KR20170028262A - Resin sheet and electronic apparatus - Google Patents

Abstract

A resin sheet of the present invention is used to bond electronic components. The adhesive force is 80 gf/5mm or more at 25C. The lowest melting viscosity of the resin sheet is more than or equal to 300 Pas, and less than or equal to 2,000 Pas, when measured at the measuring temperature range of 50-200C with the frequency of 62.83 rad/sec using a viscoelastic measuring device.

Description

[0001] RESIN SHEET AND ELECTRONIC APPARATUS [0002]

The present invention relates to a resin sheet and an electronic apparatus.

In the manufacture of electronic devices, there is a case where electronic parts are mounted on one side of an insulating layer and fixed. For example, there is a technique of forming an electronic component on a build-up layer at the time of manufacturing a wiring board in which an electronic component such as a ceramic capacitor is built. As such a technique, for example, a technique described in Patent Document 1 can be cited.

Patent Document 1 discloses that in an electronic component built-in wiring board having an electronic component having a main body portion and an external electrode, at least a part of the external electrode is formed in an opening portion formed in the main body portion.

Japanese Patent Laid-Open Publication No. 2013-183028

It is preferable that a process of forming a resin sheet on a base layer provided with a circuit, for example, placing an electronic part on a resin sheet, and then curing the resin sheet at the time of manufacturing an electronic device having the electronic part mounted on the insulating layer Have been reviewed by the inventors. However, as the circuit wiring becomes finer, the filling property of the resin sheet with respect to the circuit of the ground layer becomes more important. On the other hand, in the same process, it has been found that such a resin sheet is also required to improve the adhesion to electronic parts. Up to now, it has been difficult to realize a resin sheet capable of improving the balance between the bottom layer and the adhesion to the electronic component.

According to the present invention,

As a resin sheet used for bonding electronic components,

The tack force at 25 캜 is 80 gf / 5 mmφ or more,

When the resin sheet is measured under the conditions of a frequency of 62.83 rad / sec and a measurement temperature range of 50 ° C to 200 ° C using a dynamic viscoelasticity measuring apparatus, the resin sheet has a minimum melt viscosity of 300 Pa · s or more and 1000 Pa · s or less A resin sheet is provided.

According to the present invention, there is provided an electronic device comprising the cured film of the resin sheet described above and the electronic component bonded onto one side of the cured film.

According to the present invention, it is possible to realize a resin sheet capable of improving the balance between the filling property of a circuit and the adhesion property to an electronic component.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a resin sheet according to the present embodiment. Fig.
2 is a schematic cross-sectional view showing a method of manufacturing a circuit board according to the embodiment.
3 is a schematic cross-sectional view showing a method of manufacturing a circuit board according to the present embodiment.
4 is a schematic cross-sectional view showing a manufacturing method of the electronic device according to the embodiment.
5 is a schematic cross-sectional view showing a modified example of the resin sheet according to the present embodiment.
6 is a plan view schematically showing a method of measuring the positional deviation.
7 is a schematic cross-sectional view showing a modified example of the ceramic capacitor.

Best Mode for Carrying Out the Invention Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and a description thereof will be omitted.

First, the outline of the resin sheet according to the present invention will be described.

The resin sheet of the present invention has a constitutional requirement A in which the adhesive force at 25 DEG C is 80 gf / 5 mm phi or more and a constitutional requirement A when measured at a frequency of 62.83 rad / sec and a measurement temperature range of 50 DEG C to 200 DEG C using a dynamic viscoelasticity measuring apparatus Satisfies the constituent requirement B that the minimum melt viscosity is 300 Pa · s or more and 1000 Pa · s or less.

The resin sheet of the present invention can be used to adhere an electronic component on one side thereof. On the other hand, the other surface can be adhered to the circuit surface of the substrate on which the circuit pattern is formed.

In the present invention, by satisfying the constituent requirement A, the resin sheet has sufficient adhesion to the electronic parts bonded on the upper side. By increasing the adhesive force of the constituent requirement A, it is possible to suppress the occurrence of positional deviation of such electronic parts after the resin sheet is cured by increasing the adhesion of the resin sheet to the electronic parts.

Further, in the present invention, by satisfying the constituent requirement B, the resin sheet has good embedding characteristics with respect to the circuit arranged on the lower side. By making the minimum melt viscosity of the component B so low as to fall within the above-mentioned range, the resin sheet before curing is likely to be embedded in the circuit interval or the like.

As a result of the investigation by the inventor of the present invention, it has been found that the filling of the resin sheet with respect to the lower circuit (circuit of the substrate) becomes more important as the circuit wiring becomes finer, while the adhesion to electronic parts I found out what I needed. On the basis of these findings, it has been further investigated that a resin sheet capable of improving the balance of the substrate with respect to the circuit and the adhesion to the electronic component can be improved by combining the constitutional requirement A and the constituent requirement B .

The resin sheet of the present invention can improve both the filling of the circuit board with the circuit and the adhesion to the electronic part, and the balance between the filling property and the adhesiveness can be achieved. In addition, a circuit board or an electronic device using such a resin sheet has high reliability and excellent yield.

Hereinafter, a resin sheet, a circuit board, a method of manufacturing a circuit board, and an electronic apparatus according to the present embodiment will be described in detail.

[Resin composition for resin sheet]

First, a resin composition for a resin sheet for forming a resin sheet according to the present embodiment will be described.

The resin composition for a resin sheet is a varnish-type resin composition. By making the resin composition for a resin sheet into a film, the resin sheet of the present embodiment can be obtained. Such a resin composition for a resin sheet is a thermosetting resin composition containing a thermosetting resin. As the resin sheet of the present embodiment, a resin film using the above-mentioned thermosetting resin composition can be used.

Examples of the thermosetting resin include, but not limited to, a phenol resin, a resin having a benzoxazine ring, an epoxy resin, a melamine resin, an unsaturated polyester resin, a maleimide resin, a polyurethane resin, a diallyl phthalate resin, A cyanate resin, and a resin having a methacryloyl group. For example, the thermosetting resin may include a liquid resin in a liquid state at room temperature (25 DEG C). These may be used alone or in combination of two or more. In the present embodiment, it is preferable that the thermosetting resin comprises an epoxy resin.

(Epoxy resin (A))

Examples of the epoxy resin (A) include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, bisphenol M type epoxy resin (4,4 ' Bisphenol-type epoxy resin (4,4 '- (1,4-phenylene diisoprene) bisphenol type epoxy resin), bisphenol Z type epoxy resin (4,4' -Cyclohexidiene bisphenol type epoxy resin); Novolak type epoxy resins such as phenol novolak type epoxy resin, cresol novolak type epoxy resin, tetra novolak type epoxy resin to tetraphenol group, and novolak type epoxy resin having condensed ring aromatic hydrocarbon structure; Biphenyl type epoxy resins; Aralkyl type epoxy resins such as xylylene type epoxy resin and biphenyl aralkyl type epoxy resin; Naphthalene type epoxy resins, naphthalene type epoxy resins, naphthalene diol type epoxy resins, bifunctional to tetrafunctional naphthalene type epoxy resins, binaphthyl type epoxy resins, naphthalene aralkyl type epoxy resins, and naphthalene modified cresol novolac epoxy resins. An epoxy resin having a skeleton; Anthracene type epoxy resin; Phenoxy type epoxy resin; Dicyclopentadiene type epoxy resin; Norbornene type epoxy resin; Adamantane type epoxy resin; A fluorene type epoxy resin, an allylated epoxy resin, a glycidylamine type epoxy resin, a glycidyl ester type epoxy resin, and an alicyclic epoxy resin. Of these, from the viewpoint of improving the filling property of the resin sheet and the surface smoothness, it is more preferable to include an epoxy resin having a naphthalene skeleton. Thus, the resin sheet can be reduced in linear expansion and high elasticity. It is also possible to improve the rigidity of the circuit board to contribute to the improvement of the workability and to improve the reflow resistance and the warpage in the semiconductor package. From the viewpoint of improving the filling property of the resin sheet, it is particularly preferable to include an epoxy resin having a trifunctional or more naphthalene skeleton.

