JP6083127B2 - Laminate, laminate with build-up layer, circuit board, semiconductor package, and method for manufacturing laminate - Google Patents

Description

  The present invention relates to a laminated board, a circuit board, a semiconductor package, and a method for producing the laminated board.

  In recent years, circuit boards tend to be thinner and thinner with the demand for higher functionality and lighter and shorter electronic devices.

A general circuit board is mainly composed of a laminated board in which a plurality of prepregs each having a fiber base layer and a resin layer are laminated. The current laminated board is mainly used for FCBGA (Flip Chip Ball Grid Array) used in, for example, a CPU (Central Processing Unit) and has a thickness of about 0.8 mm.
In recent years, thinning of laminates has been promoted for reasons such as reduction in substrate cost due to demands for reduction in thickness, reduction in member cost, processing cost, and improvement in electrical characteristics. Recently, a laminate having a thickness of about 0.4 mm, further 0.2 mm or less has been developed.

  However, when the thickness of the laminate is reduced, the warpage of the laminate increases due to a decrease in the strength of the laminate and an increase in the thermal expansion coefficient. As a result, the amount of variation in the warpage of the semiconductor package becomes large, and the mounting yield may be reduced.

  As means for solving such problems, for example, there are means described in the following documents.

  Patent Document 1 (Japanese Patent Laid-Open No. 62-292428) describes that the warp and twist of the prepreg can be reduced by keeping the longitudinal and lateral ratio of the tensile strength of the glass nonwoven fabric within a certain range. .

  Patent Document 2 (Japanese Patent Application Laid-Open No. 4-259543) relates to a method for manufacturing a laminated board for printed circuit that is less warped and twisted and has excellent dimensional stability. Patent Document 2 discloses that the longitudinal and lateral tensile strength ratios of the glass woven fabric used for the surface layer are controlled by controlling the longitudinal and lateral tensile strength ratios of the glass nonwoven fabric used for the intermediate layer. It is described that a balance between both directions is to be achieved.

  Patent Document 3 (Japanese Patent Laid-Open No. 2008-258335) describes that warpage of a semiconductor package can be effectively prevented by using a buildup layer in which a fiber base material is unevenly distributed in the thickness direction. Has been.

JP 62-292428 A JP-A-4-259543 JP 2008-258335 A

  However, as the circuit board is further reduced in thickness, the warpage of the laminate has become more prominent. Further, with the increase in the warp of the laminated plate, the increase in the warp of the circuit board and the increase in the warp of the semiconductor package resulting therefrom have become more prominent.

Although the techniques of Patent Documents 1, 2, and 3 were effective in solving the warpage of the laminated board, the development of a laminated board with further reduced warpage is desired as the circuit board is further reduced in thickness. It was.
This invention is made | formed in view of the above subjects, and makes it a subject to provide the laminated board with which curvature was reduced and suitable as a thin circuit board.

According to the present invention,
A plurality of prepregs comprising a fiber base layer and a resin layer are laminated so that the prepregs are in direct contact with each other, and are laminated plates used for a core layer of a circuit board,
In the stacking direction,
The distance between the center line of the first fiber base layer arranged closest to one surface and the center line of the second fiber base layer adjacent to the first fiber base layer is D1,
The distance between the center line of the third fiber base layer arranged closest to the other surface and the center line of the fourth fiber base layer adjacent to the third fiber base layer is D2,
The thickness of the laminate is D3,
The number of fiber base layers of the laminate is n (where n is an integer of 2 or more. When the number n of the fiber base layers is 2, the first fiber base layer and the fourth fiber) The base material layer, the second fiber base material layer, and the third fiber base material layer represent the same fiber base material layer.When the number of the fiber base material layers is 3, the second fiber base material When the material layer and the fourth fiber base layer show the same fiber base layer),
Satisfy both the conditions of the following formulas (1) and (2),
The resin layer includes an inorganic filler,
Content of the said inorganic filler in the said resin layer is 20 mass% or more and 80 mass% or less with respect to the said whole resin layer,
The laminate is provided with a laminate that does not include a build-up layer.
D3 / n <D1 (1)
D3 / n <D2 (2)

Furthermore, according to the present invention,
The laminate in the present invention;
The buildup layer including a fifth fiber base layer provided on at least one surface of the laminate,
With
In the stacking direction,
The distance between the one surface of the laminate and the center line of the fifth fiber base layer included in the buildup layer is D6,
When the distance between the surface of the buildup layer and the center line of the fifth fiber base layer is D7, a laminate with a buildup layer that satisfies D6> D7 is provided.
Furthermore, according to the present invention,
There is provided a circuit board including the laminate according to the present invention or the laminate with a buildup layer .

Furthermore, according to the present invention,
A semiconductor package is provided in which a semiconductor element is mounted on the circuit board according to the present invention.

Furthermore, according to the present invention,
A plurality of prepregs comprising a fiber base layer and a resin layer are laminated, and a method for producing a laminate used for a core layer of a circuit board,
A first step of preparing a plurality of prepregs including a prepreg in which the fiber base material layer is unevenly distributed in the thickness direction;
In the stacking direction,
The distance between the center line of the first fiber base layer arranged closest to one surface and the center line of the second fiber base layer adjacent to the first fiber base layer is D1,
The distance between the center line of the third fiber base layer arranged closest to the other surface and the center line of the fourth fiber base layer adjacent to the third fiber base layer is D2,
The thickness of the laminate is D3,
The number of fiber base layers of the laminate is n (where n is an integer of 2 or more. When the number n of the fiber base layers is 2, the first fiber base layer and the fourth fiber) The base material layer, the second fiber base material layer, and the third fiber base material layer represent the same fiber base material layer.When the number of the fiber base material layers is 3, the second fiber base material When the material layer and the fourth fiber base layer show the same fiber base layer),
A second step of superimposing the plurality of prepregs so as to satisfy both of the following formulas (1) and (2):
D3 / n <D1 (1)
D3 / n <D2 (2)
A third step of forming the plurality of superimposed prepregs;
Have
The resin layer includes an inorganic filler,
Content of the said inorganic filler in the said resin layer is 20 mass% or more and 80 mass% or less with respect to the said whole resin layer,
The laminate is provided with a method for producing a laminate, which does not include a build-up layer.

  According to the present invention, since the fiber base material layer is arranged outside the laminate, the expansion stress moves to the center of the laminate, so that the warpage is reduced and a laminate suitable for a thin circuit board is provided. be able to.

The above-described object and other objects, features, and advantages will become more apparent from the preferred embodiments described below and the accompanying drawings.
It is sectional drawing which shows the structure of the laminated board in this embodiment. It is sectional drawing which shows the manufacturing process of the laminated board in this embodiment. It is sectional drawing which shows the manufacturing method of the prepreg in this embodiment. It is sectional drawing which shows the structure of the laminated sheet with metal foil in this embodiment. It is sectional drawing which shows the structure of the laminated board with a buildup layer in this embodiment. It is sectional drawing which shows the structure of the buildup layer in this embodiment. It is sectional drawing which shows the structure of the circuit board in this embodiment. It is sectional drawing which shows the structure of the circuit board with a soldering resist layer in this embodiment. It is sectional drawing which shows the structure of the soldering resist layer in this embodiment. It is sectional drawing which shows the structure of the semiconductor package in this embodiment. It is sectional drawing which shows the structure of the laminated board in this embodiment. It is sectional drawing which shows the manufacturing process of the laminated board in this embodiment. It is sectional drawing which shows the structure of the laminated board in this embodiment. It is sectional drawing which shows the manufacturing process of the laminated board in this embodiment. It is sectional drawing which shows the manufacturing process of the laminated board in this embodiment. It is sectional drawing which shows the manufacturing process of the laminated board in this embodiment. It is sectional drawing which shows the manufacturing method of the prepreg in this embodiment. It is sectional drawing which shows the manufacturing method of the prepreg in this embodiment. It is sectional drawing which shows the manufacturing method of the prepreg in this embodiment.

  Embodiments of the present invention will be described below with reference to the drawings. In all the drawings, similar constituent elements are denoted by common reference numerals, and description thereof is omitted as appropriate.

FIG. 13 is a cross-sectional view showing the configuration of the laminated plate 100c in the present embodiment. The laminate in the present embodiment is a laminate in which a plurality of prepregs including a fiber base layer and a resin layer are laminated, and a wiring layer is formed on the upper part or a buildup layer is formed. In the direction, the distance between the center line A1 of the first fiber base layer 101 disposed closest to the one surface 110 and the center line A3 of the second fiber base layer 101a adjacent to the first fiber base layer 101 D1 and the center line A2 of the third fiber base layer 105 disposed closest to the other surface 111 and the center line A4 of the fourth fiber base layer 105a adjacent to the third fiber base layer 105 When the distance is D2, the thickness of the laminate is D3, and the number of fiber base layers in the laminate is n (where n is an integer of 2 or more), the following formula (1) And (2) so that both conditions are satisfied. Layer is disposed.
D3 / n <D1 (1)
D3 / n <D2 (2)

Further, in order to more effectively obtain the effect of preventing the warp of the laminate, the distance between one surface 110 of the laminate and the center line A1 of the first fiber base layer 101 is D4, and the other surface 111 When the distance between the first fiber base layer 105 and the center line A2 of the third fiber base layer 105 is D5, the respective fiber base layers are arranged so as to satisfy both of the following formulas (3) and (4): It is preferable.
D4 <D1 (3)
D5 <D2 (4)

  The number n of the fiber base layers included in the laminated board in the present embodiment is not particularly limited, but may be 2 or more, preferably 2 or more and 6 or less, and more preferably 2 or more and 4 or less. When the number of the fiber base layers is within the above range, the balance between mechanical strength and productivity is particularly excellent, and a laminated board suitable for a thin circuit board can be obtained.

  Moreover, in order to obtain the effect of preventing warpage of the laminate more effectively, it is preferable that all the fiber base layers in the laminate are arranged symmetrically with respect to the center line B1 of the laminate.

  The thickness of the laminated board in this embodiment is preferably 0.025 mm or more and 0.6 mm or less. More preferably, it is 0.04 mm or more and 0.4 mm or less, More preferably, it is 0.06 mm or more and 0.3 mm or less, Especially preferably, it is 0.08 mm or more and 0.2 mm or less. When the thickness of the laminate is within the above range, the balance between mechanical strength and productivity is particularly excellent, and a laminate suitable for a thin circuit board can be obtained.

  The linear expansion coefficient in the plane direction of the laminate in the present embodiment is 1 ppm / ° C. or more and 20 ppm / ° C. or less, preferably 2 ppm / ° C. or more and 15 ppm / ° C. or less, more preferably 2 ppm / ° C. or more and 8 ppm / ° C. or less. . When the linear expansion coefficient of the laminate is within the above range, it is possible to more effectively obtain warpage suppression and temperature cycle reliability improvement of a circuit board on which a wiring pattern is formed and a semiconductor package on which a semiconductor element is mounted. Improvement of temperature cycle reliability with the mother board when the package is secondarily mounted can be obtained more effectively. In addition, unless otherwise indicated, the linear expansion coefficient of this embodiment represents the average value of the linear expansion coefficient in the region of 50 ° C. or higher and 150 ° C. or lower.

<Embodiment (A)>
Hereinafter, the embodiment (A) will be described.
In the embodiment (A), the number n of the fiber base layers included in the laminate is 2. When the number n of the fiber base layers is 2, the first fiber base layer 101 and the fourth fiber base layer 105a, and the second fiber base layer 101a and the third fiber base layer 105 are respectively The same fiber base layer is shown. Therefore, hereinafter, only the first fiber base layer 101 and the third fiber base layer 105 will be described.

(Laminated board)
First, the structure of the laminated board in this embodiment is demonstrated.
FIG. 1 is a cross-sectional view showing a configuration of a laminated plate 100a in the present embodiment. The laminated plate 100a includes a first prepreg 104 including a first fiber base layer 101, a first resin layer 102, and a second resin layer 103, a third fiber base layer 105, a third resin layer 106, and a fourth. The second prepreg 108 including the resin layer 107 is obtained by being laminated so that the first fiber base layer 101 and the third fiber base layer 105 are arranged outside in the stacking direction.
At this time, “disposed on the outside” means that the distance between the center line A1 of the first fiber base layer 101 and the center line A2 of the third fiber base layer 105 is D1, as shown in FIG. When the thickness of the laminate is D3, it means that the first fiber base layer 101 and the third fiber base layer 105 are arranged so as to satisfy D3 / 2 <D1.
Further, in order to more effectively obtain the effect of preventing the warping of the laminated plate, the distance D4 between one surface 110 of the laminated plate and the center line A1 of the first fiber base layer 101, and the other surface 111 When the distance D5 is set to the center line A2 of the third fiber base layer 105, it is preferably arranged so as to further satisfy the conditions of D4 <D1 and D5 <D1.

In order to more effectively obtain the effect of preventing warping of the laminate, the first fiber base layer 101 and the third fiber base layer 105 are arranged symmetrically with respect to the center line B1 of the laminate. It is preferable.
As described above, by disposing the fiber base layer on the outer side of the laminated board, the warpage of the laminated board can be reduced by moving the expansion stress to the center of the laminated board.

(Laminate production method)
Below, the manufacturing method of the laminated board 100a in this embodiment is demonstrated. FIG. 2A and FIG. 2B are cross-sectional views showing the manufacturing process of the laminate in the present embodiment.

First, a first prepreg 104 including a first fiber base layer 101, a first resin layer 102, and a second resin layer 103, a third fiber base layer 105, a third resin layer 106, and a fourth resin layer 107. A second prepreg 108 is prepared.
The first resin layer 102 is thicker than the second resin layer 103, and the third resin layer 106 is thicker than the fourth resin layer 107. To do. That is, in both the first prepreg 104 and the second prepreg 108, the first fiber base layer 101 and the third fiber base layer 105 are unevenly distributed in the thickness direction. Hereinafter, the prepreg in which the fiber base material is unevenly distributed is referred to as an asymmetric prepreg. In addition, the manufacturing method of a prepreg is mentioned later.

Next, as shown in FIG. 2 (a), the first prepreg 104 and the first prepreg 104 are arranged so that the first fiber base layer 101 and the third fiber base layer 105 are disposed outside in the prepreg laminating direction. Two prepregs 108 are overlapped.
At this time, “disposed on the outside” means that the distance between the center line A1 of the first fiber base layer 101 and the center line A2 of the third fiber base layer 105 is D1, as shown in FIG. When the thickness of the laminate is D3, it means that the first fiber base layer 101 and the third fiber base layer 105 are arranged so as to satisfy D3 / 2 <D1.
In order to more effectively obtain the effect of preventing the warp of the laminate, as shown in FIG. 1, a distance D4 between one surface 110 of the laminate and the center line A1 of the first fiber base layer 101 is shown. When the distance D5 between the other surface 111 and the center line A2 of the third fiber base material layer 105 is set, it is preferably arranged so as to further satisfy the conditions of D4 <D1 and D5 <D1.
In order to more effectively obtain the effect of preventing warping of the laminate, the first fiber base layer 101 and the third fiber base layer 105 are placed on the center line B1 of the laminate as shown in FIG. They are preferably arranged symmetrically with respect to each other.

  The laminating method is not particularly limited, but may be, for example, a batch type, and the first prepreg and the second prepreg are continuously supplied and continuously using a vacuum laminating apparatus, a vacuum becquerel apparatus, or the like. May be laminated.

  Finally, the first prepreg 104 and the second prepreg 108 superposed as described above are molded by heating and pressurization, whereby a laminated plate 100a in the present embodiment as shown in FIG. 2B is obtained.

  Although it does not specifically limit as said heat-processing method, For example, it can implement using a hot-air drying apparatus, an infrared heating apparatus, a heating roll apparatus, a flat platen hot-plate press apparatus, etc. When a hot-air drying device or an infrared heating device is used, the bonding can be carried out without substantially applying pressure to the joined ones. Moreover, when using a heating roll apparatus or a flat hot platen press apparatus, it can implement by making predetermined | prescribed pressure act on the said joined thing.

