TW201830478A - Pattern forming method - Google Patents

Abstract

A substrate processing apparatus includes: a plurality of processing portions which respectively perform a processing to a band-like shape substrate; a first processing chamber that accommodates a first processing portion which can execute a common sub-process in the plurality of the processing portions; a second processing chamber that accommodates a second processing portion out of the plurality of the processing portions; a feed portion that feeds the substrate to each of the first processing chamber and the second processing chamber.

Description

   Pattern forming method   

The present invention relates to a substrate processing apparatus.

This application claims priority based on Japanese Patent Application No. 2011-097122 for which it applied on April 25, 2011, and uses the content here.

As a display element which comprises a display device, such as a display device, a liquid crystal display element, an organic electroluminescence (organic EL) element, etc. are mentioned, for example. At present, these display elements are gradually forming an active device (Thin Film Transistor: TFT) called a thin film transistor (TFT) on the substrate surface corresponding to each pixel.

In recent years, a technique for forming a display element on a sheet-like substrate (for example, a thin-film member) has been proposed. As such a technique, for example, a technique called a roll to roll method (hereinafter, simply referred to as a “roll method”) is widely known (for example, refer to Patent Document 1). In the reel method, one sheet-like substrate (for example, a film-like film member) wound around a supply roller on the substrate supply side is sent out, and while the sent-out substrate is taken up by a recovery roller on the substrate recovery side, The substrate is processed by a processing unit (unit) provided between the supply roller and the recovery roller.

In addition, during the period from when the substrate is sent out to being taken up, for example, while the substrate is being transferred using a plurality of transfer rollers, the gate electrode, the gate insulating film, the semiconductor film, and the source electrode constituting the TFT are formed using a plurality of processing units. The drain electrode and the like form the constituent elements of the display element in order on the processed surface of the substrate.

Patent Document 1: International Publication No. 2006/100868

However, the above steps may require a long conveying path with a length of several hundred meters, and for example, it is required to efficiently arrange each processing unit in a limited space such as a factory.

An aspect of the present invention is to provide a substrate processing apparatus capable of efficiently disposing a processing unit.

According to an aspect of the present invention, a substrate processing apparatus is provided, which includes: a plurality of processing sections, each of which processes a substrate formed into a band shape; a first processing chamber, which houses a plurality of processing sections capable of executing a common procedure; A processing unit; a second processing chamber that houses the second processing unit of the plurality of processing units; and a transfer unit that transfers the substrate to the first processing chamber and the second processing chamber, respectively.

According to the aspect of the present invention, the space of the processing section can be efficiently used.

3‧‧‧ Substrate Processing Department (Processing Department)

10‧‧‧Processing device

11 ~ 13‧‧‧processing room (first processing room, second processing room, third processing room)

15 ~ 19‧‧‧ Connection

20‧‧‧ transporting device (transportation department)

41‧‧‧coating device

42‧‧‧Developing device

43‧‧‧washing device

44‧‧‧Plating equipment

45‧‧‧ Waste liquid recovery department (recovery pipe, recovery department)

51 ~ 53‧‧‧Heating device

60‧‧‧Cage

61‧‧‧ substrate moving entrance (removing entrance)

62‧‧‧ substrate storage room (storage room)

63‧‧‧ Substrate Removal Exit (Removal Exit)

70‧‧‧Heating section

84‧‧‧ Foreign body movement suppression device

85‧‧‧ fluid movement restriction device

86‧‧‧Temperature control device (substrate temperature control section)

91‧‧‧Vibration removing device (adjustment mechanism)

92, 93‧‧‧Tension elimination mechanism

96‧‧‧Rotary drive unit

100‧‧‧ substrate processing equipment

192, 193‧‧‧Vibration absorption mechanism

292, 293‧‧‧ Vibration absorption mechanism

392, 393‧‧‧ Vibration imparting mechanism

S‧‧‧ substrate

CONT‧‧‧Control Department

EX‧‧‧Exposure device

R (R1 ~ R30) ‧‧‧Guide roller (Guide)

FIG. 1 is a diagram showing the overall configuration of a substrate processing apparatus according to this embodiment.

FIG. 2 is a cross-sectional view showing the structure of a substrate processing section of the substrate processing apparatus of this embodiment.

Fig. 3 is a sectional view showing the structure of a heating unit according to this embodiment.

Fig. 4 is a perspective view showing the structure of a heating unit according to this embodiment.

Fig. 5 is a perspective view showing the structure of a heating device according to this embodiment.

FIG. 6 is a diagram showing an example of the arrangement of a heating device arranged in a processing chamber according to this embodiment.

FIG. 7 is a comparison diagram showing an example of the arrangement of the heating device.

Fig. 8 is a side view showing the structure of a vibration removing device according to this embodiment.

Fig. 9 is a side view showing another structure of the vibration removing device.

Fig. 10 is a side view showing another structure of the vibration removing device.

Fig. 11 is a side view showing another structure of the vibration removing device.

Fig. 12 is a side view showing another structure of the vibration removing device.

Fig. 13 is a side view showing another structure of the vibration removing device.

FIG. 14 is a diagram showing the configuration of the processing chambers in this embodiment.

Fig. 15 is a diagram showing the configuration of a fluid removal device according to this embodiment.

Hereinafter, this embodiment will be described with reference to the drawings.

FIG. 1 is a diagram showing a configuration of a substrate processing apparatus 100 according to this embodiment.

As shown in FIG. 1, the substrate processing apparatus 100 includes a substrate supply section 2 that supplies a strip-shaped substrate (for example, a sheet-like film member) S 2, and a substrate processing section 3 that processes a surface (processed surface) Sa of the substrate S 3. A substrate recovery section 4 that recovers the substrate S, and a control section CONT that controls these sections. The substrate processing section 3 includes a substrate processing apparatus 100 for performing various processes on the surface of the substrate S after the substrate S is sent from the substrate supply section 2 to the time when the substrate S is collected by the substrate recovery section 4. This substrate processing apparatus 100 can be used when a display element (electronic element) such as an organic EL element or a liquid crystal display element is formed on the substrate S.