The epoxy resin (A) includes an epoxy resin represented by the following general formula (1) as an example of a preferable embodiment.

However,

(In the formula (1), n is an integer of 0 to 10, and R ₁ and R ₂ independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms)

The content of the epoxy resin (A) is preferably 3% by weight or more, more preferably 5% by weight or more, based on the total solid content of the thermosetting resin composition. By making the content of the epoxy resin (A) equal to or higher than the lower limit value described above, it is possible to contribute to improvement of the filling property and smoothness of the resin sheet formed using the thermosetting resin composition. On the other hand, the content of the epoxy resin (A) is preferably 40% by weight or less, more preferably 35% by weight or less, based on the total solid content of the thermosetting resin composition. By setting the content of the epoxy resin (A) to the upper limit or lower, the heat resistance and moisture resistance of the resin sheet formed using the thermosetting resin composition can be improved. The epoxy resin (A) may contain a liquid epoxy resin. The content of the liquid epoxy resin may be 15% by weight or less and 10% by weight or less based on the total solid content of the thermosetting resin composition. By reducing the content of the liquid epoxy resin, it is possible to suppress deterioration of the carrier peelability due to too strong adhesive force.

Further, the total solid content of the thermosetting resin composition refers to the entirety of the components excluding the solvent contained in the thermosetting resin composition. Hereinafter, it is the same in the present specification.

The thermosetting resin composition may further comprise at least one liquid or semi-solid resin selected from a cyanate resin, an allyl phenol compound, a propenyl phenol compound, an active ester compound, an alkoxysilane-modified phenol compound and a carbodiimide compound . By including these resins, the adhesive strength can be improved while keeping the minimum melt viscosity of the resin sheet within the above range. Particularly, the thermosetting resin composition preferably contains a cyanate resin among the above-mentioned resins.

(Cyanate resin (B1))

By including the cyanate resin in the thermosetting resin composition, it is possible to impart appropriate tackiness to the resin sheet and improve the low linear expansion of the resin sheet, the elastic modulus and the rigidity. It is also possible to contribute to improvement of the heat resistance and moisture resistance of the obtained semiconductor device.

The cyanate resin (B1) is a resin having a cyanate group (-O-CN) in the molecule. In particular, it is preferable to use a cyanate resin having two or more cyanate groups in the molecule. Examples of the cyanate resin (B1) include, but are not limited to, dicyclopentadiene type cyanate ester resins, phenol novolak type cyanate ester resins, novolak type cyanate resins, bisphenol A type cyanate resins, Bisphenol-type cyanate resins such as bisphenol E type cyanate resins and tetramethyl bisphenol F type cyanate resins, and naphthol aralkyl type cyanate resins.

The cyanate resin (B1) is not particularly limited, and can be obtained, for example, by reacting a halogenated cyanide compound with a phenol or naphthol. Examples of such cyanate resins include cyanate resins obtained by the reaction of phenol novolac type polyvalent phenols with halogenated cyanide, cyanate resins obtained by reaction of cresol novolac type polyvalent phenols with halogenated cyanide, naphthol aralkyl type And a cyanate resin obtained by a reaction between a cyanuric chloride and a cyanogen halide. The cyanate resin (B1) may be used singly or in combination of two or more.

Among them, from the viewpoint of improving the low linear expansion of the resin sheet, the modulus of elasticity and the rigidity, it is more preferable to contain a phenol novolak type cyanate resin, a dicyclopentadiene type cyanate ester resin, or a naphthol aralkyl type cyanate resin And a phenol novolak type cyanate resin is particularly preferable.

The content of the cyanate resin (B1) is preferably 3% by weight or more, more preferably 5% by weight or more, based on the total solid content of the thermosetting resin composition. By making the content of the cyanate resin (B1) equal to or more than the above lower limit value, the resin sheet formed using the thermosetting resin composition can be more effectively lowered in linear expansion and high elasticity. Further, it can contribute to the improvement of the filling property and the smoothness. On the other hand, the content of the cyanate resin (B1) is preferably 40% by weight or less, more preferably 35% by weight or less, based on the total solid content of the thermosetting resin composition. By setting the content of the cyanate resin (B1) to be not more than the upper limit, the heat resistance and moisture resistance of the resin sheet formed using the thermosetting resin composition can be improved.

(Filler (C))

It is preferable that the thermosetting resin composition further contains a filler (C).

As the filler (C), an inorganic filler can be used. Examples of the inorganic filler include, but are not limited to, silicates such as talc, calcined clay, unbaked clay, mica, and glass; Oxides such as titanium oxide, alumina, boehmite, silica and fused silica; Carbonates such as calcium carbonate, magnesium carbonate, and hydrotalcite; Hydroxides such as aluminum hydroxide, magnesium hydroxide and calcium hydroxide; Sulfates or sulfites such as barium sulfate, calcium sulfate and calcium sulfite; Borates such as zinc borate, barium metaborate, aluminum borate, calcium borate and sodium borate; Nitrides such as aluminum nitride, boron nitride, silicon nitride, and carbon nitride; Strontium titanate, titanate such as barium titanate, and the like. Among these, talc, alumina, glass, silica, mica, aluminum hydroxide and magnesium hydroxide are preferable, and silica is particularly preferable.

The silica is not particularly limited, but may include at least one of, for example, spherical silica and crushed silica. From the viewpoint of improving the filling property and surface smoothness of the resin sheet, it is more preferable to include spherical silica. The silica may be, for example, molten spherical silica.

The average particle diameter D ₅₀ of the filler (C) is not particularly limited, but is preferably 0.01 μm or more and 5.0 μm or less, and more preferably 0.05 μm or more and 2.0 μm or less.

The average particle diameter D ₅₀ of the filler (C) is, for example, It is possible to measure using a laser diffraction particle size distribution measuring apparatus (HORIBA, LA-500). The filler may contain one or more kinds of fillers.

The content of the filler (C) is preferably 40 wt% or more, more preferably 50 wt% or more, based on the total solid content of the thermosetting resin composition, for example. By setting the content of the filler (C) to the lower limit value or more, the heat resistance and moisture resistance of the resin sheet obtained using the thermosetting resin composition can be effectively improved. It is also possible to reduce the warpage of the obtained semiconductor package by lowering the linear expansion and high elasticity of the resin sheet. On the other hand, the content of the filler (C) is preferably 90% by weight or less, more preferably 85% by weight or less, based on the total solid content of the thermosetting resin composition. By making the content of the filler (B) equal to or lower than the upper limit value, it becomes possible to improve the filling property of the resin sheet more effectively.

(Curing accelerator (D))

It is preferable that the thermosetting resin composition further includes, for example, a curing accelerator (D). As a result, the curability of the thermosetting resin composition can be improved.

