KR101571390B1 - Apparatus for drilling continuously using laser - Google Patents
Apparatus for drilling continuously using laser Download PDFInfo
- Publication number
- KR101571390B1 KR101571390B1 KR1020140069631A KR20140069631A KR101571390B1 KR 101571390 B1 KR101571390 B1 KR 101571390B1 KR 1020140069631 A KR1020140069631 A KR 1020140069631A KR 20140069631 A KR20140069631 A KR 20140069631A KR 101571390 B1 KR101571390 B1 KR 101571390B1
- Authority
- KR
- South Korea
- Prior art keywords
- film
- laser head
- laser
- hole
- laser beam
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/047—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuous drilling apparatus using a laser, and more particularly, to a continuous drilling apparatus using a laser which continuously forms a through hole at a desired position of a film-like flexible substrate using a laser.
The flexible substrate in the form of a film is capable of designing a compact and lightweight high-density wiring circuit, has a bendable characteristic, and is applied to a wide range of products such as mobile phones, cameras, and LCD displays.
1 is a schematic view of a conventional drilling apparatus using a laser.
The laser drilling apparatus is for forming a through hole at a desired position of a flexible substrate in the form of a laser using a laser. The drilling apparatus includes a take-
The
Therefore, in the conventional laser drilling apparatus, before the laser beam L is irradiated, the
However, when the
SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a method and apparatus for transferring a film while rotating a drum stage having a curved transfer surface, So as to improve the operation speed of the drilling process and increase the production yield.
According to an aspect of the present invention, there is provided a continuous drilling apparatus using laser, comprising: a take-up roller on which a raw film is wound; A second edge face that is curved around the rotation axis and that supports one end of the film supplied from the take-up roller, a second edge face that is spaced from the first edge face and supports the center of the film, A transfer surface having a third edge face spaced apart from the second edge face and supporting the other end of the film and a second edge face which is in close contact with the transfer face to closely contact the film with the transfer face, A vacuum space; a first space portion provided between the first rim surface and the second rim surface; and a second space portion provided between the second rim surface and the third rim surface; A first laser head for irradiating a laser beam onto a first area of the film adhered to the transfer surface to form a through hole; A first suction part installed in the first space part and sucking smoke generated when a through hole is formed by the laser beam irradiated from the first laser head; A laser beam is provided on the second region of the film closely attached to the transfer surface in a manner that the laser beam is provided to the rear side of the first laser head with respect to the transport direction of the film, A second laser head for forming a through hole by irradiation; A second suction part installed in the second space part and sucking smoke generated when a through hole is formed by the laser beam irradiated from the second laser head; And a take-up roller for rewinding the film having the through-holes formed by the first laser head and the second laser head, wherein the film portion on the upper side of the first space portion and the film portion on the upper side of the second space portion And the beam is irradiated.
In the continuous drilling apparatus using laser according to the present invention, the first region and the second region may be divided based on a center portion in the width direction of the film.
delete
delete
In the continuous drilling apparatus using a laser according to the present invention, the first suction portion is operated only while the laser beam is irradiated by the first laser head, and the second suction portion is irradiated with the laser beam from the second laser head Lt; / RTI >
In the continuous drilling apparatus using a laser according to the present invention, each of the first laser head and the second laser head includes a galvanometer scanner for deflecting the laser beam to a desired position, A first detecting unit installed at the front and detecting an error of the film with respect to the transport direction of the film; A second detecting unit installed at the rear of the second laser head for detecting an error of the film with respect to the transport direction of the film; And a controller receiving the error detected by the first detector and the second detector and transmitting a correction value for correcting the error to the galvanometer scanner.
In the continuous drilling apparatus using a laser according to the present invention, a pair of fitting holes arranged in parallel with the width direction of the film is formed at both ends of the film, and the first detecting portion and the second detecting portion are formed in the fitting It is possible to detect the wrong error by sensing the hole.
A continuous drilling apparatus using a laser according to the present invention is characterized by comprising: a first inspection unit installed at the rear of the first laser head for inspecting a state of a through hole formed in the first region; And a second inspection unit installed at the rear of the second laser head for checking the state of the through hole formed in the second area.
According to the continuous drilling apparatus using the laser of the present invention, the operation speed of the drilling process can be improved and the production yield can be increased.
Further, according to the continuous drilling apparatus using the laser of the present invention, the work area of the laser head can be set small to improve the processing accuracy of the through hole, and at the same time, the size of the apparatus can be reduced.
Further, according to the continuous drilling apparatus using the laser of the present invention, it is possible to prevent damage to the transfer surface of the film and to improve the durability of the apparatus.
Further, according to the continuous drilling apparatus using the laser of the present invention, it is possible to reduce the defect rate of the product and improve the working speed of the drilling process.