In addition, in the present embodiment, the XYZ orthogonal coordinate system is set as shown in FIG. 1, and this XYZ orthogonal coordinate system is appropriately used for description below. The XYZ orthogonal coordinate system, for example, sets the X axis and the Y axis along the horizontal plane, and sets the Z axis upward in the vertical direction. In addition, the substrate processing apparatus 100 as a whole transfers the substrate S from the negative side (−) to the positive side (+ side) along the X axis. At this time, the width direction (short side direction) of the strip-shaped substrate S is set in the Y-axis direction.

As the substrate S to be processed in the substrate processing apparatus 100, a foil such as a resin film or stainless steel can be used. For the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, Ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, Materials such as polycarbonate resin, polystyrene resin, vinyl acetate resin, etc.

The substrate S is preferably one having a relatively small thermal expansion coefficient that has substantially no change in size due to a heat of about 200 ° C. For example, an inorganic filler may be mixed in a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, and silicon oxide.

The size of the substrate S in the width direction (short-side direction) is, for example, about 1 m to 2 m, and the size in the length direction (long-side direction) is, for example, 10 m or more. Of course, this size is only an example, and it is not limited to this. For example, the dimension in the Y direction of the substrate S may be 50 cm or less, or may be 2 m or more. The dimension in the X direction of the substrate S may be 10 m or less.

The substrate S is formed to have flexibility. Here, the term "flexible" refers to a property that, for example, the substrate can be bent without breaking or cracking by applying a force of a weight to the substrate. In addition, the property of bending by the force of the degree of self-weight is also included in the flexibility. In addition, the flexibility described above will vary depending on the environment, such as the material, size, thickness, and temperature of the substrate. In addition, as the substrate S, a single strip-shaped substrate may be used, or a structure in which a plurality of unit substrates are connected to form a strip shape may be used.

The substrate supply unit 2 sends out and supplies the substrate S rolled into a reel shape to the substrate processing unit 3, for example. The substrate supply unit 2 is provided with, for example, a shaft portion for winding the shaft of the substrate S or a rotation driving device for rotating the shaft portion. In addition, a covering portion or the like for covering the substrate S in a rolled state may be provided. In addition, the substrate supply unit 2 is not limited to a mechanism for sending out the substrate S rolled into a reel shape, as long as it includes a mechanism for sequentially sending out the strip-shaped substrate S in its longitudinal direction.

The substrate recovery unit 4 is configured to take up a substrate S that has passed through the substrate processing apparatus 100 provided in the substrate processing unit 3 into a reel shape, for example. Similar to the substrate supply unit 2, the substrate recovery unit 4 is provided with a shaft portion for winding the substrate S, a rotation drive source for rotating the shaft portion, and a cover portion for covering the recovered substrate S and the like. In addition, when the substrate processing unit 3 cuts the substrate S, for example, into a panel shape, the substrate S may be recovered, for example, in a state in which the substrate S is recovered in an overlapped state and a state different from the state in which the substrate S is wound into a roll shape. Make up.

The substrate processing unit 3 transfers the substrate S supplied from the substrate supply unit 2 to the substrate recovery unit 4 and processes the processed surface Sa of the substrate S during the transfer process. The substrate processing unit 3 includes, for example, a processing device 10 and a transfer device (transfer portion) 20.

The processing device 10 includes various devices for forming, for example, an organic EL element on the processing surface Sa of the substrate S. Examples of such a device include a partition wall forming device for forming a partition wall on the surface to be processed Sa, an electrode forming device for forming an electrode, and a light emitting layer forming device for forming a light emitting layer. More specifically, there are a droplet coating device (e.g., an inkjet type coating device, etc.), a film forming device (e.g., a plating device, a vapor deposition device, a sputtering device), an exposure device, a developing device, a surface modification device, Net device and so on. Each of these devices is appropriately installed along the conveyance path of the substrate S. In the present embodiment, as the processing device 10, for example, a coating device 41, heating devices 51 to 53, an exposure device EX, a developing device 42, a cleaning device 43, a plating device 44 (above, described in detail after FIG. 2), and the like are used. The structure is described as an example.

The conveyance device 20 includes a plurality of guide rollers (guide portions) R that guide the substrate S in the substrate processing section 3 (only two rollers are illustrated in FIG. 1). The guide roller R is arranged along the conveyance path of the substrate S. A rotation driving mechanism (not shown) is attached to at least a part of the plurality of guide rollers R. In the present embodiment, the length of the transport path of the transport device 20 is, for example, approximately several hundred meters in total length.

FIG. 2 is a cross-sectional view showing a part of the substrate processing section 3.

As shown in FIG. 2, the substrate processing unit 3 includes three processing chambers 11 to 13. The processing chambers 11 to 13 are partitioned by a partition 14.

The partition 14 includes a partition member 14a constituting the bottom of the processing chamber 11, a partition member 14b constituting the top of the processing chamber 11 and the bottom of the processing chamber 12, a partition member 14c constituting the top of the processing chamber 12 and the bottom of the processing chamber 13, A partition member 14d on the top of the processing chamber 13.

The processing chamber 11 is disposed at the lowermost position (most near the -Z side) in the direction of gravity among the plurality of processing chambers. The processing chamber 11 forms a processing space for processing the substrate S using a liquid (wet processing). In the processing chamber 11, for example, as shown in FIG. 2, a processing device 10 is provided with a coating device 41 including a photoresist liquid storage container (accommodating a photoresist liquid for coating the substrate S), and a developer liquid storage container (accommodating container). A developing device 42 for developing solution for developing substrate S), a cleaning device 43 with a cleaning solution storage container (a cleaning solution for cleaning substrate S), and a plating liquid storage container (a storage solution for storing A plating device 44 for forming a pattern on the substrate S after the cleaning process. In addition, it is not limited to the above-mentioned liquids, and the processing chamber 11 can also accommodate processing devices using various liquids.

The coating device 41 includes a guide roller R2 disposed inside the coating device 41 and guiding the substrate S, and a guide roller R3 for carrying out the substrate S after the coating process is completed from the coating device 41 to the processing chamber 11. A guide roller R1 that guides the substrate S supplied from the substrate supply unit 2 to the coating device 41 is disposed upstream of the guide roller R2 in the conveying direction of the substrate S. The developing device 42 includes a guide roller R20 disposed inside the developing device 42 and guiding the substrate S, and a guide roller R21 that carries the substrate S that has undergone the development process from the developing device 42 into the processing chamber 11. On the upstream side of the guide roller R20 in the conveying direction of the substrate S, guide rollers R18 and R19 for guiding the substrate S to the developing device 42 from the heating device 52 of the processing chamber 12 via the guide roller R17 are arranged.

