TW201247414A - Laminated board, circuit board, semiconductor package, and method for manufacturing laminated board - Google Patents

Abstract

The laminated board 100c according to the present invention is obtained by laminating a plurality of prepregs having fiber base layers and resin layers, and forming a wiring layer or a buildup layer on the top, wherein when in the lamination direction, the distance between the central line (A1) of a first fiber base layer (101) provided closest to a surface (110) and the central line (A3) of a second fiber base layer (101a) adjacent to the first fiber base layer (101) is set as D1, the distance between the central line (A2) of a third fiber base layer (105) provided closest to another surface (111) and the central line (A4) of a fourth fiber base layer (105a) adjacent to the third fiber base layer (105) is set as D2, the thickness of the laminated board is set as D3, and the number of the fiber base layers in the laminated board is set as n (where n is an integer of 2 or above), either one of the following conditions of formulae (1) and (2) is satisfied: D3/n < D1 (1) D3/n < D2 (2).

Description

201247414 VI. Description of the Invention: TECHNICAL FIELD The present invention relates to a method of manufacturing a laminated board, a circuit board, a semiconductor package, and a laminated board. [Prior Art] In recent years, as electronic devices have been required to be highly functional and light and thin, circuit boards have become increasingly thinner. A typical circuit board is mainly composed of a laminate in which a plurality of prepregs including a fiber base layer and a resin layer are laminated. The current mainstream of the laminate is, for example, a FCBGA (Flip Chip BaU Grid Array) used in a CPU (Central Processing Unit) for a thickness of about 0.8 mm. In recent years, the thickness of the laminated board has been promoted due to the reduction in the cost of the substrate, such as reduction in component cost and processing cost, and improvement in electrical characteristics. Recently, the thickness of the laminated board has been developed to be about .4_ and further 0.2 mm or less. However, in the case of reducing the thickness of the laminated board, the strength of the laminated board is lowered or the heat (four) is increased by a large laminated board. As a result, the amount of variation in the distortion of the semiconductor package is increased, and the yield of the crack is lowered. ^ ' For example, there are methods described in the following documents. 101113166 λ 201247414 is described in the patent document U 曰 专利 昭 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 And distortion. A method for producing a laminated board for a printed circuit which is excellent in warpage or distortion and has excellent dimensional stability is disclosed in Japanese Laid-Open Patent Publication No. Hei-4-259543. Patent Document 2 describes the difference in the number of the vertical and horizontal directions of the glass woven fabric used in the control surface layer, and the longitudinal and transverse tensile strength of the glass nonwoven fabric used in the intermediate layer. Ratio, and achieve the balance between vertical and horizontal directions. It is described in the patent document 3 (Japanese Laid-Open Patent Publication No. 2008-258335) that the warpage of the semiconductor package can be effectively prevented by using a buildup layer in which the fiber base material is biased to one side with respect to the thickness direction. [PRIOR ART DOCUMENT] Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. SUMMARY OF THE INVENTION ^ (Problems to be Solved by the Invention) However, as the circuit board is further thinned, the warpage of the laminated board gradually becomes more conspicuous. Further, as the warpage of the laminated board increases, the increase in the warpage of the circuit board and the increase in the warpage of the semiconductor package caused by it gradually become more remarkable. 101113166 5 201247414 The techniques of Patent Documents 1, 2, and 3 are effective in solving the warpage of the laminated board, but as the circuit board is further thinned, it is desired to develop warpage and reduce the laminated board. The present invention has been made in view of the above problems, and an object thereof is to provide a laminated board which is suitable for use as a thin circuit board while reducing warpage. (Means for Solving the Problem) According to the present invention, it is possible to provide a laminated board in which a plurality of prepregs including a fibrous base material layer and a resin layer are laminated, and a wiring layer or a build-up layer is formed on the upper portion. And in the lamination direction, the distance between the center line of the first fiber base material layer disposed closest to one surface and the center line of the second fiber base material layer adjacent to the first fiber base material layer is set to D1, Setting a distance between a center line of the third fiber base material layer disposed closest to the other surface and a center line of the fourth fiber base material layer adjacent to the third fiber base material layer as D2, and setting the thickness of the laminated board In the case of D3, when the number of layers of the fiber base material layer of the laminate is n (where η is an integer of 2 or more), any of the following formulas (1) and (2) is satisfied: D3 /n&lt;Dl (1) D3/n&lt;D2 (2). 