  The temperature during the heat treatment is not particularly limited, but it is preferably a temperature range in which the resin used melts and the resin curing reaction does not proceed rapidly. For example, the heating temperature is preferably 120 ° C. or higher and 250 ° C. or lower, and more preferably 150 ° C. or higher and 230 ° C. or lower.

In addition, since the time for the heat treatment varies depending on the type of resin used and the like, it is not particularly limited. For example, the heat treatment can be performed by treating for 30 minutes or more and 180 minutes or less.
Moreover, the pressure to pressurize is not particularly limited, but is preferably 0.2 MPa or more and 5 MPa or less, and more preferably 2 MPa or more and 4 MPa or less.

(Manufacturing method of prepreg)
Below, the manufacturing method of the prepreg which comprises the laminated board 100a in this embodiment is demonstrated.
The prepreg included in the laminate 100a is a sheet-like material including a fiber base layer and a resin layer, which is obtained by impregnating a fiber base with one or more resin compositions and then semi-curing the fiber base. A sheet-like material having such a structure is preferable because it is excellent in various properties such as dielectric properties, mechanical and electrical connection reliability under high temperature and high humidity, and suitable for manufacturing a laminated board for a circuit board.

  The method for impregnating the fiber base material with the resin composition used in the present embodiment is not particularly limited. For example, the resin composition is dissolved in a solvent to prepare a resin varnish, and the fiber base material is immersed in the resin varnish. The method, the method of apply | coating with various coaters, the method of spraying by a spray, the method of laminating the resin layer with a support base material, etc. are mentioned. Among these, the method of immersing the fiber base material in the resin varnish is preferable. Thereby, the impregnation property of the resin composition with respect to the fiber base material can be improved. In addition, when a fiber base material is immersed in a resin varnish, a normal impregnation coating equipment can be used.

  In particular, when the thickness of the fiber substrate is 0.1 mm or less, a method of laminating with a film-like resin layer from both sides of the fiber substrate is preferable. Thereby, the impregnation amount of the resin composition with respect to the fiber base material can be freely adjusted, and the moldability of the prepreg can be further improved. In addition, when laminating a film-like resin layer, it is more preferable to use a vacuum laminating apparatus or the like.

Specifically, examples of the method for producing the prepreg include the following methods.
FIG. 3 is a cross-sectional view showing a method for producing a prepreg. Here, the carrier material 5a, 5b is manufactured in advance, and after laminating the carrier material 5a, 5b on the fiber base material 11, a method of peeling the carrier film will be specifically described.

A carrier material 5a in which the first resin composition is previously applied to the carrier film and a carrier material 5b in which the second resin composition is applied to the carrier film are manufactured. Next, using the vacuum laminating apparatus 60, the carrier materials 5a and 5b are overlapped from both sides of the fiber base material under reduced pressure, and bonded with a laminating roll 61 heated to a temperature at which the resin composition melts as necessary, The fiber base material 11 is impregnated with the resin composition coated on the carrier film. By bonding under reduced pressure, even if there is an unfilled portion inside the fiber base material 11 or at the joint portion between the resin layer of the carrier material 5a, 5b and the fiber base material 11, this is reduced by a vacuum void or substantially It can be a vacuum void.
As another device for joining the fiber base material 11 and the carrier materials 5a and 5b under such a reduced pressure, for example, a vacuum box device, a vacuum becquerel device, or the like can be used.

  Next, after bonding the fiber base material 11 and the carrier materials 5a and 5b, heat treatment is performed at a temperature equal to or higher than the melting temperature of the resin applied to the carrier material by the hot air drying device 62. Thereby, the decompression void etc. which have occurred in the joining process under reduced pressure can be almost eliminated. As another method for heat treatment, for example, an infrared heating device, a heating roll device, a plate-shaped hot platen pressing device, or the like can be used.

After laminating the carrier materials 5a and 5b to the fiber substrate 11, the carrier film is peeled off. By this method, the resin composition is supported on the fiber base material 11, and the prepreg 21 in which the fiber base material 11 is built is obtained.
If said method is used, the prepreg in which the fiber base material layer was unevenly distributed in the thickness direction can be produced by adjusting the thickness of the resin layer of the carrier materials 5a and 5b.

  In addition to the above method, the method described in paragraphs 0022 to 0041 of Reference Document 1 (Japanese Patent Laid-Open No. 2010-275337) can be used. This will be specifically described below with reference to FIG.

  The fiber base material 3 is conveyed so as to pass between the two die coaters to a coating machine provided with the first coating device 1a and the second coating device 1b, which are two die coaters, on both sides thereof. The resin varnish 4 is applied on each side. The first coating apparatus 1a and the second coating apparatus 1b may use the same die coater or different ones. Moreover, as shown in FIG. 18, the 1st coating apparatus 1a and the 2nd coating apparatus 1b may use a roll coater. Moreover, although it is preferable that the coating distance L and the tip overlap distance D have a certain distance as shown in FIGS. 17 and 18, they may not have a certain distance as shown in FIG. .

  Each of the first coating device 1 a and the second coating device 1 b has a coating tip 2, and each coating tip 2 is elongated in the width direction of the fiber substrate 3. And the 1st coating front-end | tip part 2a which is a coating front-end | tip part of the 1st coating apparatus 1a protrudes toward one surface of the fiber base material 3, and is the coating front-end | tip part of the 2nd coating apparatus 1b. The 2 coating front-end | tip part 2b protrudes toward the other surface of the fiber base material 3. FIG. Thereby, when the resin varnish 4 is applied, the first coating tip 2a is in contact with one surface of the fiber substrate 3 via the resin varnish 4, and the second coating tip 2b is a fiber base. The other surface of the material 3 comes into contact with the resin varnish 4.

The discharge amount per unit time of the resin varnish 4 discharged from the first coating device 1a and the second coating device 1b may be the same or different. By varying the discharge amount per unit time of the resin varnish, the thickness of the resin varnish 4 to be applied can be individually controlled on one side and the other side of the fiber base 3, and the layer of the resin layer The thickness can be easily adjusted.
A prepreg is manufactured by heating at a predetermined temperature in a dryer to volatilize the solvent of the applied resin varnish 4 and to semi-cur the resin composition.

  In addition, when the fiber base material is immersed in the resin varnish, the solvent used in the resin varnish preferably exhibits good solubility with respect to the resin component in the resin composition. May be used. Examples of the solvent exhibiting good solubility include acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, cellosolve and carbitol.

The thickness of the second resin layer 103 and the fourth resin layer 107 of the asymmetric prepreg is usually preferably 1 μm to 15 μm, and the thickness of the first resin layer 102 and the third resin layer 106 is usually preferably 2.3 μm to 100 μm.
Here, the thickness of the resin layer is a distance from the interface between the fiber base layer and the resin layer to the opposite interface of the resin layer, and does not include the resin impregnated in the fiber base layer.
Further, the ratio (C2 / C1) between the thickness C2 of the second resin layer 103 and the fourth resin layer 107 of the asymmetric prepreg and the thickness C1 of the first resin layer 102 and the third resin layer 106 is 0.1 <C2 / C1. A range of <0.9 is preferable from the viewpoint of facilitating warpage control. The thickness of the resin layer can be measured, for example, by observing a cross section of the prepreg after curing with an optical microscope.

  The solid content of the resin varnish is not particularly limited, but is preferably 40% by weight to 80% by weight, and more preferably 50% by weight to 65% by weight. Thereby, the impregnation property to the fiber base material of the resin varnish can further be improved. A prepreg can be obtained by impregnating a fiber base material with a resin composition and drying at a predetermined temperature, for example, 80 ° C. or more and 200 ° C. or less.

Next, returning to FIG. 1, the material constituting the laminated plate in the present embodiment will be described in detail.
(Fiber substrate layer)
In the present embodiment, the fiber substrate used for the first fiber substrate layer 101 and the third fiber substrate layer 105 is not particularly limited, but a glass fiber substrate such as glass cloth, polybenzoxazole resin fiber, Polyamide resin fibers such as polyamide resin fibers, aromatic polyamide resin fibers, wholly aromatic polyamide resin fibers, polyester resin fibers such as polyester resin fibers, aromatic polyester resin fibers, wholly aromatic polyester resin fibers, polyimide resin fibers, Examples thereof include organic fiber base materials such as synthetic fiber base materials composed mainly of fluororesin fibers, kraft paper, cotton linter paper, paper base materials mainly composed of linter and kraft pulp mixed paper, and the like. Among these, glass cloth is particularly preferable from the viewpoint of strength and water absorption. Moreover, the thermal expansion coefficient of a laminated board can be made still smaller by using a glass cloth.

As a glass fiber base material used in this embodiment, the basis weight (weight of the fiber base material per 1 m ² ) is preferably 4 g / m ² or more and 150 g / m ² or less, more preferably 8 g / m ² or more and 110 g. / M ² or less, more preferably 12 g / m ² or more and 60 g / m ² or less, further preferably 12 g / m ² or more and 30 g / m ² or less, and particularly preferably 12 g / m ² or more and 24 g / m ² or less. ² or less.

  When the basis weight is not more than the above upper limit value, the impregnation property of the resin composition in the fiber base material is improved, and the occurrence of strand voids and a decrease in insulation reliability can be suppressed. In addition, it is possible to easily form a through hole by a laser such as carbon dioxide, UV, or excimer. Moreover, the intensity | strength of a glass fiber base material or a laminated board can be improved as basic weight is more than the said lower limit. As a result, handling properties can be improved, prepreg can be easily produced, and reduction in the warpage reduction effect of the substrate can be suppressed.

  Among the glass fiber substrates, a glass fiber substrate having a linear expansion coefficient of 6 ppm / ° C. or less is preferable, and a glass fiber substrate having 3.5 ppm / ° C. or less is more preferable. By using the glass fiber base material having such a linear expansion coefficient, it is possible to further suppress the warpage of the laminated board of the present embodiment.

  Furthermore, the fiber base material used in the present embodiment preferably has a Young's modulus of 60 GPa to 100 GPa, more preferably 65 GPa to 92 GPa, and still more preferably 86 GPa to 92 GPa. By using a glass fiber base material having such a Young's modulus, for example, deformation of the wiring board due to reflow heat during semiconductor mounting can be effectively suppressed, so that the connection reliability of electronic components is further improved.

  Moreover, the glass fiber base material used in the present embodiment preferably has a dielectric constant at 1 MHz of 3.8 to 7.0, more preferably 3.8 to 6.8, and even more preferably 3. .8 or more and 5.5 or less. By using a glass fiber substrate having such a dielectric constant, the dielectric constant of the laminate can be further reduced, which is suitable for a semiconductor package using a high-speed signal.

  For example, E glass, S glass, NE glass, T glass, UN glass, and quartz glass are preferably used as the glass fiber substrate having the above-described linear expansion coefficient, Young's modulus, and dielectric constant.

  The first fiber base layer 101 and the third fiber base layer 105 in the laminated plate 100a are the first resin layer 102 and the second resin layer 103, and the third resin layer 106 and the fourth resin. Although the resin composition constituting the layer 107 is impregnated with each other, the thickness of the fiber base layer can usually be considered as the thickness of the fiber base.

  Although the thickness of a fiber base material layer is not specifically limited, Preferably it is 5 micrometers or more and 100 micrometers or less, More preferably, they are 10 micrometers or more and 60 micrometers or less, More preferably, they are 12 micrometers or more and 35 micrometers or less. By using the fiber base material having such a thickness, the handling property at the time of manufacturing the prepreg is further improved, and the warp reduction effect is particularly remarkable.

  When the thickness of the fiber base material layer is not more than the above upper limit, the impregnation property of the resin composition in the fiber base material can be improved, and the occurrence of a decrease in strand voids and insulation reliability can be suppressed. In addition, it is possible to easily form a through hole by a laser such as carbon dioxide, UV, or excimer. Moreover, the intensity | strength of a fiber base material or a prepreg can be improved as the thickness of a fiber base material layer is more than the said lower limit. As a result, handling properties can be improved, prepreg can be easily produced, and reduction in the warpage reduction effect of the substrate can be suppressed.

The number of fiber base materials used is not limited to one, and a plurality of thin fiber base materials can be used in an overlapping manner. In addition, when using a plurality of fiber base materials in piles, the total thickness only needs to satisfy the above range.
The first fiber base layer 101 and the third fiber base layer 105 in the laminated plate 100a may be the same or different.

  Laminate 100a has a fiber substrate layer formed by impregnating a resin composition into a fiber substrate such as a glass fiber substrate, thereby being excellent in low linear expansion coefficient and high elastic modulus, a thin multilayer wiring board, A semiconductor package in which a semiconductor chip is mounted on a multilayer wiring board can be obtained with less warping and excellent heat resistance and thermal shock reliability. Among them, high strength, low water absorption, and low thermal expansion can be achieved by having a fiber base layer formed by impregnating a glass fiber base with a resin composition.

(Resin composition)
The resin composition impregnated into the fiber base material is not particularly limited, but preferably has a low linear expansion coefficient and a high elastic modulus and is excellent in thermal shock reliability. It is preferable that the resin composition contains a thermosetting resin.

(Thermosetting resin)
Although it does not specifically limit as a thermosetting resin, It is preferable that it has a low linear expansion coefficient and a high elasticity modulus, and is excellent in the reliability of thermal shock property.
The glass transition temperature of the thermosetting resin is preferably 160 ° C. or higher and 350 ° C. or lower, more preferably 180 ° C. or higher and 300 ° C. or lower. By using a thermosetting resin having such a glass transition temperature, the effect of further improving the lead-free solder reflow heat resistance can be obtained.

Specific thermosetting resins include, for example, novolac type phenolic resins such as phenol novolak resin, cresol novolak resin, bisphenol A novolak resin, unmodified resole phenolic resin, oil modified resole modified with tung oil, linseed oil, walnut oil, etc. Phenol resin such as phenolic resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, bisphenol M type epoxy resin, bisphenol P type epoxy resin, bisphenol Bisphenol type epoxy resin such as Z type epoxy resin, novolak type epoxy resin such as phenol novolac type epoxy resin, cresol novolac type epoxy resin, biffe Type epoxy resin, biphenyl aralkyl type epoxy resin, aryl alkylene type epoxy resin, naphthalene type epoxy resin, anthracene type epoxy resin, phenoxy type epoxy resin, dicyclopentadiene type epoxy resin, norbornene type epoxy resin, adamantane type epoxy resin, fluorene Type epoxy resin, epoxy resin, urea (urea) resin, resin having triazine ring such as melamine resin, unsaturated polyester resin, bismaleimide resin, polyurethane resin, diallyl phthalate resin, silicone resin, resin having benzoxazine ring, Examples include cyanate resin, polyimide resin, polyamideimide resin, and benzocyclobutene resin.
One of these may be used alone, two or more having different weight average molecular weights may be used in combination, and one or two or more thereof and a prepolymer thereof may be used in combination.

  Among these, cyanate resins (including prepolymers of cyanate resins) are particularly preferable. By using cyanate resin, the thermal expansion coefficient of a laminated board can be made small. Further, the cyanate resin is excellent in electrical characteristics (low dielectric constant, low dielectric loss tangent), mechanical strength, and the like.

  Examples of the cyanate resin that can be used include those obtained by reacting a cyanogen halide compound with phenols, and those obtained by prepolymerization by a method such as heating as required. Specifically, bisphenol cyanate resins such as novolac type cyanate resin, bisphenol A type cyanate resin, bisphenol E type cyanate resin, tetramethylbisphenol F type cyanate resin, naphthol aralkyl type polyvalent naphthols, and cyanogen halides Cyanate resin, dicyclopentadiene-type cyanate resin, biphenylalkyl-type cyanate resin, and the like obtained by the above reaction. Among these, novolac type cyanate resin is preferable. By using the novolac type cyanate resin, the crosslink density is increased and the heat resistance is improved. Therefore, the flame retardancy of the laminate can be improved.

