TW201630102A - Substrate processing apparatus and device manufacturing method - Google Patents

Abstract

A substrate processing apparatus includes: a plurality of processing portions which respectively perform a processing to a band-like shape substrate; a first processing chamber that accommodates a first processing portion which can execute a common sub-process in the plurality of the processing portions; a second processing chamber that accommodates a second processing portion out of the plurality of the processing portions; a feed portion that feeds the substrate to each of the first processing chamber and the second processing chamber.

Description

Substrate processing apparatus and component manufacturing method

The present invention relates to a substrate processing apparatus.

Priority is claimed on Japanese Patent Application No. 2011-097122, filed on Apr. 25, 2011, the content of which is hereby incorporated herein.

Examples of the display element constituting the display device such as a display device include a liquid crystal display element, an organic electroluminescence (organic EL) element, and the like. At present, these display elements are becoming mainstream with the formation of an active device called a Thin Film Transistor (TFT) on the surface of the substrate corresponding to each pixel.

In recent years, a technique of forming a display element on a sheet-like substrate (for example, a film member or the like) has been proposed. As such a technique, for example, a method called a roll to roll method (hereinafter, abbreviated as "reel method") is widely known (for example, refer to Patent Document 1). In the reel method, one sheet-like substrate (for example, a strip-shaped film member) wound around a supply roller on the substrate supply side is fed, and the substrate to be fed is taken up by the recovery roller on the substrate recovery side. The substrate is applied to the substrate by a processing unit (unit) provided between the supply roller and the recovery roller.

In the meantime, the gate electrode, the gate insulating film, the semiconductor film, and the source electrode constituting the TFT are formed by using a plurality of processing units while transferring the substrate using a plurality of transfer rollers or the like while the substrate is being ejected. a drain electrode, etc., on the treated surface of the substrate The sequence forms the constituent elements of the display element.

Patent Document 1: International Publication No. 2006/100868

However, in the above steps, a long transport path of several hundred meters in total length may be required, and for example, it is required to efficiently arrange the respective processing units in a limited space such as a factory.

An aspect of the present invention is to provide a substrate processing apparatus capable of efficiently arranging a processing unit.

According to an aspect of the present invention, a substrate processing apparatus includes: a plurality of processing units that respectively process a substrate formed into a strip shape; and a first processing chamber that accommodates a plurality of processing units capable of executing a common subroutine a processing unit; the second processing chamber is configured to receive the second processing unit of the plurality of processing units; and the transport unit to transport the substrates to the first processing chamber and the second processing chamber, respectively.

According to the aspect of the invention, the space of the processing portion can be utilized efficiently.

3‧‧‧Substrate processing unit (processing unit)

10‧‧‧Processing device

11~13‧‧‧Processing room (first processing room, second processing room, third processing room)

15~19‧‧‧Connecting Department

20‧‧‧Transporting device (transporting unit)

41‧‧‧ Coating device

42‧‧‧Developing device

43‧‧‧cleaning device

44‧‧‧ plating device

45‧‧‧ Waste liquid recovery department (recycling pipe, recycling department)

51~53‧‧‧ heating device

60‧‧‧ housing

61‧‧‧Substrate entrance (moving entrance)

62‧‧‧Substrate containment room (containment room)

63‧‧‧Substrate removal (transportation)

70‧‧‧heating department

84‧‧‧ Foreign object movement suppression device

85‧‧‧Liquid movement limiting device

86‧‧‧temperature control device (substrate temperature adjustment unit)

91‧‧‧Vibration removal device (adjustment mechanism)

92, 93‧‧‧Tensile Elimination Mechanism

96‧‧‧Rotary drive department

100‧‧‧Substrate processing unit

192, 193‧ ‧ vibration absorption mechanism

292, 293‧‧ ‧ vibration absorption mechanism

392, 393‧‧ ‧ vibration-giving institutions

S‧‧‧Substrate

CONT‧‧‧Control Department

EX‧‧‧Exposure device

R (R1~R30)‧‧‧ Guide roller (guide)

Fig. 1 is a view showing the overall configuration of a substrate processing apparatus of the present embodiment.

Fig. 2 is a cross-sectional view showing the configuration of a substrate processing unit of the substrate processing apparatus of the embodiment.

Fig. 3 is a cross-sectional view showing the configuration of a heating unit of the embodiment.

Fig. 4 is a perspective view showing the configuration of the heating unit of the embodiment.

Fig. 5 is a perspective view showing the configuration of the heating device of the embodiment.

Fig. 6 is a view showing an arrangement example of a heating device disposed in a processing chamber according to the embodiment.

Fig. 7 is a comparison diagram showing a configuration example of the heating device.

Fig. 8 is a side view showing the configuration of the vibration removing device of the embodiment.

Fig. 9 is a side view showing another configuration of the vibration removing device.

Fig. 10 is a side view showing another configuration of the vibration removing device.

Fig. 11 is a side view showing another configuration of the vibration removing device.

Fig. 12 is a side view showing another configuration of the vibration removing device.

Fig. 13 is a side view showing another configuration of the vibration removing device.

Fig. 14 is a view showing the configuration of the processing chambers of the embodiment.

Fig. 15 is a view showing the configuration of the fluid removing device of the embodiment.

Hereinafter, the present embodiment will be described with reference to the drawings.

Fig. 1 is a view showing the configuration of a substrate processing apparatus 100 of the present embodiment.

As shown in FIG. 1, the substrate processing apparatus 100 includes a substrate supply unit 2 that supplies a strip-shaped substrate (for example, a sheet-like film member) S, and a substrate processing unit 3 that processes the surface (processed surface) Sa of the substrate S. The substrate recovery unit 4 of the substrate S is recovered, and the control unit CONT of each of the units is controlled. The substrate processing unit 3 includes a substrate processing apparatus 100 for performing various processes on the surface of the substrate S while the substrate S is fed from the substrate supply unit 2 and after the substrate S is recovered by the substrate collection unit 4 . This substrate processing apparatus 100 can be used for forming a display element (electronic element) such as an organic EL element or a liquid crystal display element on the substrate S.

Further, in the present embodiment, the XYZ orthogonal coordinate system is set as shown in Fig. 1, and the XYZ orthogonal coordinate system will be appropriately described below. The XYZ orthogonal coordinate system, for example, sets the X axis and the Y axis along the horizontal plane, and sets the Z axis upward in the vertical direction. Further, the substrate processing apparatus 100 entirely transports the substrate S from the negative side (− side) to the positive side (+ side) along the X-axis. At this time, the width direction (short side direction) of the strip-shaped substrate S is set in the Y-axis direction.