As the curing accelerator (D), those which accelerate the curing reaction of the epoxy resin (A) can be used, and the kind thereof is not particularly limited. Examples of the curing accelerator (D) include, but are not limited to, zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, zinc octylate, bisacetylacetonate cobalt (II), trisacetylacetonate cobalt (III)), tertiary amines such as triethylamine, tributylamine and diazabicyclo [2.2.2] octane, tetraphenylphosphonium tetraphenylborate (TPP-K), tetraphenylphosphonium tetra (4-methylphenyl) borate (TPP-MK), 2-phenyl-4-methylimidazole, 2-ethyl- Imidazoles such as imidazole, 2-phenyl-4-methyl-5-hydroxyimidazole and 2-phenyl-4,5-dihydroxyimidazole, phenol compounds such as phenol, bisphenol A and nonylphenol, Organic acids such as acetic acid, benzoic acid, salicylic acid, para-toluenesulfonic acid and the like, and onium salt compounds, The can be included. Among these, from the viewpoint of improving the curability more effectively, it is more preferable to include an onium salt compound.

The onium salt compound used as the curing accelerator (D) is not particularly limited, and for example, a compound represented by the following general formula (2) can be used.

[Figure 2]

(In the formula (2), P represents a phosphorus atom, R ³ , R ⁴ , R ⁵ and R ⁶ represent an organic group having a substituted or unsubstituted aromatic ring or heterocyclic ring, or a substituted or unsubstituted aliphatic group, A ^- represents an anion of n (n? 1) -valent proton donor having at least one proton capable of releasing from the molecule in the molecule, or an anion thereof.

The content of the curing accelerator (D) is, for example, preferably 0.1% by weight or more, more preferably 0.3% by weight or more based on the total solid content of the thermosetting resin composition. By setting the content of the curing accelerator (D) to the lower limit value or more, the curability of the thermosetting resin composition can be improved more effectively. On the other hand, the content of the curing accelerator (D) is preferably 10% by weight or less, more preferably 5% by weight or less, based on the total solid content of the thermosetting resin composition. By keeping the content of the curing accelerator (D) at or below the upper limit, the preservability of the thermosetting resin composition can be improved.

(E) Colorant

The thermosetting resin composition may further contain, for example, a colorant (E). The colorant (E) includes, for example, one or two or more selected from dyes, pigments, and pigments such as rust, red, blue, sulfur, and black. Of these, a green colorant can be used from the viewpoint of improving the visibility of the opening, and a green dye may be used. Examples of the green colorant may include one or more known colorants such as anthraquinone, phthalocyanine, and perylene.

The content of the colorant (E) is preferably 0.05% by weight or more, more preferably 0.1% by weight or more based on the total solid content of the thermosetting resin composition. By setting the content of the colorant (E) to the lower limit value or more, the visibility and hiding property of the opening of the resin sheet obtained by using the thermosetting resin composition can be improved more effectively. On the other hand, the content of the colorant (E) is preferably 5% by weight or less, more preferably 3% by weight or less based on the total solid content of the thermosetting resin composition. By setting the content of the colorant (E) to the upper limit value or less, it becomes possible to more effectively improve the curability and the like of the thermosetting resin composition.

(Other component (F))

The thermosetting resin composition may contain one or more additives such as a coupling agent, a leveling agent, a curing agent, a sensitizer, a defoaming agent, an ultraviolet absorber, a foaming agent, an antioxidant, a flame retardant, May be added.

Examples of the coupling agent include a silane coupling agent such as an epoxy silane coupling agent, a cationic silane coupling agent and an aminosilane coupling agent, a titanate coupling agent, and a silicone oil coupling agent. As the leveling agent, an acrylic copolymer or the like can be mentioned. The content of the coupling agent is not particularly limited, but is preferably 0.05 to 5% by weight, more preferably 0.2 to 3% by weight, based on the total solid content of the thermosetting resin composition.

Examples of the curing agent include phenol resins such as phenol novolak resins, cresol novolak resins, aryl alkylene novolac resins, and the like. The content of the curing agent is not particularly limited, but is preferably 0.05 to 10% by weight, more preferably 0.2 to 5% by weight, based on the total solid content of the thermosetting resin composition.

The resin sheet of the present embodiment satisfies the constituent requirements A and B by using the thermosetting resin composition containing the above-mentioned respective components in a predetermined amount. Particularly, it is preferable that the epoxy resin (A) is used in an amount of 3 to 40% by weight, the cyanate resin (B1), the allylphenol compound, the propenylphenol compound, the active ester compound, the alkoxysilane-modified phenol compound and the carbodiimide compound By using a thermosetting resin composition comprising 3 to 40% by weight of a liquid, semi-solid resin of the type, 40 to 80% by weight of a filler (C) and 0.1 to 5% by weight of a curing accelerator (D) It is possible to obtain a resin sheet which more surely satisfies the constituent requirements A and B. From the viewpoint of obtaining a resin sheet which satisfies the constitutional requirements A and B and which is particularly excellent in balance between the filling property and the adhesiveness, it is preferable to use a resin composition containing 5 to 35% by weight of an epoxy resin (A), a cyanate resin (B1) 10 to 35% by weight of at least one liquid or semi-solid resin selected from propenylphenol compounds, active ester compounds, alkoxysilane-modified phenol compounds and carbodiimide compounds, 50 to 85% by weight of filler (C) , And 0.3 to 5% by weight of a curing accelerator (D), based on the total weight of the thermosetting resin composition.

The thermosetting resin composition is a varnish-type resin composition. By making the thermosetting resin composition on the varnish as a film, the resin sheet of the present embodiment is obtained.

The resin sheet of the present embodiment can be obtained, for example, by applying a solvent removal treatment to a coating film (resin film) obtained by applying a varnish-type thermosetting resin composition. The resin sheet may be defined such that the content of the solvent is 5 wt% or less with respect to the entire thermosetting resin composition. In the present embodiment, for example, solvent removal treatment can be performed under the conditions of 100 ° C to 150 ° C for 1 minute to 5 minutes. This makes it possible to sufficiently remove the solvent while suppressing the progress of the curing of the thermosetting resin film.

In the present embodiment, the method of forming the thermosetting resin composition on the carrier substrate is not particularly limited, but the following methods can be used. For example, a resin varnish is first prepared by dissolving and dispersing a thermosetting resin in a solvent or the like to prepare a resin varnish, coating the resin varnish on a carrier substrate by using various coater apparatuses, and then drying the resin varnish. And a method of drying it after spray coating, and the like. Among them, a method of coating a resin varnish on a carrier substrate by using various coater apparatuses such as a comma coater and a die coater, and then drying it is preferred. This makes it possible to efficiently produce a resin sheet with a carrier substrate having a resin sheet having no void and having a uniform thickness.

(solvent)

The thermosetting resin composition on the varnish described above may contain, for example, a solvent.

Examples of the solvent include acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, cyclohexane, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethylsulfoxide , Organic solvents such as ethylene glycol, cellosolve, carbitol, anisole, and N-methylpyrrolidone.

In the thermosetting resin composition on the varnish, the solid content of the thermosetting resin composition is preferably 30 wt% or more and 80 wt% or less, and more preferably 40 wt% or more and 70 wt% or less. As a result, a thermosetting resin composition excellent in workability and film formability can be obtained. In addition, the thermosetting resin composition on the varnish may be prepared, for example, by mixing various components such as an ultrasonic dispersing system, a high-pressure impact dispersing system, a high-speed rotation dispersing system, a bead mill system, a high-speed shear dispersing system, And then dissolving, mixing and stirring in a solvent.

