KR20170032592A - Roll type laser drilling apparatus - Google Patents
Roll type laser drilling apparatus Download PDFInfo
- Publication number
- KR20170032592A KR20170032592A KR1020150130100A KR20150130100A KR20170032592A KR 20170032592 A KR20170032592 A KR 20170032592A KR 1020150130100 A KR1020150130100 A KR 1020150130100A KR 20150130100 A KR20150130100 A KR 20150130100A KR 20170032592 A KR20170032592 A KR 20170032592A
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- South Korea
- Prior art keywords
- film
- inspection vision
- laser
- inspection
- line scan
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/08—Measuring arrangements characterised by the use of optical techniques for measuring diameters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/2408—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures for measuring roundness
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
[0001] The present invention relates to a laser drilling apparatus, and more particularly to a laser drilling apparatus in which line scan cells of each of a plurality of inspection units arranged so as to be shifted from each other with respect to a width direction of a film are placed on one line, Type laser drilling apparatus capable of inspecting a film to be inspected.
The flexible substrate in the form of a film is capable of designing a compact and lightweight high-density wiring circuit, has a bendable characteristic, and is applied to a wide range of products such as mobile phones, cameras, and LCD displays.
7 is a view schematically showing a conventional laser drilling apparatus.
The laser drilling apparatus is for forming a through hole at a desired position of a flexible substrate in the form of a laser using a laser. The drilling apparatus includes a take-
The
The
Therefore, in the conventional laser drilling apparatus, before the laser beam L is irradiated, the
However, this method has a problem that the operation speed of the drilling process is remarkably slowed down. The
In order to solve such a problem, Korean Patent Laid-Open Publication No. 2003-0067798 discloses a laser drilling machine for manufacturing a flexible printed wiring board on both sides.
The present invention can reduce the lead time and the loss of raw materials in the intermediate process by processing various PTHs for the next process in the roll state rather than in the sheet form in the copper alloy material as a raw material in the process of manufacturing a flexible printed wiring board on both sides However, in the laser drilling process, the suction plate and the gripper are used to maintain the flatness in the flexible print portion to which the laser is irradiated. In this case, after laser processing, step feeding is performed using a gripper, Since the process is performed by the original sequence, the step feeding method for maintaining the flatness is not different from the conventional one.
That is, as a step for maintaining the flatness, the step feeding method occupies more than half of the total laser machining time, so that it is advantageous to continuously supply the raw material in comparison with the conventional method. However, It is unreasonable to reduce it dramatically.
It is an object of the present invention to improve the process of the conventional step feeding method by using a roller to continuously feed the film.
In addition, even if the plurality of inspection vision parts are arranged so as to be shifted from each other with respect to the width direction of the film, a laser drilling device capable of positioning the line scan cells of each of the plurality of inspection vision parts on one virtual line of the through- ≪ / RTI >
A laser drilling apparatus according to an embodiment of the present invention for solving the above-mentioned problems comprises: a working roller for feeding a film; A plurality of laser heads arranged in a staggered direction with respect to a width direction of the film by irradiating a laser beam onto the film conveyed on the working roller to form through holes in the film; And a plurality of inspection vision units arranged in a staggered direction with respect to a width direction of the film, wherein each of the plurality of inspection vision units includes at least one line scan cell Each of the inspection vision units includes a plurality of mirrors that shift the line scan cells forward or backward with respect to the transport direction of the film.
Here, the plurality of mirrors of the plurality of inspection vision units may arrange the line scan cells of the plurality of inspection vision units on one imaginary line parallel to the width direction of the film.
Here, the plurality of inspection vision units may simultaneously scan a pair of IP holes formed in the film and arranged parallel to the width direction of the film.
Wherein the plurality of laser heads include a first laser head forming a through hole in a first region of the film and a second laser head forming a through hole in a second region of the film, Wherein the non-polarizing portion includes a first inspection vision portion for inspecting a first region of the film and a second inspection vision portion for inspecting a second region of the film, wherein the plurality of mirrors of the first inspection vision portion includes: And a plurality of mirrors of the second inspection vision unit shifts the line scan cells of the second inspection vision unit backward with respect to the transport direction of the film by shifting the line scan cells of the non- And a plurality of mirrors of the first inspection vision unit and a plurality of mirrors of the second inspection vision unit shift the line scan cells of the first inspection vision unit and the line scan cells of the second inspection vision unit, Can be arranged on one imaginary line parallel to the width direction of the film.