As a substrate S to be processed by the substrate processing apparatus 100, a usable example is used. A foil such as a resin film or stainless steel. As the resin film, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, or the like may be used. Materials such as polycarbonate resin, polystyrene resin, and vinyl acetate resin.

The substrate S is preferably one which is subjected to heat of, for example, about 200 ° C and whose thermal expansion coefficient is substantially unchanged. For example, an inorganic filler may be mixed in the resin film to lower the coefficient of thermal expansion. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, cerium oxide, and the like.

The dimension in the width direction (short side direction) of the substrate S is formed, for example, to about 1 m to 2 m, and the dimension in the longitudinal direction (longitudinal direction) is formed to be, for example, 10 m or more. Of course, this size is only an example and is not limited thereto. For example, the dimension of the substrate S in the Y direction may be 50 cm or less, or may be 2 m or more. Further, the dimension of the substrate S in the X direction may be 10 m or less.

The substrate S is formed to have flexibility. Here, the term "flexibility" refers to a property in which the substrate can be bent without being broken or broken by applying a force to the substrate. Moreover, the property of being bent by the force of the degree of self-weight is also included in the flexibility. Further, the flexibility described above varies depending on the material, size, thickness, temperature, and the like of the substrate. Further, the substrate S may be a strip-shaped substrate, or a plurality of unit substrates may be connected to form a strip.

The substrate supply unit 2 supplies and supplies the substrate S wound in a roll shape to the substrate processing unit 3, for example. The substrate supply unit 2 is provided with, for example, a shaft portion for winding the substrate S or a rotation driving device for rotating the shaft portion. In addition to this, for example, a cover portion or the like for covering the substrate S wound in a roll state may be provided. Further, the substrate supply unit 2 is not limited to a mechanism for feeding the substrate S wound in a reel shape, and includes a mechanism for sequentially feeding the strip-shaped substrate S in the longitudinal direction thereof. Yes.

The substrate collection unit 4 collects the substrate S of the substrate processing apparatus 100 included in the substrate processing unit 3, for example, in a roll shape. Similarly to the substrate supply unit 2, the substrate collection unit 4 is provided with a shaft portion for winding the substrate S, a rotation drive source for rotating the shaft portion, and a cover portion for covering the recovered substrate S. In the case where the substrate processing unit 3 cuts the substrate S into a flat shape, for example, the substrate S may be collected in a state in which the substrate S is collected in a stacked state or the like in a state of being wound into a reel. Composition.

The substrate processing unit 3 transports the substrate S supplied from the substrate supply unit 2 to the substrate collection unit 4, and processes the processed surface Sa of the substrate S during the transfer process. The substrate processing unit 3 includes, for example, a processing device 10 and a conveying device (transporting unit) 20.

The processing apparatus 10 has various means for forming, for example, an organic EL element on the processed surface Sa of the substrate S. As such a device, for example, a partition wall forming device for forming a partition wall on the surface to be processed Sa, an electrode forming device for forming an electrode, and a light-emitting layer forming device for forming a light-emitting layer can be used. More specifically, there are a droplet applying device (for example, an inkjet coating device), a film forming device (for example, a plating device, a vapor deposition device, a sputtering device), an exposure device, a developing device, a surface modifying device, and a washing machine. Net device, etc. Each of these devices is appropriately disposed along the transport path of the substrate S. In the present embodiment, as the processing apparatus 10, for example, the application device 41, the heating devices 51 to 53, the exposure device EX, the developing device 42, the cleaning device 43, and the plating device 44 (described above in detail in FIG. 2) are used. The configuration is described as an example.

The transport device 20 has a plurality of guide rollers (guide portions) R that guide the substrate S in the substrate processing unit 3 (only two rollers are illustrated in FIG. 1). The guide roller R is disposed along the transport path of the substrate S. a guide roller R mounted on at least a part of the plurality of guide rollers R is mounted with a rotary drive Moving mechanism (not shown). In the present embodiment, the length of the transport path of the transport device 20 is, for example, about several hundred meters in total length.

2 is a cross-sectional view showing a part of the substrate processing unit 3.

As shown in FIG. 2, the substrate processing unit 3 has three processing chambers 11 to 13. The processing chambers 11 to 13 are partitioned by the partition portion 14.

The partition portion 14 includes a partition member 14a constituting the bottom of the processing chamber 11, a partition member 14b constituting the top of the processing chamber 11 and the bottom of the processing chamber 12, a partition member 14c constituting the top of the processing chamber 12, and the bottom of the processing chamber 13, and the like. The partition member 14d at the top of the processing chamber 13.

The processing chamber 11 is disposed at a lowermost portion (most at the -Z side) in the gravity direction in a plurality of processing chambers. The processing chamber 11 forms a processing space for performing processing (wet processing) using the liquid on the substrate S. In the processing chamber 11, as shown in FIG. 2, for example, a coating device 41 including a photoresist liquid storage container (containing a photoresist liquid for coating the substrate S), and a developer storage container (receiving) are provided as the processing device 10. A developing device 42 for developing a developing solution for the substrate S, a cleaning device 43 including a cleaning liquid storage container (a cleaning liquid for accommodating the cleaning substrate S), and a plating liquid storage container (for storage) A plating apparatus 44 for forming a plating solution on the substrate S after the cleaning process. Further, it is not limited to the above liquid, and the processing chamber 11 can also accommodate a processing device using various liquids.

The coating device 41 includes a guide roller R2 disposed inside the coating device 41, a guide substrate S, and a guide roller R3 that carries out the coating process from the coating device 41 to the processing chamber 11. A guide roller R1 that guides the substrate S supplied from the substrate supply unit 2 to the coating device 41 is disposed on the upstream side of the guide roller R2 in the transport direction of the substrate S. The developing device 42 has a guide roller R20 disposed inside the developing device 42 and guiding the substrate S, and a developing portion The substrate S that has been finished is carried out from the developing device 42 to the guide roller R21 in the processing chamber 11. Guide rollers R18 and R19 for guiding the substrate S from the heating device 52 of the processing chamber 12 to the developing device 42 via the guiding roller R17 are disposed on the upstream side of the guiding roller R20 in the conveying direction of the substrate S.

Guide rollers R22 and R23 for guiding the substrate S from the developing device 42 to the cleaning device 43 are disposed on the downstream side of the guide roller R21 in the transport direction of the substrate S. Further, the guide rollers R1, R18, R19, R22, and R23 are disposed in the processing chamber 11.