On the downstream side of the guide roller R21 in the conveying direction of the substrate S, guide rollers R22 and R23 that guide the substrate S from the developing device 42 to the cleaning device 43 are arranged. In addition, these guide rollers R1, R18, R19, R22, and R23 are arranged in the processing chamber 11.

The cleaning device 43 includes a guide roller R24 disposed inside the cleaning device 43 and guiding the substrate S, and a guide roller R25 for carrying out the cleaning process of the substrate S from the cleaning device 43 to the processing chamber 11. . The plating device 44 includes a guide roller R28 disposed inside the plating device 44 and guiding the substrate S, and a guide roller R29 for carrying out the plating process-completed substrate S from the plating device 44 to the processing chamber 11. .

The partition member 14a is provided with a plurality of recovery pipes (a waste liquid recovery unit, a recovery unit) 45 constituting a part of a waste liquid recovery flow path connected to a recovery device (not shown). One end portion of the recovery tube 45 is connected to the coating device 41, the developing device 42, and the cleaning device 43, respectively, and the other end portion is connected to a waste liquid recovery flow path (not shown) connected to the recovery device. Each recovery pipe 45 discharges the photoresist liquid, the developing liquid, and the cleaning liquid that become waste liquid in the coating device 41, the developing device 42, and the cleaning device 43 through the waste liquid recovery flow path to the recovery device. An on-off valve (not shown) is provided in the recovery pipe 45. The control unit CONT can control the timing of opening and closing the on-off valve. In this embodiment, since the processing chamber 11 at the lowermost part in the direction of gravity is provided with a device for wet processing, the length of the flow path system of the waste liquid recovery flow path between these devices and the recovery device can be suppressed.

The processing chamber 12 is disposed above the processing chamber 11 (+ Z side). The processing chamber 12 forms a processing space for heating the substrate S. In the processing chamber 12, heating devices 51 to 53 for heating the substrate S are provided as the processing device 10. The heating device 51 heats the substrate S coated with the photoresist liquid by the coating device 41 to dry the photoresist liquid. The heating device 52 heats the substrate S of the exposure device EX passing through the processing chamber 13 again to dry the photoresist liquid. The heating device 52 heats the substrate S at a temperature different from the heating temperature of the heating device 51, for example, a temperature higher than the heating temperature of the heating device 51. The heating device 53 heats the substrate S that has undergone the development processing by the developing device 42 and is cleaned by the cleaning device 43 to dry the surface of the substrate S.

A guide roller R4 for guiding the substrate S passing through the coating device 41 in the processing chamber 11 toward the heating device 51 is disposed upstream of the heating device 51 in the conveying direction of the substrate S. On the downstream side of the heating device 51 in the conveying direction of the substrate S, guide rollers R5, R6, and R7 are arranged along the conveying path, and the substrate S is guided into the processing chamber 13 by the guide rollers R5, R6, and R7. Exposure device EX.

On the upstream side of the heating device 52 in the conveying direction of the substrate S, guide rollers R14, R15 that guide the substrate S of the exposure device EX passing through the processing chamber 13 to the heating device 52 via the guide roller R13 are arranged along the conveying path. And R16. On the downstream side of the heating device 52 in the conveying direction of the substrate S, the developing device 42 of the processing chamber 11 is provided with a guide roller R17 that guides the substrate S through the guide rollers R18 and R19.

A guide roller R26 for guiding the substrate S passing through the cleaning device 43 toward the heating device 53 is disposed upstream of the heating device 53 in the conveying direction of the substrate S. Further, on the downstream side of the heating device 53 in the conveying direction of the substrate S, a guide roller R27 for guiding the substrate S to the plating device 44 in the processing chamber 11 is arranged. A guide roller R30 for guiding the substrate S to the next step is arranged on the + X side of the guide roller R27. These guide rollers R4, R5, R6, R7, R14, R15, R16, R17, R26, R27 and R30 are arranged in the processing chamber 12.

Between the processing chamber 11 and the processing chamber 12, a plurality of connection portions 15 to 19 are provided between the partition member 14 b to allow the substrate S to pass therethrough. The connection portions 15 to 19 are, for example, through holes that penetrate the partition member 14b in the Z direction. Each of the connection portions 15 to 19 is formed in a size through which the substrate S can pass. The substrate S is moved across the processing chamber 11 and the processing chamber 12 by the connection portions 15 to 19.

The guide roller R3 and the guide roller R4 are guide substrates S that pass through the connection portion 15. The guide roller R17 and the guide roller R18 are guide substrates S that pass through the connection portion 16. The guide roller R25 and the guide roller R26 pass through the connecting portion 17 through the guide substrate S. The guide roller R27 and the guide roller R28 pass through the connecting portion 18 through the guide substrate S. The guide roller R29 and the guide roller R30 are guide substrates S passing through the connection portion 19. As described above, the transfer device 20 guides the substrate S so that the substrate S passes through the connection portions 15 to 19.

In addition, the above-mentioned guide rollers R3, R4, R17, R18, and R25 to R30, which are disposed across the connecting portions 15 to 19, may also have a structure having a temperature adjustment device that adjusts the temperature of the substrate S, for example. With this configuration, the temperature of the substrate S can be adjusted before and after the heating devices 51 to 53.

The detailed configuration of the heating devices 51 to 53 will be described next. Each of the heating devices 51 to 53 includes one or a plurality of heating units 50. FIG. 3 is a side cross-sectional view showing the configuration of the heating unit 50. FIG. 4 is a perspective view showing the configuration of the heating unit 50.

As shown in FIGS. 3 and 4, the heating unit 50 includes a casing 60 and a heating portion 70 in the heating casing 60.