The reason for this is that the novolak cyanate resin forms a triazine ring after the curing reaction. Furthermore, it is considered that novolak-type cyanate resin has a high benzene ring ratio due to its structure and is easily carbonized. Even when the thickness of the laminate is 0.6 mm or less, the laminate including the resin layer produced by curing the novolac-type cyanate resin has excellent rigidity. Since such a laminated board is excellent in the rigidity at the time of a heating, it is excellent also in the reliability at the time of semiconductor element mounting.
As a novolak-type cyanate resin, what is shown by the following general formula (I) can be used, for example.

  The average repeating unit n of the novolak type cyanate resin represented by the general formula (I) is an arbitrary integer. Although the minimum of n is not specifically limited, 1 or more are preferable and 2 or more are more preferable. When n is not less than the above lower limit, the heat resistance of the novolak-type cyanate resin is improved, and it is possible to suppress desorption and volatilization of the low monomer during heating. The upper limit of n is not particularly limited, but is preferably 10 or less, and more preferably 7 or less. It can suppress that a melt viscosity becomes it high that n is below the said upper limit, and can suppress that the moldability of a resin layer falls.

  As the cyanate resin, a naphthol type cyanate resin represented by the following general formula (II) is also preferably used. The naphthol type cyanate resin represented by the following general formula (II) includes, for example, naphthols such as α-naphthol and β-naphthol, p-xylylene glycol, α, α′-dimethoxy-p-xylene, 1,4- It is obtained by condensing naphthol aralkyl resin obtained by reaction with di (2-hydroxy-2-propyl) benzene and cyanic acid. In the general formula (II), n is preferably 10 or less. When n is 10 or less, the resin viscosity does not increase, the impregnation property to the fiber base material is good, and there is a tendency not to deteriorate the performance as a laminate. In addition, intramolecular polymerization hardly occurs at the time of synthesis, the liquid separation property at the time of washing with water tends to be improved, and the decrease in yield tends to be prevented.

（式中、Ｒは水素原子またはメチル基を示し、ｎは１以上の整数を示す。）

(In the formula, R represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more.)

  As the cyanate resin, a dicyclopentadiene type cyanate resin represented by the following general formula (III) is also preferably used. In the dicyclopentadiene type cyanate resin represented by the following general formula (III), n in the following general formula (III) is preferably 0 or more and 8 or less. When n is 8 or less, the resin viscosity does not increase, the impregnation property to the fiber base material is good, and the performance as a laminated plate can be prevented from being lowered. Moreover, by using a dicyclopentadiene type cyanate resin, it is excellent in low hygroscopicity and chemical resistance.

（ｎは０以上８以下の整数を示す。）

(N represents an integer of 0 or more and 8 or less.)

Although the minimum of the weight average molecular weight (Mw) of cyanate resin is not specifically limited, Mw500 or more is preferable and Mw600 or more is more preferable. When Mw is equal to or higher than the lower limit, it is possible to suppress the occurrence of tackiness when the resin layer is produced, and to suppress the adhesion between the resin layers or the transfer of the resin when the resin layers come into contact with each other. it can. The upper limit of Mw is not particularly limited, but is preferably Mw 4,500 or less, and more preferably Mw 3,000 or less. Moreover, when Mw is not more than the above upper limit value, it is possible to suppress the reaction from being accelerated, and in the case of a circuit board, it is possible to suppress the occurrence of molding defects and the decrease in interlayer peel strength.
Mw such as cyanate resin can be measured by, for example, GPC (gel permeation chromatography, standard substance: converted to polystyrene).

  Moreover, cyanate resin may be used individually by 1 type, may use together 2 or more types which have different Mw, and may use 1 type, or 2 or more types, and those prepolymers together.

  The content of the thermosetting resin contained in the resin composition is not particularly limited as long as it is appropriately adjusted according to the purpose, but is preferably 5% by mass or more and 90% by mass or less based on the entire resin composition, 10 mass% or more and 80 mass% or less are more preferable, and 20 mass% or more and 50 mass% or less are especially preferable. When the content of the thermosetting resin is not less than the above lower limit value, handling properties are improved, and it becomes easy to form a resin layer. When the content of the thermosetting resin is less than or equal to the above upper limit, the strength and flame retardancy of the resin layer are improved, or the linear expansion coefficient of the resin layer is reduced and the effect of reducing the warpage of the laminate is improved. There is a case.

  In addition to using cyanate resin (particularly novolak-type cyanate resin, naphthol-type cyanate resin, dicyclopentadiene-type cyanate resin) as a thermosetting resin, an epoxy resin (substantially free of halogen atoms) may be used, You may use together. Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, bisphenol M type epoxy resin, bisphenol P type epoxy resin, bisphenol Z type epoxy resin and the like. Type epoxy resin, phenol novolac type epoxy resin, novolac type epoxy resin such as cresol novolac type epoxy resin, arylphenyl type epoxy resin such as biphenyl type epoxy resin, xylylene type epoxy resin, biphenyl aralkyl type epoxy resin, naphthol type epoxy resin, Naphthalenediol type epoxy resin, bifunctional or tetrafunctional epoxy type naphthalene resin, naphthylene ether type epoxy resin, binaphthyl type epoxy resin Naphthalene-type epoxy resins such as xylene resin, naphthalene-aralkyl-type epoxy resin, anthracene-type epoxy resin, phenoxy-type epoxy resin, dicyclopentadiene-type epoxy resin, norbornene-type epoxy resin, adamantane-type epoxy resin, fluorene-type epoxy resin, etc. .

  As an epoxy resin, one of these may be used alone, or two or more having different weight average molecular weights may be used in combination, or one or two or more and those prepolymers may be used in combination. May be.

  Among these epoxy resins, aryl alkylene type epoxy resins are particularly preferable. Thereby, moisture-absorbing solder heat resistance and flame retardance can be further improved.

  The aryl alkylene type epoxy resin refers to an epoxy resin having one or more aryl alkylene groups in a repeating unit. For example, a xylylene type epoxy resin, a biphenyl dimethylene type epoxy resin, etc. are mentioned. Among these, a biphenyl dimethylene type epoxy resin is preferable. A biphenyl dimethylene type | mold epoxy resin can be shown, for example with the following general formula (IV).

  The average repeating unit n of the biphenyl dimethylene type epoxy resin represented by the general formula (IV) is an arbitrary integer. Although the minimum of n is not specifically limited, 1 or more are preferable and 2 or more are more preferable. When n is not less than the above lower limit, crystallization of the biphenyldimethylene type epoxy resin can be suppressed and the solubility in a general-purpose solvent is improved, so that handling becomes easy. The upper limit of n is not particularly limited, but is preferably 10 or less, and more preferably 5 or less. When n is less than or equal to the above upper limit, the fluidity of the resin is improved and the occurrence of molding defects and the like can be suppressed.

  As the epoxy resin other than the above, a novolak type epoxy resin having a condensed ring aromatic hydrocarbon structure is preferable. Thereby, heat resistance and low thermal expansibility can further be improved.

  The novolak type epoxy resin having a condensed ring aromatic hydrocarbon structure is a novolak type epoxy resin having a naphthalene, anthracene, phenanthrene, tetracene, chrysene, pyrene, triphenylene, and tetraphen or other condensed ring aromatic hydrocarbon structure. . The novolac type epoxy resin having a condensed ring aromatic hydrocarbon structure is excellent in low thermal expansion because a plurality of aromatic rings can be regularly arranged. Moreover, since the glass transition temperature is also high, it is excellent in heat resistance. Furthermore, since the molecular weight of the repeating structure is large, it is superior in flame retardancy compared to conventional novolak type epoxies, and the weakness of cyanate resin can be improved by combining with cyanate resin. Therefore, when used in combination with a cyanate resin, the glass transition temperature is further increased, so that the lead-free compatible mounting reliability is excellent.

  The novolak-type epoxy resin having a condensed ring aromatic hydrocarbon structure is obtained by epoxidizing a novolak-type phenol resin synthesized from a phenol compound, a formaldehyde compound, and a condensed ring aromatic hydrocarbon compound.

  The phenol compound is not particularly limited, but examples thereof include cresols such as phenol, o-cresol, m-cresol, and p-cresol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2, 6-xylenol, 3,4-xylenol, xylenols such as 3,5-xylenol, trimethylphenols such as 2,3,5 trimethylphenol, ethyl such as o-ethylphenol, m-ethylphenol, p-ethylphenol Phenols, alkylphenols such as isopropylphenol, butylphenol, t-butylphenol, o-phenylphenol, m-phenylphenol, p-phenylphenol, catechol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene , Naphthalenediols such as 2,7-dihydroxynaphthalene, polyphenols such as resorcin, catechol, hydroquinone, pyrogallol and fluoroglucin, and alkyl polyphenols such as alkylresorcin, alkylcatechol and alkylhydroquinone. . Of these, phenol is preferable from the viewpoint of cost and the effect on the decomposition reaction.

  The aldehyde compound is not particularly limited, and examples thereof include formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural, glyoxal, n-butyraldehyde, caproaldehyde, allylaldehyde, Examples include benzaldehyde, crotonaldehyde, acrolein, tetraoxymethylene, phenylacetaldehyde, o-tolualdehyde, salicylaldehyde, dihydroxybenzaldehyde, trihydroxybenzaldehyde, 4-hydroxy-3-methoxyaldehyde paraformaldehyde and the like.

  Although the condensed ring aromatic hydrocarbon compound is not particularly limited, for example, naphthalene derivatives such as methoxynaphthalene and butoxynaphthalene, anthracene derivatives such as methoxyanthracene, phenanthrene derivatives such as methoxyphenanthrene, other tetracene derivatives, chrysene derivatives, pyrene derivatives, Derivatives such as triphenylene and tetraphen derivatives are mentioned.

  The novolak type epoxy resin having a condensed ring aromatic hydrocarbon structure is not particularly limited. For example, methoxynaphthalene-modified ortho-cresol novolak epoxy resin, butoxynaphthalene-modified meta (para) cresol novolak epoxy resin, and methoxynaphthalene-modified novolak epoxy resin Etc. Among these, a novolac type epoxy resin having a condensed ring aromatic hydrocarbon structure represented by the following formula (V) is preferable.

(In the formula, Ar is a condensed ring aromatic hydrocarbon group. R may be the same or different from each other, and is a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, a halogen element, a phenyl group, A group selected from an aryl group such as a benzyl group and an organic group containing a glycidyl ether, n, p and q are integers of 1 or more, and the values of p and q may be the same for each repeating unit, May be different.)

(Ar in formula (V) is a structure represented by (Ar1) to (Ar4) in formula (VI). R in formula (VI) may be the same or different from each other. It is often a group selected from a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms or a halogen element, an aryl group such as a phenyl group and a benzyl group, and an organic group including glycidyl ether.)

  Further, as the epoxy resin other than the above, naphthalene type epoxy resins such as naphthol type epoxy resin, naphthalene diol type epoxy resin, bifunctional or tetrafunctional epoxy type naphthalene resin, naphthylene ether type epoxy resin and the like are preferable. Thereby, heat resistance and low thermal expansibility can further be improved. In addition, since the naphthalene ring has a higher π-π stacking effect than a benzene ring, it is particularly excellent in low thermal expansion and low thermal shrinkage. Furthermore, since the polycyclic structure has a high rigidity effect and the glass transition temperature is particularly high, the heat shrinkage change before and after reflow is small. As a naphthol type epoxy resin, for example, the following general formula (VII-1), as a naphthalene diol type epoxy resin, the following formula (VII-2), as a bifunctional or tetrafunctional epoxy type naphthalene resin, the following formula (VII-3): As (VII-4) (VII-5) and a naphthylene ether type epoxy resin, it can show by the following general formula (VII-6), for example.

（ｎは平均１以上６以下の数を示し、Ｒはグリシジル基または炭素数１以上１０以下の炭化水素基を示す。）

(N represents an average number of 1 to 6, and R represents a glycidyl group or a hydrocarbon group having 1 to 10 carbon atoms.)

（式中、Ｒ^１は水素原子またはメチル基を表す。Ｒ^２はそれぞれ独立的に水素原子、炭素原子数１〜４のアルキル基、アラルキル基、ナフタレン基、またはグリシジルエーテル基含有ナフタレン基を表す。ｏおよびｍはそれぞれ０〜２の整数であって、かつｏまたはｍのいずれか一方は１以上である。）

(In the formula, R ¹ represents a hydrogen atom or a methyl group. R ² each independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an aralkyl group, a naphthalene group, or a glycidyl ether group-containing naphthalene group. O and m are each an integer of 0 to 2, and either o or m is 1 or more.)

  Although the minimum of content of an epoxy resin is not specifically limited, 1 mass% or more is preferable in the whole resin composition, and 2 mass% or more is more preferable. When the content is not less than the above lower limit, the reactivity of the cyanate resin is improved, and the moisture resistance of the resulting product can be improved. Although the upper limit of content of an epoxy resin is not specifically limited, 55 mass% or less is preferable and 40 mass% or less is more preferable. Heat resistance can be improved more as content is below the said upper limit.

  Although the minimum of the weight average molecular weight (Mw) of an epoxy resin is not specifically limited, Mw500 or more are preferable and Mw800 or more are more preferable. It can suppress that tackiness arises in a resin layer as Mw is more than the said lower limit. The upper limit of Mw is not particularly limited, but is preferably Mw 20,000 or less, and more preferably Mw 15,000 or less. When Mw is not more than the above upper limit, the impregnation property to the fiber base material is improved at the time of producing the prepreg, and a more uniform product can be obtained. The Mw of the epoxy resin can be measured by GPC, for example.

  Cyanate resins (especially novolac-type cyanate resins, naphthol-type cyanate resins, dicyclopentadiene-type cyanate resins) and epoxy resins (arylalkylene-type epoxy resins, especially biphenyldimethylene-type epoxy resins, condensed ring aromatic hydrocarbons) In the case of using a novolak type epoxy resin or a naphthol type epoxy resin having a structure, it is preferable to use a phenol resin. Examples of the phenol resin include novolac type phenol resins, resol type phenol resins, aryl alkylene type phenol resins, and the like. As a phenol resin, one of these may be used alone, two or more having different weight average molecular weights may be used in combination, and one or two or more thereof and a prepolymer thereof may be used in combination. May be. Among these, aryl alkylene type phenol resins are particularly preferable. Thereby, moisture absorption solder heat resistance can be improved further.

  Examples of the aryl alkylene type phenol resin include a xylylene type phenol resin and a biphenyl dimethylene type phenol resin. A biphenyl dimethylene type phenol resin can be shown by the following general formula (VIII), for example.

  The repeating unit n of the biphenyl dimethylene type phenol resin represented by the general formula (VIII) is an arbitrary integer. Although the minimum of n is not specifically limited, 1 or more are preferable and 2 or more are more preferable. Heat resistance can be improved more as n is more than the said lower limit. The upper limit of the repeating unit n is not particularly limited, but is preferably 12 or less, and more preferably 8 or less. When n is not more than the above upper limit value, compatibility with other resins is improved, and workability can be improved.

  Cyanate resin (especially novolac-type cyanate resin, naphthol-type cyanate resin, dicyclopentadiene-type cyanate resin) and epoxy resin (arylalkylene-type epoxy resin, especially biphenyldimethylene-type epoxy resin, condensed ring aromatic hydrocarbon structure) A combination of a novolac type epoxy resin or a naphthol type epoxy resin) and an arylalkylene type phenol resin can control the crosslinking density and easily control the reactivity.

  Although the minimum of content of a phenol resin is not specifically limited, 1 mass% or more is preferable in the whole resin composition, and 5 mass% or more is more preferable. Heat resistance can be improved as content of a phenol resin is more than the said lower limit. Moreover, especially the upper limit of content of a phenol resin is although it is not limited, 55 mass% or less is preferable in the whole resin composition, and 40 mass% or less is more preferable. When the content of the phenol resin is not more than the above upper limit value, the characteristics of low thermal expansion can be improved.