The cleaning device 43 includes a guide roller R24 disposed inside the cleaning device 43 and guiding the substrate S, and a guide roller R25 that carries out the cleaning process from the cleaning device 43 to the processing chamber 11 . The plating apparatus 44 includes a guide roller R28 disposed inside the plating apparatus 44, a guide substrate S, and a guide roller R29 that carries out the plating process from the plating apparatus 44 into the processing chamber 11 .

The partition member 14a is provided with a plurality of collection pipes (waste liquid recovery unit, collection unit) 45 constituting a part of the waste liquid recovery flow path connected to the recovery device (not shown). One end of the recovery pipe 45 is connected to the coating device 41, the developing device 42, and the cleaning device 43, respectively, and the other end portion is connected to a waste liquid recovery flow path (not shown) connected to the recovery device. Each of the recovery pipes 45 discharges the photoresist liquid, the developer, and the cleaning liquid which become the waste liquid in the coating device 41, the developing device 42, and the cleaning device 43 to the recovery device via the waste liquid recovery flow path. An opening and closing valve (not shown) is provided in the recovery pipe 45. The control unit CONT can control the opening and closing timing of the opening and closing valve. In the present embodiment, since the processing chamber 11 at the lowermost portion in the direction of gravity is provided with the apparatus for wet processing, the length of the flow path of the waste liquid recovery flow path between the apparatus and the recovery apparatus can be suppressed.

The processing chamber 12 is disposed above the processing chamber 11 (+Z side). The processing chamber 12 forms a processing space for heat-treating the substrate S. In the processing chamber 12, as the processing device 10, there is an addition Heating means 51 to 53 of the hot substrate S. The heating device 51 heats the substrate S coated with the photoresist by the coating device 41 to dry the photoresist. The heating device 52 reheats the substrate S passing through the exposure device EX of the processing chamber 13 to dry the photoresist. The heating device 52 heats the substrate S at a temperature different from the heating temperature of the heating device 51, for example, at a temperature higher than the heating temperature of the heating device 51. The heating device 53 heats the substrate S which has been subjected to development processing by the developing device 42 and is cleaned by the cleaning device 43, and the surface of the substrate S is dried.

A guide roller R4 that guides the substrate S passing through the coating device 41 in the processing chamber 11 to the heating device 51 is disposed on the upstream side of the heating device 51 in the conveying direction of the substrate S. Guide rollers R5, R6, and R7 are disposed along the transport path on the downstream side of the heating device 51 in the transport direction of the substrate S, whereby the guide rollers R5, R6, and R7 guide the substrate S into the processing chamber 13 Exposure device EX.

On the upstream side of the heating device 52 in the transport direction of the substrate S, guide rollers R14 and R15 for guiding the substrate S passing through the exposure device EX of the processing chamber 13 to the heating device 52 via the guide roller R13 are disposed along the transport path. And R16. On the downstream side of the heating device 52 in the conveying direction of the substrate S, the developing device 42 in the processing chamber 11 is provided with a guiding roller R17 for guiding the substrate S via the guiding rollers R18 and R19.

A guide roller R26 that guides the substrate S passing through the cleaning device 43 to the heating device 53 is disposed on the upstream side of the heating device 53 in the conveying direction of the substrate S. Further, on the downstream side of the heating device 53 in the transport direction of the substrate S, a guide roller R27 that guides the substrate S to the plating device 44 in the processing chamber 11 is disposed. Further, a guide roller R30 for guiding the substrate S to the next step is disposed on the +X side of the guide roller R27. These guide rollers R4, R5, R6, R7, R14, R15, R16, R17, R26, R27 and R30 are disposed in the processing chamber 12.

In the partition member 14b, a plurality of connecting portions 15 to 19 for passing the substrate S are provided between the processing chamber 11 and the processing chamber 12. The connecting portions 15 to 19 are, for example, through holes penetrating the partition member 14b in the Z direction. Each of the connecting portions 15 to 19 is formed to have a size through which the substrate S can pass. The substrate S moves across the processing chamber 11 and the processing chamber 12 by the connecting portions 15 to 19.

The guide roller R3 and the guide roller R4 guide the substrate S through the connecting portion 15. The guide roller R17 and the guide roller R18 guide the substrate S through the connecting portion 16. The guide roller R25 and the guide roller R26 guide the substrate S through the connecting portion 17. The guide roller R27 and the guide roller R28 guide the substrate S through the connecting portion 18. The guide roller R29 and the guide roller R30 guide the substrate S through the connecting portion 19. As described above, the transport device 20 guides the substrate S so that the substrate S passes through the connecting portions 15 to 19.

Further, the guide rollers R3, R4, R17, R18, and R25 to R30 disposed via the connecting portions 15 to 19 may be configured to have a temperature adjustment device for adjusting the temperature of the substrate S, for example. With this configuration, the temperature of the substrate S can be adjusted before and after the heating devices 51 to 53.

Next, the detailed configuration of the heating devices 51 to 53 will be described. The heating devices 51 to 53 each have one or a plurality of heating units 50. 3 is a side cross-sectional view showing the structure of the heating unit 50. 4 is a perspective view showing the construction of the heating unit 50.

As shown in FIGS. 3 and 4, the heating unit 50 includes a casing 60 and a heating unit 70 in the heating casing 60.

The casing 60 is formed in a rectangular ring shape in which the pair of first wall portions (the right side wall portion 60d and the left side wall portion 60c) and the pair of second wall portions (the upper wall portion 60f and the lower wall portion 60e) form an internal space. Moreover, the internal space formed in the casing 60 functions as a substrate storage chamber (accommodation chamber) 62. A substrate carrying inlet (porting) 61 is formed in the first wall portion (left side wall portion) 60c of one of the casings 60, and the casing 60 is formed in the casing 60. The other first wall portion (right side wall portion) 60d is formed with a substrate transfer port (transport) 63. Moreover, one end surface (-Y side end surface) of the casing 60 is referred to as a first opening end 60a, and the other end surface (+Y side end surface) of the casing 60 is referred to as a second opening end 60b. A connecting portion (not shown) for connecting the plurality of heating units 50 is provided at the first open end 60a and the second open end 60b of the casing 60.

The first open end 60a and the second open end 60b of the casing 60 can be attached to the lid portion of the sealed substrate storage chamber 62. Therefore, when only one heating unit 50 is used, the sealed space can be formed by blocking the end faces of the open ends 60a and 60b. Further, by connecting a plurality of heating units 50, it is possible to form a larger sealed space than when the single heating unit 50 is used. In this case, the end surface of the heating unit 50 disposed at the end in the joining direction can be blocked by the lid portion.