The thermosetting resin composition is preferably made of a composition that does not include a fiber substrate such as a glass fiber substrate or a paper substrate. By not including such a base material, the filling property of a circuit is improved, and a thermosetting resin composition particularly suitable for forming a resin sheet can be realized.

[Resin sheet]

The resin sheet according to the present embodiment may include a film obtained from the resin composition for a resin sheet. In the present embodiment, the resin sheet may be in the form of a sheet or a roll in a rollable form.

As described above, the resin sheet of the present embodiment has an adhesive force of 80 gf / 5 mmφ or more at 25 ° C. The lower limit value of the adhesive force of the resin sheet is 80 gf / 5 mm phi or more, preferably 90 gf / 5 mm phi or more, and more preferably 100 gf / 5 mm phi or more. The upper limit value of the adhesive force of the resin sheet is not particularly limited, but is preferably 1000 gf / 5 mm or less, more preferably 900 gf / 5 mm or less, and even more preferably 800 gf / 5 mm or less. By setting the adhesive strength to the lower limit value or more, the adhesion to the electronic component can be increased. This makes it possible to suppress the positional deviation of the electronic component due to the influence of the drying or the additional process before the resin sheet is cured at the time of manufacturing the electronic device. By setting the adhesive force to the upper limit value or less, the carrier and the carrier base material can be easily peeled off, and the handling of the resin sheet becomes favorable.

In the present embodiment, the adhesive force of the resin sheet can be measured by, for example, the following procedure. First, a resin sheet with a carrier substrate is prepared. The resin sheet of the resin sheet with a carrier substrate was bonded to the core at 80 캜. Next, the resin substrate and the core material with the carrier substrate adhered to each other are cut into squares of about 10 cm, and the carrier base material is peeled off to obtain a measurement sample. Then, the measurement sample was placed on the stage of an adhesion tester (made by Rescasa) set at 25 占 폚 so that the core material was located below, and a probe (5 mm?) Was pressed under the condition of 100 gf / 5 mm ?, 5 sec. Thereafter, the probe is released from the measurement sample under the condition of 2 mm / sec. At this time, the tensile force which the probe receives from the measurement sample is measured, and the peak value is determined as the adhesive force (gf / 5 mm?). As described above, the adhesive force of the release surface of the resin sheet from which the carrier substrate is peeled can be measured.

In the resin sheet of the present embodiment, the minimum melt viscosity at 50 to 200 占 폚 as measured by dynamic viscoelasticity test under the conditions of a measurement frequency of 62.83 rad / sec and a temperature raising rate of 3 占 폚 / min is not more than 2000 Pa 占 퐏. The upper limit of the lowest melt viscosity is 2000 Pa · s or less, but is preferably 900 Pa · s or less, more preferably 800 Pa · s or less. By setting the lowest melt viscosity to the upper limit value or less, it becomes possible to improve the filling property of the resin sheet as described above. On the other hand, the lower limit value of the lowest melt viscosity is 300 Pa · s or more, preferably 400 Pa · s or more, and more preferably 500 Pa · s or more. By setting the minimum melt viscosity to the lower limit value or more, the surface smoothness of the resin sheet can be improved.

In the present embodiment, the dynamic viscoelasticity test can be carried out under the following conditions using, for example, a dynamic viscoelasticity measuring apparatus. The dynamic viscoelasticity measuring apparatus is not particularly limited, and for example, Physica MCR-301 manufactured by Anton Paar may be used.

Frequency: 62.83 rad / sec

Measuring temperature: 50 to 200 ° C

Heating rate: 3 ° C / min

Geometry: Parallel Plate

Plate diameter: 10mm

Plate spacing: 0.1 mm

Load (Normal force): 0N (schedule)

Strain: 0.3%

Measurement Atmosphere: Air

In the present embodiment, it is possible to control the adhesive force and the minimum melt viscosity by appropriately selecting, for example, the kind and amount of each component contained in the thermosetting resin composition, the method of preparing the thermosetting resin composition, and the like. Among them, for example, the dispersibility of the filler in a range in which the content of the liquid epoxy resin is small (15% by weight or less with respect to the total solid content of the thermosetting resin composition) by a combination method such as heating, a coupling agent treatment, And the like can be mentioned as an element for setting the adhesive strength and the minimum melt viscosity to a desired numerical value range. In addition, the content of the filler is set to the lower limit value or more (the content is 40 wt% or more with respect to the total solid content of the thermosetting resin composition) within a range where the content of the liquid epoxy resin is small, Is an especially important factor for controlling the adhesive strength and the lowest melt viscosity.

In the present embodiment, when a cured product is obtained by heat-treating the resin sheet at 200 ° C for 1 hour, it is preferable that the cured product of the resin sheet has a storage elastic modulus at 25 ° C of 7 GPa or more. This makes it possible to suppress the bending of the circuit board including the resin sheet obtained by using the thermosetting resin composition and to improve the strength and to suppress the warpage of the semiconductor package having the circuit board. The storage elastic modulus is more preferably 10 GPa or more. On the other hand, the upper limit value of the storage elastic modulus is not particularly limited, but may be, for example, 50 GPa or less.

In the present embodiment, it is preferable that the cured product of the resin sheet has a glass transition temperature of 160 DEG C or higher when the cured product is obtained by heat-treating the resin sheet at 200 DEG C for 1 hour. This makes it possible to improve the heat resistance and downflow resistance of the resin sheet obtained by using the thermosetting resin composition. The glass transition temperature is more preferably 200 DEG C or higher. On the other hand, the upper limit value of the glass transition temperature is not particularly limited, but may be 350 DEG C or less, for example.

In the present embodiment, the storage elastic modulus and the glass transition temperature can be obtained, for example, by subjecting the cured product to dynamic viscoelasticity testing at a frequency of 1 Hz and a temperature raising rate of 5 deg. C / min using a dynamic viscoelasticity measuring apparatus Can be calculated from the measurement results. The dynamic viscoelasticity measuring apparatus is not particularly limited, and for example, DMS6100 manufactured by Seiko Instruments Inc. may be used.

In the present embodiment, when a cured product is obtained by heat-treating the resin sheet at 200 占 폚 for 1 hour, it is preferable that the coefficient of linear expansion of the cured product of the resin sheet at a temperature lower than the glass transition temperature is 30 ppm / 占 폚 or less. This makes it possible to suppress the warpage of the semiconductor package including the resin sheet obtained by using the thermosetting resin composition. The coefficient of linear expansion is more preferably 28 ppm / 占 폚 or lower. On the other hand, the lower limit value of the linear expansion coefficient is not particularly limited, but can be, for example, 3 ppm / DEG C or more.

In the present embodiment, for example, an average of the coefficient of linear expansion obtained at 25 to 50 DEG C obtained by measuring the cured product at a temperature raising rate of 10 DEG C / min using a TMA (thermal analysis apparatus) is calculated, The coefficient of linear expansion below the transition temperature can be used.

In the present embodiment, the storage modulus, the glass transition temperature, and the coefficient of linear expansion are controlled by appropriately selecting, for example, the type and blending amount of each component contained in the thermosetting resin composition and the method of preparing the thermosetting resin composition It is possible.