The casing 60 has a rectangular ring shape with an internal space formed by a pair of first wall portions (the right wall portion 60d and the left wall portion 60c) and a pair of the second wall portions (the upper wall portion 60f and the lower wall portion 60e). The internal space formed in the housing 60 functions as a substrate storage room (accommodation room) 62. A substrate carrying inlet (carrying entrance) 61 is formed on the first wall portion (left side wall portion) 60c on one side of the casing 60, and a substrate carrying port is formed on the other first wall portion (right side wall portion) 60d of the casing 60 Exit (removal exit) 63. Moreover, one end surface (-Y side end surface) of the casing 60 is used as a first open end 60a, and the other end surface (+ Y side end surface) of the casing 60 is used as a second open end 60b. At the first open end 60a and the second open end 60b of the casing 60, a connecting portion (not shown) for connecting a plurality of heating units 50 is provided.

The first open end 60a and the second open end 60b of the casing 60 can be fitted with the lid portion of the sealed substrate storage chamber 62. Therefore, when only one heating unit 50 is used, a closed space can be formed by blocking the end faces of the open ends 60a and 60b. In addition, by connecting a plurality of heating units 50, a larger sealed space can be formed than when a single heating unit 50 is used. In this case, the end face of the heating unit 50 disposed at the end in the connecting direction can be blocked by the cover portion.

The substrate carrying-in port 61 and the substrate carrying-out port 63 are formed so that the board | substrate S can pass. That is, the Z-direction dimensions of the substrate carrying inlet 61 and the substrate carrying outlet 63 are formed larger than the thickness of the substrate S. The Y-direction dimensions of the substrate carrying-in entrance 61 and the substrate carrying-out exit 63 are formed to be larger than those in the short-side direction of the substrate S.

The substrate accommodating chamber 62 is provided with a folding roller (folding portion) 64 to 67 for guiding the substrate S. The folding rollers 64 to 67 are rotatably supported by a casing 60 by a support member (not shown). The folding rollers 64 and 66 are arranged on the + X side end portion of the substrate storage chamber 62, that is, on the right side wall portion 60d side. The folding rollers 65 and 67 are arranged on the -X side end portion of the substrate storage chamber 62, that is, on the left side wall portion 60c side. The folding rollers 64, 65, 66, and 67 are arranged in this order from the upper part (+ Z side) to the lower part (-Z side) of the casing 60.

The folding roller 64 folds the substrate S carried in from the substrate carrying port 61 and traveling in the + X direction to the -X direction. The folding roller 65 folds the substrate S folded in the folding roller 64 and travels in the -X direction to the + X direction. The folding roller 66 folds the substrate S folded in the folding roller 65 and travels in the + X direction to the -X direction. The folding roller 67 folds the substrate S folded in the folding roller 66 and travels in the -X direction to the + X direction.

Therefore, when the substrate S guided by the folding rollers 64 to 67 is viewed from the Z direction, the folding pieces (parts) of the substrate S overlap each other, and the folding pieces are arranged in a non-contact state with each other. Therefore, the substrate S can be efficiently stored in the substrate storage chamber 62 while maintaining the state of the processing surface Sa of the substrate S.

A rotary drive mechanism (not shown), such as a motor, is connected to at least one of the folding rollers 64 to 67. The control unit CONT can adjust the number of rotations and the timing of the rotation of the rotation driving mechanism. Therefore, the conveyance speed of the substrate S can be adjusted by each heating unit 50.

In addition, at least one of the folding rollers 64 to 67 may be moved in any of the X direction, the Y direction, and the Z direction. In this case, the conveyance path of the substrate S can be adjusted by each heating unit 50 by controlling the folding rollers 64 to 67 by the control unit CONT. In addition, in this embodiment, although four folding rollers are arranged in the casing 60, the number can be increased or decreased according to the heating time of the substrate S.

FIG. 5 is a diagram illustrating the configuration of the heating devices 51 to 53.

As shown in FIG. 5, the heating devices 51 to 53 include a plurality of heating units 50 arranged in an array in the Y direction. The plurality of heating units 50 are in a state where adjacent heating units 50 are connected to each other. In addition, in FIG. 5, the cover portion of the first open end 60 a of the heating unit 50 is omitted.

The substrate storage chambers 62 are communicated with each other by the connection heating unit 50. Therefore, by connecting the heating unit 50, one heating furnace provided with the conveyance path of several board | substrate S can be comprised. The heating unit 70 may have a structure provided in common to the plurality of heating units 50 or a structure provided in each of the heating units 50 individually.

In a case where the heating section 70 is provided in common to the plurality of heating units 50, the heating section 70 can be heated together to form a plurality of substrate storage chambers 62 as one heating furnace. Therefore, the plurality of substrates S transported through different transport paths are heated together by the heating unit 70 in one heating furnace. Therefore, it is possible to improve the efficiency of the heat treatment. In addition, in a case where the heating unit 70 is separately provided in each heating unit 50, the heating temperature or the timing of heating may be adjusted according to each heating unit 50. In addition, as the heating section 70, a heating mechanism or an irradiation section (not shown) for radiating electromagnetic waves can be used.

FIG. 6 is a diagram showing the arrangement of the heating devices 51 and 52 in the processing chamber 11.

The configuration shown in FIG. 6 is a configuration in which a plurality of (three) heating devices 51 that connect a plurality of heating units 50 in the processing chamber 12 are arranged in the Y direction. In this way, by arranging the heating units 50 or the heating devices 51 in the Y direction, as compared with the configuration in which the heating units 50 are arranged in the X direction as shown in FIG.

Returning to FIG. 2, the processing chamber 13 is disposed above the processing chamber 12 (+ Z side). The processing chamber 13 is a processing space for exposing the substrate S. In the processing chamber 13, an exposure device EX is provided as the processing device 10. The exposure device EX irradiates the photoresist layer coated on the substrate S in the coating device 41 with exposure light passing through a mask pattern. In the processing chamber 13, guide rollers R10 and R11 that guide the substrate S to a position where the exposure light of the exposure device EX is irradiated are arranged.

An opening 90 is formed in the partition member 14c. The opening portion 90 is formed through the partition member 14c in the Z direction. The substrate S is guided from the processing chamber 12 to the processing chamber 13 through the openings 90 through the guide rollers R8 and R9. The substrate S is guided from the processing chamber 13 to the processing chamber 12 through the openings 90 through the guide rollers R12 and R13. As described above, the opening portion 90 is a portion through which the substrate S passes.