  Although the minimum of the weight average molecular weight (Mw) of a phenol resin is not specifically limited, Mw400 or more is preferable and especially Mw500 or more is preferable. It can suppress that tackiness arises in a resin layer as Mw is more than the said lower limit. Moreover, although the upper limit of Mw of a phenol resin is not specifically limited, Mw18,000 or less is preferable and Mw15,000 or less is more preferable. When Mw is not more than the above upper limit value, the impregnation property to the fiber base material is improved at the time of producing the prepreg, and a more uniform product can be obtained. The Mw of the phenol resin can be measured by GPC, for example.

  Furthermore, cyanate resins (especially novolac-type cyanate resins, naphthol-type cyanate resins, dicyclopentadiene-type cyanate resins), phenol resins (arylalkylene-type phenol resins, especially biphenyldimethylene-type phenol resins), and epoxy resins (arylalkylene-type epoxy resins) In particular, when a board (particularly a circuit board) is produced using a combination with a biphenyldimethylene type epoxy resin, a novolak type epoxy resin having a condensed ring aromatic hydrocarbon structure, or a naphthol type epoxy resin), it has excellent dimensional stability. Sex can be obtained.

  Moreover, it is preferable that a resin composition contains an inorganic filler. Thereby, even if the laminated board is made thinner, it is possible to impart even better strength. Furthermore, the low thermal expansion of the laminate can be further improved.

(Inorganic filler)
Examples of inorganic fillers include silicates such as talc, calcined clay, unfired clay, mica and glass, oxides such as titanium oxide, alumina, boehmite, silica and fused silica, calcium carbonate, magnesium carbonate and hydrotalcite. Carbonates such as, hydroxides such as aluminum hydroxide, magnesium hydroxide, calcium hydroxide, sulfates or sulfites such as barium sulfate, calcium sulfate, calcium sulfite, zinc borate, barium metaborate, aluminum borate, Examples thereof include borates such as calcium borate and sodium borate, nitrides such as aluminum nitride, boron nitride, silicon nitride and carbon nitride, titanates such as strontium titanate and barium titanate.

  As the inorganic filler, one of these may be used alone, or two or more may be used in combination. Among these, silica is particularly preferable, and fused silica is preferable in terms of excellent low thermal expansion. The fused silica has a crushed shape and a spherical shape. In order to ensure high filling of the inorganic filler and impregnation of the fiber base material, it is possible to adopt a usage method suitable for the purpose, such as using spherical silica to lower the melt viscosity of the resin composition. .

Although the minimum of the average particle diameter of an inorganic filler is not specifically limited, 0.01 micrometer or more is preferable and 0.1 micrometer or more is more preferable. It can suppress that the viscosity of a varnish becomes high as the particle size of an inorganic filler is more than the said lower limit, and can improve workability | operativity at the time of prepreg preparation. The upper limit of the average particle diameter is not particularly limited, but is preferably 5.0 μm or less, and more preferably 2.0 μm or less. When the particle size of the inorganic filler is not more than the above upper limit, phenomena such as sedimentation of the filler in the varnish can be suppressed, and a more uniform resin layer can be obtained. In addition, when the L / S of the conductor circuit of the inner layer substrate is less than 20/20 μm, it is possible to suppress the influence on the insulation between the wirings.
The average particle size of the inorganic filler is measured, for example, by measuring the particle size distribution of the particles on a volume basis using a laser diffraction type particle size distribution analyzer (manufactured by HORIBA, LA-500), and the median diameter (D ₅₀ ) is determined as the average particle size. And

  The inorganic filler is not particularly limited, but an inorganic filler having a monodispersed average particle diameter may be used, or an inorganic filler having a polydispersed average particle diameter may be used. Furthermore, one type or two or more types of inorganic fillers having an average particle size of monodispersed and / or polydispersed may be used in combination.

  The inorganic filler is preferably spherical silica having an average particle size of 5.0 μm or less, and more preferably spherical silica having an average particle size of 0.01 μm or more and 2.0 μm or less. Thereby, the filling property of an inorganic filler can further be improved.

  Although content of an inorganic filler is not specifically limited, 20 to 80 weight% is preferable based on the whole resin composition, and 30 to 75 weight% is more preferable. When the content is within the above range, particularly low thermal expansion and low water absorption can be achieved.

  The resin composition used in the present embodiment can also contain a rubber component, and for example, rubber particles can be used. Preferable examples of the rubber particles include core-shell type rubber particles, crosslinked acrylonitrile butadiene rubber particles, crosslinked styrene butadiene rubber particles, acrylic rubber particles, and silicone particles.

The core-shell type rubber particle is a rubber particle having a core layer and a shell layer. For example, the outer shell layer is made of a glassy polymer, the inner core layer is made of a rubbery polymer, or the outer shell layer is made of a glassy polymer, and the intermediate layer is made of a rubbery polymer. And a three-layer structure in which the core layer is composed of a glassy polymer.
The glassy polymer layer is made of, for example, a polymer of methyl methacrylate, and the rubbery polymer layer is made of, for example, a butyl acrylate polymer (butyl rubber). Specific examples of the core-shell type rubber particles include Staphyloid AC3832, AC3816N (trade names, manufactured by Ganz Kasei Co., Ltd.), and Metabrene KW-4426 (trade names, manufactured by Mitsubishi Rayon Co., Ltd.). Specific examples of the crosslinked acrylonitrile butadiene rubber (NBR) particles include XER-91 (average particle size: 0.5 μm, manufactured by JSR).

  Specific examples of the crosslinked styrene butadiene rubber (SBR) particles include XSK-500 (average particle size 0.5 μm, manufactured by JSR). Specific examples of the acrylic rubber particles include methabrene W300A (average particle size 0.1 μm), W450A (average particle size 0.2 μm) (manufactured by Mitsubishi Rayon Co., Ltd.), and the like.

  The silicone particles are not particularly limited as long as they are rubber elastic fine particles formed of organopolysiloxane. For example, fine particles made of silicone rubber (organopolysiloxane crosslinked elastomer) itself and a core portion made of silicone mainly composed of two-dimensional crosslinks. Examples thereof include core-shell structure particles coated with silicone mainly composed of a three-dimensional crosslinking type. As silicone rubber fine particles, commercially available products such as KMP-605, KMP-600, KMP-597, KMP-594 (manufactured by Shin-Etsu Chemical Co., Ltd.), Trefil E-500, Trefil E-600 (manufactured by Toray Dow Corning), etc. Can be used.

  The content of the rubber particles is not particularly limited, but is preferably 20% by weight or more and 80% by weight or less, more preferably 30% by weight or more and 75% by weight or less based on the entire resin composition, including the above inorganic fillers. . When the content is within the range, particularly low water absorption can be achieved.

(Other additives)
In addition, additives such as a coupling agent, a curing accelerator, a curing agent, a thermoplastic resin, and an organic filler can be appropriately blended in the resin composition as necessary. The resin composition used in the present embodiment can be suitably used in a liquid form in which the above components are dissolved and / or dispersed with an organic solvent or the like.

  By using the coupling agent, the wettability of the interface between the thermosetting resin and the inorganic filler is improved, and the resin composition can be uniformly fixed to the fiber substrate. Therefore, it is preferable to use a coupling agent, and heat resistance, particularly solder heat resistance after moisture absorption can be improved.

  As the coupling agent, any of those usually used as a coupling agent can be used. Specifically, an epoxy silane coupling agent, a cationic silane coupling agent, an aminosilane coupling agent, a titanate coupling agent, and silicone. It is preferable to use one or more coupling agents selected from oil-type coupling agents. Thereby, the wettability with the interface of an inorganic filler can be made high, and thereby heat resistance can be improved more.

  The lower limit of the addition amount of the coupling agent is not particularly limited because it depends on the specific surface area of the filler, but is preferably 0.05 parts by mass or more, more preferably 0.1 parts by mass or more with respect to 100 parts by mass of the filler. . A filler can fully be coat | covered as content of a coupling agent is more than the said lower limit, and heat resistance can be improved. Moreover, especially the upper limit of addition amount is although it is not limited, 3 mass parts or less are preferable and 2 mass parts or less are more preferable. When the content is not more than the above upper limit value, it is possible to suppress the influence on the reaction, and it is possible to suppress a decrease in bending strength and the like.

  A well-known thing can be used as a hardening accelerator. For example, organic metal salts such as zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), trisacetylacetonate cobalt (III), triethylamine, tributylamine, diazabicyclo [2, 2,2] tertiary amines such as octane, 2-phenyl-4-methylimidazole, 2-ethyl-4-ethylimidazole, 2-phenyl-4-ethylimidazole, 2-phenyl-4-methyl-5-hydroxy Onium salt compounds such as imidazoles such as imidazole and 2-phenyl-4,5-dihydroxyimidazole, phenolic compounds such as phenol, bisphenol A and nonylphenol, and organic acids such as acetic acid, benzoic acid, salicylic acid and paratoluenesulfonic acid. , Or a mixture thereof. As the curing accelerator, one kind including these derivatives may be used alone, or two or more kinds including these derivatives may be used in combination.

  The onium salt compound is not particularly limited, and for example, an onium salt compound represented by the following general formula (IX) can be used.

(Wherein P is a phosphorus atom, R 1, R 2, R 3 and R 4 are each an organic group having a substituted or unsubstituted aromatic ring or heterocyclic ring, or a substituted or unsubstituted aliphatic group, and are identical to each other. A ⁻ represents an anion of an n (n ≧ 1) -valent proton donor having at least one proton that can be released outside the molecule, or a complex anion thereof.

  Although content of a hardening accelerator is not specifically limited, 0.01 to 5 weight% of the whole resin composition is preferable, and 0.1 to 2 weight% is more preferable. When the content is not less than the above lower limit, the effect of promoting curing can be sufficiently exerted. The preservability of a prepreg can be improved more as content is below the said upper limit.

  The resin composition in the present embodiment includes a phenoxy resin, a polyimide resin, a polyamideimide resin, a polyphenylene oxide resin, a polyethersulfone resin, a polyester resin, a polyethylene resin, a thermoplastic resin such as a polystyrene resin, a styrene-butadiene copolymer, and styrene. -Polystyrene thermoplastic elastomers such as isoprene copolymers, thermoplastic elastomers such as polyolefin thermoplastic elastomers, polyamide elastomers and polyester elastomers, dienes such as polybutadiene, epoxy-modified polybutadiene, acrylic-modified polybutadiene, and methacryl-modified polybutadiene An elastomer may be further used in combination.

  Examples of the phenoxy resin include a phenoxy resin having a bisphenol skeleton, a phenoxy resin having a naphthalene skeleton, a phenoxy resin having an anthracene skeleton, and a phenoxy resin having a biphenyl skeleton. A phenoxy resin having a structure having a plurality of these skeletons can also be used.

Among these, it is preferable to use a phenoxy resin having a biphenyl skeleton and a bisphenol S skeleton as the phenoxy resin. The rigidity of the biphenyl skeleton can increase the glass transition temperature of the phenoxy resin, and the presence of the bisphenol S skeleton can improve the adhesion between the phenoxy resin and the metal. As a result, the heat resistance of the laminate can be improved, and the adhesion of the wiring layer to the laminate can be improved when the circuit board is manufactured. It is also preferable to use a phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton as the phenoxy resin. Thereby, the adhesiveness to the laminated board of a wiring layer can further be improved at the time of manufacture of a circuit board.
It is also preferable to use a phenoxy resin having a bisphenolacetophenone structure represented by the following general formula (X).

(In the formula, R1 may be the same or different, and is a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms or a group selected from halogen elements, and R2 is a hydrogen atom, 1 carbon atom) And a group selected from a hydrocarbon group having 10 or less or a halogen element, R3 is a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, and m is an integer of 0 to 5.

  Since the phenoxy resin containing a bisphenol acetophenone structure has a bulky structure, it is excellent in solvent solubility and compatibility with the thermosetting resin component to be blended. Moreover, since a uniform rough surface can be formed with low roughness, the fine wiring formability is excellent.

  The phenoxy resin having a bisphenol acetophenone structure can be synthesized by a known method such as a method in which an epoxy resin and a phenol resin are polymerized with a catalyst.

  The phenoxy resin having a bisphenol acetophenone structure may contain a structure other than the bisphenol acetophenone structure of the general formula (X), and the structure is not particularly limited, but bisphenol A type, bisphenol F type, bisphenol S type, biphenyl Type, phenol novolac type, cresol novolac type structure and the like. Among them, those containing a biphenyl structure are preferable because of their high glass transition temperature.

  The content of the bisphenol acetophenone structure of the general formula (X) in the phenoxy resin containing a bisphenol acetophenone structure is not particularly limited, but is preferably 5 mol% to 95 mol%, more preferably 10 mol% to 85 mol%. Or less, more preferably 15 mol% or more and 75 mol% or less. The effect which improves heat resistance and moisture-proof reliability can fully be exhibited as content is more than the said lower limit. Moreover, solvent solubility can be improved as content is below the said upper limit.

  The weight average molecular weight (Mw) of the phenoxy resin is not particularly limited, but is preferably from 5,000 to 100,000, more preferably from 10,000 to 70,000, still more preferably from 20,000 to 50,000. When Mw is not more than the above upper limit, compatibility with other resins and solubility in a solvent can be improved. When it is at least the above lower limit, the film-forming property is improved, and it is possible to suppress the occurrence of problems when used for manufacturing a circuit board.

  The content of the phenoxy resin is not particularly limited, but is preferably 0.5% by mass or more and 40% by mass or less, and more preferably 1% by mass or more and 20% by mass or less of the resin composition excluding the filler. When the content is equal to or higher than the lower limit, it is possible to suppress a decrease in mechanical strength of the insulating resin layer and a decrease in plating adhesion with the conductor circuit. When it is not more than the above upper limit value, an increase in the thermal expansion coefficient of the insulating layer can be suppressed, and the heat resistance can be lowered.

  If necessary, additives other than the above components such as pigments, dyes, antifoaming agents, leveling agents, ultraviolet absorbers, foaming agents, antioxidants, flame retardants, and ion scavengers may be added to the resin composition. May be.

  Examples of pigments include kaolin, synthetic iron oxide red, cadmium yellow, nickel titanium yellow, strontium yellow, hydrous chromium oxide, chromium oxide, cobalt aluminate, synthetic ultramarine blue and other inorganic pigments, phthalocyanine polycyclic pigments, azo pigments, etc. Etc.

  Examples of the dye include isoindolinone, isoindoline, quinophthalone, xanthene, diketopyrrolopyrrole, perylene, perinone, anthraquinone, indigoid, oxazine, quinacridone, benzimidazolone, violanthrone, phthalocyanine, and azomethine.

(Laminated plate with metal foil)
It continues and demonstrates the laminated sheet 200 with a metal foil in this embodiment.
The laminated board 100a in this embodiment is good also as the laminated board 200 with a metal foil as shown in FIG. 4 by which the metal foil 201 was formed in the at least single side | surface.
The thickness of the metal foil is preferably 1 μm or more and 18 μm or less. More preferably, it is 2 μm or more and 12 μm or less. When the thickness of the metal foil 201 is within the above range, a fine pattern can be formed and the laminate can be thinned.

  Examples of the metal constituting the metal foil 201 include copper and copper alloys, aluminum and aluminum alloys, silver and silver alloys, gold and gold alloys, zinc and zinc alloys, nickel and nickel alloys, tin and tin. Fe-Ni type alloys such as iron-based alloys, iron and iron-based alloys, Kovar (trade name), 42 alloy, Invar or Super Invar, W or Mo, and the like. Also, an electrolytic copper foil with a carrier can be used.

  Moreover, you may laminate | stack a film on the at least single side | surface of the laminated board 100a in this embodiment instead of the metal foil 201. FIG. Examples of the film include polyethylene, polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyimide, and fluorine resin.

