KR20170028262A - 수지 시트, 및 전자 장치 - Google Patents

수지 시트, 및 전자 장치 Download PDF

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Publication number
KR20170028262A
KR20170028262A KR1020160111836A KR20160111836A KR20170028262A KR 20170028262 A KR20170028262 A KR 20170028262A KR 1020160111836 A KR1020160111836 A KR 1020160111836A KR 20160111836 A KR20160111836 A KR 20160111836A KR 20170028262 A KR20170028262 A KR 20170028262A
Authority
KR
South Korea
Prior art keywords
resin sheet
resin
layer
sheet
thermosetting resin
Prior art date
Application number
KR1020160111836A
Other languages
English (en)
Korean (ko)
Inventor
고지 사토
Original Assignee
스미토모 베이클리트 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 베이클리트 컴퍼니 리미티드 filed Critical 스미토모 베이클리트 컴퍼니 리미티드
Publication of KR20170028262A publication Critical patent/KR20170028262A/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/16—Capacitors
    • C09J2201/622—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020160111836A 2015-09-03 2016-08-31 수지 시트, 및 전자 장치 KR20170028262A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015173970 2015-09-03
JPJP-P-2015-173970 2015-09-03

Publications (1)

Publication Number Publication Date
KR20170028262A true KR20170028262A (ko) 2017-03-13

Family

ID=58278155

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160111836A KR20170028262A (ko) 2015-09-03 2016-08-31 수지 시트, 및 전자 장치

Country Status (3)

Country Link
JP (1) JP2017048392A (ja)
KR (1) KR20170028262A (ja)
TW (1) TW201718798A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7067140B2 (ja) * 2017-03-29 2022-05-16 味の素株式会社 樹脂組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013183028A (ja) 2012-03-01 2013-09-12 Ibiden Co Ltd 電子部品内蔵配線板、チップコンデンサ、及び電子部品内蔵配線板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013183028A (ja) 2012-03-01 2013-09-12 Ibiden Co Ltd 電子部品内蔵配線板、チップコンデンサ、及び電子部品内蔵配線板の製造方法

Also Published As

Publication number Publication date
TW201718798A (zh) 2017-06-01
JP2017048392A (ja) 2017-03-09

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