Further, by laminating the resin sheet of the present embodiment on a carrier substrate, a resin sheet with a carrier substrate can be formed. Thus, the handling property of the resin sheet can be improved.

In the present embodiment, for example, a polymer film can be used as the carrier substrate. Examples of the polymer film include, but are not limited to, polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate and polybutylene terephthalate, releasing paper such as polycarbonate and silicone sheet, fluorine resin, polyimide resin And thermoplastic resin sheets having heat resistance such as heat resistance. Among them, a sheet composed of polyethylene terephthalate is most preferable because it is easy to control the price and the peel strength. This makes it easy to peel off the resin sheet with an appropriate strength.

The thickness of the carrier substrate is not particularly limited, but may be, for example, 10 to 100 占 퐉 or 10 to 70 占 퐉. As a result, the handling property in the production of the resin sheet is favorable and preferable.

The resin sheet of the present invention may be a single layer or a multilayer, and may include one or more of the above-mentioned films. When the resin sheet has multiple layers, it may be composed of the same kind or may be composed of different kinds.

The resin sheet of the present embodiment can be configured to include a first resin sheet (first resin layer) and a second resin sheet (second resin layer) disposed under the first resin sheet. The first resin sheet and the second resin sheet have the same structure as the resin sheet.

The first resin sheet may have higher adhesion to electronic parts than the second resin sheet. That is, in this embodiment, the adhesive force of the first resin sheet can be made larger than the adhesive force of the second resin sheet. On the other hand, the second resin sheet may have a higher embedding characteristic with respect to the lower layer circuit than the first resin sheet. That is, in the present embodiment, the lowest melt viscosity of the second resin sheet can be made larger than the lowest melt viscosity of the first resin sheet. By using a resin sheet of two or more layers, the upper layer can improve the adhesion with the electronic component, and the lower layer can be better embedded in the circuit. In other words, it is possible to further enhance the balance between the adhesion to the electronic component and the filling property with respect to the lower layer circuit.

In the present embodiment, a method of forming a resin sheet (resin layer) of two or more layers is not particularly limited. For example, first, a first resin layer and a second resin layer, which are obtained by applying a thermosetting resin composition to a carrier substrate, 1 < / RTI > resin layer and the second resin layer are opposed to each other and dried. Thereafter, the carrier substrate is removed from the first resin layer and the second resin layer to obtain a resin sheet having a two-layer structure. In addition, a thermosetting resin composition is applied to a carrier substrate and dried to obtain a first resin sheet. Thereafter, the second resin sheet is formed on the first resin sheet by applying and drying the thermosetting resin composition on the first resin sheet. It is also possible to use a method of obtaining a two-layered resin sheet by coating and drying two layers simultaneously on a carrier substrate.

Further, in the present embodiment, in the production of the second resin sheet, the content of the liquid epoxy resin is further reduced or not added to the first resin sheet, thereby improving the peelability of the second resin sheet and the carrier substrate Lt; / RTI >

[Circuit board]

The circuit board according to the present embodiment may include a cured film of the resin sheet and an electronic component bonded on one side of the cured film.

Fig. 3 (c) shows an example of the circuit board 1 of the present embodiment. The circuit board 1 may include a buildup layer 12, an insulating layer 62, a wiring 40, and an electronic component (ceramic capacitor 50). The wiring 40 is buried in the buildup layer 12 of the lower layer. And a ceramic capacitor 50 is fixed on the upper surface of the buildup layer 12 in the lower layer. The ceramic capacitor 50 and the insulating layer 62 are disposed on the buildup layer 12 of the lower layer so as to form the same layer. The insulating layer 62 may be a cured product of a prepreg. Such prepreg may not include a substrate. The buildup layer 12 of the upper layer is disposed on the ceramic capacitor 50 and the insulating layer 62. [ In the circuit board 1 of the present embodiment, the insulating layer 62 may be formed of a coreless layer not using a core layer in addition to the electronic parts being embedded. It is possible to provide such a coreless substrate with built-in electronic parts.

In the present embodiment, since the buildup layer 12 is formed of the resin sheet described above, it is possible to obtain a circuit board having a structure with high reliability because the wiring is well embedded and the positional deviation of the electronic component is suppressed Do.

[Electronic devices]

In the electronic device according to the present embodiment, an electronic device in which an electronic device is mounted on the circuit board is used. Examples of electronic devices include semiconductor devices.

Fig. 4C shows an example of the electronic device 100. Fig. And the semiconductor chip 80 is connected to the circuit board 1 by flip-chip bonding. The electronic device 100 may include a circuit board 1, a wiring layer, an external connection terminal, a connection portion (wiring 74, a metal plating layer 78) to be connected to the electrode bumps of the semiconductor element, and a semiconductor chip 80 have.

On both sides of the circuit board 1, a wiring layer is formed. The number of wiring layers is arbitrary. The wiring 76 of the wiring layer in the lower layer is electrically connected to the external connection terminal 86. The wiring 74 of the upper wiring layer is electrically connected to the bumps 82 of the semiconductor chip 80. The periphery of the wirings 74 and 76 is covered with solder resist films 64 and 68, respectively. The gap between the semiconductor chip 80 and the solder resist film 64 is filled with an underfill resin 84. [

In the present embodiment, by using a circuit board having a structure with high reliability, it is possible to realize an electronic device having a structure with a high yield, with reliability being stably obtained.

[Method of manufacturing circuit board]

The manufacturing process of the circuit board of this embodiment will be described with reference to Figs.

Fig. 1 is a cross-sectional view showing the structure of the resin sheet 10 of the present embodiment, and Figs. 2 and 3 are process sectional views showing a manufacturing procedure of the circuit board 1 of the present embodiment.

First, the resin sheet 10 shown in Fig. 1 is prepared. As the resin sheet 10, a resin sheet 10 formed from the resin composition for a resin sheet of the present embodiment is used. The resin sheet 10 is formed on one side of a carrier substrate (not shown).

Next, the carrier 20 on which the release layer 30 is formed on one side is prepared. The carrier 20 is not particularly limited as long as it is a substrate having high strength, for example, a metal plate such as a copper plate is used. On the carrier 20, a resist patterned by lithography is formed. Then, a metal barrier layer is formed, and an electrolytic plating film is formed by an electrolytic plating treatment. Then, the resist is removed by using a resist stripping liquid to form a wiring 40 (wiring pattern) functioning as a patterned conductive circuit (FIG. 2 (a)).

The resin sheet 10 is peeled off from the release layer 30 in a state in which one side of the resin sheet 10 on which the carrier substrate is not disposed faces the wiring side on which the wiring 40 of the carrier 20 is formed, Lt; / RTI > As a result, the resin sheet 10 and the carrier 20 are bonded. That is, the resin sheet is bonded to the surface of the substrate (carrier 20) on the side where the conductive circuit (wiring 40) is formed. As a result, the resin sheet 10 can be buried in the space around the wiring 40 or at intervals between wirings. Thereafter, the carrier base material is peeled from the resin sheet 10 (Fig. 2 (b)).

Next, an electronic component (for example, a ceramic capacitor 50) is laminated on the peeling surface of the resin sheet 10 (Fig. 2 (c)).