Here, the first inspection vision unit and the second inspection vision unit can simultaneously scan a pair of IP holes formed on the film and arranged parallel to the width direction of the film.
The apparatus may further include a plurality of detectors positioned at a front end or a rear end of the plurality of laser heads to detect a deviation of the film with respect to the transport direction of the film.
The apparatus may further include a plurality of suction units for sucking in smoke generated when the through holes are formed by the laser beams irradiated from the plurality of laser heads.
According to the above-described configuration of the present invention, there is an advantage that the conventional step feeding method can be improved by feeding the film continuously using rollers.
In addition, even if the plurality of inspection vision parts are arranged to be shifted from each other with respect to the width direction of the film, there is an advantage that the line scan cells of each of the plurality of inspection vision parts can be positioned on one imaginary line of the film. Therefore, there is an advantage that it is possible to inspect whether the through hole formed in the processed film is formed at the correct position and angle on the basis of the pair of IP holes.
1 schematically shows a laser drilling apparatus according to an embodiment of the present invention.
FIG. 2 is a perspective view of a laser drilling apparatus shown in detail in some configurations of the laser drilling apparatus shown in FIG. 1. FIG.
FIG. 3 is an enlarged perspective view of a part of the laser drilling apparatus shown in FIG. 2. FIG.
4 is a view showing a film in which the through holes are formed by the first and
Figure 5 is a schematic illustration of an improved inspection vision of a laser drilling apparatus according to another embodiment of the present invention.
6 is a view for explaining the principle in which two line scan cells are arranged on the same line by the improved inspection vision unit shown in FIG.
FIG. 7 schematically shows a drilling apparatus using a conventional laser.
Hereinafter, embodiments of a laser drilling apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
The laser drilling apparatus according to the present invention is a device for laser drilling a through hole continuously through a flexible film such as an FPCB in an unsteady state. Conventionally, continuous laser drilling can be performed in a state in which the film is fed continuously and without stopping, out of the way of feeding the film stepwise for laser processing the through hole to form the through hole.
The through hole is formed through the film, and may be formed for the heat dissipation function or for electrical conduction on both sides of the film.
FIG. 1 is a schematic view of a laser drilling apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of a laser drilling apparatus shown in detail in some configurations of the laser drilling apparatus shown in FIG. 1, FIG. 4 is an enlarged perspective view showing a part of the laser drilling apparatus shown in FIG. 2, and FIG. 4 is a cross-sectional view showing a through-hole formed film by the first and
Referring to FIGS. 1 to 4, a laser drilling apparatus according to an embodiment of the present invention forms a through hole at a desired position of a flexible substrate, which is in the form of a film, using a laser, The first and
The
The take-
The
The
The working field, which is a limit area where the laser beam can be irradiated, is determined in consideration of the spot size of the laser beam, the processing precision, and the like. However, such a working area can not be enlarged for the precision processing as in the present invention. Therefore, since a small work area formed by one laser head can not form a through hole with respect to the entire width of the
The
4, the dividing line C is a virtual line for distinguishing the first region A and the second region B in the
The first and second detecting
The first and second
The first and second
The first
The first
The
In order to achieve this, the
The first film feeding
The first and
The first and
The first and
The
Referring to Fig. 4, the
The
The
The
The
The first detecting
The first and second detecting
The first and second detecting
As the first and
The laser drilling apparatus according to an embodiment of the present invention shown in Figs. 1 to 4 can continuously feed a film along a locus having a radius of curvature and can perform a continuous laser drilling process in an unstable state. Therefore, there is no loss in the process by the step feeding method as in the prior art, that is, there is no need to stop feeding the film in order to spread the film flat before irradiating the laser beam, A step of forming a hole can be performed at the same time.
Further, a laser drilling apparatus according to an embodiment of the present invention is provided with a plurality of laser heads capable of performing through hole processing for a plurality of divided regions on a film, so that the work area of the laser head is set small It is possible to improve the processing accuracy of the through hole and reduce the size of the device.
Further, in the laser drilling apparatus according to the embodiment of the present invention, the detecting section is provided in front of the laser head to detect a wrong error of the film, and corrects the wrong error immediately in a state in which the film is fed without any manual work, The defect rate of the drilling process can be reduced and the operation speed of the drilling process can be improved.
In the laser drilling apparatus according to the embodiment of the present invention shown in Figs. 1 to 4, the first
The first line scan cell LS1 of the first
Since the first
The first and second detecting
FIG. 5 schematically illustrates an improved inspection vision of a laser drilling apparatus according to another embodiment of the present invention, and FIG. 6 shows an example in which two line scan cells are scanned by the same inspection line, Fig. 2 is a view for explaining the principle of being disposed on a substrate.
