KR20170028888A - 비-원형 레이저 빔들을 이용한 재료의 프로세싱 - Google Patents

비-원형 레이저 빔들을 이용한 재료의 프로세싱 Download PDF

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Publication number
KR20170028888A
KR20170028888A KR1020167035653A KR20167035653A KR20170028888A KR 20170028888 A KR20170028888 A KR 20170028888A KR 1020167035653 A KR1020167035653 A KR 1020167035653A KR 20167035653 A KR20167035653 A KR 20167035653A KR 20170028888 A KR20170028888 A KR 20170028888A
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KR
South Korea
Prior art keywords
laser
pulse
pulses
processing
orientation
Prior art date
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Withdrawn
Application number
KR1020167035653A
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English (en)
Korean (ko)
Inventor
프랭크 헨드릭스
빅터 브이. 마티리트스카이
Original Assignee
하이 큐 레이저 게엠베하
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51176164&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20170028888(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 하이 큐 레이저 게엠베하 filed Critical 하이 큐 레이저 게엠베하
Publication of KR20170028888A publication Critical patent/KR20170028888A/ko
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B23K26/0057—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting
    • B23K2203/50—
    • B23K2203/56—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
KR1020167035653A 2014-07-09 2015-07-08 비-원형 레이저 빔들을 이용한 재료의 프로세싱 Withdrawn KR20170028888A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14176292.2 2014-07-09
EP14176292.2A EP2965853B2 (en) 2014-07-09 2014-07-09 Processing of material using elongated laser beams
PCT/EP2015/065615 WO2016005455A1 (en) 2014-07-09 2015-07-08 Processing of material using non-circular laser beams

Publications (1)

Publication Number Publication Date
KR20170028888A true KR20170028888A (ko) 2017-03-14

Family

ID=51176164

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167035653A Withdrawn KR20170028888A (ko) 2014-07-09 2015-07-08 비-원형 레이저 빔들을 이용한 재료의 프로세싱

Country Status (7)

Country Link
US (1) US10589384B2 (https=)
EP (1) EP2965853B2 (https=)
JP (1) JP2017528322A (https=)
KR (1) KR20170028888A (https=)
CN (1) CN106536119A (https=)
LT (1) LT2965853T (https=)
WO (1) WO2016005455A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210113558A (ko) * 2020-03-06 2021-09-16 쇼오트 아게 기판 엘리먼트의 분리를 준비 및/또는 수행하기 위한 방법 및 기판 서브엘리먼트
KR20220016988A (ko) * 2019-06-21 2022-02-10 트룸프 레이저-운트 시스템테크닉 게엠베하 적어도 하나의 공작물을 프로세싱하기 위한 방법