The substrate transfer port 61 and the substrate transfer port 63 are formed to have a size through which the substrate S can pass. That is, the dimension of the substrate carrying inlet 61 and the substrate carrying opening 63 in the Z direction is formed to be larger than the thickness of the substrate S. Moreover, the dimension of the substrate carrying inlet 61 and the substrate carrying-out 63 in the Y direction is formed to be larger than the dimension of the short side of the substrate S.

Folding rollers (folding portions) 64 to 67 for guiding the substrate S are provided in the substrate accommodating chamber 62. The folding rollers 64 to 67 are rotatably supported by the housing 60 by a support member (not shown). The folding rollers 64 and 66 are disposed on the +X side end portion of the substrate storage chamber 62, that is, on the right side wall portion 60d side. The folding rollers 65 and 67 are disposed on the -X side end portion of the substrate storage chamber 62, that is, on the left side wall portion 60c side. The folding rollers 64, 65, 66, and 67 are arranged in this order from the upper portion (+Z side) of the casing 60 to the lower portion (-Z side).

The folding drum 64 folds the substrate S that has been carried in the +X direction from the substrate loading port 61 in the -X direction. The folding cylinder 65 folds the substrate S which is folded over in the folding drum 64 and travels in the -X direction in the +X direction. The folding drum 66 will be folded over the folding cylinder 65 and oriented in the +X direction The traveling substrate S is folded in the -X direction. The folding drum 67 folds the substrate S which is folded over in the folding drum 66 and travels in the -X direction in the +X direction.

Therefore, the substrate S guided by the folding rollers 64 to 67 overlaps the folded sheets (parts) of the substrate S when viewed from the Z direction, and the folded sheets are disposed in a non-contact state with each other. Therefore, the substrate S can be efficiently accommodated in the substrate storage chamber 62 while maintaining the state of the processed surface Sa of the substrate S.

At least one of the folding rollers 64 to 67 is connected to a rotation driving mechanism (not shown) such as a motor. The control unit CONT can adjust the number of revolutions of the rotary drive mechanism and the timing of the rotation. Therefore, the transport speed of the substrate S can be adjusted in accordance with each heating unit 50.

Further, at least one of the folding rollers 64 to 67 may be moved in either of the X direction, the Y direction, and the Z direction. In this case, the folding rollers 64 to 67 can be controlled by the control unit CONT to adjust the transport path of the substrate S for each heating unit 50. Further, in the present embodiment, although four folding rollers are disposed in the casing 60, the number of heating can be increased or decreased depending on the heating time of the substrate S.

Fig. 5 is a view showing the configuration of the heating devices 51 to 53.

As shown in FIG. 5, the heating devices 51 to 53 have a plurality of heating units 50 arranged in the Y direction. The plurality of heating units 50 are in a state in which adjacent heating units 50 are coupled to each other. Further, in Fig. 5, the cover portion of the first open end 60a of the heating unit 50 is omitted.

The substrate accommodating chambers 62 are connected to each other by the connection heating unit 50. Therefore, by the heating unit 50, it is possible to constitute one heating furnace in which a plurality of substrates S are transported. The heating unit 70 may be configured to be disposed in common to the plurality of heating units 50, or may be configured separately for each of the heating units 50.

In a case where the heating unit 70 is provided in common to the plurality of heating units 50, the heating unit 70 can be heated together to form a plurality of substrate storage chambers 62 of one heating furnace. Therefore, the plurality of substrates S transported through the different transport paths are heated together by the heating unit 70 in one heating furnace. Therefore, the efficiency of the heat treatment can be improved. Further, in the case where the heating unit 70 is provided in each of the heating units 50, the heating temperature or the heating time may be adjusted in accordance with each heating unit 50. Further, as the heating unit 70, a heat generating unit or an irradiation unit (not shown) that irradiates electromagnetic waves can be used.

Fig. 6 is a view showing the arrangement of the heating devices 51 and 52 in the processing chamber 11.

In the configuration shown in Fig. 6, a plurality of (three) heating devices 51 that connect a plurality of heating units 50 in the processing chamber 12 are arranged in a row in the Y direction. As described above, by arranging the heating unit 50 or the heating device 51 in the Y direction, the space of the processing chamber 12 can be further saved as compared with the configuration in which the heating units 50 are arranged in the X direction as shown in FIG. 7 .

Returning to Fig. 2, the processing chamber 13 is disposed above the processing chamber 12 (+Z side). The processing chamber 13 is a processing space for performing exposure processing on the substrate S. In the processing chamber 13, an exposure device EX is provided as the processing device 10. The exposure apparatus EX irradiates the photoresist layer applied to the substrate S in the coating apparatus 41 with the exposure light via the mask pattern. Guide rollers R10 and R11 for guiding the substrate S to the position of the exposure light to be irradiated to the exposure device EX are disposed in the processing chamber 13.

An opening 90 is formed in the partition member 14c. The opening 90 is formed to penetrate the partition member 14c in the Z direction. The substrate S is guided from the processing chamber 12 to the processing chamber 13 via the opening 90 by the guide rollers R8 and R9. Further, the substrate S is guided from the processing chamber 13 to the processing chamber 12 via the opening portion 90 by the guide rollers R12 and R13. As described above, the opening portion 90 is a portion through which the substrate S passes.

A vibration removing device (adjusting mechanism) 91 is provided inside the opening portion 90 to remove the The vibration of the substrate S guided by the transport device 20 (for example, the guide rollers R8 to R13, etc.). The vibration removing device 91 is configured to remove the vibration transmitted to the substrate S by eliminating the tension of the substrate S and reducing the vibration transmission property of the substrate S. Therefore, the vibration removing device 91 of the present embodiment has the tension removing mechanisms 92 and 93 for eliminating the tension of the substrate S. Further, the vibration removing device 91 may not completely eliminate the vibration of the substrate S as long as the vibration can be reduced to a level that the processing device can tolerate. Therefore, the strain relief mechanism can also be referred to as a tension reduction mechanism.

The tension canceling mechanism 92 is disposed on the upstream side of the substrate S in the transport direction of the exposure device EX (guide roller R10). More specifically, the tension eliminating mechanism 92 is disposed between the guide roller R8 and the guide roller R9. The tension canceling mechanism 93 is disposed on the downstream side of the substrate S in the transport direction of the exposure device EX (guide roller R11). More specifically, the tension eliminating mechanism 93 is disposed between the guide roller R12 and the guide roller R13.

Fig. 8 is a view showing the configuration of the strain relief mechanisms 92 and 93.