Next, the prepreg 60 is laminated on the resin sheet 10 and the ceramic capacitor 50. Thereafter, an opening 90 for exposing the ceramic capacitor 50 is formed in the prepreg 60 by, for example, laser irradiation, plasma etching, or a mechanical drill (FIG. 3 (a)). As a result, it is possible to select the optimum opening process for the resin sheet 10 in the B-stage state. As the prepreg 60, for example, a prepreg in which a general thermosetting resin composition is semi-cured can be used, but a prepreg using the resin composition for a resin sheet constituting the resin sheet 20 of the present embodiment may be used . The thickness of the prepreg 60 is preferably 10 to 100 탆, and more preferably 10 to 70 탆.

Next, the resin sheet 10 with a carrier substrate is laminated on the ceramic capacitor 50 and the prepreg 60 by thermocompression bonding. Thus, the periphery and the upper portion of the ceramic capacitor 50 inside the opening can be embedded in the resin sheet 10. In addition, the resin sheet 10 can be disposed on the prepreg 60. Thereafter, the carrier base material is peeled from the resin sheet 10. The peeling layer 30 remains on the peeling surface of the resin sheet 10 (Fig. 3 (b)). At this time, as the carrier base material of the resin sheet 10, a metal foil may be used. As the metal foil, for example, copper foil and the like can be used. Instead of the resin sheet 10 used in FIG. 3 (b), a general prepreg made of a composition different from the resin composition for a resin sheet constituting the resin sheet 10 may be used. The prepreg can be used in the form of a resin sheet with a carrier substrate. For example, the ceramic capacitor 50 may be embedded using a copper foil prepreg.

Next, the structure shown in FIG. 3 (b) is heat-treated. As a result, the resin sheet 10, the prepreg 60, and the resin sheet 10 in the upper layer can be cured together. In the present embodiment, since the resin sheet 10 as the lower layer for fixing the ceramic capacitor 50 and the resin sheet 10 as the upper layer for embedding the ceramic capacitor 50 can be integrally cured, the number of processes and the manufacturing time can be reduced It is possible to increase the productivity of the process. In addition, in the resin sheet 10 of the lower layer, not only the adhesive force is set to the lower limit value or more, but the minimum melt viscosity is set to the lower limit value or more, thereby effectively suppressing the position deviation of the ceramic capacitor 50 even in the uncured state It is possible. Therefore, in the processes of FIGS. 2 (c) to 3 (b), in other words, the ceramic capacitor 50 is placed on the resin sheet 10 and, until such resin sheet 10 is cured, The uncured resin sheet 10 can suppress the displacement of the ceramic capacitor 50.

In the above description, an example of batch curing is described in (b) of Fig. 3, but the present invention is not limited to this. For example, when the ceramic capacitor 50 is disposed on the resin sheet 10 (Fig. 2 (c)), the resin sheet 10 may be hardened a little. For example, in the state shown in Fig. 2 (c), the resin sheet 10 is heat-treated to such an extent that the resin sheet 10 is not completely cured. As a result, the positional deviation of the resin sheet 10 can be further reduced. In addition, compared to the case where the film is completely cured, the time of the process can be shortened and the productivity is improved.

2 (c), the resin sheet 10 on which the ceramic capacitor 50 is disposed may be completely cured. As a result, the positional deviation of the ceramic capacitor 50 can be further suppressed.

When the resin sheet 10 having a minimum melt viscosity of less than the above lower limit value is used, the resin sheet 10 (hereinafter, referred to as " resin sheet 10 ") is thermally compressed during lamination of the prepreg 60, The viscosity of the ceramic capacitor 50 is lowered, and the ceramic capacitor 50 may be easily displaced. In this case as well, although the positional deviation can be suppressed by completely curing in Fig. 2 (c), voids may be generated at the interface between the lower portion of the ceramic capacitor 50 and the resin sheet 10 by completely curing. On the other hand, when the space around the condenser is filled with the resin, the viscosity of the resin decreases along with the resin sheet of the upper layer and the resin sheet of the lower layer, and the viscosity of the voids is reduced.

In the present embodiment, the condition of the heat curing treatment is not particularly limited, but may be, for example, 200 to 220 DEG C for about 1 hour. A buildup layer 12 (insulating layer) made of a cured product of the resin sheet 10 and an insulating layer 62 made of a cured product of the prepreg 60 are formed by the curing treatment. Thus, the ceramic capacitor 50 can be fixed on the buildup layer 12 of the lower layer. Subsequently, the carrier 20 is peeled from the peeling layer 30 (Fig. 3 (c)).

Thus, the circuit board 1 of the present embodiment is obtained. When the prepreg 60 does not contain a base material, the coreless circuit board 1 having no core layer is obtained.

[Manufacturing method of electronic device]

The manufacturing process of the electronic device 100 of the present embodiment will be described with reference to FIG.

4 is a process sectional view showing a manufacturing procedure of the electronic device 100 of the present embodiment.

The circuit board 1 obtained in the above-described manufacturing process of the circuit board is used. First, openings (through holes 70 and 72) are formed by laser irradiation on both sides of the circuit board 1, for example (Fig. 4 (a)). A part of the electrode 54 of the ceramic capacitor 50 is exposed at the bottom of the through hole 70. [ On the other hand, a part of the wiring 40 is exposed at the bottom of the through hole 72. [

Next, a wiring layer is formed on both surface sides of the circuit board 1. In the present embodiment, an example in which the wiring layer is one layer is shown, but the number of the wiring layers is not limited to this, and the number of the wiring layers can be arbitrarily set (FIG. 4B).

The method of forming the wiring layers 74 and 76 in the wiring layer is not particularly limited, but a method of forming wiring by, for example, lithography processing and selective etching is used.

Next, a solder resist film 64 is formed on the upper surface side of the circuit board 1. An opening for exposing a part of the wiring 74 is formed in the solder resist film 64 by, for example, laser irradiation, plasma etching, chemical etching, or lithography. Subsequently, a metal plating layer 78 is formed on the upper surface of the wiring 74 in the opening by electroplating or the like. The metal plating layer 78 functions as a connection portion to be connected to the electrode bumps (bumps 82) of the semiconductor chip 80.

On the other hand, a solder resist film 68 is also formed on the lower surface side of the circuit board 1. In the same manner, an opening for exposing a part of the wiring 76 is formed in the solder resist film 68. Subsequently, solder balls or the like are mounted on the wirings 76 in the openings to form the external connection terminals 86.

Next, the bumps 82 of the semiconductor chip 80 are flip-chip connected to the connecting portions (the wiring 74 and the metal plating layer 78) on the upper surface side of the circuit board 1. [ In addition, the underfill resin 84 is filled on the lower side of the semiconductor chip 80. Thus, a semiconductor device (electronic device 100) is obtained (Fig. 4 (c)).

1 in the manufacturing process of the present embodiment, the example in which the resin sheet 10 is a single layer has been described with reference to Fig. 1. However, the present invention is not limited to a single layer and may be a plurality of layers of two or more layers. Fig. 5 shows an example in which the resin sheet of this embodiment has two layers. The resin sheet 10 is composed of a first resin layer 14 (first resin sheet) and a second resin layer 16 (second resin sheet). The first resin layer 14 in the upper layer has a property of stably fixing the ceramic capacitor 50 and the second resin layer 16 in the lower layer has a characteristic in which circuit patterns such as the wirings 40 can be easily filled have. By making the resin sheet two or more layers, it becomes possible to further improve the balance between the filling of the lower layer circuit and the adhesiveness to the upper electronic part.