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
JP2017530867A (ja) 2014-07-14 2017-10-19 コーニング インコーポレイテッド 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法
EP3169479B1 (en) 2014-07-14 2019-10-02 Corning Incorporated Method of and system for arresting incident crack propagation in a transparent material
CN208586209U (zh) 2014-07-14 2019-03-08 康宁股份有限公司 一种用于在工件中形成限定轮廓的多个缺陷的系统
WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
DE102014116958B9 (de) 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
EP3854513B1 (de) 2014-11-19 2024-01-03 TRUMPF Laser- und Systemtechnik GmbH System zur asymmetrischen optischen strahlformung
DE102014116957A1 (de) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
KR20170105562A (ko) 2015-01-12 2017-09-19 코닝 인코포레이티드 다중 광자 흡수 방법을 사용한 열적 템퍼링된 기판의 레이저 절단
JP7292006B2 (ja) 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
EP3274313A1 (en) 2015-03-27 2018-01-31 Corning Incorporated Gas permeable window and method of fabricating the same
CN107835794A (zh) 2015-07-10 2018-03-23 康宁股份有限公司 在挠性基材板中连续制造孔的方法和与此相关的产品
EA201892522A1 (ru) * 2016-05-05 2019-05-31 Дзе Трастиз Оф Дзе Юниверсити Оф Пенсильвания Днк-моноклональные антитела, нацеленные на молекулы контрольных точек
EP3452418B1 (en) 2016-05-06 2022-03-02 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
JP6755707B2 (ja) * 2016-05-12 2020-09-16 株式会社ディスコ レーザー加工装置
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
FR3054151B1 (fr) * 2016-07-25 2018-07-13 Amplitude Systemes Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
JP2019532908A (ja) 2016-08-30 2019-11-14 コーニング インコーポレイテッド 強度マッピング光学システムによる材料のレーザー切断
JP6923284B2 (ja) 2016-09-30 2021-08-18 コーニング インコーポレイテッド 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
LT3529214T (lt) 2016-10-24 2021-02-25 Corning Incorporated Substrato apdorojimo stotis lakšto formos stiklo substratų lazeriniam mašininiam apdorojimui
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US10830943B2 (en) * 2017-10-31 2020-11-10 Corning Incorporated Optical fibers and optical systems comprising the same
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
JP6783401B2 (ja) * 2018-01-31 2020-11-11 Hoya株式会社 円盤形状のガラス素板の製造方法、及び磁気ディスク用ガラス基板の製造方法
DE102018126381A1 (de) * 2018-02-15 2019-08-22 Schott Ag Verfahren und Vorrichtung zum Einfügen einer Trennlinie in ein transparentes sprödbrüchiges Material, sowie verfahrensgemäß herstellbares, mit einer Trennlinie versehenes Element
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN110316949A (zh) * 2018-03-28 2019-10-11 福州高意光学有限公司 一种飞秒激光器切割玻璃的方法
JP7123652B2 (ja) * 2018-06-20 2022-08-23 株式会社ディスコ レーザー加工装置
JP7120903B2 (ja) * 2018-10-30 2022-08-17 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
WO2020090905A1 (ja) * 2018-10-30 2020-05-07 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
CN113056346B (zh) 2018-10-30 2023-12-15 浜松光子学株式会社 激光加工装置及激光加工方法
US11897056B2 (en) 2018-10-30 2024-02-13 Hamamatsu Photonics K.K. Laser processing device and laser processing method
KR102346335B1 (ko) * 2018-11-19 2022-01-04 가부시키가이샤 도교 세이미쓰 레이저 가공 장치 및 그 제어 방법
CN110253155B (zh) * 2019-05-10 2021-10-15 武汉华工激光工程有限责任公司 一种微裂纹控制的激光加工装置
US20210024411A1 (en) 2019-07-26 2021-01-28 Laser Engineering Applications Method for structuring a transparent substrate with a laser in a burst mode
JP7391583B2 (ja) 2019-09-18 2023-12-05 浜松ホトニクス株式会社 検査装置及び検査方法
JP7305495B2 (ja) * 2019-09-18 2023-07-10 浜松ホトニクス株式会社 検査装置及び検査方法
DE102019129036A1 (de) * 2019-10-28 2021-04-29 Schott Ag Verfahren zur Herstellung von Glasscheiben und verfahrensgemäß hergestellte Glasscheibe sowie deren Verwendung
DE102019217021A1 (de) * 2019-11-05 2021-05-06 Photon Energy Gmbh Laserschneidverfahren und zugehörige Laserschneidvorrichtung
CN112775539A (zh) * 2019-11-07 2021-05-11 大族激光科技产业集团股份有限公司 激光加工方法及装置
JP2021088474A (ja) * 2019-12-03 2021-06-10 日本電気硝子株式会社 ガラス物品の製造方法、及びガラス物品
DE102019219462A1 (de) * 2019-12-12 2021-06-17 Flabeg Deutschland Gmbh Verfahren zum Schneiden eines Glaselements und Schneidsystem
JP2021163914A (ja) * 2020-04-02 2021-10-11 浜松ホトニクス株式会社 レーザ加工装置、レーザ加工方法及びウェハ
DE102020206670A1 (de) * 2020-05-28 2021-12-02 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Laserschneidverfahren und Laserschneidanlage
KR20230020498A (ko) * 2020-06-04 2023-02-10 코닝 인코포레이티드 수정된 펄스 버스트 프로파일을 사용하여 투명 작업편을 레이저 처리하는 방법
CN114178710B (zh) * 2020-08-24 2024-11-26 奥特斯(中国)有限公司 部件承载件及其制造方法
DE102020122598A1 (de) 2020-08-28 2022-03-03 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Bearbeiten eines Materials
DE102020123786A1 (de) * 2020-09-11 2022-03-17 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Trennen von Dünnstglas
DE102020213776A1 (de) * 2020-11-03 2022-05-05 Q.ant GmbH Verfahren zum Spalten eines Kristalls
WO2022185096A1 (en) 2021-03-03 2022-09-09 Uab Altechna R&B Laser beam transforming element
US11782276B2 (en) 2021-03-17 2023-10-10 Google Llc Systems and methods to reduce bounce spacing and double-bounce in waveguides
DE102021109579B4 (de) 2021-04-16 2023-03-23 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und vorrichtung zum ausbilden von modifikationen mit einem laserstrahl in einem material mit einer gekrümmten oberfläche
WO2022259963A1 (ja) * 2021-06-11 2022-12-15 Ａｇｃ株式会社 ガラス物品の製造方法、ガラス物品、カバーガラス、及び表示装置
WO2022264976A1 (ja) * 2021-06-16 2022-12-22 Ａｇｃ株式会社 板状部材の製造方法及び板状部材
US12270997B2 (en) 2021-09-01 2025-04-08 Google Llc Systems and methods to minimize double-bounce in waveguides
WO2023099946A1 (en) 2021-12-02 2023-06-08 Uab Altechna R&D Pulsed laser beam shaping device for laser processing of a material transparent for the laser beam
DE102022115711A1 (de) * 2022-06-23 2023-12-28 Schott Ag Verfahren und Vorrichtung zum Bearbeiten von Werkstücken
CN114985990B (zh) * 2022-07-14 2024-10-22 中国科学院半导体研究所 双激光裂片方法和装置
CN115609165A (zh) * 2022-10-26 2023-01-17 中国科学院微电子研究所 碳化硅激光切割方法
DE102024118609A1 (de) * 2024-07-01 2026-01-08 Schott Ag Verfahren zur Herstellung von ultradünnen Elementen aus glasbasiertem Material, ultradünnes Element aus glasbasiertem Material sowie dessen Verwendung
CN118714898B (zh) * 2024-08-28 2024-12-27 深圳御光新材料有限公司 钙钛矿薄膜电池的制作方法和钙钛矿薄膜电池