1 is a schematic view of a drilling apparatus using a conventional laser,
2 is a schematic view of a continuous drilling apparatus using a laser according to an embodiment of the present invention,
FIG. 3 is a view showing a drum stage of a continuous drilling apparatus using the laser of FIG. 2,
FIG. 4 is a plan view along the IV-IV 'direction shown in FIG. 2,
FIG. 5 is a view for explaining the functions of the first detection unit and the second detection unit of the continuous drilling apparatus using the laser of FIG. 2,
FIG. 6 is a view showing a first suction unit and a second suction unit of the continuous drilling apparatus using the laser of FIG. 2;
Hereinafter, embodiments of a continuous drilling apparatus using a laser according to the present invention will be described in detail with reference to the accompanying drawings.
FIG. 2 is a schematic view of a continuous drilling apparatus using a laser according to an embodiment of the present invention, FIG. 3 is a view showing a drum stage of a continuous drilling apparatus using the laser of FIG. 2, FIG. 5 is a view for explaining the functions of the first detecting unit and the second detecting unit of the continuous drilling apparatus using the laser of FIG. 2, and FIG. 6 is a cross- FIG. 1 is a view showing a first suction part and a second suction part of a continuous drilling machine using a laser of FIG.
2 to 6, the
The
As shown in FIG. 3, the
The
The
The
The
The
The working field, which is a limit area where the laser beam can be irradiated, is determined in consideration of the spot size of the laser beam, the processing precision, and the like. However, such a working area can not be enlarged for the precision processing as in the present invention. Therefore, since a small work area formed by one laser head can not form a through hole with respect to the entire width of the
As shown in Fig. 4, in the present embodiment, the
The
The
The
On the other hand, if the
In order to prevent the transferring
The
As shown in Figs. 4 and 5, a pair of
As shown in FIG. 5A, for example, three through
If the pair of
Image acquiring means such as a camera may be used as the first detecting
The controller receives the error a detected by the
The
An image acquisition means such as a camera may be used as the
The
Similarly, in the
On the other hand, if the state of the through hole inspected by the
The
The
The
Similarly, the
At this time, the
The winding
The continuous drilling apparatus using the laser according to the present embodiment configured as described above has a structure in which a film is adhered to a drum stage having a curved transfer surface and a film is transferred while rotating the drum stage, Can be continuously formed. Therefore, there is no need to stop the film transfer to flatten the film before irradiating the laser beam as in the conventional method, and the process of transferring the film and the process of forming the through hole by irradiating the laser beam can be performed simultaneously . Accordingly, the continuous drilling apparatus using the laser of the present embodiment can improve the operation speed of the drilling process, thereby increasing the production yield.
Further, in the continuous drilling apparatus using laser according to the present embodiment configured as described above, a plurality of laser heads capable of respectively performing through-hole processing on a plurality of divided regions on the film are installed together on one drum stage The work area of the laser head can be set small so as to improve the processing accuracy of the through hole and to reduce the size of the apparatus.
Further, the continuous drilling apparatus using the laser according to the present embodiment configured as described above has a first space portion between the first rim surface and the second rim surface, and a second space between the second rim surface and the third rim surface, By irradiating the upper part of the film with the laser beam, it is possible to prevent damage to the transfer surface of the film and to improve the durability of the apparatus.
Further, in the continuous drilling apparatus using the laser according to the present embodiment configured as described above, a detecting section is provided in front of the laser head to detect a wrong error of the film, and a wrong error The defect rate of the product can be reduced and the operation speed of the drilling process can be improved.
The scope of the present invention is not limited to the above-described embodiments and modifications, but can be implemented in various forms of embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.
100: Continuous drilling machine using laser
110: Retraction roller
120: drum stage
121: Feed surface
126: Vacuum hole
131: first laser head
132: second laser head
170: take-up roller
Claims (8)
A second edge face that is curved around the rotation axis and that supports one end of the film supplied from the take-up roller, a second edge face that is spaced from the first edge face and supports the center of the film, A transfer surface having a third edge face spaced apart from the second edge face and supporting the other end of the film and a second edge face which is in close contact with the transfer face to closely contact the film with the transfer face, A vacuum space; a first space portion provided between the first rim surface and the second rim surface; and a second space portion provided between the second rim surface and the third rim surface;
A first laser head for irradiating a laser beam onto a first area of the film adhered to the transfer surface to form a through hole;
A first suction part installed in the first space part and sucking smoke generated when a through hole is formed by the laser beam irradiated from the first laser head;
A laser beam is provided on the second region of the film closely attached to the transfer surface in a manner that the laser beam is provided to the rear side of the first laser head with respect to the transport direction of the film, A second laser head for forming a through hole by irradiation;
A second suction part installed in the second space part and sucking smoke generated when a through hole is formed by the laser beam irradiated from the second laser head; And
And a winding roller for rewinding the film having the through-holes formed by the first laser head and the second laser head,
And a laser beam is irradiated onto the film portion on the upper side of the first space portion and the film portion on the upper side of the second space portion.
