196a, a roller supporting portion 196b, a spring member 196c and a wall portion 196d.

The roller 196a is disposed between the direction changing roller 194a and the direction changing roller 194b. A portion Sc of the substrate S which has been changed in direction is engaged with the roller 196a. The roller 196a is mounted on the wall portion 196d through a roller support portion 196b and a spring member 196c. Therefore, the vibration of the substrate S is absorbed by the roller 196a and the spring member 196c in the part Sc.

Fig. 10 shows vibration absorbing mechanisms 292 and 293 as other structural examples of the tension relieving mechanisms 92 and 93 in the vibration removing device 91. Fig.

The vibration absorbing mechanisms 292 and 293 have the direction changing rollers 294a and 294b (direction switching portion 294) and the vibration absorbing portion 297. [ The vibration absorbing portion 297 has a roller 297a and a vibration absorbing layer 297b formed on the cylindrical surface of the roller 297a.

The roller 297a is disposed between the direction changing roller 294a and the direction changing roller 294b. A portion Sc of the substrate S which has been redirected is attached to the roller 297a. As the vibration absorbing layer 297b, for example, a vibration absorbing material such as a solbothane is used. In the structure shown in Fig. 10, since the vibration of the substrate S is absorbed by the vibration absorbing layer 297b formed on the roller 297a, the structure is finished with a simple structure.

11 shows vibration imparting mechanisms 392 and 393 as another example of the tension relieving mechanisms 92 and 93 in the vibration eliminating device 91. [

The vibration imparting mechanisms 392 and 393 have the direction changing rollers 394a and 394b (direction changing portion 394) and the vibration generating portion 398. [ The vibration generating section 398 includes a roller 398a, a vibration adjusting section 398b for vibrating the roller 398a, a sensor (not shown) for detecting vibration at a position on the downstream side of the roller 398a 398c.

The roller 398a is disposed between the direction changing roller 394a and the direction changing roller 394b. A portion Sc of the substrate S which has been redirected is attached to the roller 398a. Based on the detection result of the sensor 398c, the vibration adjusting unit 398b generates vibration that eliminates the vibration of the substrate S. [ Therefore, in the structure shown in Fig. 11, the oscillation of the substrate S can be suppressed by removing the vibration of the substrate S by the roller 398a.

12, for example, in the configuration of the tension releasing mechanism 92, the direction changing roller 94a and the nip roller 95a are disposed in the processing chamber 12, and the direction changing roller 94b And the nip roller 95b are arranged in the processing chamber 13. In the structure of the tension releasing mechanism 93, the direction changing roller 94a and the nip roller 95a are arranged in the processing chamber 13, The roller 94b and the nip roller 95b may be arranged in the process chamber 12. [

Similarly, in the structure of the vibration absorbing mechanism 192 shown in Fig. 9, for example, the direction changing roller 194a and the roller 196a are disposed in the process chamber 12, and the direction changing roller 194b is disposed in the process chamber 13 And the roller 196a and the direction switching roller 194b are disposed in the process chamber 12 in the structure of the vibration absorbing mechanism 193. In the structure of the vibration absorbing mechanism 193, the direction changing roller 194a is disposed in the process chamber 13, It may be a configuration. As the wall portion 196d, for example, a partition member 14b or the like can be used.

10, for example, the direction changing roller 294a and the roller 297a are disposed in the process chamber 12, and the direction changing roller 294b is disposed in the process chamber 13 And the roller 297a and the direction switching roller 294b are disposed in the process chamber 12 in the structure of the vibration absorbing mechanism 293. The direction of the rotation of the roller 297a It may be a configuration.

11, for example, a direction changing roller 394a and a roller 398a are disposed in the process chamber 12, and a direction changing roller 394b is disposed in the process chamber 13 And the roller 398a and the direction changing roller 394b are disposed in the process chamber 12 in the structure of the vibration absorbing mechanism 393. The direction of the rotation It may be a configuration.

8, the direction switching roller 94a and the nip roller 95a and the direction changing roller 94b and the nip roller 95b are disposed in the processing chamber 12 and Or may be arranged in at least one of the processing chamber 13. 13 shows a configuration in which the direction changing rollers 94a and 94b and the nip rollers 95a and 95b are disposed in the process chamber 13. In Fig.

In the above embodiment, the vibration removing device 91 is provided between the process chamber 12 and the process chamber 13, but the present invention is not limited to this.

14, in addition to the vibration removing device 91, a foreign matter movement restraining device 84 for suppressing the movement of foreign matter, and a foreign matter movement restraining device 84 for suppressing the movement of the foreign matter, for example, A fluid movement restricting device 85 for regulating the movement of the liquid, and a temperature regulating device (substrate temperature regulating portion) 86 for regulating the temperature of the substrate S, and the like.