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2395960A1 (en) * 2000-01-10 2001-07-19 Electro Scientific Industries, Inc. Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths
JP3867109B2 (ja) * 2000-09-13 2007-01-10 浜松ホトニクス株式会社 レーザ加工方法
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
DE10330179A1 (de) 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen flacher Werkstücke aus Keramik
US8624157B2 (en) * 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
KR101157444B1 (ko) * 2007-07-06 2012-06-22 닛토덴코 가부시키가이샤 편광판
JP5446631B2 (ja) * 2009-09-10 2014-03-19 アイシン精機株式会社 レーザ加工方法及びレーザ加工装置
KR100984727B1 (ko) * 2010-04-30 2010-10-01 유병소 대상물 가공 방법 및 대상물 가공 장치
AU2011279374A1 (en) 2010-07-12 2013-02-07 Filaser Usa Llc Method of material processing by laser filamentation
JP5860228B2 (ja) 2011-06-13 2016-02-16 株式会社ディスコ レーザー加工装置
US9029242B2 (en) * 2011-06-15 2015-05-12 Applied Materials, Inc. Damage isolation by shaped beam delivery in laser scribing process
JP2013082589A (ja) 2011-10-11 2013-05-09 V Technology Co Ltd ガラス基板のレーザ加工装置
DE102012110971B4 (de) * 2012-11-14 2025-03-20 Schott Ag Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks
JP2014104484A (ja) 2012-11-27 2014-06-09 Disco Abrasive Syst Ltd レーザー加工装置
KR101547806B1 (ko) 2013-07-29 2015-08-27 에이피시스템 주식회사 멀티 초점을 가지는 비구면 렌즈를 이용한 취성 기판 가공 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220016988A (ko) * 2019-06-21 2022-02-10 트룸프 레이저-운트 시스템테크닉 게엠베하 적어도 하나의 공작물을 프로세싱하기 위한 방법
KR20210113558A (ko) * 2020-03-06 2021-09-16 쇼오트 아게 기판 엘리먼트의 분리를 준비 및/또는 수행하기 위한 방법 및 기판 서브엘리먼트

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EP2965853B2 (en) 2020-03-25
CN106536119A (zh) 2017-03-22
US20170120374A1 (en) 2017-05-04
LT2965853T (lt) 2016-11-25
JP2017528322A (ja) 2017-09-28

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