101113166 6 201247414 Further, according to the present invention, there can be provided a circuit board comprising the above-described laminated board of the present invention. Furthermore, according to the present invention, there is provided a semiconductor package in which a semiconductor element is mounted on a circuit board of the present invention. Further, according to the present invention, there is provided a method for producing a laminated board in which a plurality of prepregs including a fibrous base material layer and a resin layer are laminated, and a wiring layer or a build-up layer is formed on the upper portion. a method of laminating a sheet; and comprising: the dimensioning of the base material layer in the thickness direction, the first step of preparing a plurality of prepregs comprising the prepreg of the fiber on one side; and the second step of the layering direction The distance between the center line of the center line and the center line of the adjacent line and the center line of the adjacent line is the closest to the surface of the first fiber minus the first fiber-like second fiber substrate ^~~ The fiber base layer four fiber base material layer is disposed closest to the other surface and is disposed on the third fiber base material layer to be D2, and the thickness of the laminated plate is D3, n (where η is When the number of layers of the fiber base material layer of the laminated plate is 2 or more, the above-mentioned plural number satisfies the overlap of the prepreg in the conditions of the following formulas (1) and (2), 101113166 201247414 D3/n&lt;Dl (1) D3/n&lt;D2 (2); and a third step, So that the plurality of shaped prepregs overlap. (Effect of the Invention) According to the present invention, it is possible to provide a laminate for a thin circuit substrate by reducing the distortion of the monthly read stress to the center of the laminate by disposing the fiber substrate layer on the outer side of the laminate. . [Embodiment] Hereinafter, embodiments of the present invention will be described using the drawings. In the drawings, the same components are denoted by the same reference numerals, and the description is omitted as appropriate. Fig. 13 is a cross-sectional view showing the configuration of the laminated board 1 () e in the embodiment. The laminated plate of the fourth embodiment of the present invention is formed by a plurality of prepregs having a fiber layer and a resin layer, and a wiring layer or a build-up layer is formed on the upper portion; and is closest in the lamination direction. The distance between the center line of the first-fiber base material layer 1〇1 disposed on one surface and the center line A3 of the second fiber base material layer 101a adjacent to the first fiber base material layer 101 is set to D1, which will be the most The distance between the center line A2 of the third fiber base material layer 1〇5 disposed close to the other surface 111 and the line A4 of the fourth fiber base material layer 1〇53 adjacent to the third fiber base material layer 1〇5 is set. In the case of D2, the thickness of the laminated plate is such that when the number of layers of the fibrous base material layer in the laminated plate is n (where η is an integer of 2 or more), the following formulas (1) and (2) are satisfied. 101113166 〇201247414 Each fiber substrate layer is configured in any of the conditions. D3/n&lt;Dl (1) D3/n&lt;D2 (2) Further, in order to more effectively obtain the warpage preventing effect of the laminated board, it is preferable to laminate one surface 110 of the laminated board with the first fibrous base material layer 101. When the distance between the center line A1 is D4 and the distance between the other surface U1 and the center line A2 of the third fiber base material layer 1〇5 is D5, the conditions of the following formulas (3) and (4) are satisfied. Each of the fiber base material layers is disposed in any of the ways. D4 &lt; D1 (3) D5 &lt; D2 (4) The number n of the fiber base material layers contained in the laminated plate in the present embodiment is not particularly limited as long as it is 2 or more, preferably 2 or more and 6 or less. Further, the car λ is preferably 2 or more and 4 or less. When the number of layers of the fibrous base material layer is within the above range, the balance between mechanical strength and productivity can be obtained particularly well, and it is suitable for a laminate of a thin circuit substrate. Further, in order to more effectively obtain the effect of preventing the slab of the laminated board, it is preferable that the entire substrate layer in the laminated board is symmetrically arranged with respect to the center line Β1 of the laminated board. The thickness of the laminated plate in the present embodiment is preferably 0.025 mm or more and 0.6 mm or less. More preferably, it is preferably (10) 4 or more and q 4 is as follows, and further preferably 0.06 or more and 〇. 3 or less, particularly preferably 〇〇8 匪 or more 〇 2 faces with a thickness within the above _, then mechanical strength and raw 101113166 are obtained. 