A vibration removing device (adjustment mechanism) 91 is provided inside the opening 90 to remove the vibration of the substrate S guided by the transfer device 20 (for example, the guide rollers R8 to R13). The vibration removing device 91 is configured to remove vibration transmitted to the substrate S by eliminating the tension of the substrate S and reducing the vibration transmission property of the substrate S. Therefore, the vibration removing device 91 of this embodiment includes tension removing mechanisms 92 and 93 for removing the tension of the substrate S. In addition, the vibration removing device 91 may not completely eliminate the vibration of the substrate S, as long as the vibration can be reduced to a level that the processing device can tolerate. Therefore, the tension relief mechanism can also be called a tension reduction mechanism.

The strain relief mechanism 92 is disposed on the upstream side of the substrate S in the conveyance direction of the exposure device EX (the guide roller R10). More specifically, the tension relief mechanism 92 is disposed between the guide roller R8 and the guide roller R9. The strain relief mechanism 93 is disposed on the downstream side of the substrate S in the conveyance direction of the exposure device EX (the guide roller R11). More specifically, the tension relief mechanism 93 is disposed between the guide roller R12 and the guide roller R13.

FIG. 8 is a diagram showing the configuration of the tension relief mechanisms 92 and 93.

As shown in FIG. 8, the tension relief mechanisms 92 and 93 include direction conversion rollers 94 a and 94 b (direction conversion portion 94) and nip rollers 95 a and 95 b (nip portion 95). The direction conversion rollers 94a and 94b change the conveying direction of the substrate S into that the substrate S is loosened in the direction of gravity (-Z direction). Specifically, the portion Sb between the direction conversion roller 94a and the direction conversion roller 94b in the substrate S is in a relaxed state. In addition, a temperature adjustment mechanism (substrate temperature adjustment section) 94c is provided on the direction conversion drum 94a. The temperature of the portion of the substrate S that is in contact with the direction changing roller 94a is adjusted by the temperature adjustment mechanism 94c. The temperature adjustment mechanism 94c can be omitted.

The nip roller 95a is provided at a position where the substrate S is sandwiched between the nip roller 95a and the direction change roller 94a. The nip roller 95b is provided at a position between the substrate S and the direction change roller 94b. The nip rollers 95 a and 95 b are connected to a rotation driving unit 96. The rotation driving unit 96 individually adjusts the timing or number of rotations of the nip rollers 95a and 95b. Therefore, the substrate S can be conveyed while the slack portion Sb is formed.

In addition, the substrate can be conveyed at a different speed between the portion sandwiched by the direction conversion roller 94a and the clamping roller 95a in the substrate S and the portion sandwiched by the direction conversion roller 94b and the clamping roller 95b in the substrate S S. Therefore, the substrate S can be transported while adjusting the size of the slack portion Sb.

As described above, the slackness portions Sb are formed by the tension-relief mechanisms 92 and 93 and the tension of the substrate S is eliminated, thereby reducing the vibration system from the upstream of the direction change roller 94a and the nip roller 95a. Therefore, transmission of the vibration of the substrate S is suppressed between the processing chamber 12 and the processing chamber 13 via the tension relief mechanisms 92 and 93. Therefore, the exposure apparatus EX disposed in the processing chamber 13 performs exposure processing without being affected by the vibration of the processing chamber 11 or the processing chamber 12. Since such strain relief mechanisms 92 and 93 are arranged on the partition member 14c, the spaces in the processing chambers 11 to 13 of the substrate processing section 3 can be efficiently used.

Next, the steps for manufacturing display elements (electronic elements) such as organic EL elements and liquid crystal display elements using the substrate processing apparatus 100 configured as described above will be described. The substrate processing apparatus 100 manufactures the display element according to the control of the control unit CONT.

First, a substrate S wound around a roller (not shown) is mounted on the substrate supply unit 2. The control unit CONT rotates a roller (not shown) to feed the substrate S from the substrate supply unit 2 from this state. Next, the substrate S passing through the substrate processing section 3 is taken up by a roller (not shown) provided in the substrate recovery section 4.

The control unit CONT appropriately transfers the substrate S in the substrate processing unit 3 by the transfer device 20 of the substrate processing unit 3 after the substrate S is delivered from the substrate supply unit 2 and is wound up by the substrate recovery unit 4. The control unit CONT first carries the substrate S into the processing chamber 11 of the substrate processing unit 3. The operation of the control unit CONT will be described below.

The substrate S carried into the processing chamber 11 is carried into the coating apparatus 41 via the guide roller R1 shown in FIG. 2. In the coating apparatus 41, the substrate S is conveyed in the + X direction by the guide roller R2. During the transportation, a coating film of a photosensitizer is formed on the processing surface Sa of the substrate S. The substrate S processed in the coating apparatus 41 is conveyed to the processing chamber 12 through the connection portion 15 by the guide of the guide roller R3.

The substrate S carried into the processing chamber 12 is carried into the substrate storage chamber 62 from the substrate carrying inlet 61 of the heating device 51 via the guide roller R4 (see FIG. 3). In the substrate storage chamber 62, the substrate S is heated in a state where the substrate S is folded several times, and the substrate S is heated in the transported state. Therefore, a heating process that effectively uses the space of the substrate storage chamber 62 can be performed. In the heating device 51, the coating film formed on the substrate S is dried by heating. After the heat treatment is performed, the substrate S carried out from the substrate carrying port 63 is transferred to the opening 90 through the guide rollers R5, R6, and R7.

The substrate S that has reached the opening 90 is carried into the tension removing mechanism 92 by the guide roller R8. In the tension removing mechanism 92, the conveying speed is different between the portion sandwiched by the direction conversion roller 94a and the clamping roller 95a and the portion sandwiched by the direction conversion roller 94b and the clamping roller 95b so that the substrate S is formed Slack.

After the slack portion Sb is formed, the transfer speeds of the direction conversion rollers 94a and 94b to the substrate S by the nip rollers 95a and 95b are made equal. With this operation, the substrate S is carried out from the strain relief mechanism 92 in a state where the slack portion Sb is formed. The substrate S is transferred to the processing chamber 13 via a guide roller R9.