14, the foreign matter movement restraining device 84, the fluid movement restricting device 85, the temperature regulating device 86 and the vibration removing device 91 are arranged in this order from the upstream side to the downstream side in the carrying direction of the substrate S Respectively. At least one of the vibration removing device 91, the foreign material movement restraining device 84, the fluid movement restricting device 85 and the temperature regulating device 86 is disposed between the process chamber 11 and the process chamber 12 As shown in Fig.

The foreign material movement restraining device 84 has an air curtain forming portion 84a and a stage 84b. The foreign matter movement restraining device 84 forms an air curtain by the air curtain forming portion 84a with respect to the substrate S supported by the stage 84b. The foreign matter on the substrate S is removed by the air curtain.

The fluid movement restricting device 85 has an upstream roller 85a, a downstream roller 85b, and a gas injector 85c. 15 is a plan view showing the configuration of the fluid movement restricting device 85. Fig. As shown in Figs. 14 and 15, the fluid movement restricting device 85 is provided with a gas ejecting portion 85c for the substrate S, which is conveyed while being held by the upstream roller 85a and the downstream roller 85b, As shown in FIG.

The gas injecting section 85c is arranged so that the position on the -Y side, the position on the + X side, and the side in the -Y direction (the Y direction) with respect to the substrate S held in the state of being engaged with the upstream roller 85a and the downstream roller 85b And the position in the + X direction. It is possible to remove the gas adhering to the surface of the substrate S by the gas or the gas sensitive to the surface of the substrate by jetting the gas onto the substrate S. [

14, the temperature adjusting device 86 adjusts the temperature of the substrate S from which the fluid has been removed. The temperature regulating device 86 has a roller 86a and a temperature regulating device 86b. In the above-described embodiment, the configuration in which the temperature adjusting mechanism 94c is provided on the direction changing roller 94a has been described as an example, but the temperature of the substrate S can be adjusted separately from this.

Each of the foreign matter movement restraining device 84, the fluid movement restricting device 85, the temperature regulating device 86 and the vibration removing device 91 is configured to be disposed between the process chamber 12 and the process chamber 13 But may be arranged between the process chamber 11 and the process chamber 12.

In the above embodiment, the treatment chambers 11 to 13 are hierarchically arranged in the Z direction. However, the present invention is not limited to this. For example, the treatment chambers 11 to 13 may be arranged in the X direction or the Y direction. Further, the present invention can be applied even when each of the treatment chambers 11 to 13 is formed as an independent apparatus or a factory.

In the above embodiment, the substrate S is conveyed such that the surface S of the substrate S faces the direction perpendicular to the gravitational direction (parallel to the XY plane). However, the present invention is not limited thereto The substrate S may be transported in a state in which the target surface Sa of the substrate S faces the direction parallel to the gravity direction (the substrate S is standing). In this case, when the substrate S is bent in the gravitational direction by the tension releasing mechanisms 92 and 93, the work surface Sa of the substrate S may be partially oriented in a direction perpendicular to the gravitational direction .

2, a combination of a coating device, a heating device, an exposure device, a developing device, a cleaning device, and a plating device has been described as an example of the processing device 10, but the present invention is not limited to this combination. A plurality of the processing apparatuses 10 may be arranged in the X direction or the Y direction. That is, by carrying the substrate S to the coating device of the other processing apparatus 10 through the guide roller R30 and repeating the above operation, the constituent elements of the display element are sequentially formed on the substrate S . In this case, when a plurality of processing apparatuses 10 are arranged in plural, the exposure precision and resolution of the plurality of exposure apparatuses EX may be different from each other. When a plurality of the processing apparatuses 10 are arranged in the Y direction, a configuration in which a plurality of heating units 50 shown in Fig. 5, that is, a structure in which adjacent heating units 50 are connected as described above can be used.

In the present embodiment, the pressures in the chambers of the processing chambers 11 to 13 may be independently adjusted.

For example, in the processing chamber 13 accommodating the exposure apparatus EX, particles (particles) adhering to the surface of the optical system are prevented from entering the other processing chamber, for example, the processing chamber 12, It is preferable to make the pressure higher than the pressure of the processing chamber 12. [ Since the processing chamber 11 uses a plurality of liquids, it is preferable to set the pressure in the processing chamber 13 higher than the pressure in the processing chamber 12 so that these liquids do not flood into the processing chamber 12.

The pressures of the three processing chambers are set such that the pressure in the processing chamber 13 is the highest among the three processing chambers and the pressure in the processing chamber 11 is the lowest, As shown in FIG.