201247414 The balance of productivity is particularly excellent, and it is suitable for the line expansion of the surface of the laminated board in this embodiment of the thin circuit board::. Above °C above 20 PPm/°C, preferably 2 ppm^c or more 15 is] Ppm/down, and further preferably 2 PPm/t: above 8 ppm/°Cj; &lt; When wPpm/°C has a coefficient of linear expansion within the above range, it is possible to more effectively suppress the circuit board of the laminated board and the semiconductor package mounted with the semiconductor element = high temperature cycle reliability, and how to more effectively improve the half Guide (4) is installed in the second installation of the affair and the mother board of the warmth of the ring. Further, the linear expansion coefficient of the present embodiment is an average value of the swell of the ridge of 150 t or less as long as it is not particularly limited. <Embodiment (A)&gt; Hereinafter, the embodiment (A) will be described. In the embodiment (A), the number n of layers of the fibrous base material layer contained in the laminated sheet is 2. Furthermore, when the number of layers of the fibrous base material layer is 2, the first fibrous base material layer 101 and the fourth fibrous base material layer 10a, and the second fibrous base material layer 1〇1a and the second fibrous base material layer 105 denotes the same fibrous base material layer, respectively. Therefore, only the first fibrous base material layer 101 and the third fibrous base material layer 1〇5 will be described below. (Laminated Board) First, the configuration of the laminated board in the present embodiment will be described. Fig. 1 is a cross-sectional view showing the configuration of a laminate 1a in the embodiment. The laminate 100a is provided with a first fiber base layer 1 〇1, a first resin 101113166 10 201247414 layer 102, and a first prepreg 1〇4 of the second resin 35l〇3 and a third fiber base material layer 105. The second prepreg 108 of the second resin layer 1〇6 and the fourth resin layer 1〇7 is disposed on the outer side of the first fiber base material layer 1〇1 and the third fiber base material layer 105 in the laminating direction. The way is obtained by layering. At this time, the phrase "disposed on the outside" means that the figure is shown! As shown in the figure, the distance between the center line of the first fiber base layer ιοί and the center line A2 of the third fiber base material layer 1〇5 is D1. When the thickness of the laminate is D3, D3/ is satisfied. The first fibrous base material 351〇1 and the third fibrous base material layer 105 are disposed in a manner of 2 &lt; D1. Further, in order to more effectively obtain the anti-turbine effect of the laminated board, it is preferable to set the distance between one surface 110 of the laminated board and the center line A1 of the first fibrous base material layer 1〇1 to D4, and the other side is When the distance from the center line A2 of the third fiber base material layer 1〇5 is D5, the conditions of D4 &lt; D1 and D5 &lt; D1 are further satisfied. Further, in order to more effectively obtain the effect of preventing warpage of the laminated board, it is preferable that the first fibrous base material layer 101 and the third fibrous base material layer 1〇5 are symmetrically arranged with respect to the center line B1 of the laminated board, respectively. As described above, by disposing the fibrous base material layer on the outer side of the laminated plate, the expansion stress can be moved toward the center of the laminated plate, whereby the single piece of the laminated plate can be reduced. (Manufacturing Method of Laminated Sheet) Next, the manufacturing method of the laminated board 1 〇〇a in the present embodiment will be described. 101113166 11 201247414 Fig. 2 (4) and Fig. 2 (b) are cross-sectional views showing the steps of manufacturing the laminated board in the embodiment. First, the first prepreg 104 having the first fibrous base material layer 101, the first resin layer 102, and the second resin layer 103 is prepared, and the third fibrous base material layer (10), the third resin layer 106, and the first The second prepreg 108 of the resin layer is further used. The thickness of the first resin layer 102 is thicker than the thickness of the second resin layer 1〇3, and further, the thickness of the third resin layer 106 is thicker than the fourth resin. The thickness of the layer of Zhejiang. That is, both the first prepreg 104 and the second prepreg (10) are in the thickness direction, and the first fiber base layer and the third fiber base layer 105 are respectively biased to the side. Hereinafter, the prepreg in which the fiber substrate is biased to one side is referred to as a surface-impregnation body. Furthermore, the manufacturing method of the test body is as follows. Next, as shown in FIG. 2(a), the first prepreg is placed such that the first fibrous base material layer 101 and the third fibrous base material layer 1〇5 are disposed outside in the lamination direction of the prepreg. 