As a manufacturing method of the laminated board 200 with metal foil, it is as follows, for example. In the case of a laminate obtained by laminating two prepregs, metal foil is stacked on the upper and lower surfaces or one side of the outer sides of the laminated first prepreg and second prepreg, and a high vacuum condition is applied using a laminator device or a becquerel device. Join them together. Alternatively, the metal foil is laminated on the upper and lower surfaces or one surface outside the first prepreg and the second prepreg as they are.
Next, a laminated plate can be obtained by heating and pressurizing a prepreg and a metal foil or the like with a vacuum press or heating with a dryer.

(Laminated board with build-up layer)
It continues and demonstrates the laminated board 300 with a buildup layer in this embodiment.
As shown in FIG. 5, the laminated plate 100 a may further include a buildup layer 303 including a fifth fiber base layer 301 and a resin layer on an upper portion of at least one surface 110 of the laminated plate. Here, although the 5th fiber base material layer 301 does not need to be included, the prevention effect of the curvature of the laminated board 300 with a buildup layer will increase when the 5th fiber base material layer 301 is included.

Further, at this time, in order to more effectively obtain the effect of preventing warpage of the laminate 300 with the buildup layer, as shown in FIG. 6, the one surface 110 and the fifth fiber base layer 301 are arranged in the stacking direction. When the distance between the center line A5 of D5 is D6 and the distance between the surface 310 of the buildup layer and the centerline A5 of the fifth fiber base layer is D7, the buildup layer 303 satisfies the condition of D6> D7. Are preferably laminated.
The method for laminating the buildup layer 303 is not particularly limited, but may be the same method as the laminating method for the laminated plate 100a or another method.
The material used for the buildup layer 303 is not particularly limited, but the material used for the laminated plate 100a may be used as appropriate, or another material may be used.

  The manufacturing method of the buildup layer 303 is not particularly limited, but may be the same manufacturing method as the first prepreg 104 or the second prepreg 108 in this embodiment, or may be another manufacturing method. .

(Circuit board)
Next, the circuit board 400 in this embodiment will be described.
The laminated plate 100a can be used for a circuit board 400 as shown in FIG. A method for manufacturing the circuit board 400 is not particularly limited, and examples thereof include the following methods.

  A through hole 405 for interlayer connection is formed in the laminate 200 with metal foil formed by the above method, and a wiring layer 401 is manufactured by a subtractive method, a semi-additive method, or the like. Thereafter, an optional buildup layer 303 is laminated, and the steps of interlayer connection and circuit formation by an additive method are repeated to manufacture the circuit board 400. Here, some or all of the buildup layers may or may not include a fiber base layer.

(Circuit board with solder resist layer)
Next, the circuit board 500 with a solder resist layer in the present embodiment will be described.
As shown in FIG. 8, the circuit board 400 has a sixth fiber base layer 501 and a resin layer on at least one surface 110 of the circuit board (the surface 310 of the buildup layer when a buildup layer is formed). A solder resist layer 503 may be further formed. Here, the sixth fiber base layer 501 may not be included, but if the sixth fiber base layer 501 is included, the effect of preventing warpage of the circuit board 500 with the solder resist layer is enhanced.

  At this time, in order to more effectively obtain the warp prevention effect of the circuit board 500 with the solder resist layer, as shown in FIG. 9, one surface 110 (build-up layer is formed in the stacking direction). In this case, the distance between the surface 310) of the build-up layer and the center line A6 of the sixth fiber base layer 501 is D8, and the distance between the surface 510 of the solder resist layer and the center line A6 of the sixth fiber base layer 501 is When D9, the solder resist layer 503 is preferably laminated so as to satisfy the condition of D8> D9.

  The method for laminating the solder resist layer 503 is not particularly limited, but may be the same method as the laminating method of the laminated plate 100a or the buildup layer 303 in this embodiment, or another method.

  The material used for the solder resist layer 503 is not particularly limited, but the material used for the laminated plate 100a or the buildup layer 303 in this embodiment may be used as appropriate, or another material may be used. .

  The method for producing the solder resist layer 503 is not particularly limited, but may be the same production method as the first prepreg 104, the second prepreg 108, or the buildup layer 303 in this embodiment, or another production method. It may be a method.

(Semiconductor package)
Furthermore, the semiconductor package 600 as shown in FIG. 10 can be manufactured by mounting the semiconductor element 601 on the circuit board 500 in the present embodiment. Although the semiconductor package 600 in this embodiment is not specifically limited, For example, it has the laminated board 100a with the metal foil processed circuit, the buildup layer 303, the soldering resist layer 503, and the semiconductor element 601.

  A method for manufacturing the semiconductor package 600 is not particularly limited, and examples thereof include the following methods. The semiconductor element 601 is mounted on the upper part of the laminated board 100a having a circuit processed with the solder resist layer 503. At this time, the semiconductor element 601 and the wiring layer 401 are bonded to each other by the bump 603 in the via hole 403. Thereafter, underfilling is performed by the underfill 605. In this way, a semiconductor package can be obtained.

  As described above, according to this embodiment, a laminated plate 100a with reduced warpage is provided. In particular, even when a thin laminated plate is used, the occurrence of warpage can be effectively suppressed. And the circuit board using the laminated board 100a is excellent in mechanical characteristics, such as curvature and dimensional stability, and a moldability. Therefore, the laminated board 100a can be suitably used for applications that require reliability, such as printed wiring boards that require high density and high multilayer.

  In the laminated plate 100a, the occurrence of warpage is reduced also in the above-described circuit processing and the subsequent processes. Therefore, the semiconductor package 600 according to this embodiment is less likely to warp and crack, and can be thinned.

Moreover, as shown in FIGS. 11-16, between the 1st prepreg 104 and the 2nd prepreg 108, the several prepreg provided with a fiber base material layer and a resin layer may be laminated | stacked.
In the following embodiment, a description will be given focusing on differences from the embodiment (A).

<Embodiment (B)>
Hereinafter, the embodiment (B) will be described.
In the embodiment (B), the number n of the fiber base layers included in the laminate is 3. According to the present embodiment, the same effect as in the embodiment (A) can be obtained. Furthermore, since the number n of the fiber base layers is larger than that in the embodiment (A), further excellent mechanical strength can be obtained.

In addition, when the number of fiber base material layers is 3, the 2nd fiber base material layer 101a and the 4th fiber base material layer 105a show the same fiber base material layer. Accordingly, the following description will be made using the first fiber base layer 101, the second fiber base layer 101a, and the third fiber base layer 105.
FIG. 11 is a cross-sectional view showing the configuration of the laminated plate 100b in the present embodiment.

  The laminated plate 100b includes a first prepreg 104 including a first fiber base layer 101, a first resin layer 102, and a second resin layer 103, a second fiber base layer 101a, a fifth resin layer 701, and a sixth. A third prepreg 703 including the resin layer 702 and a second prepreg 108 including the third fiber base layer 105, the third resin layer 106, and the fourth resin layer 107 are stacked in this order, and further stacked. In the direction, the first fiber base layer 101 and the third fiber base layer 105 are laminated so as to be arranged on the outside.

At this time, “arranged outside” means that the center line A1 of the first fiber base layer 101 and the second fiber base layer 101a adjacent to the first fiber base layer 101 as shown in FIG. When the distance from the center line A3 is D1 and the distance between the center line A2 of the third fiber base material layer 105 and A3 is D2, both the conditions of D3 / 3 <D1 and D3 / 3 <D2 are satisfied. It means to be arranged.
Further, in order to more effectively obtain the effect of preventing the warp of the laminated plate, it is preferable that the laminated plate is arranged so as to further satisfy the conditions of D4 <D1 and D5 <D2.

  Further, in order to more effectively obtain the effect of preventing warping of the laminate, as shown in FIG. 11, the first fiber substrate layer 101 and the third fiber substrate layer 105 are placed on the center line B1 of the laminate. On the other hand, it is preferable that they are arranged symmetrically, and it is more preferable that the second fiber base material layer 101a further satisfies that it is arranged on the center line B1 of the laminate.

(Laminate production method)
The manufacturing method of the laminated board 100b in this embodiment is demonstrated. FIG. 12A to FIG. 12D are cross-sectional views showing the manufacturing process of the laminated board in the present embodiment.
First, a first prepreg 104 including a first fiber base layer 101, a first resin layer 102, and a second resin layer 103, a second fiber base layer 101a, a fifth resin layer 701, and a sixth resin layer 702. And a second prepreg 108 including a third fiber base layer 105, a third resin layer 106, and a fourth resin layer 107.

  At this time, in the third prepreg 703, the fifth resin layer 701 and the sixth resin layer 702 have the same thickness, and the second fiber base layer 101a is on the center line B2 of the third prepreg 703 with respect to the thickness direction. It is formed so that it may be arranged. Hereinafter, the prepreg in which the fiber base material is disposed on the center line of the prepreg is referred to as a symmetric prepreg. The thicknesses of the fifth resin layer 701 and the sixth resin layer 702 of the symmetric prepreg are usually 1 μm or more and 100 μm or less.

  Next, as shown in FIG. 12A, the first prepreg 104, the first prepreg 104, and the third fiber base layer 105 are arranged outside in the prepreg lamination direction. The three prepregs 703 and the second prepreg 108 are overlapped in this order.

At this time, “arranged outside” means that the center line A1 of the first fiber base layer 101 and the second fiber base layer 101a adjacent to the first fiber base layer 101 as shown in FIG. When the distance from the center line A3 is D1 and the distance between the center line A2 of the third fiber base material layer 105 and A3 is D2, both the conditions of D3 / 3 <D1 and D3 / 3 <D2 are satisfied. It means to be arranged.
Further, in order to more effectively obtain the effect of preventing the warping of the laminated plate, it is preferable that the laminated plate is arranged so as to further satisfy the conditions of D4 <D1 and D5 <D2.

Further, in order to more effectively obtain the effect of preventing warping of the laminate, as shown in FIG. 11, the first fiber substrate layer 101 and the third fiber substrate layer 105 are placed on the center line B1 of the laminate. On the other hand, it is preferable to arrange symmetrically, and it is more preferable to further satisfy that the second fiber base layer 101a is arranged on the center line B1 of the laminate.
In addition, although it does not specifically limit as a lamination | stacking method, For example, the method similar to embodiment (A) can be used.

Finally, by heating and pressurizing the first prepreg 104, the third prepreg 703, and the second prepreg 108 that have been superposed as described above, the laminate in this embodiment as shown in FIG. 100b is obtained.
Moreover, even if symmetrical prepregs having different thicknesses are used as shown in FIG. 12C, a laminated plate 100b2 in the present embodiment as shown in FIG. 12D is obtained.

  In addition, although the material used for the laminated boards 100b and 100b2 in this embodiment is not specifically limited, the material used in Embodiment (A) may be used suitably, and another material may be used. .

  Similarly to the embodiment (A), even when using the laminate 100b in this embodiment, a laminate with metal foil, a laminate with a buildup layer, a circuit board, a laminate with a solder resist layer, and a semiconductor element are manufactured. A mounted semiconductor package can be manufactured.

<Embodiment (C)>
Hereinafter, the embodiment (C) will be described.
In the embodiment (C), the number n of fiber base layers included in the laminate is 4. According to the present embodiment, the same warp reduction effect as in the embodiments (A) and (B) can be obtained. Furthermore, since the number n of the fiber base layers is larger than those in the embodiments (A) and (B), further excellent mechanical strength can be obtained.

  FIG. 13 is a cross-sectional view showing the configuration of the laminated plate 100c in the present embodiment. The laminated plate 100c includes a first prepreg 104 including a first fiber base layer 101, a first resin layer 102, and a second resin layer 103, a second fiber base layer 101a, a fifth resin layer 701, and a sixth. Third prepreg 703 including resin layer 702, fourth prepreg 803 including fourth fiber base layer 105a, seventh resin layer 801, and eighth resin layer 802, third fiber base layer 105, third resin The layer 106 and the second prepreg 108 including the fourth resin layer 107 are laminated in this order, and the first fiber base layer 101 and the third fiber base layer 105 are arranged outside in the stacking direction. Are stacked as shown.

At this time, “arranged outside” means that the center line A1 of the first fiber base layer 101 and the second fiber base layer 101a adjacent to the first fiber base layer 101 as shown in FIG. The distance from the center line A3 is D1, and the distance between the center line A2 of the third fiber base layer 105 and the center line A4 of the fourth fiber base layer 105a adjacent to the third fiber base layer 105 is D2. It means that it arrange | positions so that both conditions of D3 / 4 <D1 and D3 / 4 <D2 may be satisfy | filled.
Further, in order to more effectively obtain the effect of preventing the warp of the laminated plate, it is preferable that the laminated plates are arranged so as to satisfy the conditions of D4 <D1 and D5 <D2.

  In order to more effectively obtain the effect of preventing the warping of the laminated plate, as shown in FIG. 13, the first fiber base layer 101 and the third fiber base layer 105 are arranged with respect to the center line B1 of the laminated plate. The second fiber base layer 101a and the fourth fiber base layer 105a are preferably arranged symmetrically with respect to the center line B1 of the laminated plate. preferable.

(Laminate production method)
The manufacturing method of the laminated board 100c in this embodiment is demonstrated. 14-16 is sectional drawing which shows the manufacturing method of the laminated board in this embodiment.
First, a first prepreg 104 including a first fiber base layer 101, a first resin layer 102, and a second resin layer 103, a second fiber base layer 101a, a fifth resin layer 701, and a sixth resin layer 702. A third prepreg 703, a fourth fiber base layer 105a, a seventh resin layer 801, and a fourth prepreg 803 including an eighth resin layer 802, a third fiber base layer 105, a third resin layer 106, And the 2nd prepreg 108 provided with the 4th resin layer 107 is prepared.
At this time, the first prepreg 104 and the second prepreg 108 are asymmetric prepregs, and the third prepreg 703 and the fourth prepreg 803 are symmetric prepregs.

Next, as shown in FIG. 14A, the first prepreg 104, the first fiber base layer 105, and the third fiber base layer 105 are arranged on the outside in the prepreg stacking direction. The three prepregs 703, the fourth prepreg 803, and the second prepreg 108 are overlapped in this order.
At this time, “arranged outside” means that the center line A1 of the first fiber base layer 101 and the second fiber base layer 101a adjacent to the first fiber base layer 101 as shown in FIG. The distance from the center line A3 is D1, and the distance between the center line A2 of the third fiber base layer 105 and the center line A4 of the fourth fiber base layer 105a adjacent to the third fiber base layer 105 is D2. It means that it arrange | positions so that both conditions of D3 / 4 <D1 and D3 / 4 <D2 may be satisfy | filled.
Further, in order to more effectively obtain the effect of preventing the warping of the laminated plate, it is preferable that the laminated plates are arranged so as to satisfy the conditions of D4 <D1 and D5 <D2.

Further, in order to more effectively obtain the effect of preventing the warp of the laminate, as shown in FIG. 13, the first fiber base layer 101 and the third fiber base layer 105 are placed on the center line B1 of the laminate. On the other hand, it is preferable that the second fiber base material layer 101a and the fourth fiber base material layer 105a are arranged symmetrically with respect to the center line B1 of the laminated plate. Is more preferable.
In addition, it does not specifically limit as a lamination | stacking method, For example, the method similar to embodiment (A) or embodiment (B) can be used.

Finally, the first prepreg 104, the third prepreg 703, the fourth prepreg 803, and the second prepreg 108 that are superposed as described above are molded by heating and pressing, as shown in FIG. The laminated board 100c in this embodiment is obtained.
Moreover, even if symmetrical prepregs having different thicknesses are laminated as shown in FIG. 15A, a laminated plate 100c2 in the present embodiment as shown in FIG. 15B is obtained.
Also, as shown in FIG. 16A, even when four asymmetric prepregs are laminated, a laminated plate 100c3 in the present embodiment as shown in FIG. 16B is obtained.

  In addition, the material used for the laminated plates 100c, 100c2, and 100c3 in this embodiment is not particularly limited, but the material used in the embodiment (A) or (B) may be used as appropriate, or another material. May be used.