S ... PCB CONT ... The control unit
EX ... Exposure device R (R1 to R30) ... Guide roller (guide portion)
3 ... Substrate processing section (processing section) Processing device
41 ... The applicator 42 ... The developing device
43 ... The cleaning device 44 ... Plating device
11-13 ... (First treatment chamber, second treatment chamber, third treatment chamber)
15 to 19 ... Connection 20 ... The transfer device (transfer section)
45 ... The waste liquid collecting unit (collecting pipe, collecting unit) 51 to 53 ... Heating device
60 ... Chamber 61 ... Substrate inlet (inlet)
62 ... Substrate accommodating chamber (accommodating chamber) 63 ... Substrate outlet (outlet)
70 ... Heating section 84 ... Foreign matter movement suppression device
85 ... Fluid movement regulating device 86 ... Temperature controller (substrate temperature controller)
91 ... Vibration removing device (adjusting mechanism) 92, 93 ... Tension relieving mechanism
96 ... The rotation driving unit 100 ... Substrate processing apparatus
192, 193 ... Vibration absorbing mechanisms 292, 293 ... Vibration absorbing mechanism
392, 393 ... Vibration imparting mechanism

Claims (14)

A substrate processing apparatus for forming an electronic device on a substrate while conveying a band-shaped substrate having flexibility in a long direction,
A first processing chamber for wet processing the substrate using a liquid;
A second processing chamber divided from the first processing chamber by a partition member for drying the substrate,
A third processing chamber divided from the second processing chamber by a partition member for exposing a pattern of the electronic device to the substrate,
A first transporting path in which the substrate is transported in the longitudinal direction in the order of the first processing chamber, the second processing chamber, and the third processing chamber through a connecting portion or an opening formed in each of the partitioning members; And a conveying device for guiding the substrate along a second conveyance path for allowing the processed substrate to be conveyed back to the first processing chamber through the connection portion or the opening portion. The method according to claim 1,
Wherein the first processing chamber is provided with a coating apparatus for forming a coating film of the liquid on the substrate before the exposure processing and a wet processing apparatus for processing the substrate after the exposure processing with the liquid. The method of claim 2,
Wherein the first transport path is set such that the substrate is transported in the order of the coating device accommodated in the first process chamber, the second process chamber, and the third process chamber, Wherein the substrate subjected to exposure processing in the first processing chamber is set to be transferred to the wet processing apparatus accommodated in the first processing chamber. The method of claim 3,
The wet processing apparatus includes a developing device that develops the substrate using a developing solution (developing solution), a cleaning device that cleans the substrate using a cleaning solution, and a pattern forming device that forms a pattern on the substrate using a plating solution (plating solution) Plating apparatus. The method of claim 4,
The conveying apparatus includes a plurality of rollers for forming a third conveying path for conveying the substrate processed by the wet processing apparatus through the second conveying path to the second processing chamber again through the connecting portion or the opening And the substrate processing apparatus. The method of claim 5,
A first heating device for heating the substrate conveyed through the first conveyance path to dry the coating film formed by the coating device, and a second heating device for heating the substrate conveyed through the third conveyance path And a second heating device for drying the substrate processed by the wet processing apparatus is accommodated. The method according to any one of claims 1 to 6,
Wherein the transfer device comprises a substrate processing apparatus having a substrate processing apparatus including a substrate carried in the third processing chamber through the first transport path or an adjustment mechanism for reducing the tension of the substrate carried out from the third processing chamber in the second transport path Device. The method according to any one of claims 1 to 6,
A foreign matter movement restraining device for removing foreign matter on the substrate between the second treatment chamber and the third treatment chamber or between the first treatment chamber and the second treatment chamber; Wherein at least one of the fluid movement restricting devices for removing the fluid is provided. The method according to any one of claims 1 to 6,
Wherein the first processing chamber, the second processing chamber, and the third processing chamber are hierarchically arranged in the gravitational direction. The method according to any one of claims 1 to 6,
Wherein the pressure of each of the first processing chamber, the second processing chamber, and the third processing chamber is independently adjusted. The method of claim 10,
The first processing chamber is set to the lowest pressure and the third processing chamber is set to the highest pressure among the first to third processing chambers. A device manufacturing method for forming an electronic device on a substrate while conveying a band-shaped substrate having flexibility in a long direction,
A first step of bringing the substrate into the first processing chamber divided by the partition member through a connection portion or an opening formed in the partitioning member and performing a first wet processing on the substrate in the first processing chamber,
The substrate subjected to the first wet processing in the first treatment chamber is carried into the second treatment chamber divided from the first treatment chamber by the partition member through the connection portion or the opening portion formed in the partition member, A second step of drying the substrate,
The substrate dried in the second treatment chamber is carried into the third treatment chamber divided from the first treatment chamber and the second treatment chamber by the partition member through the connection portion or the opening portion formed in the partition member, A third step of exposing the pattern of the electronic device,
A fourth step of bringing the substrate subjected to the exposure treatment in the third treatment chamber into the first treatment chamber through the connection portion formed in the partition member or the opening portion and performing a second wet treatment on the substrate in the first treatment chamber ,
A fifth step of carrying the substrate subjected to the second wet processing in the first treatment chamber into the second treatment chamber through the connection portion formed in the partition member or the opening and drying the substrate in the second treatment chamber ≪ / RTI > The method of claim 12,
Wherein the first wet processing is a process of applying a photosensitive agent to the substrate by a coating apparatus disposed in the first processing chamber. 14. The method of claim 13,
Wherein the second wet processing is a processing of developing the photosensitive agent on the substrate by a developing apparatus arranged in the one processing chamber.

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