Wherein the first region and the second region are divided based on a center portion in the width direction of the film.
Characterized in that the first suction portion is operated only while the laser beam is irradiated by the first laser head and the second suction portion is operated only while the laser beam is irradiated by the second laser head. Device.
Wherein each of the first laser head and the second laser head has a galvanometer scanner for deflecting the laser beam to a desired position,
A first detector disposed in front of the first laser head for detecting an error of the film with respect to the transport direction of the film;
A second detecting unit installed at the rear of the second laser head for detecting an error of the film with respect to the transport direction of the film; And
And a controller for receiving the error detected by the first detector and the second detector and transmitting a correction value for correcting the error to the galvanometer scanner, .
Wherein a pair of fitting holes are formed at both ends of the film so as to be parallel to the width direction of the film,
Wherein the first detecting unit and the second detecting unit detect the fitted error by detecting the fitting hole.
A first inspection unit installed at the rear of the first laser head for checking a state of a through hole formed in the first area; And
And a second inspection unit installed at a rear side of the second laser head to inspect a state of the through hole formed in the second area.
Priority Applications (1)
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KR1020140069631A KR101571390B1 (en) | 2014-06-09 | 2014-06-09 | Apparatus for drilling continuously using laser |
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KR1020140069631A KR101571390B1 (en) | 2014-06-09 | 2014-06-09 | Apparatus for drilling continuously using laser |
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KR101571390B1 true KR101571390B1 (en) | 2015-11-24 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180088085A (en) | 2017-01-26 | 2018-08-03 | 주식회사 제니스테크 | Devices of inspecting films, patterning devices having the same and methods of inspecting films |
KR102158708B1 (en) | 2020-06-10 | 2020-09-22 | 주식회사 디에이테크놀로지 | Drum Type Pattern Jig for Laser Notching Process of Electrode Film for Secondary Battery, And Laser Notching System Having the Pattern Jig |
KR102245162B1 (en) | 2020-08-11 | 2021-04-27 | 주식회사 디에이테크놀로지 | System for Laser Notching Process of Secondary Battery Electrode Film |
CN114043023A (en) * | 2021-11-25 | 2022-02-15 | 惠州市西龙五金制品有限公司 | Electric spark puncher of steel with smog processing function |
KR102430493B1 (en) | 2021-03-22 | 2022-08-10 | 주식회사 디에이테크놀로지 | Laser Notching System for Manufacturing Secondary Battery |
KR20220160324A (en) | 2021-05-27 | 2022-12-06 | 주식회사 디에이테크놀로지 | Laser Notching System for Manufacturing Secondary Battery |
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JP2004216436A (en) * | 2003-01-16 | 2004-08-05 | Canon Sales Co Inc | Laser beam machining method, correction method of laser beam machining position, and laser beam machining device |
JP2006351977A (en) * | 2005-06-20 | 2006-12-28 | Sony Corp | Laser processing apparatus and laser processing method |
JP2008012916A (en) * | 2006-06-08 | 2008-01-24 | Hitachi Via Mechanics Ltd | Composite sheet, machining method of composite sheet and laser machining device |
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JP2004216436A (en) * | 2003-01-16 | 2004-08-05 | Canon Sales Co Inc | Laser beam machining method, correction method of laser beam machining position, and laser beam machining device |
JP2006351977A (en) * | 2005-06-20 | 2006-12-28 | Sony Corp | Laser processing apparatus and laser processing method |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180088085A (en) | 2017-01-26 | 2018-08-03 | 주식회사 제니스테크 | Devices of inspecting films, patterning devices having the same and methods of inspecting films |
KR102158708B1 (en) | 2020-06-10 | 2020-09-22 | 주식회사 디에이테크놀로지 | Drum Type Pattern Jig for Laser Notching Process of Electrode Film for Secondary Battery, And Laser Notching System Having the Pattern Jig |
CN113770538A (en) * | 2020-06-10 | 2021-12-10 | Da技术有限公司 | Pattern clamp for laser grooving process of electrode and laser grooving system equipped with pattern clamp |
CN113770538B (en) * | 2020-06-10 | 2023-04-11 | Da技术有限公司 | Pattern clamp for laser grooving process of electrode and laser grooving system equipped with pattern clamp |
KR102245162B1 (en) | 2020-08-11 | 2021-04-27 | 주식회사 디에이테크놀로지 | System for Laser Notching Process of Secondary Battery Electrode Film |
KR102430493B1 (en) | 2021-03-22 | 2022-08-10 | 주식회사 디에이테크놀로지 | Laser Notching System for Manufacturing Secondary Battery |
KR20220160324A (en) | 2021-05-27 | 2022-12-06 | 주식회사 디에이테크놀로지 | Laser Notching System for Manufacturing Secondary Battery |
CN114043023A (en) * | 2021-11-25 | 2022-02-15 | 惠州市西龙五金制品有限公司 | Electric spark puncher of steel with smog processing function |
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