  Further, similarly to the embodiment (A) or (B), even when using the laminate 100c in the present embodiment, a laminate with metal foil, a laminate with a buildup layer, a circuit board, a laminate with a solder resist layer, In addition, a semiconductor package on which a semiconductor element is mounted can be manufactured.

  As mentioned above, although embodiment of this invention was described, these are illustrations of this invention and various structures other than the above are also employable. For example, also when the number n of the fiber base material layers contained in a laminated board is five or more, the laminated board in this embodiment can be obtained according to embodiment (A)-(C).

  Hereinafter, although an example and a comparative example explain the present invention, the present invention is not limited to these. In the examples, parts are parts by weight unless otherwise specified. Moreover, the thickness of the layer is represented by an average film thickness.

In the examples and comparative examples, the following raw materials were used.
Epoxy resin A: biphenyl aralkyl type novolak epoxy resin (Nippon Kayaku Co., Ltd., NC-3000)
Epoxy resin B: naphthalene skeleton modified cresol novolac type epoxy resin (DICA, EXA-7320)
Epoxy resin C: naphthalenediol diglycidyl ether (manufactured by DIC, Epicron HP-4032D)
Epoxy resin D: Naphthalene ether type epoxy resin (manufactured by DIC, HP-6000)
Epoxy resin E: Polyfunctional naphthalene type epoxy resin (manufactured by DIC, HP-4750)

Cyanate resin A: Novolac-type cyanate resin (Lonza Japan, Primaset PT-30)
Cyanate resin B: Bisphenol A type cyanate resin (Lonza Japan, Primaset BA230)
Cyanate resin C: p-xylene-modified naphthol aralkyl-type cyanate resin represented by the general formula (II) (naphthol aralkyl-type phenol resin (manufactured by Toto Kasei Co., Ltd., “SN-485”) and cyan chloride)

Phenol resin A: Biphenyl dimethylene type phenol resin (manufactured by Nippon Kayaku Co., Ltd., GPH-103)
Phenolic resin B: Naphthol aralkyl type phenolic resin (Toto Kasei Co., Ltd., SN-485)
Bismaleimide resin A (Kai Kasei Kogyo Co., Ltd., BMI-70)

Phenoxy resin A: Phenoxy resin containing bisphenolacetophenone structure (Synthesis example)
100 g of tetramethylbiphenyl type epoxy resin (“YX-4000” manufactured by Japan Epoxy Resin, epoxy equivalent of 185 g / eq), 80 g of bisphenolacetophenone, and 70 g of cyclohexanone were placed in a reaction vessel having a capacity of 1 L and dissolved by stirring. Next, 0.4 g of a 50 wt% tetramethylammonium chloride solution was added dropwise and reacted at 180 ° C. for 5 hours in a nitrogen atmosphere. After completion of the reaction, the precipitate was filtered, dried in a vacuum dryer at 95 ° C. for 8 hours, and bisphenolacetophenone having a weight average molecular weight of 38,000 represented by the above general formula (X) and a glass transition temperature of 130 ° C. A phenoxy resin containing structure was obtained.

Filler A: Spherical silica (manufactured by Admatechs, SO-32R, average particle size 1 μm)
Filler B: Spherical silica (manufactured by Tokuyama, NSS-5N, average particle size 75 nm)
Filler C: Aluminum hydroxide (manufactured by Showa Denko KK, HP-360)
Filler D: Silicone particles (manufactured by Shin-Etsu Chemical Co., Ltd., KMP600, average particle size 5 μm)

Coupling agent A: γ-glycidoxypropyltrimethoxysilane (GE Toshiba Silicone, A187)
Coupling agent B: Epoxy silane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403E)
Curing catalyst A: phosphorus-based catalyst of an onium salt compound corresponding to the above general formula (IX) (Sumitomo Bakelite Co., Ltd., C05-MB)
Curing catalyst B: Dicyandiamide colorant A: Phthalocyanine blue / Benzimidazolone / Methyl ethyl ketone (= 1/1/8) Mixture: (manufactured by Sanyo Dye)

(Example)
The laminated board in this embodiment was produced using the following procedures.
First, production of a prepreg will be described. The composition of the resin varnish used is shown in Table 1, and the thickness of each layer of the obtained prepregs 1 to 15 is shown in Table 2. In addition, P1 to P15 described in Tables 2 to 4 mean prepreg 1 to prepreg 15, and Unitika described in Table 2 means Unitika Glass Fiber Co., Ltd., and Nittobo Co., Ltd. means Nittobo Co., Ltd. The prepregs 1 to 8 are asymmetric prepregs, and the prepregs 9 to 15 are symmetric prepregs.

(Prepreg 1)
1. Preparation of resin composition varnish A 11.0 parts by weight of biphenyl aralkyl type novolak epoxy resin (Nippon Kayaku Co., Ltd., NC-3000) as epoxy resin A, and biphenyldimethylene type phenol resin (Nippon Kayaku Co., Ltd.) as phenol resin A Made by GPH-103) 8.8 parts by weight, as cyanate resin A novolak-type cyanate resin (Lonza Japan, Primaset PT-30) 16.0 parts by weight, as cyanate resin B bisphenol A type cyanate resin (Lonza Japan) 4.0 parts by weight of Primaset BA230 (manufactured by KK) was dissolved and dispersed in methyl ethyl ketone. Furthermore, 60.0 parts by weight of spherical silica (manufactured by Admatechs, SO-32R, average particle size 1 μm) as filler A and γ-glycidoxypropyltrimethoxysilane (manufactured by GE Toshiba Silicone, Ltd.) as coupling agent A, A187) 0.2 part by weight was added and stirred for 30 minutes using a high-speed stirrer to adjust the non-volatile content to 50% by weight to prepare a resin composition varnish A (resin varnish A). .

2. Production of Carrier Material Resin varnish A is dried on a PET film (polyethylene terephthalate, Teijin DuPont Films Purex film, thickness 36 μm) using a die coater device, resulting in a resin layer thickness of 13.0 μm This was coated and dried for 5 minutes with a drying apparatus at 160 ° C. to obtain a resin sheet A with PET film (carrier material A) for the first resin layer.

  In addition, the resin varnish A was coated on a PET film in the same manner, and dried with a dryer at 160 ° C. for 5 minutes so that the thickness of the resin layer after drying was 7.0 μm. Resin sheet B with PET film (carrier material B) was obtained.

3. Manufacture of prepreg Carrier material A for the first resin layer and carrier material B for the second resin layer are made of a glass fiber substrate (thickness 15 μm, E glass woven fabric manufactured by Unitika Glass Fiber, E02Z 04 53SK, IPC standard 1015 , Linear expansion coefficient: 5.5 ppm / ° C.) on both sides of the resin layer so as to face the fiber base material, impregnated with the resin composition with a vacuum laminator and hot air dryer shown in FIG. Prepreg was obtained.

Specifically, the carrier material A and the carrier material B are overlapped on both surfaces of the glass fiber base so that they are positioned at the center in the width direction of the glass fiber base, respectively, and 9.999 × 10 ⁴ Pa (from normal pressure) Bonding was performed using a laminate roll at 80 ° C. under a reduced pressure of about 750 Torr).

  Here, in the inner region of the width direction dimension of the glass fiber base material, the resin layers of the carrier material A and the carrier material B are respectively bonded to both sides of the glass fiber base material, and the width direction dimension of the glass fiber base material In the outer region, the resin layers of the carrier material A and the carrier material B were joined together.

Next, the bonded product was heated for 2 minutes through a horizontal conveyance type hot air drying apparatus set at 120 ° C. without applying pressure to obtain prepreg 1 (P1).
At this time, the thickness (C1) of the first resin layer is 9 μm, the thickness of the glass fiber base layer is 15 μm, the thickness (C2) of the second resin layer is 3 μm, the total thickness is 27 μm, and C2 / C1 is 0.00. 33. The thickness of the resin layer was measured by cutting out a cross section of the prepreg and observing it with an optical microscope.

(Prepreg 2, 4, 5)
The prepregs 2, 4, and 5 are the same as the prepreg 1 except that the thickness (C1) of the first resin layer, the thickness (C2) of the second resin layer, and the glass fiber base used were changed as shown in Table 2. Produced in the same manner.

(Prepreg 3)
1. Preparation of Varnish B of Resin Composition 12.0 parts by weight of naphthalene skeleton-modified cresol novolac type epoxy resin (DIC, EXA-7320) as epoxy resin B, novolak type cyanate resin (Lonza Japan, Prima) as cyanate resin A Set PT-30) 12.0 parts by weight, phenoxy resin A 5.6 parts by weight of the phenoxy resin containing the bisphenolacetophenone structure prepared as above, phosphorus onium salt compound corresponding to the above general formula (IX) as the curing catalyst A 0.2 parts by weight of a system catalyst (C05-MB, manufactured by Sumitomo Bakelite Co., Ltd.) was dissolved and dispersed in methyl ethyl ketone. Furthermore, 65.0 parts by weight of spherical silica (manufactured by Admatechs, SO-32R, average particle size 1 μm) as filler A, spherical silica (manufactured by Tokuyama, NSS-5N, average particle size 75 nm) 5 as filler B 0.0 part by weight and 0.2 part by weight of γ-glycidoxypropyltrimethoxysilane (GE Toshiba Silicone Co., A187) as a coupling agent A are added and stirred for 30 minutes using a high-speed stirring device. The resin composition was adjusted to have a non-volatile content of 50% by weight to prepare a resin composition varnish B (resin varnish B).

2. Production of Prepreg Prepreg 3 uses resin varnish B obtained above. Table 2 shows the thickness (C1) of the first resin layer, the thickness (C2) of the second resin layer, and the glass fiber base used. It was manufactured in the same manner as prepreg 1 except that

(Prepreg 6)
In the prepreg 6, the thickness (C1) of the first resin layer and the thickness (C2) of the second resin layer were changed as shown in Table 2, and the glass fiber base used was 28 μm thick. It was manufactured in the same manner as prepreg 1 except that it was changed to a cloth, WTX1035-53-X133, IPC standard 1035, linear expansion coefficient: 2.8 ppm / ° C.

(Prepreg 7)
1. Preparation of Varnish C of Resin Composition As epoxy resin A, biphenyl aralkyl type novolak epoxy resin (Nippon Kayaku Co., Ltd., NC-3000) 8.0 parts by weight, as epoxy resin B naphthalene skeleton modified cresol novolak type epoxy resin (DIC Corporation) Manufactured by EXA-7320), 3.0 parts by weight of bismaleimide resin A, 20.0 parts by weight of bismaleimide resin (BMI-70, manufactured by KAI Kasei Kogyo Co., Ltd.), and 3.5 parts by weight of dicyandiamide as curing catalyst B in methyl ethyl ketone. Dissolved and dispersed. Furthermore, 65.0 parts by weight of aluminum hydroxide (manufactured by Showa Denko KK, HP-360) as filler C and 0.5 parts by weight of epoxy silane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403E) as coupling agent B are added. And it stirred for 30 minutes using the high-speed stirring apparatus, it adjusted so that it might become 50 weight% of non volatile matters, and the varnish C (resin varnish C) of the resin composition was prepared.

2. Production of Prepreg The prepreg 7 uses the resin varnish C obtained above, and the thickness (C1) of the first resin layer, the thickness (C2) of the second resin layer, and the glass fiber substrate used are as shown in Table 2. It was manufactured in the same manner as prepreg 1 except that

(Prepreg 8)
1. Preparation of Varnish D of Resin Composition As epoxy resin A, 15.0 parts by weight of biphenylaralkyl type novolac epoxy resin (Nippon Kayaku Co., Ltd., NC-3000), and as epoxy resin B, naphthalene skeleton modified cresol novolak type epoxy resin (DIC Corporation) Manufactured by EXA-7320), 2.0 parts by weight of epoxy resin C, naphthalenediol diglycidyl ether (DIC Corporation, Epicron HP-4032D) by 6.0 parts by weight, and cyanate resin C represented by the general formula (II) -Xylene-modified naphthol aralkyl type cyanate resin (naphthol aralkyl type phenolic resin (manufactured by Toto Kasei Co., Ltd., "SN-485") and cyan chloride reaction product) 16.0 parts by weight, bismaleimide resin A as bismaleimide resin (Kai Kasei) (BMI-70, manufactured by Kogyo Co., Ltd.) As a curing catalyst A, 0.1 part by weight of an onium salt compound phosphorus catalyst (Sumitomo Bakelite Co., Ltd., C05-MB) corresponding to the above general formula (IX) was dissolved and dispersed in methyl ethyl ketone. Furthermore, 40.0 parts by weight of spherical silica (manufactured by Admatechs, SO-32R, average particle size 1 μm) as filler A, and spherical silica (manufactured by Tokuyama, NSS-5N, average particle size 75 nm) 7 as filler B 0.0 part by weight, filler D as silicone particles (Shin-Etsu Chemical Co., Ltd., KMP600, average particle size 5 μm) 7.0 parts by weight and coupling agent B as epoxy silane (Shin-Etsu Chemical Co., Ltd., KBM-403E) 0 .4 parts by weight was added and stirred for 30 minutes using a high-speed stirrer to adjust the non-volatile content to 50% by weight to prepare a resin composition varnish D (resin varnish D).

2. Production of Prepreg The prepreg 8 uses the resin varnish D obtained above. The thickness (C1) of the first resin layer, the thickness (C2) of the second resin layer, and the glass fiber base used are as shown in Table 2. It was manufactured in the same manner as prepreg 1 except that

(Prepreg 9)
1. Preparation of resin composition varnish E 10.8 parts by weight of naphthalene ether type epoxy resin (manufactured by DIC, HP-6000) as epoxy resin D, novolak type cyanate resin (manufactured by Lonza Japan, Primaset PT- as cyanate resin A) 30) 14.0 parts by weight, and 5.0 parts by weight of naphthol aralkyl type phenol resin (manufactured by Toto Kasei Co., Ltd., SN-485) as phenol resin B were dissolved and dispersed in methyl ethyl ketone. Furthermore, 65.0 parts by weight of spherical silica (manufactured by Admatechs, SO-32R, average particle size 1 μm) as filler A, spherical silica (manufactured by Tokuyama, NSS-5N, average particle size 75 nm) 5 as filler B 0.0 part by weight, 0.2 part by weight of γ-glycidoxypropyltrimethoxysilane (GE Toshiba Silicone Co., A187) as a coupling agent A was added and stirred for 30 minutes using a high-speed stirrer. It adjusted so that it might become 50 weight% of non volatile matters, and prepared the varnish E (resin varnish E) of the resin composition.

2. Production of Prepreg The prepreg 9 uses the resin varnish E obtained above, and the thickness (C1) of the first resin layer, the thickness (C2) of the second resin layer, and the glass fiber substrate used are as shown in Table 2. It was manufactured in the same manner as prepreg 1 except that

(Prepreg 10)
1. Preparation of Varnish F of Resin Composition 15.6 parts by weight of polyfunctional naphthalene type epoxy resin (manufactured by DIC, HP-4750) as epoxy resin E, novolak type cyanate resin (manufactured by Lonza Japan, Primaset PT) as cyanate resin A -30) 14.0 parts by weight, 0.2 parts by weight of an onium salt compound phosphorus catalyst (manufactured by Sumitomo Bakelite Co., C05-MB) corresponding to the above general formula (IX) as the curing catalyst A is dissolved and dispersed in methyl ethyl ketone. I let you. Furthermore, 65.0 parts by weight of spherical silica (manufactured by Admatechs, SO-32R, average particle size 1 μm) as filler A, spherical silica (manufactured by Tokuyama, NSS-5N, average particle size 75 nm) 5 as filler B 0.0 part by weight, 0.2 part by weight of γ-glycidoxypropyltrimethoxysilane (GE Toshiba Silicone Co., A187) as a coupling agent A was added and stirred for 30 minutes using a high-speed stirrer. It adjusted so that it might become 50 weight% of non volatile matters, and prepared the resin composition varnish F (resin varnish F).