As shown in Fig. 8, the tension eliminating mechanisms 92 and 93 have direction changing rollers 94a and 94b (direction changing portion 94) and holding rollers 95a and 95b (nip portion 95). The direction changing rollers 94a and 94b convert the conveying direction of the substrate S into the substrate S in the direction of gravity (-Z direction). Specifically, the portion Sb between the direction changing roller 94a and the direction changing roller 94b in the substrate S is in a relaxed state. Further, a temperature adjustment mechanism (substrate temperature adjustment unit) 94c is provided in the direction change roller 94a. The temperature of the portion of the substrate S that is in contact with the direction changing roller 94a is adjusted by the temperature adjusting mechanism 94c. Further, the temperature adjustment mechanism 94c can also be omitted.

The nip roller 95a is provided at a position sandwiching the substrate S between the direction changing roller 94a. The nip roller 95b is provided at a position sandwiching the substrate S between the direction changing roller 94b. The grip rollers 95a and 95b are connected to the rotation driving portion 96. The rotation driving portion 96 individually adjusts the clamping roller The rotation time or number of revolutions of 95a and 95b. Therefore, the substrate S can be conveyed in a state in which the slack portion Sb is formed.

Further, in the substrate S, the portion sandwiched between the direction changing roller 94a and the nip roller 95a and the portion of the substrate S sandwiched by the direction changing roller 94b and the nip roller 95b can transport the substrate at different conveying speeds. S. Therefore, the substrate S can be conveyed while adjusting the size of the slack portion Sb.

As described above, the slack portion Sb is formed by the strain relief mechanisms 92 and 93, and the tension of the substrate S is eliminated, and the vibration from the upstream side of the direction change roller 94a and the pinch roller 95a is reduced. Therefore, the transmission of the vibration of the substrate S is suppressed between the processing chamber 12 and the processing chamber 13 via the tension eliminating mechanisms 92 and 93. Therefore, the exposure apparatus EX disposed in the processing chamber 13 performs exposure processing without being affected by the vibration of the processing chamber 11 or the processing chamber 12. Since the tension eliminating mechanisms 92 and 93 are disposed in the partition member 14c, the space of the processing chambers 11 to 13 of the substrate processing unit 3 can be utilized efficiently.

Next, a procedure of manufacturing a display element (electronic component) such as an organic EL element or a liquid crystal display element using the substrate processing apparatus 100 having the above configuration will be described. The substrate processing apparatus 100 manufactures the display element in accordance with the control of the control unit CONT.

First, the substrate S wound around a roller (not shown) is attached to the substrate supply unit 2. The control unit CONT rotates the drum (not shown) so that the substrate S is sent out from the substrate supply unit 2 from this state. Then, the substrate S passing through the substrate processing unit 3 is taken up by a roller (not shown) provided in the substrate collecting portion 4.

The control unit CONT causes the substrate S to be on the substrate by the transfer device 20 of the substrate processing unit 3 after the substrate S is fed from the substrate supply unit 2 to the substrate recovery unit 4 The inside of the processing unit 3 is appropriately transported. The control unit CONT first carries the substrate S into the processing chamber 11 of the substrate processing unit 3. Hereinafter, the operation of the control unit CONT will be described.

The substrate S carried into the processing chamber 11 is carried into the coating device 41 via the guide roller R1 as shown in FIG. 2 . In the coating device 41, the substrate S is conveyed by the guide roller R2 in the +X direction. During the transfer, a coating film of a photosensitive agent is formed on the surface to be processed Sa of the substrate S. The substrate S processed by the coating device 41 is transported to the processing chamber 12 via the connecting portion 15 by the guide roller R3.

The substrate S carried into the processing chamber 12 is carried into the substrate accommodating chamber 62 from the substrate loading port 61 of the heating device 51 via the guiding roller R4 (see FIG. 3). In the substrate accommodating chamber 62, the substrate S is heated while the substrate S is folded over a plurality of times, and the substrate S is heated in this transport state. Therefore, the heat treatment for effectively utilizing the space of the substrate accommodating chamber 62 can be performed. In the heating device 51, the coating film formed on the substrate S is dried by heating. After the heat treatment, the substrate S carried out from the substrate carrying-out port 63 is conveyed to the opening portion 90 via the guide rolls R5, R6, and R7.

The substrate S that has reached the opening 90 is carried into the tension eliminating mechanism 92 by the guide roller R8. In the tension eliminating mechanism 92, the conveying speed is made different between the portion sandwiched by the direction changing roller 94a and the holding roller 95a and the portion sandwiched by the direction changing roller 94b and the holding roller 95b, so that the substrate S is formed. Relaxed part Sb.

After the slack portion Sb is formed, the conveying speeds of the direction changing rolls 94a and 94b and the holding rolls 95a and 95b to the substrate S are made equal. By this operation, the substrate S is carried out from the tension eliminating mechanism 92 in a state where the slack portion Sb is formed. The substrate S is transferred to the processing chamber 13 via the guide roller R9.

The vibration transmitted from the processing chamber 12 side via the substrate S is tied to the substrate S The relaxation portion Sb removes vibration. Therefore, the vibration is suppressed from being transmitted to the processing chamber 13 via the substrate S. Further, in the case where the temperature adjustment mechanism 94c is provided in the direction change roller 94a, the temperature change of the substrate S is performed in the direction change roller 94a. Here, it is adjusted to, for example, a temperature suitable for exposure processing.

The substrate S carried into the processing chamber 13 is transported by the guide rollers R10 and R11. The substrate S is subjected to exposure processing by an exposure device EX. By exposure processing, a predetermined area formed in the coating film of the processed surface Sa of the substrate S is light-sensitive. After the substrate S whose exposure process is completed is inserted into the opening 90, the tension eliminating mechanism 93 is carried in via the guide roller R12.

In the tension canceling mechanism 93, the slack portion Sb is formed on the substrate S in the same manner as the above-described tension canceling mechanism 92. Therefore, the vibration transmitted from the processing chamber 12 side via the substrate S is removed from the slack portion Sb of the substrate S to remove the vibration. On the other hand, as described above, since the slack portion Sb is also formed in the tension canceling mechanism 92, the portion of the substrate S disposed in the processing chamber 13 is removed from the processing chamber in both the strain relief mechanism 92 and the strain relief mechanism 93. The state of vibration transmitted by 12.

When the vibrations of the guide rollers R8 to R13 or the heating devices 51 and 52 are transmitted to the substrate S, the substrate S or other portions may be vibrated at the exposure light irradiation position of the exposure device EX, and the exposure accuracy may be lowered. . Therefore, the vibration of the substrate S across the portion of the exposure device EX is removed by using the vibration removing device 91, thereby suppressing the decrease in the exposure accuracy.