The vibration transmitted from the processing chamber 12 side through the substrate S is removed from the slack portion Sb of the substrate S. Therefore, transmission of vibration to the processing chamber 13 via the substrate S is suppressed. In addition, when a temperature adjustment mechanism 94c is provided in the direction conversion drum 94a, the temperature of the substrate S is adjusted in the direction conversion drum 94a. Here, it is adjusted to the temperature suitable for exposure processing, for example.

The substrate S carried into the processing chamber 13 is carried by the guide rollers R10 and R11. This substrate S is subjected to exposure processing by an exposure device EX. By the exposure process, a predetermined area in the coating film formed on the processed surface Sa of the substrate S is photosensitive. After the substrate S having completed the exposure process is inserted into the opening portion 90, it is carried into the strain relief mechanism 93 via the guide roller R12.

The tension relief mechanism 93 forms a slack portion Sb on the substrate S in the same manner as the tension relief mechanism 92 described above. Therefore, the vibration transmitted from the processing chamber 12 side through the substrate S is removed from the slack portion Sb of the substrate S. On the other hand, as described above, the slack portion Sb is also formed in the tension relief mechanism 92. Therefore, the portion of the substrate S disposed in the processing chamber 13 is removed from the processing chamber by the tension relief mechanism 92 and the tension relief mechanism 93 The state of the 12 vibration.

If the vibrations of the guide rollers R8 to R13 or the heating devices 51 and 52 are transmitted to the substrate S, the substrate S or other parts may vibrate at the exposure light irradiation position of the exposure device EX, and the exposure accuracy may be reduced. . Therefore, the vibration of the substrate S across the exposure device EX is removed by using the vibration removal device 91 to suppress a decrease in exposure accuracy.

The substrate S transferred from the processing chamber 13 to the processing chamber 12 is carried into the heating device 52 via the guide rollers R14, R15, and R16. In the heating device 52, heat treatment is performed on the photosensitive coating film. After the heat treatment is performed, the substrate S carried out from the heating device 52 is inserted into the connection portion 16 through the guide roller R17, and is transferred to the processing chamber 11 through the connection portion 16.

The substrate S transferred to the processing chamber 11 is carried into the developing device 42 via the guide rollers R18 and R19. In the developing device 42, the substrate S is conveyed by the guide roller R20 while being immersed in the developer, and the developing process is performed during the conveyance. The substrate S that has undergone the development processing is carried out from the developing device 42 by the guide roller R21, and is carried into the cleaning device 43 through the guide rollers R22 and R23.

In the cleaning device 43, the substrate S is conveyed by the guide roller R24 while being immersed in the developer, and the cleaning process is performed during the conveyance. The substrate S that has undergone the cleaning process is carried out from the cleaning device 43 by the guide roller R25 and then carried into the processing chamber 12 through the connection portion 17.

The substrate S transferred to the processing chamber 12 is carried into the heating device 53 via the guide roller R26. The heating device 53 performs a heat treatment for drying the cleaned substrate S or a heat treatment for heating the coating film. After performing this heat treatment, the substrate S carried out from the heating device 53 is conveyed to the processing chamber 11 through the connection portion 18 by the guide of the guide roller R27.

The substrate S transferred to the processing chamber 11 is carried into a plating apparatus 44. In the plating apparatus 44, the substrate S is conveyed by the guide roller R28 while being immersed in the plating solution, and the plating process is performed during the conveyance. A predetermined pattern is formed on the substrate S that has been subjected to a plating process. The substrate S after the plating process is carried out from the plating apparatus 44 by the guide roller R29, and is transferred to the processing chamber 12 through the connection portion 19. In the processing chamber 12, a heating device (not shown) is carried in via a guide roller R30, and heat processing is performed.

As described above, according to the present embodiment, the processing sections 3 that respectively perform different types of processing on the substrate S are disposed, and the processing sections 3 having common processing steps (common subroutines) among the processing sections 3 are arranged at the same Processing room. Furthermore, since the transfer device 20 is provided, the transfer device 20 can transfer the substrate S in such a manner that the substrate S is transferred across the processing chambers 11 to 13 and the substrate S is moved in and out of the processing chambers 11 to 13 a plurality of times. The space of the substrate processing section 3 is efficiently used.

For example, as shown in this embodiment, when forming the constituent elements of the display element, since the heat treatment is frequently performed, a plurality of heating devices are provided. When the heating device is collectively arranged in one processing chamber 12 as shown in this embodiment, thermal energy can be efficiently used. In addition, since the processing chamber 12 in which the heating device is arranged is arranged at the center level in the Z direction, and the processing chamber 11 (wet processing) and the processing chamber 13 (exposure processing) are arranged across the processing chamber 12, it is easy to enter The structure of the heating device. Therefore, the conveyance path of the substrate S in the entire device can be shortened. In addition, since a plurality of heating devices are arranged in the processing chamber 12 so as to overlap in the X and Y directions, the space of the processing chamber 12 can be saved. Therefore, it is possible to suppress the installation floor area required for installing the substrate processing apparatus 100.

In FIG. 2, as the processing device 10, a combination of a coating device, a heating device, an exposure device, a developing device, a cleaning device, and a plating device is described as an example. But it is not limited to this combination. In addition, a plurality of the processing devices 10 may be arranged in the X direction or the Y direction. That is, the substrate S is transported to the coating device of the other processing device 10 via the guide roller R30, and the above-mentioned operations are repeatedly performed to sequentially form the constituent elements of the display element on the substrate S. In this case, when the plurality of processing devices 10 are arranged, the exposure accuracy or resolution of the plurality of exposure devices EX may be made different from each other.

When a plurality of the processing devices 10 are arranged in the Y direction, as described above, a configuration in which a plurality of heating units 50 shown in FIG. 5, that is, adjacent heating units 50 are connected can be used.

The technical scope of the present invention is not limited to the embodiments described above, and appropriate changes can be made without departing from the scope of the present invention.

For example, in the above-mentioned embodiment, although the configuration of the tension removing mechanisms 92 and 93 shown in FIG. 8 is used as the configuration of the vibration removing device 91, it is not limited to this. The vibration removing device 91 may have a configuration shown in, for example, FIGS. 9 to 11.

FIG. 9 shows vibration absorbing mechanisms 192 and 193 as other configuration examples of the tension removing mechanisms 92 and 93 of the vibration removing device 91.