7 is a view showing a modified example of the ceramic capacitor 50. Fig. In the above description, as shown in Fig. 3 (c), an example is shown in which the ceramic capacitor 50 in which the electrodes 54 are formed at both ends in the longitudinal direction of the main body 52 is used, A ceramic capacitor 50 having a branch structure can be used. For example, the configuration in which the electrode 54 is disposed on only one side of the main body 52, that is, the configuration in which the electrode 54 is disposed on the lower side of the main body 52 (FIG. 7A) And a capacitor 50 having a configuration in which the electrode 54 is disposed on the upper side of the main body portion 52 (Fig. 7 (b)). These electrodes 54 have electrode patterns. 7 (c), a capacitor 50 formed on both surfaces of the main body 52 and formed over the entire surface of the main body 52 can also be used.

In the present embodiment, an example of flip chip connection has been described, but the present invention is not limited to this, and various connection methods can be used. For example, a wire bonding method may be used.

The present invention is not limited to the above-described embodiments, and variations, modifications, and the like within the scope of achieving the object of the present invention are included in the present invention.

[ Example ]

Next, an embodiment of the present invention will be described. The present invention is not limited to this.

(Preparation of thermosetting resin composition)

For each of the examples and comparative examples, the thermosetting resin composition on the varnish was adjusted. The thermosetting resin composition on the varnish was obtained by dissolving and dispersing the ingredients of each component blended according to Table 1 in the following solvent 1 and then stirring for 1 hour using a high-speed stirring device. Further, the numerical values representing the blending ratios of the respective components in Table 1 indicate the blending ratios (% by weight) of the respective components with respect to the total solid content of the thermosetting resin composition.

Details of the ingredients of each component in Table 1 are as follows.

(Thermosetting resin)

Thermosetting resin 1: Naphthalene-modified cresol novolak epoxy resin (HP-5000, manufactured by DIC)

Thermosetting resin 2: naphthylene ether type epoxy resin (HP-6000, manufactured by DIC)

Thermosetting resin 3: tetrafunctional naphthalene type epoxy resin (EPICLON HP-4710, manufactured by DIC Corporation)

Thermosetting resin 4: Bisphenol F type epoxy resin (EPICLON, 830S, manufactured by DIC)

Thermosetting resin 5: phenol novolac cyanate resin (Primaset PT-30, manufactured by LONZA)

Thermosetting resin 6: Carbodiimide (V-05 made by Nisshinbo Chemical Co., Ltd.)

Thermosetting resin 7: Trifunctional alkoxysilane-modified phenol novolac (Arakawa Chemical Industries, Ltd., P501)

Thermosetting resin 8: 2-Propenoic acid, 2- [4- (acetoxy) phenyl] ethyl ester)

(filling)

Filler 1: spherical silica (SO-C4 made by Admatechs Co., average particle diameter 1.0 mu m, treated with phenylaminosilane)

Filler 2: spherical silica (SO-C4 made by Admatechs, average particle size 1.0 μm, untreated)

(Hardening accelerator)

Curing accelerator 1: tetraphenylphosphonium tetrakis (4-methylphenyl) borate (TPP-MK)

(Coupling agent)

Coupling agent 1: Epoxy silane (KBM-403, Shin-Etsu Chemical Co., Ltd.)

(solvent)

Solvent 1: methyl ethyl ketone

(Production of resin sheet)

The thermosetting resin composition obtained was applied onto a PET film (38 μm thick) as a carrier base material for Examples 1 to 8 and Comparative Examples 1 to 4, and then the solvent was removed at 140 ° C. for 2 minutes to form a carrier having a thickness of 30 μm Thereby forming a base resin sheet.

In Example 4, a resin sheet was produced as follows. The obtained thermosetting resin composition was coated on a PET film (38 μm thick) as a carrier base, and then the solvent was removed under the conditions of 140 ° C. and 2 minutes to form a first resin layer as the first layer. In the same manner, a second resin layer of the second layer was obtained. The two resin layers were formed by bonding the first resin layer and the second resin layer. Thereafter, the carrier substrate was peeled off from the second resin layer to form a resin-coated resin sheet in which a first resin sheet having a thickness of 30 탆 and a second resin sheet having a thickness of 30 탆 were laminated.

(adhesiveness)

With respect to each of the Examples and Comparative Examples, the adhesive strength of the resin sheet was measured as follows. First, a resin sheet with a carrier substrate was bonded to a core material (FR-4 substrate) at 80 占 폚. Next, the bonded resin sheet with a carrier substrate and the core material were cut into squares of about 10 cm, and a carrier substrate (PET film) was peeled off to produce measurement samples. Then, the measurement sample was placed on the stage of a tester (made by Rescasa) set at 25 캜 so that the core material was located below, and a probe (5 mmφ) was pressed at a rate of 100 gf / 5 mmφ for 5 seconds. Thereafter, the probe was released from the measurement sample under the condition of 2 mm / sec. At this time, the tensile force of the probe was measured from the measurement sample, and the peak value was determined as the adhesive force (gf / 5 mm?). Thus, the adhesive strength of the peeled surface of the resin sheet from which the PET film was peeled off was measured. The results are shown in Table 1.

(Lowest melt viscosity)

With respect to each of the Examples and Comparative Examples, the lowest melt viscosity of the resin sheet was measured as follows. First, a resin sheet from which a PET film as a carrier base was peeled from the resin sheet with a carrier base material obtained above was prepared as a measurement sample. Next, with respect to this measurement sample, the melt viscosities were measured under the following conditions using a dynamic viscoelasticity measuring apparatus (manufactured by Anton Paar, device name: Physica MCR-301). From the obtained measurement results, the lowest melt viscosity (Pa · s) at 50 to 200 ° C was calculated. The results are shown in Table 1.

Frequency: 62.83 rad / sec

Measuring temperature: 50 to 200 ° C

Heating rate: 3 ° C / min

Geometry: Parallel Plate

Plate diameter: 10mm

Plate spacing: 0.1 mm

Load (Normal force): 0N (schedule)

Strain: 0.3%

Measurement Atmosphere: Air

(Glass transition temperature, storage modulus)

For each of the examples and comparative examples, three resin sheets were peeled off from the obtained resin substrate with a carrier substrate as a carrier substrate to obtain a resin sheet having a thickness of 90 탆. Then, the resin sheet was heat-treated at 200 ° C for 1 hour, cut into a width of 8 mm, a length of 50 mm, and a thickness of 90 μm to obtain a measurement sample. The dynamic viscoelasticity test was carried out on this measurement sample under the conditions of a frequency of 1 Hz and a temperature raising rate of 5 deg. C / min using a dynamic viscoelasticity measuring apparatus (DMS6100, manufactured by Seiko Instruments Inc.). Next, the glass transition temperature (占 폚) and the storage elastic modulus (GPa) at 25 占 폚 were calculated from the obtained measurement results. The glass transition temperature was determined from the peak value of tan delta. The results are shown in Table 1.

(Coefficient of linear expansion)

For each of the examples and comparative examples, three resin sheets were peeled off from the obtained resin substrate with a carrier substrate as a carrier substrate to obtain a resin sheet having a thickness of 90 탆. Then, the resin sheet was heat-treated at 200 캜 for 1 hour, cut into a width of 4 mm, a length of 20 mm, and a thickness of 90 탆 to obtain a measurement sample. The measurement sample was measured for the coefficient of linear expansion under the conditions of a temperature raising rate of 10 캜 / min using TMA (manufactured by TA Instruments Co., Ltd.). Then, the average of the measurement results at 25 to 50 占 폚 was calculated, and the coefficient of linear expansion at the temperature lower than the glass transition temperature (ppm / 占 폚) was determined. The results are shown in Table 1.