2. Production of Prepreg The prepreg 10 uses the resin varnish F obtained above, and the thickness (C1) of the first resin layer, the thickness (C2) of the second resin layer, and the glass fiber substrate used are as shown in Table 2. It was manufactured in the same manner as prepreg 1 except that

(Prepreg 11)
The resin varnish A obtained above was impregnated with a glass fiber substrate (thickness 15 μm, E glass woven fabric manufactured by Unitika Glass Fiber, E02Z 04 53SK, IPC standard 1015, linear expansion coefficient: 5.5 ppm / ° C.), The prepreg was obtained by drying in a heating furnace at 150 ° C. for 2 minutes. At this time, the thickness of the glass fiber base layer was 15 μm, the resin layers having the same thickness (6 μm) were provided on both surfaces of the glass fiber base layer, and the total thickness was 27 μm.

(Prepreg 12, 14)
The prepregs 12 and 14 were produced in the same manner as the prepreg 11 except that the thickness of the resin layer and the glass fiber base used were changed as shown in Table 2.

(Prepreg 13)
The prepreg 13 was produced in the same manner as the prepreg 11 except that the resin varnish B obtained above was used and the thickness of the resin layer and the glass fiber substrate used were changed as shown in Table 2.

(Prepreg 15)
In the prepreg 15, the thickness of the resin layer was changed as shown in Table 2, the glass fiber base used was 28 μm thick, T glass woven fabric manufactured by Nittobo Co., Ltd., WTX1035-53-X133, IPC standard 1035, linear expansion coefficient: It was manufactured in the same manner as the prepreg 11 except that it was changed to 2.8 ppm / ° C.

(Prepreg 16)
The prepreg 16 was produced in the same manner as the prepreg 11 except that the resin varnish C obtained above was used and the thickness of the resin layer and the glass fiber substrate used were changed as shown in Table 2.

(Prepreg 17)
The prepreg 17 was produced in the same manner as the prepreg 11 except that the resin varnish D obtained above was used and the thickness of the resin layer and the glass fiber substrate used were changed as shown in Table 2.

  In Examples 1-13 and Comparative Examples 1-9, a laminated board is manufactured using the prepregs 1-17 (in the table, simply described as P1-17), and the circuit board and the laminated board are used. A semiconductor package was manufactured.

Example 1
1. Manufacture of Laminate Sheets Two prepregs 1 (P1) were each peeled from the PET film on both sides and laminated so that the first resin layers face each other, and a 12 μm copper foil ( 3EC-VLP foil manufactured by Mitsui Kinzoku Mining Co., Ltd.) was superposed and heat-pressed at 220 ° C. and 3 MPa for 2 hours to obtain a laminate with metal foil. The thickness of the core layer (part consisting of the laminate) of the obtained laminate with metal foil was 0.054 mm. In addition, the thickness of the prepreg and the resin layer used in the examples and comparative examples hardly changed before and after curing. Therefore, the thickness of the core layer (portion made of the laminated plate) is the total thickness of the prepreg.

2. Manufacture of Build-up Layer 25 parts by weight of novolak type cyanate resin (Lonza Japan, Primaset PT-30) as cyanate resin A, biphenylaralkyl type novolak epoxy resin (manufactured by Nippon Kayaku Co., Ltd., NC-3000) as epoxy resin A 25 parts by weight, 10 parts by weight of a phenoxy resin containing the bisphenolacetophenone structure prepared above as phenoxy resin A, and 0.4 parts by weight of an imidazole compound (manufactured by Shikoku Kasei Kogyo Co., Ltd., 1-benzyl-2-phenylimidazole) as a curing accelerator Was dissolved and dispersed in methyl ethyl ketone. Furthermore, 39.4 parts by weight of spherical silica (manufactured by Admatechs, SO-32R, average particle size 1 μm) as filler A and γ-glycidoxypropyltrimethoxysilane (manufactured by GE Toshiba Silicone, as coupling agent A, A187) 0.2 part by weight was added and stirred for 30 minutes using a high-speed stirrer to adjust the non-volatile content to 50% by weight to prepare a resin composition varnish G (resin varnish G). .

  Resin varnish G is coated on a PET film (polyethylene terephthalate, Teijin DuPont Films Purex film, thickness 36 μm) using a die coater so that the resin layer after drying has a thickness of 22.0 μm. And this was dried for 5 minutes with a 160 degreeC drying apparatus, and the resin sheet C with PET film (carrier material C) for 1st resin layers was obtained.

  In addition, the resin varnish G is coated on the PET film in the same manner, and dried for 5 minutes with a drier at 160 ° C. so that the thickness of the resin layer after drying becomes 11.0 μm. Resin sheet D with PET film (carrier material D) was obtained.

  Carrier material C for the first resin layer and carrier material D for the second resin layer are made of glass fiber substrate (thickness 15 μm, E glass woven fabric manufactured by Unitika Glass Fiber, E02Z 04 53SK, IPC standard 1015, linear expansion (Building coefficient: 5.5 ppm / ° C) The resin layer is placed on both sides so as to face the fiber substrate, and the resin composition is impregnated with the vacuum laminating apparatus and hot air drying apparatus shown in FIG. An up layer A was obtained.

  Specifically, the carrier material C and the carrier material D are overlapped on both surfaces of the glass fiber base so that they are positioned at the center in the width direction of the glass fiber base, respectively, and from the normal pressure, 9.999 × 104 Pa (about 750 Torr) ) Bonding was performed using a laminate roll at 80 ° C. under the reduced pressure.

  Here, in the inner region of the width direction dimension of the glass fiber base material, the resin layers of the carrier material C and the carrier material D are respectively bonded to both sides of the glass fiber base material, and the width direction dimension of the glass fiber base material In the outer region, the resin layers of the carrier material C and the carrier material D were joined together.

  Next, the bonded material was heat-treated without applying pressure by passing it through a horizontal conveyance type hot air dryer set at 120 ° C. for 2 minutes to obtain a buildup layer A.

  At this time, the thickness (C1) of the first resin layer is 18 μm, the thickness of the glass fiber base layer is 15 μm, the thickness (C2) of the second resin layer is 7 μm, the total thickness is 40 μm, and C2 / C1 is 0.00. 39.

3. Production of Solder Resist Layer 25 parts by weight of novolak type cyanate resin (Lonza Japan, Primaset PT-30) as cyanate resin A, biphenyl aralkyl type novolak epoxy resin (Nippon Kayaku, NC-3000) as epoxy resin A 25 parts by weight, 10 parts by weight of a phenoxy resin containing the bisphenolacetophenone structure prepared above as phenoxy resin A, and 0.4 parts by weight of an imidazole compound (manufactured by Shikoku Kasei Kogyo Co., Ltd., 1-benzyl-2-phenylimidazole) as a curing accelerator Was dissolved and dispersed in methyl ethyl ketone. Furthermore, 39 parts by weight of spherical silica (manufactured by Admatechs, SO-32R, average particle size 1 μm) as filler A, and γ-glycidoxypropyltrimethoxysilane (manufactured by GE Toshiba Silicone, A187) as coupling agent A 0.2 part by weight, phthalocyanine blue / benzimidazolone / methyl ethyl ketone (= 1/1/8) mixture as colorant A: (by Sanyo Dye Co., Ltd.) 0.4 part by weight in solid content, high speed stirrer The mixture was stirred for 30 minutes and adjusted to a non-volatile content of 50% by weight to prepare varnish H (resin varnish H) of the resin composition.

  Resin varnish H is coated on a PET film (polyethylene terephthalate, Purex film manufactured by Teijin DuPont Films, thickness 36 μm) using a die coater so that the thickness of the resin layer after drying is 14.0 μm. And this was dried for 5 minutes with a 160 degreeC drying apparatus, and the resin sheet E with PET film (carrier material E) for 1st resin layers was obtained.

  In addition, the resin varnish H was coated on the PET film in the same manner, and dried for 5 minutes with a dryer at 160 ° C. so that the thickness of the resin layer after drying was 9.0 μm. The resin sheet F with PET film (carrier material F) was obtained.

  Carrier material E for the first resin layer and carrier material F for the second resin layer are made of glass fiber substrate (thickness: 15 μm, E glass woven fabric manufactured by Unitika Glass Fiber, E02Z 04 53SK, IPC standard 1015, linear expansion Solder in which the resin layer is disposed on both sides of the coefficient (5.5 ppm / ° C.) so as to face the fiber base material, impregnated with the resin composition by the vacuum laminating apparatus and hot air drying apparatus shown in FIG. A resist layer A was obtained.

  Specifically, the carrier material E and the carrier material F are overlapped on both surfaces of the glass fiber base so as to be positioned at the center in the width direction of the glass fiber base, respectively, and are 9.999 × 104 Pa (about 750 Torr) from normal pressure. ) Bonding was performed using a laminate roll at 80 ° C. under the reduced pressure.

  Here, in the inside region of the width direction dimension of the glass fiber base material, the resin layers of the carrier material E and the carrier material F are respectively bonded to both sides of the glass fiber base material, and the width direction dimension of the glass fiber base material In the outer region, the resin layers of the carrier material E and the carrier material F were joined together.

Next, the joined material was heat-treated without applying pressure by passing it through a horizontal conveyance type hot air drying apparatus set at 120 ° C. for 2 minutes to obtain a solder resist layer A.
At this time, the thickness (C1) of the first resin layer is 10 μm, the thickness of the glass fiber base layer is 15 μm, the thickness (C2) of the second resin layer is 5 μm, the total thickness is 30 μm, and C2 / C1 is 0.00. It was 5.

4). Production of Circuit Board Using the laminated sheet with metal foil obtained above as a core board, on both sides of the inner circuit board on which the circuit pattern was formed (residual copper ratio 70%, L / S = 50/50 μm) The PET film on the first resin layer side of the buildup layer A obtained in step 1 was peeled off and the first resin layer was overlaid. A vacuum pressurizing laminator apparatus was used for vacuum heating and press molding at a temperature of 150 ° C., a pressure of 1 MPa, and a time of 120 seconds. Thereafter, heat curing was performed at 220 ° C. for 60 minutes with a hot air dryer, and the PET film on the second resin layer side was peeled off. Next, blind via holes (non-through holes) were formed by a carbonic acid laser. Next, the inside of the via and the surface of the resin layer were immersed in a swelling liquid at 60 ° C. (Atotech Japan, Swelling Dip Securigant P) for 5 minutes, and further an aqueous potassium permanganate solution at 80 ° C. (Atotech Japan, After being immersed in Concentrate Compact CP) for 10 minutes, it was neutralized and roughened.

  After going through the steps of degreasing, applying a catalyst, and activating this, an electroless copper plating film is formed to about 0.5 μm, a plating resist is formed, and a pattern electroplated copper is formed to 10 μm using the electroless copper plating film as a feeding layer. , L / S = 50/50 μm fine circuit processing was performed. Next, after performing an annealing process at 200 ° C. for 60 minutes with a hot air drying apparatus, the power feeding layer was removed by flash etching.

  Next, the PET film on the first resin layer side of the solder resist layer A obtained above is peeled off and the first resin layer is overlaid, and a vacuum pressure laminator device is used for this, and the temperature is 150 ° C. and the pressure is 1 MPa. Then, vacuum heating and pressure molding was performed for 120 seconds. Thereafter, heat curing was performed at 220 ° C. for 60 minutes with a hot air dryer, and the PET film on the second resin layer side was peeled off. Next, blind via holes (non-through holes) were formed by a carbonic acid laser so that the semiconductor element mounting pads and the like were exposed.

  Finally, on the circuit layer exposed from the solder resist layer A, an electroless nickel plating layer of 3 μm is formed, and further, an electroless gold plating layer of 0.1 μm is formed thereon, and the obtained substrate is formed. A circuit board for a semiconductor package was obtained by cutting into a size of 50 mm × 50 mm.

5. Production of Semiconductor Package A semiconductor element (TEG chip, size 20 mm × 20 mm, thickness 725 μm) having solder bumps was mounted on a circuit board for a semiconductor package by thermocompression bonding using a flip chip bonder device. Next, after melt-bonding the solder bumps in an IR reflow furnace, a liquid sealing resin (manufactured by Sumitomo Bakelite Co., Ltd., CRP-X4800B) was filled and the liquid sealing resin was cured to obtain a semiconductor package. The liquid sealing resin was cured at a temperature of 150 ° C. for 120 minutes. The solder bumps of the semiconductor element used were formed of lead-free solder having a Sn / Ag / Cu composition.

(Examples 2-8, 12, 13)
In Examples 2-8, 12, and 13, a laminate with metal foil, a circuit board, and a semiconductor package were produced in the same manner as in Example 1 except that prepregs 2 to 10 were used.

Example 9
Except for the prepreg 4, the prepreg 14, and the prepreg 4 in this order, the PET films on both sides of the prepreg 4 were peeled off, and a total of three prepregs were laminated so that the first resin layer of the prepreg 4 was in contact with the prepreg 14 side. Produced a laminated sheet with metal foil, a circuit board, and a semiconductor package in the same manner as in Example 1.

(Example 10)
In order of prepreg 4, prepreg 14, prepreg 14, and prepreg 4, the PET films on both sides of prepreg 4 are peeled off, and a total of four prepregs are attached so that the first resin layer of prepreg 4 is in contact with the prepreg 14 side. A laminated board with metal foil, a circuit board, and a semiconductor package were produced in the same manner as in Example 1 except that the lamination was performed.

( Reference Example 1 )
Example 1 except that four prepregs 4 (P4) were each peeled off the PET film on both sides, and a total of four prepregs were laminated so that the first resin layer of the prepreg 4 was directed toward the center of the laminate. Similarly, a laminate with metal foil, a circuit board, and a semiconductor package were manufactured.

(Comparative Examples 1-7)
In Comparative Examples 1 to 7, a laminate with metal foil, a circuit board, and a semiconductor package were manufactured in the same manner as in Example 1 except that each of the two prepregs 11 to 17 was laminated.

(Comparative Examples 8 and 9)
In Comparative Examples 8 and 9, a laminate with metal foil, a circuit board, and a semiconductor package were manufactured in the same manner as in Example 1 except that three and four prepregs 14 were laminated.

  The following evaluation was performed about the laminated board with a metal foil, circuit board, and semiconductor package which were obtained by each Example and the comparative example. Each evaluation is shown below together with the evaluation method. The obtained results are shown in Tables 3 and 4. Table 5 shows the amount of change in substrate warpage between the example and the comparative example ((substrate warpage amount in the comparative example) − (substrate warpage amount in the example)).

(1) Amount of substrate warpage The laminate with metal foil produced in Examples and Comparative Examples was cut at a size of 270 mm x 350 mm near the center, and after peeling off the metal foil with an etching solution, it was cut into 50 mm x 50 mm size at 30 mm intervals. A total of 12 pieces of the substrate warp samples were obtained. The substrate warpage of the obtained sample was measured for the warpage of the substrate at room temperature (25 ° C.) using a temperature variable laser three-dimensional measuring machine (LS200-MT100MT50: manufactured by TETECH).

  The measurement range is 48 mm x 48 mm, the measurement is performed by applying a laser to one side of the substrate, the distance from the laser head is the difference between the farthest point and the nearest point, and the warp amount of each piece. The average of the amount of warpage was taken as the amount of substrate warpage.

(2) Continuity test Three semiconductor packages produced in the examples and comparative examples were measured using a flying checker (1116X-YC Hitester: manufactured by Hioki Electric Co., Ltd.) and the circuit terminals passing between the semiconductor element and the circuit board via the solder bumps. Conductivity was measured and set as the initial value. Next, after treatment for 40 hours at 60 ° C. and 60% moisture absorption, treatment was performed three times in an IR reflow furnace (peak temperature: 260 ° C.), and the continuity was measured in the same manner, and the resistance value was 5% or more from the initial value. The rise was determined to be a disconnection during mounting. Here, when the disconnection has occurred at the initial value, it is determined that it is a malfunction in circuit fabrication and is not counted. In addition, the measurement location was 61 locations per semiconductor package, and a total of 183 locations were measured.
Each code is as follows.
(Double-circle): There was no disconnection location.
○: The disconnection portion was 1 to 10%.
(Triangle | delta): The disconnection location was 11 to 50%.
X: The disconnection location was 51% or more.