The vibration absorption mechanisms 192 and 193 include direction conversion rollers 194 a and 194 b (direction conversion portion 194) and a vibration absorption portion 196.

The vibration absorbing portion 196 includes a drum 196a, a drum supporting portion 196b, a spring member 196c, and a wall portion 196d.

The drum 196a is disposed between the direction changing drum 194a and the direction changing drum 194b. A part Sc of the substrate S which has been changed in direction is hung on the drum 196a. The roller 196a is attached to the wall portion 196d through the roller support portion 196b and the spring member 196c. Therefore, the vibration of the substrate S is absorbed by the roller 196a and the spring member 196c in this part Sc.

FIG. 10 shows vibration absorbing mechanisms 292 and 293 as other configuration examples of the tension removing mechanisms 92 and 93 of the vibration removing device 91.

The vibration absorption mechanisms 292 and 293 include direction conversion rollers 294 a and 294 b (direction conversion portion 294) and a vibration absorption portion 297. The vibration absorbing portion 297 includes a roller 297a and a vibration absorbing layer 297b formed on a cylindrical surface of the roller 297a.

The drum 297a is disposed between the direction conversion drum 294a and the direction conversion drum 294b. Here, a part Sc of the substrate S which is changed in direction is hung on the drum 297a. As the vibration absorbing layer 297b, a vibration absorbing material such as SORBOTHANE is used. In the configuration shown in FIG. 10, since the vibration of the substrate S is absorbed by the vibration absorbing layer 297b formed on the drum 297a, it can be achieved with a simple configuration.

FIG. 11 shows vibration applying mechanisms 392 and 393 as other configuration examples of the tension removing mechanisms 92 and 93 of the vibration removing device 91.

The vibration applying mechanisms 392 and 393 include direction conversion rollers 394a and 394b (direction conversion section 394) and a vibration generating section 398. The vibration generating unit 398 includes a drum 398a, a vibration adjustment unit 398b that vibrates the drum 398a, and a sensor 398c that detects a vibration of the substrate S at a position downstream of the drum 398a.

The drum 398a is disposed between the direction changing drum 394a and the direction changing drum 394b. A part Sc of the substrate S which is changed in direction is hung on the drum 398a. The vibration adjustment unit 398b generates a vibration that cancels the vibration of the substrate S based on the detection result of the sensor 398c. Therefore, in the configuration shown in FIG. 11, the transmission of the vibration of the substrate S can be suppressed by cancelling the vibration of the substrate S by the drum 398 a.

In addition, as shown in FIG. 12, for example, in the configuration of the strain relief mechanism 92 described above, the direction changing drum 94 a and the clamping drum 95 a are disposed in the processing chamber 12, and the direction changing drum 94 b and the clamping drum 95 b are disposed in the processing chamber 13. In the structure of the tension relief mechanism 93 described above, the direction conversion drum 94a and the clamping drum 95a are disposed in the processing chamber 13, and the direction conversion drum 94b and the clamping drum 95b are disposed in the processing chamber 12.

Similarly, the vibration absorption mechanism 192 shown in FIG. 9 may be used. For example, the direction conversion roller 194a and the roller 196a are disposed in the processing chamber 12, and the direction conversion roller 194b is disposed in the processing chamber 13. In the configuration, the direction conversion drum 194 a is disposed in the processing chamber 13, and the roller 196 a and the direction conversion drum 194 b are disposed in the processing chamber 12. As the wall portion 196d, for example, a partition member 14b or the like can be used.

It is also possible to adopt the configuration of the vibration absorbing mechanism 292 shown in FIG. 10, for example, the direction conversion roller 294a and the roller 297a are disposed in the processing chamber 12, the direction conversion roller 294b is disposed in the processing chamber 13, and the vibration absorption mechanism 293 is configured. Among them, the direction conversion drum 294a is disposed in the processing chamber 13, and the drum 297a and the direction conversion drum 294b are disposed in the processing chamber 12.

Further, it may be in the configuration of the vibration imparting mechanism 392 shown in FIG. 11, for example, the direction conversion roller 394 a and the roller 398 a are disposed in the processing chamber 12, the direction conversion roller 394 b is disposed in the processing chamber 13, and the vibration absorption mechanism 393 is configured. Among them, the direction conversion drum 394 a is disposed in the processing chamber 13, and the roller 398 a and the direction conversion drum 394 b are disposed in the processing chamber 12.

In addition, in the configuration of the tension relief mechanisms 92 and 93 shown in FIG. 8, the direction conversion drum 94 a and the clamping drum 95 a and the direction conversion drum 94 b and the clamping drum 95 b may be disposed in the processing chamber 12 and the processing chamber 13. Composition of at least one party. FIG. 13 shows a configuration in which the direction change rollers 94 a and 94 b and the nip rollers 95 a and 95 b are disposed in the processing chamber 13.

Moreover, in the said embodiment, although the structure provided with the vibration removal apparatus 91 between the processing chamber 12 and the processing chamber 13 was demonstrated as an example, it is not limited to this.

For example, it may be connected between the processing chamber 12 and the processing chamber 13. In addition to the vibration removing device 91, as shown in FIG. 14, a foreign body movement suppressing device 84 for suppressing the movement of a foreign body or a fluid movement limiting device for restricting gas and liquid may be provided. 85. The temperature adjustment device (substrate temperature adjustment unit) 86 for adjusting the substrate S is configured.

In FIG. 14, a foreign matter movement suppression device 84, a fluid movement restriction device 85, a temperature adjustment device 86, and a vibration removal device 91 are sequentially arranged from the upstream side to the downstream side in the conveying direction of the substrate S. In addition, at least one of the vibration removing device 91, the foreign matter movement suppressing device 84, the fluid movement restricting device 85, and the temperature adjustment device 86 may be disposed between the processing chamber 12 and the processing chamber 13.

The foreign body movement suppression device 84 includes an air curtain forming portion 84 a and a stage 84 b. The foreign matter movement suppressing device 84 forms an air curtain on the substrate S supported by the stage 84b via the air curtain forming portion 84a. The foreign matter on the substrate S is removed by the air curtain.