(Circuit embedding property evaluation, adhesion property evaluation)

With respect to each of the examples and comparative examples, the circuit filling property and the adhesion to the multilayer ceramic capacitor were evaluated as described below. First, a resist patterned by lithography was formed on a copper plate as a carrier. Next, a nickel barrier layer was formed, and then an electrolytic copper plating film (thickness: 12 m) was formed by electrolytic plating to form a wiring pattern with L / S = 12/12 m. Next, the resist was removed using a resist stripper. Next, the carrier sheet-attached resin sheet obtained above was laminated on the release layer so that the resin sheet would embed the wiring, and then the carrier sheet was peeled from the resin sheet. Then, a ceramic capacitor was placed on the resin sheet. Then, the resin sheet was cured at 200 DEG C for 1 hour to form an insulating layer made of a cured resin sheet. As a result, an evaluation sample was obtained.

The surface of the insulating layer was observed under a microscope to check whether or not an insulating layer was embedded between the wiring patterns, and the circuit embedding property was evaluated according to the following criteria.

&Amp; cir & & cir & & cir &: No voids were observed between wiring patterns at all portions of the sample.

?: No voids were observed between wiring patterns in all portions of the sample, but slight bending was observed on the surface of the insulating layer.

X: voids were observed between wiring patterns in at least one place of the sample.

The results are shown in Table 1.

The adhesion test of the multilayer ceramic capacitor was carried out according to the following criteria by the die-shear strength measurement using the push-pull test.

?: 20 N / mm ² or more.

?: Not less than 15 N / mm ^{2 and not} more than 20 N / mm ² .

X: less than 15 N / mm ² .

The results are shown in Table 1.

(Carrier peelability)

With respect to each of the examples and comparative examples, the carrier peelability of the resin sheet was evaluated as follows. First, a PET film having a thickness of 25 占 퐉 was laminated on the side of the resin sheet with a carrier substrate on which the PET film (38 占 퐉 thickness) was not provided, to obtain a laminate. Then, the laminate was cut into squares of about 10 cm to obtain measurement samples. Then, a PET film having a thickness of 38 mu m was fixed on the stage in the measurement sample. Subsequently, under a temperature condition of 25 ° C, one of the four corners of the PET film having a thickness of 25 μm in the measurement sample was pulled 5 cm in the vertical direction with respect to the measurement sample, and the carrier peelability was evaluated did.

?: Peeling occurred between the PET film having a thickness of 25 占 퐉 and the resin sheet.

?: Partial peeling occurred between the PET film having a thickness of 38 占 퐉 and the resin sheet, but peeling was observed between the PET film having a thickness of 25 占 퐉 and the resin sheet.

X: Peeling was performed between the PET film having a thickness of 38 mu m and the resin sheet without peeling between the PET film having a thickness of 25 mu m and the resin sheet, or the measurement sample was peeled from the fixing stage. The results are shown in Table 1.

(Position deviation vehicle)

With respect to each of the examples and comparative examples, the positional deviation of the ceramic capacitor was measured as follows. First, a resin sheet with a carrier base material was laminated on a copper plate such that a copper plate and a resin sheet were opposed to each other, and vacuum-suction was performed for 30 seconds using a batch vacuum press laminate. Thereafter, pressure was applied under pressure of 1 kg / cm ² for 30 seconds using pressure-resistant rubber. Then, the carrier substrate was peeled off from the resin substrate-equipped resin sheet. Then, a ceramic capacitor (size 1608) was placed on the resin sheet.

Then, a prepreg having an opening formed corresponding to the ceramic capacitor portion was placed on the resin sheet.

Then, a resin sheet was laminated and treated at a pressure of 30 kg / cm ² and a vacuum press at 200 캜 for 30 minutes, and the ceramic capacitor was fixed to the resin sheet to cure the resin sheet. Thus, a measurement sample was obtained.

6 is a plan view schematically showing a method of measuring the positional deviation. After the prepreg was raised, the plane distances (X, Y, Z, W) between the origin A and B and the four corners of the ceramic capacitor were measured. The openings 90 in Fig. 6 represent openings formed in the prepreg.

Next, the resin sheet was cured. The plane distances (X, Y, Z, W) between the origin A and the origin B of the cured measurement sample and the four corners of the ceramic capacitor were measured again. Then, for X, Y, Z, and W, at any one of the four corners of the capacitor in which the largest deviation occurred in the above-described step of curing the resin sheet, the deviation amount was set as the position deviation amount. The results are shown in Table 1.

In Comparative Example 3, since the adhesive force was high, when the resin substrate was peeled from the resin sheet after the resin sheet was laminated on the copper plate, the peeling between the copper plate and the resin sheet or the inside of the resin sheet was peeled off, It was not possible to carry out the peeling of the base material normally. For this reason, the positional deviation of Comparative Example 3 was not evaluated.

10 Resin Sheet
12 buildup layer
14 First resin layer
16 Second resin layer
20 carriers
30 peeling layer
40 wiring
50 Ceramic Capacitors
52 body portion
54 Electrodes
60 prepreg
62 insulation layer
64 solder resist film
68 solder resist film
70 Through Hole
72 Through Hole
74 Wiring
76 Wiring
78 metal plating layer
80 semiconductor chip
82 bump
84 underfill resin
86 External connection terminal
90 opening

Claims (13)

As a resin sheet used for bonding electronic components,
The adhesive force at 25 캜 is 80 gf / 5 mmφ or more,
When the resin sheet is measured under the conditions of a frequency of 62.83 rad / sec and a measurement temperature range of 50 ° C to 200 ° C using a dynamic viscoelasticity measuring apparatus, the resin sheet has a minimum melt viscosity of 300 Pa · s or more and 2000 Pa · s or less Wherein the resin sheet is a resin sheet. The method according to claim 1,
Wherein the resin sheet is heat treated at 200 DEG C for 1 hour to obtain a cured product, wherein the cured product has a glass transition temperature of 160 DEG C or higher. The method according to claim 1,
Wherein the resin sheet is heat treated at 200 占 폚 for 1 hour to obtain a cured product, wherein the coefficient of linear expansion of the cured product at a temperature lower than the glass transition temperature is 30 ppm / 占 폚 or less. The method according to claim 1,
Wherein the resin sheet is heat treated at 200 DEG C for 1 hour to obtain a cured product, wherein the cured product has a storage elastic modulus at 25 DEG C of 7 GPa or more. The method according to claim 1,
Wherein the adhesive strength is 1000 gf / 5 mm or less. The method according to claim 1,
A first resin layer including one surface for adhering the electronic component and the other surface opposite to the one surface and a second resin layer provided on the other surface of the first resin layer . The method of claim 6,
Wherein the minimum melt viscosity of the second resin layer is larger than the lowest melt viscosity of the first resin layer. The method according to claim 1,
Wherein the resin sheet comprises a thermosetting resin composition comprising a thermosetting resin and a filler. The method of claim 8,
Wherein the thermosetting resin comprises an epoxy resin. The method of claim 8,
Wherein the filler comprises silica. The method of claim 8,
Wherein the thermosetting resin composition further comprises a cyanate resin. The method according to claim 1,
Wherein the electronic component is a ceramic capacitor. A cured film of the resin sheet according to any one of claims 1 to 12,
And the electronic component adhered on one side of the cured film.

Images