The substrate S transferred from the processing chamber 13 to the processing chamber 12 is carried into the heating device 52 via the guiding rollers R14, R15, and R16. In the heating device 52, heat treatment of the photosensitive coating film is performed. After the heat treatment, the substrate S carried out from the heating device 52 is inserted into the connection portion 16 via the guide roller R17, and is transported to the processing chamber 11 via the connection portion 16.

The substrate S transferred to the processing chamber 11 is moved into the display via the guide rollers R18 and R19. Shadow device 42. In the developing device 42, the substrate S is conveyed by the guide roller R20 while being immersed in the developing solution, and is subjected to development processing during the conveyance. The substrate S that has been subjected to development processing is carried out from the developing device 42 by the guide roller R21, and is carried into the cleaning device 43 via the guide rollers R22 and R23.

In the cleaning device 43, the substrate S is conveyed by the guide roller R24 while being immersed in the developer, and is washed during the conveyance. The substrate S that has been subjected to the cleaning process is carried out from the cleaning device 43 by the guide roller R25, and then carried into the processing chamber 12 via the connecting portion 17.

The substrate S transferred to the processing chamber 12 is carried into the heating device 53 via the guide roller R26. In the heating device 53, heat treatment for drying the washed substrate S or heat treatment for heating the coating film or the like is performed. After the heat treatment, the substrate S carried out from the heating device 53 is conveyed to the processing chamber 11 via the connecting portion 18 by the guide roller R27.

The substrate S transferred to the processing chamber 11 is carried into the plating device 44. In the plating apparatus 44, the substrate S is conveyed by the guide roller R28 while being immersed in the plating liquid, and is plated during the conveyance. The substrate S that has been subjected to the plating treatment forms a predetermined pattern. The substrate S after the plating treatment is carried out from the plating device 44 by the guide roller R29, and is transported to the processing chamber 12 via the connection portion 19. In the processing chamber 12, a heating device (not shown) is carried through the guide roller R30 to perform heat treatment.

As described above, according to the present embodiment, the processing unit 3 that performs different types of processing on the substrate S is disposed, and the processing unit 3 having the processing steps (common subprograms) common to each other in the processing unit 3 is disposed in the same manner. Processing indoors. Further, since the transport device 20 is provided, the transport device 20 can transport the substrate S so that the substrate S can be transported across the processing chambers 11 to 13 and the substrate S can be moved in and out of the processing chambers 11 to 13 a plurality of times. Efficient use of the substrate The space of the Ministry of Science.

For example, as shown in the present embodiment, when the components of the display element are formed, since the heat treatment is frequently performed, a plurality of heating devices are provided. When the heating device is placed in one processing chamber 12 as in the present embodiment, thermal energy can be utilized efficiently. Further, since the processing chamber 12 in which the heating device is disposed is disposed at the center level in the Z direction, the processing chamber 11 (wet processing) and the processing chamber 13 (exposure processing) are disposed via the processing chamber 12, so that it is easy to access. The composition of the heating device. Therefore, the transport path of the substrate S as a whole can be shortened. Further, in the processing chamber 12, since the heating device is arranged in a plurality of rows so as to overlap in the X direction and the Y direction, the space of the processing chamber 12 can be saved. Therefore, the area of the installation required to provide the substrate processing apparatus 100 can be suppressed.

In addition, in FIG. 2, as a processing apparatus 10, the combination of a coating apparatus, a heating apparatus, an exposure apparatus, a developing apparatus, a washing apparatus, and a plating apparatus was demonstrated as an example. However, it is not limited to this combination. Further, the processing device 10 may be arranged in plural in the X direction or the Y direction. That is, the substrate S is transported to the coating device of the other processing apparatus 10 via the guide roller R30, and by repeating the above-described operations, the constituent elements of the display element are sequentially formed on the substrate S. In this case, when a plurality of processing apparatuses 10 are arranged, the exposure precision or resolution of the plurality of exposure apparatuses EX may be different.

When a plurality of the processing apparatuses 10 are arranged in the Y direction, as described above, a plurality of heating units 50 as shown in FIG. 5 and a heating unit 50 adjacent thereto can be connected.

The technical scope of the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the spirit and scope of the invention.

For example, in the above embodiment, a tension eliminating mechanism as shown in FIG. 8 is used. The configuration of 92 and 93 is a configuration of the vibration removing device 91, but is not limited thereto. The vibration removing device 91 may be configured as shown in, for example, FIGS. 9 to 11 .

Fig. 9 shows vibration absorbing mechanisms 192 and 193 which are other configuration examples of the strain relief mechanisms 92 and 93 of the vibration removing device 91.

The vibration absorbing mechanisms 192 and 193 have direction changing rollers 194a and 194b (direction changing portion 194) and a vibration absorbing portion 196.

The vibration absorbing portion 196 has a drum 196a, a drum support portion 196b, a spring member 196c, and a wall portion 196d.

The drum 196a is disposed between the direction change roller 194a and the direction change roller 194b. The roller 196a is hung with a portion Sc which is direction-converted in the substrate S. The drum 196a is attached to the wall portion 196d through the drum support portion 196b and the spring member 196c. Therefore, the vibration of the substrate S is absorbed by the roller 196a and the spring member 196c in the portion Sc.

FIG. 10 shows vibration absorbing mechanisms 292 and 293 which are other configuration examples of the strain relief mechanisms 92 and 93 of the vibration removing device 91.

The vibration absorbing mechanisms 292 and 293 have direction changing rollers 294a and 294b (direction changing portion 294) and a vibration absorbing portion 297. The vibration absorbing portion 297 has a drum 297a and a vibration absorbing layer 297b formed on a cylindrical surface of the drum 297a.

The drum 297a is disposed between the direction change roller 294a and the direction change roller 294b. The roller 297a is hung with a portion Sc which is direction-converted in the substrate S. As the vibration absorbing layer 297b, a vibration absorbing material such as SORBOTHANE is used. In the configuration shown in Fig. 10, since the vibration of the substrate S is absorbed by the vibration absorbing layer 297b formed on the drum 297a, it can be achieved with a simple configuration.

Fig. 11 shows vibration imparting mechanisms 392 and 393 as other structural examples of the strain canceling mechanisms 92 and 93 of the vibration removing device 91.

The vibration imparting mechanisms 392 and 393 have direction changing rollers 394a and 394b (direction changing portion 394) and a vibration generating portion 398. The vibration generating unit 398 includes a drum 398a, a vibration adjusting unit 398b that vibrates the drum 398a, and a sensor 398c that detects vibration of the position of the substrate S on the downstream side of the drum 398a.