The fluid movement restricting device 85 includes an upstream drum 85a, a downstream drum 85b, and a gas injection unit 85c. FIG. 15 is a plan view showing the structure of the fluid movement restricting device 85. As shown in FIGS. 14 and 15, the fluid movement restricting device 85 ejects gas from the gas ejection unit 85 c to the substrate S that is transported while being hung on the upstream drum 85 a and the downstream drum 85 b.

The gas ejection unit 85c is, for example, disposed at least at a position on the -Y side, a position on the + X side, and a position between the -Y direction and the + X direction with respect to the substrate S hung on the upstream roller 85a and the downstream roller 85b. 1 position. By spraying a gas on the substrate S, a liquid adhering to the surface of the substrate S or a gas floating on the surface of the substrate can be removed by the gas.

As shown in FIG. 14, the temperature adjustment device 86 adjusts the temperature of the substrate S from which the fluid has been removed. The temperature adjustment device 86 includes a drum 86a and a temperature adjustment mechanism 86b. In the above-mentioned embodiment, although the structure provided with the temperature adjustment mechanism 94c in the direction conversion drum 94a was demonstrated as an example, it can adjust the temperature of the board | substrate S separately.

In addition, each of the foreign body movement suppressing device 84, the fluid movement restricting device 85, the temperature adjusting device 86, and the vibration removing device 91 is not limited to a configuration arranged between the processing chamber 12 and the processing chamber 13, and may be arranged between the processing chamber 11 and The structure between the processing chambers 12.

Moreover, in the said embodiment, although the structure which arrange | positioned the processing chambers 11-13 in the Z direction as an example was demonstrated, it is not limited to this. For example, a configuration may be adopted in which the processing chambers 11 to 13 are arranged in the X direction or the Y direction. The present invention can also be applied when the processing chambers 11 to 13 are formed as separate devices or factories.

In the above embodiment, the substrate S is configured to transport the substrate S with the processed surface Sa of the substrate S in a direction perpendicular to the direction of gravity (a direction parallel to the XY plane). A structure in which the substrate S is transported in a state where the processed surface Sa faces a direction parallel to the direction of gravity (a state in which the substrate S is raised). In this case, when the substrate S is bent in the direction of gravity in the strain relief mechanisms 92 and 93, it can be configured such that the processing surface Sa of the substrate S partially faces the direction perpendicular to the direction of gravity.

In FIG. 2, as the processing device 10, a combination of a coating device, a heating device, an exposure device, a developing device, a cleaning device, and a plating device is described as an example. But it is not limited to this combination. In addition, a plurality of the processing devices 10 may be arranged in the X direction or the Y direction. That is, the substrate S is transported to the coating apparatus of the other processing apparatus 10 through the guide roller R30, and the above-mentioned operations are repeated to form the constituent elements of the display element in sequence on the substrate S. In this case, when the plurality of processing devices 10 are arranged, the exposure accuracy or resolution of the plurality of exposure devices EX may be made different from each other. When a plurality of the processing devices 10 are arranged in the Y direction, as described above, a configuration in which a plurality of heating units 50 shown in FIG. 5, that is, adjacent heating units 50 are connected can be used.

In this embodiment, it is also possible to have a configuration in which the indoor pressures of the processing chambers 11 to 13 are independently adjusted.

For example, it is preferable to adjust the pressure in the processing chamber 13 to be higher than the pressure in the processing chamber 12 to prevent foreign matter (particles) adhering to the surface of the optical system from entering into the processing chamber 12 that contains the exposure device EX. Processing chamber 13. In addition, since a plurality of liquids are used in the processing chamber 11, it is desirable to adjust the pressure in the processing chamber 13 to be higher than the pressure in the processing chamber 12 to prevent these liquids from entering the processing chamber 12.

In addition, the pressure of the three processing chambers may be such that the pressure of the processing chamber 13 is the highest and the pressure of the processing chamber 11 is the lowest. The processing chamber 12 is set to be between the processing chamber 13 and the processing chamber 11 pressure.

Claims (7)

    A pattern forming method for forming a pattern of an electronic component on a substrate by transporting a strip substrate having flexibility in a long-side direction to an exposure device for processing, and then transporting the belt-shaped substrate to a wet processing device. The exposure device is installed in a first processing chamber partitioned by a partition member, and the wet processing device is provided in a second processing chamber located below the gravity direction with respect to the first processing chamber, and includes an exposure step. The opening of the partition member provided in the first processing chamber, the substrate coated with the photosensitive agent is carried into the exposure device in the long side direction, and the pattern of the electronic component is exposed on the substrate with a coating film formed of the photosensitive agent; and In the processing step, the substrates exposed by the exposure device are transported to the wet processing device in a long side direction by a connection portion of a partition member provided between the first processing chamber and the second processing chamber in a gravity direction. The above-mentioned coating film is processed by a liquid.         The pattern forming method according to claim 1, wherein the wet processing device provided in the second processing chamber includes a coating device that forms the coating film on a surface of the substrate before the exposure processing is performed by the exposure device. And a developing device that processes the coating film of the substrate after exposure by the exposure device with a developing solution.         The pattern forming method according to claim 2, wherein the transporting unit constituted by a plurality of rollers for transporting the substrate in the longitudinal direction is configured by the coating device and the first processing chamber in the second processing chamber. The substrates are transported in this order by the exposure device and the developing device in the second processing chamber.         The pattern forming method according to claim 3, wherein in order to transfer the substrate between the first processing chamber and the second processing chamber, the transfer unit includes a first processing chamber and a second processing chamber, A roller on the processing chamber side that folds the substrate in the direction of gravity.         The pattern forming method according to any one of claims 1 to 4, wherein a recovery unit for recovering waste generated in the wet processing apparatus is provided in the second processing chamber.         The pattern forming method according to any one of claims 1 to 4, wherein the pressure in the first processing chamber is set higher than the pressure in the second processing chamber.         The pattern forming method according to claim 3, wherein the substrate is passed through the third processing chamber provided in the direction of gravity between the first processing chamber and the second processing chamber through the third processing chamber. A plurality of rollers are transported; the coating film coated on the substrate by the processing of the coating device, or the liquid adhered to the substrate by the processing of the developing device is dried while the substrate passes through the third processing chamber Or remove.