(3) Temperature cycle (TC) test Four semiconductor packages prepared in the examples and comparative examples were treated for 40 hours under the conditions of 60 ° C and 60%, and then treated three times in an IR reflow furnace (peak temperature: 260 ° C). And 500 cycles at −55 ° C. (15 minutes) and 125 ° C. (15 minutes) in the atmosphere. Next, using an ultrasonic imaging apparatus (manufactured by Hitachi Construction Machinery Finetech Co., Ltd., FS300), the semiconductor element and the solder bump were observed for abnormalities.
A: No abnormality in both semiconductor element and solder bump.
○: Cracks are seen in a part of the semiconductor element and / or solder bump, but there is no practical problem.
(Triangle | delta): A crack is seen in a part of semiconductor element and / or a solder bump, and there is a problem in practical use.
X: Both the semiconductor element and the solder bump are cracked and cannot be used.

In order to confirm the effect using the laminated board of this embodiment, Table 5 shows the amount of change in substrate warpage in comparison with an example in which the thickness (type) and the number of glass fiber base material layers are equal to each other. . When the thickness and number of the glass fiber base layers are different, the curvature radius of the substrate warpage is different, and as a result, the amount of substrate warpage is different, and it is necessary to unify these when comparing the example and the comparative example.
As can be seen from Table 5, in Examples 1 to 13, the amount of warpage of the substrate was reduced as compared with the comparative example.
Thereby, it became clear that the board | substrate curvature of the laminated board of Examples 1-13 was reduced compared with the laminated board of Comparative Examples 1-9.

  Further, as can be seen from Table 4, in the semiconductor packages obtained in Comparative Examples 1 to 9, the smaller the core layer thickness, the greater the number of disconnection points in the continuity test. The occurrence of cracks in the solder bumps increased and the connection reliability was poor. On the other hand, as can be seen from Table 3, the semiconductor packages obtained in Examples 1 to 13 have no or few disconnections in the continuity test, and further, cracks are generated in the semiconductor elements and solder bumps in the temperature cycle test. There was no or less connection reliability.

Hereinafter, examples of the reference form will be added.
<Appendix>
(Appendix 1)
  A laminate in which a plurality of prepregs including a fiber base layer and a resin layer are laminated, and a wiring layer is formed on the top or a build-up layer is formed,
  In the stacking direction,
    The distance between the center line of the first fiber base layer disposed closest to one surface and the center line of the second fiber base layer adjacent to the first fiber base layer is D1,
    The distance between the center line of the third fiber substrate layer disposed closest to the other surface and the center line of the fourth fiber substrate layer adjacent to the third fiber substrate layer is D2,
    The thickness of the laminate is D3,
    When the number of fiber base layers of the laminate is n (where n is an integer of 2 or more),
  The laminated board which satisfy | fills all the conditions of following formula (1) and (2).
    D3 / n <D1 (1)
    D3 / n <D2 (2)
(Appendix 2)
  In the laminated sheet according to appendix 1,
  In the stacking direction,
    The distance between the one surface and the center line of the first fiber base layer is D4,
    When the distance between the other surface and the center line of the third fiber base layer is D5,
  The laminated board which satisfy | fills all the conditions of following formula (3) and (4).
    D4 <D1 (3)
    D5 <D2 (4)
(Appendix 3)
  In the laminate according to appendix 1 or 2,
  In the stacking direction,
    The first fiber base layer and the third fiber base layer are
  The laminated board arrange | positioned symmetrically with respect to the centerline of the said laminated board.
(Appendix 4)
  In the laminate according to appendix 1 or 2,
  In the stacking direction,
    All fiber substrate layers in the laminate are
  The laminated board arrange | positioned symmetrically with respect to the centerline of the said laminated board.
(Appendix 5)
  The laminated board according to any one of appendices 1 to 4, wherein the number n of the fiber base layers is 2 or more and 6 or less.
(Appendix 6)
  The laminated sheet according to any one of appendices 1 to 5, wherein the thickness of the laminated sheet is 0.6 mm or less.
(Appendix 7)
  The laminated board according to any one of appendices 1 to 6, wherein the laminated board has a linear expansion coefficient in a plane direction of 1 ppm / ° C to 20 ppm / ° C.
(Appendix 8)
  The laminated sheet according to any one of appendices 1 to 7, wherein a metal foil is formed on at least one side of the laminated sheet.
(Appendix 9)
  In the laminate according to any one of appendices 1 to 8,
  The laminated board whose thickness of said 1st fiber base material layer and said 3rd fiber base material layer is 5 micrometers or more and 100 micrometers or less.
(Appendix 10)
  In the laminate according to any one of appendices 1 to 9,
  The laminated board whose fiber base material which comprises said 1st fiber base material layer and said 3rd fiber base material layer is glass cloth, respectively.
(Appendix 11)
  In the laminate according to any one of appendices 1 to 10,
  The buildup layer including a fifth fiber base layer is further formed on the upper part of the laminate,
  In the stacking direction,
    The distance between the one surface and the center line of the fifth fiber base layer included in the buildup layer is D6,
    A laminate satisfying D6> D7, where D7 is a distance between the surface of the buildup layer and the center line of the fifth fiber base layer.
(Appendix 12)
  A circuit board comprising the laminate according to any one of appendices 1 to 11.
(Appendix 13)
  In the circuit board according to appendix 12,
  A solder resist layer including a sixth fiber base layer is further formed on the circuit board,
  In the stacking direction,
    The distance between the one surface or the surface of the buildup layer and the center line of the sixth fiber base layer is D8,
    When the distance between the surface of the solder resist layer and the center line of the sixth fiber base layer is D9,
  A circuit board that satisfies D8> D9.
(Appendix 14)
  14. A semiconductor package in which a semiconductor element is mounted on the circuit board according to appendix 12 or 13.
(Appendix 15)
  A method for producing a laminate in which a plurality of prepregs comprising a fiber base layer and a resin layer are laminated, a wiring layer is formed on the top, or a build-up layer is formed,
  A first step of preparing a plurality of prepregs including a prepreg in which the fiber base material layer is unevenly distributed in the thickness direction;
  In the stacking direction,
    The distance between the center line of the first fiber base layer disposed closest to one surface and the center line of the second fiber base layer adjacent to the first fiber base layer is D1,
    The distance between the center line of the third fiber substrate layer disposed closest to the other surface and the center line of the fourth fiber substrate layer adjacent to the third fiber substrate layer is D2,
    The thickness of the laminate is D3,
    When the number of fiber base layers of the laminate is n (where n is an integer of 2 or more),
  A second step of superimposing the plurality of prepregs so as to satisfy both of the following formulas (1) and (2):
      D3 / n <D1 (1)
      D3 / n <D2 (2)
  A third step of forming the plurality of superimposed prepregs;
The manufacturing method of a laminated board which has these.
(Appendix 16)
  In the method for manufacturing a laminated board according to appendix 15,
  In the second step,
  In the stacking direction,
    The distance between the one surface and the center line of the first fiber base layer is D4,
    When the distance between the other surface and the center line of the third fiber base layer is D5,
  In order to further satisfy the conditions of the following formulas (3) and (4):
    D4 <D1 (3)
    D5 <D2 (4)
  A method for manufacturing a laminated board, wherein the plurality of prepregs are overlapped.
(Appendix 17)
  In the method for manufacturing a laminated board according to appendix 15 or 16,
  In the second step,
  In the stacking direction,
    The first fiber base layer and the third fiber base layer are
  To be arranged symmetrically with respect to the center line of the laminate,
  A method for manufacturing a laminated board, wherein the plurality of prepregs are overlapped.
(Appendix 18)
  In the method for manufacturing a laminated board according to appendix 15 or 16,
  In the second step,
  In the stacking direction,
    All fiber substrate layers in the laminate are
  To be arranged symmetrically with respect to the center line of the laminate,
  A method for manufacturing a laminated board, wherein the plurality of prepregs are overlapped.
(Appendix 19)
  In the method for manufacturing a laminated board according to any one of appendices 15 to 18,
  The manufacturing method of a laminated board whose number n of the said fiber base material layers is 2-6.

100a Laminated plate 100b Laminated plate 100b2 Laminated plate 100c Laminated plate 100c2 Laminated plate 100c3 Laminated plate 101 First fiber base layer 101a Second fiber base layer 102 First resin layer 103 Second resin layer 104 First prepreg 105 Third fiber Substrate layer 105a Fourth fiber substrate layer 106 Third resin layer 107 Fourth resin layer 108 Second prepreg 110 One surface 111 The other surface 5a Carrier material 5b Carrier material 11 Fiber substrate 21 Prepreg 60 Vacuum laminator 61 Laminating Roll 62 Hot air drying apparatus 200 Laminate plate with metal foil 201 Metal foil 300 Laminate plate with buildup layer 301 Fifth fiber base layer 303 Buildup layer 310 Surface of buildup layer 400 Circuit board 401 Wiring layer 403 Via hole 405 Through hole 500 Circuit base with solder resist layer 501 Sixth fiber base layer 503 Solder resist layer 510 Surface 600 of solder resist layer Semiconductor package 601 Semiconductor element 603 Bump 605 Underfill 701 Fifth resin layer 702 Sixth resin layer 703 Third prepreg 801 Seventh resin layer 802 Eighth Resin layer 803 Fourth prepreg 1 Coating device 1a First coating device 1b Second coating device 2 Coating tip 2a First coating tip 2b Second coating tip 3 Fiber substrate 4 Resin varnish

Claims (18)

A plurality of prepregs comprising a fiber base layer and a resin layer are laminated so that the prepregs are in direct contact with each other, and are laminated plates used for a core layer of a circuit board,
In the stacking direction,
The distance between the center line of the first fiber base layer disposed closest to one surface and the center line of the second fiber base layer adjacent to the first fiber base layer is D1,
The distance between the center line of the third fiber substrate layer disposed closest to the other surface and the center line of the fourth fiber substrate layer adjacent to the third fiber substrate layer is D2,
The thickness of the laminate is D3,
The number of fiber base layers of the laminate is n (where n is an integer of 2 or more. When the number n of the fiber base layers is 2, the first fiber base layer and the fourth fiber) The base material layer, the second fiber base material layer, and the third fiber base material layer are the same fiber base material layer, and when the number of the fiber base material layers is 3, the second fiber base layer When the material layer and the fourth fiber base layer indicate the same fiber base layer),
Satisfy both the conditions of the following formulas (1) and (2),
The resin layer includes an inorganic filler,
The content of the inorganic filler in the resin layer is 20% by mass or more and 80% by mass or less with respect to the entire resin layer,
The laminate is a laminate that does not include a build-up layer.
D3 / n <D1 (1)
D3 / n <D2 (2) The laminate according to claim 1,
In the stacking direction,
The distance between the one surface and the center line of the first fiber base layer is D4,
When the distance between the other surface and the center line of the third fiber base layer is D5,
The laminated board which satisfy | fills all the conditions of following formula (3) and (4).
D4 <D1 (3)
D5 <D2 (4) In the laminated board of Claim 1 or 2,
In the stacking direction,
The first fiber base layer and the third fiber base layer are
The laminated board arrange | positioned symmetrically with respect to the centerline of the said laminated board. In the laminated board of Claim 1 or 2,
In the stacking direction,
All fiber substrate layers in the laminate are
The laminated board arrange | positioned symmetrically with respect to the centerline of the said laminated board.   The laminated board as described in any one of Claims 1 thru | or 4 WHEREIN: The number n of the said fiber base material layers is 2 or more and 6 or less.   The laminated board as described in any one of Claims 1 thru | or 5 WHEREIN: The laminated board whose thickness of the said laminated board is 0.6 mm or less.   The laminated board as described in any one of Claims 1 thru | or 6 WHEREIN: The laminated board by which the metal foil was provided in the at least single side | surface of the said laminated board. In the laminated board as described in any one of Claims 1 thru | or 7,
The laminated board whose thickness of said 1st fiber base material layer and said 3rd fiber base material layer is 5 micrometers or more and 100 micrometers or less. In the laminated board as described in any one of Claims 1 thru | or 8,
The laminated board whose fiber base material which comprises said 1st fiber base material layer and said 3rd fiber base material layer is glass cloth, respectively. A laminate according to any one of claims 1 to 9,
A buildup layer including a fifth fiber base layer provided on at least one surface of the laminate; and
With
In the stacking direction,
The distance between the one surface of the laminate and the center line of the fifth fiber base layer included in the buildup layer is D6,
A laminate with a buildup layer that satisfies D6> D7, where D7 is a distance between the surface of the buildup layer and the center line of the fifth fiber base layer.   The circuit board containing the laminated board as described in any one of Claims 1 thru | or 9, or the laminated board with a buildup layer as described in Claim 10. The circuit board according to claim 11,
A solder resist layer including a sixth fiber base layer is further provided on the circuit board,
In the stacking direction,
The distance between the one surface of the laminate or the surface of the build-up layer and the center line of the sixth fiber base layer is D8,
When the distance between the surface of the solder resist layer and the center line of the sixth fiber base layer is D9,
A circuit board that satisfies D8> D9.   A semiconductor package, wherein a semiconductor element is mounted on the circuit board according to claim 11. A plurality of prepregs comprising a fiber base layer and a resin layer are laminated, and a method for producing a laminate used for a core layer of a circuit board,
A first step of preparing a plurality of prepregs including a prepreg in which the fiber base material layer is unevenly distributed in the thickness direction;
In the stacking direction,
The distance between the center line of the first fiber base layer disposed closest to one surface and the center line of the second fiber base layer adjacent to the first fiber base layer is D1,
The distance between the center line of the third fiber substrate layer disposed closest to the other surface and the center line of the fourth fiber substrate layer adjacent to the third fiber substrate layer is D2,
The thickness of the laminate is D3,
The number of fiber base layers of the laminate is n (where n is an integer of 2 or more. When the number n of the fiber base layers is 2, the first fiber base layer and the fourth fiber) The base material layer, the second fiber base material layer, and the third fiber base material layer are the same fiber base material layer, and when the number of the fiber base material layers is 3, the second fiber base layer When the material layer and the fourth fiber base layer indicate the same fiber base layer),
A second step of superimposing the plurality of prepregs so as to satisfy both of the following formulas (1) and (2):
D3 / n <D1 (1)
D3 / n <D2 (2)
A third step of forming the plurality of superimposed prepregs;
Have
The resin layer includes an inorganic filler,
The content of the inorganic filler in the resin layer is 20% by mass or more and 80% by mass or less with respect to the entire resin layer,
The said laminated board is a manufacturing method of a laminated board which does not include a buildup layer. In the manufacturing method of the laminated board of Claim 14,
In the second step,
In the stacking direction,
The distance between the one surface and the center line of the first fiber base layer is D4,
When the distance between the other surface and the center line of the third fiber base layer is D5,
In order to further satisfy the conditions of the following formulas (3) and (4):
D4 <D1 (3)
D5 <D2 (4)
A method for manufacturing a laminated board, wherein the plurality of prepregs are overlapped. In the manufacturing method of the laminated board of Claim 14 or 15,
In the second step,
In the stacking direction,
The first fiber base layer and the third fiber base layer are
To be arranged symmetrically with respect to the center line of the laminate,
A method for manufacturing a laminated board, wherein the plurality of prepregs are overlapped. In the manufacturing method of the laminated board of Claim 14 or 15,
In the second step,
In the stacking direction,
All fiber substrate layers in the laminate are
To be arranged symmetrically with respect to the center line of the laminate,
A method for manufacturing a laminated board, wherein the plurality of prepregs are overlapped. In the manufacturing method of the laminated board as described in any one of Claims 14 thru | or 17,
The manufacturing method of a laminated board whose number n of the said fiber base material layers is 2-6.

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