The drum 398a is disposed between the direction change roller 394a and the direction change roller 394b. The roller 398a is hung with a portion Sc which is directionally converted in the substrate S. The vibration adjusting unit 398b generates vibration that cancels the vibration of the substrate S based on the detection result of the sensor 398c. Therefore, in the configuration shown in Fig. 11, the vibration of the substrate S can be suppressed by the roller 398a, whereby the vibration of the substrate S can be suppressed.

Further, as shown in FIG. 12, for example, in the configuration of the tension canceling mechanism 92, the direction change roller 94a and the pinch roller 95a are disposed in the process chamber 12, and the direction change roller 94b and the pinch roller 95b are disposed in the process chamber 13. In the configuration of the tension canceling mechanism 93, the direction change roller 94a and the pinch roller 95a are disposed in the process chamber 13, and the direction change roller 94b and the pinch roller 95b are disposed in the process chamber 12.

Similarly, in the configuration of the vibration absorbing mechanism 192 shown in FIG. 9, for example, the direction change roller 194a and the drum 196a are disposed in the process chamber 12, and the direction change roller 194b is disposed in the process chamber 13, and the vibration absorbing mechanism 193 is In the configuration, the direction change roller 194a is disposed in the processing chamber 13, and the drum 196a and the direction change roller 194b are disposed in the processing chamber 12. Further, as the wall portion 196d, for example, a partition member 14b or the like can be used.

Further, it may be in the configuration of the vibration absorbing mechanism 292 shown in Fig. 10, for example. The direction change roller 294a and the roller 297a are disposed in the process chamber 12, and the direction change roller 294b is disposed in the process chamber 13. In the configuration of the vibration absorption mechanism 293, the direction change roller 294a is disposed in the process chamber 13, and the roller 297a and the direction change roller 294b It is disposed in the processing chamber 12.

Further, in the configuration of the vibration applying mechanism 392 shown in FIG. 11, for example, the direction changing roller 394a and the drum 398a are disposed in the processing chamber 12, the direction changing roller 394b is disposed in the processing chamber 13, and the vibration absorbing mechanism 393 is configured. The direction change roller 394a is disposed in the processing chamber 13, and the roller 398a and the direction change roller 394b are disposed in the processing chamber 12.

Further, in the configuration of the strain relief mechanisms 92 and 93 shown in FIG. 8, the direction change roller 94a, the pinch roller 95a, the direction change roller 94b, and the pinch roller 95b may be disposed in the process chamber 12 and the process chamber 13. The composition of at least one party. The configuration in which the direction change rollers 94a and 94b and the nip rollers 95a and 95b are disposed in the processing chamber 13 is shown in FIG.

Further, in the above-described embodiment, the configuration in which the vibration removing device 91 is provided between the processing chamber 12 and the processing chamber 13 has been described as an example, but the invention is not limited thereto.

For example, it may be between the processing chamber 12 and the processing chamber 13, and a foreign matter movement suppressing device 84 for suppressing movement of foreign matter or a fluid moving restricting device for restricting gas and liquid may be provided as shown in FIG. 14 in addition to the vibration removing device 91. 85. The configuration of the temperature adjustment device (substrate temperature adjustment unit) 86 of the substrate S is adjusted.

In FIG. 14, the foreign matter movement suppression device 84, the fluid movement restriction device 85, the temperature adjustment device 86, and the vibration removal device 91 are arranged in this order from the upstream side to the downstream side in the conveyance direction of the substrate S. Further, at least one of the vibration removing device 91, the foreign matter movement suppressing device 84, the fluid movement restricting device 85, and the temperature regulating device 86 may be disposed between the processing chamber 12 and the processing chamber 13.

The foreign matter movement suppressing device 84 has an air curtain forming portion 84a and a stage 84b. foreign matter The movement suppressing device 84 forms an air curtain on the substrate S supported by the stage 84b by the air curtain forming portion 84a. The foreign matter on the substrate S is removed by the air curtain.

Further, the fluid movement restricting device 85 has an upstream side drum 85a, a downstream side drum 85b, and a gas injection portion 85c. Fig. 15 is a plan view showing the configuration of the fluid movement restricting device 85. As shown in FIG. 14 and FIG. 15, the fluid movement restricting device 85 injects gas from the gas injection portion 85c to the substrate S conveyed in the state of being hung on the upstream side drum 85a and the downstream side drum 85b.

For example, the gas ejecting portion 85c is disposed at a position on the -Y side, a position on the +X side, and a position between the -Y direction and the +X direction with respect to the substrate S in a state of being hung on the upstream side drum 85a and the downstream side drum 85b. 1 location. By ejecting the gas to the substrate S, the gas adhering to the surface of the substrate S or the gas floating on the surface of the substrate can be removed by the gas.

Further, as shown in FIG. 14, the temperature adjustment device 86 performs temperature adjustment of the substrate S from which the fluid has been removed. The temperature adjustment device 86 has a drum 86a and a temperature adjustment mechanism 86b. In the above embodiment, the configuration in which the temperature changing mechanism 94c is provided in the direction changing roller 94a has been described as an example, but the temperature of the substrate S can be adjusted separately.

Further, each of the foreign matter movement suppressing device 84, the fluid movement restricting device 85, the temperature regulating device 86, and the vibration removing device 91 is not limited to being disposed between the processing chamber 12 and the processing chamber 13, and may be disposed in the processing chamber 11 and The configuration between the processing chambers 12.

Further, in the above-described embodiment, the configuration in which the processing chambers 11 to 13 are arranged in the Z direction is described as an example, but the present invention is not limited thereto. For example, the processing chambers 11 to 13 may be arranged in the X direction or the Y direction. Further, the present invention can also be applied to the case where the processing chambers 11 to 13 are each formed as an independent device or factory.

Further, in the above embodiment, the processed surface Sa of the substrate S is oriented downward. The substrate S is transported in a direction perpendicular to the direction of gravity (a direction parallel to the XY plane). However, the present invention is not limited thereto, and the processed surface Sa of the substrate S may be oriented in a direction parallel to the direction of gravity (the substrate S is made). In the up state, the substrate S is transported. In this case, when the substrate S is bent in the direction of gravity in the tension eliminating mechanisms 92 and 93, the processed surface Sa of the substrate S may be partially oriented in a direction perpendicular to the direction of gravity.