In the laser drilling apparatus according to another embodiment of the present invention, the remaining configuration except for the improved inspection vision unit shown in FIG. 5 is the same as the configuration of the laser drilling apparatus according to the embodiment of the present invention shown in FIG. 1 to FIG. .
5 has a first
The first
At least two of the first mirrors ma1 and ma2 are at least two and the line scan cells of the first
The plurality of second mirrors mb1 and mb2 are at least two or more and the line scan cells of the second
A plurality of first mirrors ma1 and ma2 and a plurality of second mirrors mb1 and mb2 are arranged in a line between the shifted line scan cells of the first
6, a plurality of first mirrors ma1 and ma2 of the first
As such, the laser drilling apparatus according to another embodiment of the present invention includes the above-described improved inspection vision unit. Therefore, even if the first and second
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, As will be understood by those skilled in the art.
101: Film
102: take-up roller 103: take-up roller
104a, 104b:
106a, 106b:
110a, 110b: suction part 200: working roller
Claims (7)
A plurality of laser heads arranged in a staggered direction with respect to a width direction of the film by irradiating a laser beam onto the film conveyed on the working roller to form through holes in the film; And
Inspecting the through holes formed in the film, and a plurality of inspection vision parts arranged in a direction of an obtuse angle with respect to a width direction of the film,
Wherein each of the plurality of inspection vision units has at least one line scan cell,
Wherein each of the inspection vision units includes a plurality of mirrors that shift the line scan cells forward or backward with respect to the transport direction of the film.
Wherein the plurality of mirrors of the plurality of inspection vision units arrange the line scan cells of the plurality of inspection vision units on one imaginary line parallel to the width direction of the film.
Wherein the plurality of inspection vision units simultaneously scan a pair of IP holes formed in the film and arranged parallel to the width direction of the film.
Wherein the plurality of laser heads include a first laser head forming a through hole in a first region of the film and a second laser head forming a through hole in a second region of the film,
Wherein the plurality of inspection vision portions include a first inspection vision portion for inspecting a first region of the film and a second inspection vision portion for inspecting a second region of the film,
The plurality of mirrors of the first inspection vision unit shifts the line scan cells of the first inspection vision unit forward in reference to the transport direction of the film,
The plurality of mirrors of the second inspection vision unit shifts the line scan cells of the second inspection vision unit backward with respect to the transport direction of the film,
Wherein the plurality of mirrors of the first inspection vision unit and the plurality of mirrors of the second inspection vision unit are arranged such that the line scan cells of the first inspection vision unit and the line scan cells of the second inspection vision unit are aligned in a direction parallel to the width direction of the film On a virtual line of the laser drilling device.
Wherein the first inspection vision unit and the second inspection vision unit simultaneously scan a pair of IP holes formed on the film and arranged parallel to the width direction of the film.
Further comprising a plurality of detection portions which detect errors in which the film is distorted with respect to the transport direction of the film and are located at the front end or the rear end of the plurality of laser heads.
Further comprising a plurality of suction portions for sucking the smoke generated when the through holes are formed by the laser beam irradiated from the plurality of laser heads.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020150130100A KR101736481B1 (en) | 2015-09-15 | 2015-09-15 | Roll type laser drilling apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150130100A KR101736481B1 (en) | 2015-09-15 | 2015-09-15 | Roll type laser drilling apparatus |
Publications (2)
Publication Number | Publication Date |
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KR20170032592A true KR20170032592A (en) | 2017-03-23 |
KR101736481B1 KR101736481B1 (en) | 2017-05-17 |
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KR1020150130100A KR101736481B1 (en) | 2015-09-15 | 2015-09-15 | Roll type laser drilling apparatus |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030067798A (en) | 2002-02-08 | 2003-08-19 | 원우연 | Laser Drilling Machine For Manufacturing Flexible Printed Circuit Board |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3463282B2 (en) | 2000-08-08 | 2003-11-05 | 住友重機械工業株式会社 | Laser processing apparatus and processing method |
JP2008012916A (en) | 2006-06-08 | 2008-01-24 | Hitachi Via Mechanics Ltd | Composite sheet, machining method of composite sheet and laser machining device |
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2015
- 2015-09-15 KR KR1020150130100A patent/KR101736481B1/en active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030067798A (en) | 2002-02-08 | 2003-08-19 | 원우연 | Laser Drilling Machine For Manufacturing Flexible Printed Circuit Board |
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