In addition, in FIG. 2, as a processing apparatus 10, the combination of a coating apparatus, a heating apparatus, an exposure apparatus, a developing apparatus, a washing apparatus, and a plating apparatus was demonstrated as an example. However, it is not limited to this combination. Further, the processing device 10 may be arranged in plural in the X direction or the Y direction. That is, the substrate S is transported to the coating device of the other processing apparatus 10 via the guide roller R30, and by repeating the above-described operations, the constituent elements of the display element are sequentially formed on the substrate S. In this case, when a plurality of processing apparatuses 10 are arranged, the exposure precision or resolution of the plurality of exposure apparatuses EX may be different. When a plurality of the processing apparatuses 10 are arranged in the Y direction, as described above, a plurality of heating units 50 as shown in FIG. 5 and a heating unit 50 adjacent thereto can be connected.

In the present embodiment, the indoor pressures in the processing chambers 11 to 13 may be independently adjusted.

For example, it is preferable to adjust the pressure in the chamber of the processing chamber 13 to be higher than the pressure in the chamber 12 so as to prevent foreign matter (fine particles) adhering to the surface of the optical system from intruding into the exposure apparatus EX from other processing chambers, for example, the processing chamber 12. Processing chamber 13. Further, since the processing chamber 11 uses a plurality of liquids, it is preferable to adjust the indoor pressure of the processing chamber 13 to be higher than the indoor pressure of the processing chamber 12 to prevent such liquid from entering the processing chamber 12.

Moreover, the pressure of the three processing chambers may also be the processing chambers 13 in the three processing chambers. The pressure is the highest, the pressure in the processing chamber 11 is the lowest, and the processing chamber 12 is set as the pressure between the processing chamber 13 and the processing chamber 11.

10‧‧‧Processing device

11~13‧‧‧Processing room

14‧‧‧Departure

14a~14d‧‧‧ partition members

15~19‧‧‧Connecting Department

20‧‧‧Transporting device

41‧‧‧ Coating device

42‧‧‧Developing device

43‧‧‧cleaning device

44‧‧‧ plating device

45‧‧‧Recycling tube

50‧‧‧heating unit

51~53‧‧‧ heating device

90‧‧‧ openings

91‧‧‧Vibration removal device

92,93‧‧‧Tensile Elimination Mechanism

R1~R30‧‧‧ Guide roller

EX‧‧‧Exposure device

Claims (14)

A substrate processing apparatus that forms an electronic component on a substrate while transporting a flexible strip substrate in a longitudinal direction, and includes a first processing chamber for wet processing the substrate using a liquid a second processing chamber separated from the first processing chamber by a partition member for drying the substrate; and a third processing chamber separated from the second processing chamber by a partition member for using the electronic component The pattern is exposed to the substrate; and the transfer device sequentially follows the first processing chamber, the second processing chamber, and the third processing chamber along a connecting portion or an opening formed in each of the partition members a first transport path that is transported in the longitudinal direction, and a second transport path that is transported to the first processing chamber by the substrate after the exposure processing in the third processing chamber through the connection portion or the opening portion. The aforementioned substrate is guided. The substrate processing apparatus according to claim 1, wherein the first processing chamber houses a coating device that forms the coating film of the liquid before the exposure processing, and the exposure processing after the liquid treatment A wet processing apparatus for the aforementioned substrate. The substrate processing apparatus according to claim 2, wherein the first transport path is set in order of the substrate in the coating device, the second processing chamber, and the third processing chamber that are housed in the first processing chamber The second transport path is set such that the substrate after the exposure processing in the third processing chamber is transported to the wet processing apparatus housed in the first processing chamber. The substrate processing apparatus according to claim 3, wherein the wet processing apparatus is a developing apparatus that develops the substrate using a developing solution, a cleaning apparatus that washes the substrate using a cleaning liquid, and a plating liquid. Any of the plating devices that form a pattern on the substrate. The substrate processing apparatus of claim 4, wherein the transfer device is provided a plurality of rollers for forming a third transport path, wherein the substrate that has been processed by the wet processing device via the second transport path is again transported to the substrate through the connection portion or the opening portion The path of the aforementioned second processing chamber. The substrate processing apparatus according to claim 5, wherein the second processing chamber houses a first heating device that heats the substrate conveyed through the first transfer path to dry the coating film formed by the coating device And a second heating device that heats the substrate conveyed through the third transfer path to dry the substrate processed by the wet processing device. The substrate processing apparatus according to any one of claims 1 to 6, wherein the transfer device includes an adjustment mechanism that reduces the substrate carried into the third processing chamber via the first transfer path or from the aforementioned The tension of the substrate in which the third processing chamber is carried out in the second transport path. The substrate processing apparatus according to any one of claims 1 to 6, wherein between the second processing chamber and the third processing chamber, or between the first processing chamber and the second processing chamber, At least one of a foreign matter movement suppressing means for removing foreign matter on the substrate and a fluid movement restricting means for removing a liquid adhering to the surface of the substrate is provided. The substrate processing apparatus according to any one of claims 1 to 6, wherein the first processing chamber, the second processing chamber, and the third processing chamber are arranged in a layer in a gravity direction. A device manufacturing method for forming an electronic component on a sheet substrate while transporting a flexible strip substrate in a longitudinal direction, comprising: sequentially applying a photosensitive film on which a liquid is formed a first heat treatment for drying the sheet substrate, an exposure treatment for forming the predetermined pattern on the film after the first heat treatment, a wet treatment for treating the sheet substrate with a predetermined liquid material after the exposure treatment, and In the second heat treatment for drying the sheet substrate after the wet treatment, the wet processing unit that performs the wet treatment is housed in the first processing chamber, and the first addition is performed. The heat treatment portion for heat treatment and the heat treatment portion for performing the second heat treatment are housed in a second processing chamber partitioned from the first processing chamber by a partition portion, and the exposure processing portion that performs the exposure processing is accommodated in the partition portion. And a third processing chamber partitioned from the second processing chamber; and a second connecting chamber, the first processing chamber, and the foregoing from the second processing chamber through a connecting portion or an opening formed in each of the partition portions The order of the second processing chamber transports the sheet substrate in the longitudinal direction. The method of manufacturing a component according to claim 10, wherein the wet processing unit accommodated in the first processing chamber is a developing device that develops the sheet substrate with a developing solution, and washes the sheet substrate with a cleaning solution. Any of the cleaning device and the plating device that forms a pattern on the sheet substrate using a plating solution. The method of manufacturing a device according to claim 11, wherein the film forming processing unit that forms the liquid photosensitive film on the sheet substrate before the first heat treatment is housed in the first processing chamber. The method of manufacturing a device according to any one of claims 10 to 12, wherein the second processing chamber and the third processing chamber are arranged side by side in the direction of gravity. The method of manufacturing a device according to claim 13, wherein the first processing chamber is disposed below the second processing chamber and the third processing chamber in the gravity direction, and is disposed in the wet processing unit. The recycling department of the object.