104 and the second prepreg 108 overlap. In this case, "distributed outside" means that the distance between the center line A1 of the first fiber base material layer 101 and the center line A2 of the third fiber base material layer 1〇5 is D1 as shown in FIG. When the thickness of the laminated board is D3, the first fibrous base material layer 1〇1 and the third fibrous base material layer 105 are disposed so as to satisfy D3/2 &lt; D1. Moreover, in order to more effectively obtain the anti-bell effect of the laminated board, it is preferably as shown in FIG. 101113166 12 201247414 1 to align the one surface 110 of the laminated board with the center line of the first fibrous base material layer 1 〇1. The distance is set to D4, and when the distance between the other surface 111 and the center line Α2 of the third fiber base material layer 105 is D5, the conditions of D4 &lt;: D1 and D5 &lt; D1 are further satisfied. Further, in order to more effectively obtain the anti-warpage effect of the laminated board, it is preferable that the first fibrous base material layer and the third fibrous base material layer 105 are symmetrically symmetric with respect to the center line B1 of the laminated board, respectively, as shown in FIG. Configuration. In addition, the lamination method is not particularly limited, and for example, it may be a batch type, or the first prepreg and the second prepreg may be continuously supplied at the same time, and continuously used by a vacuum laminating apparatus, a vacuum pressurizing apparatus, or the like. Laminated. Finally, the first prepreg 1〇4 and the second prepreg 108 which are overlapped in the above manner are heated and pressed to form a laminated board 100a according to the present embodiment as shown in Fig. 2(b). . The method of performing the above-described heat treatment is not particularly limited, and can be carried out, for example, by using a hot air drying device, an infrared heating device, a heating stick device, a flat hot plate pressurizing device, or the like. In the case of using a hot air drying device or an infrared heating device, it can be applied in a case where substantially no pressure acts on the joint. Further, in the case of using a heating roll device or a flat hot plate pressurizing device, it can be carried out by applying a predetermined pressure to the joint. The temperature at the time of heat treatment is not particularly limited, but is preferably a temperature region in which the resin to be used is not melted and the curing reaction of the resin is not rapidly performed. The heating temperature is, for example, preferably 12 〇 ° C or more and 25 〇 &lt;&gt; c or less, and more preferably 101113166 13 201247414 is 1503⁄4 or more and 230 ° C or less. Further, the time for performing the heat treatment differs depending on the type of the resin to be used and the like, and is not particularly limited. For example, it can be carried out by a treatment of 30 minutes or longer and 180 minutes or shorter. Further, the pressure for pressurization is not particularly limited, and is, for example, preferably 0.2 MPa or more and 5 MPa or less, more preferably 2 MPa or more and 4 MPa or less. (Manufacturing Method of Prepreg) Next, a method of manufacturing the prepreg constituting the laminated board 100a of the present embodiment will be described. The prepreg system contained in the laminate 100a is one in which one or two or more kinds of resin compositions are impregnated into the fibrous base material, and then the material of the fibrous base material layer and the resin layer obtained by semi-hardening is obtained. . The dielectric material of such a structure is excellent in various characteristics such as mechanical and electrical connection reliability under high temperature and high humidity, and is suitable for the production of a laminate for a circuit board. The method of impregnating the resin composition used in the present embodiment with the fiber base material is not particularly limited, and for example, a resin varnish is prepared by dissolving the resin composition in a solvent, and the fiber base material is immersed. A method of squeezing in a resin varnish, a method of coating by various coaters, a method of spraying by spraying, a method of laminating a resin layer with a supporting substrate, and the like. This special car is a method of immersing a fibrous substrate in a resin varnish. Thereby, the impregnation property of the resin composition to the fibrous substrate can be raised. Further, in the case where the fibrous substrate is immersed in the resin varnish, a usual impregnation coating device 101113166 14 201247414 can be used. Particularly in the case where the thickness of the fibrous substrate is 〇 1 mm or less, it is preferred to laminate the resin layer from both sides of the fibrous substrate. By using ^,,, and (4) the impregnation amount of the resin composition to the fibrous substrate, the impurities of the prepreg can be further improved. Further, in the case of laminating the rhythm layer, it is more preferable to use a vacuum laminating apparatus or the like. Specifically, as a method of producing a prepreg, for example, the following method can be mentioned. Fig. 3 is a cross-sectional view showing a method of manufacturing a prepreg. Here, a method of peeling the carrier film 5a, 5b from the carrier material 5a, 5b to the fiber substrate 11 and peeling off the carrier film will be specifically described. The carrier material 5a obtained by applying the first resin composition onto the carrier film and the carrier material 5b obtained by applying the second resin composition to the carrier film are prepared in advance. Then, the carrier materials 5a and 5b are superposed on both sides of the fiber base material under reduced pressure by using a vacuum laminating apparatus, and if necessary, the laminating rolls 61 heated to a temperature higher than the melting temperature of the resin composition are joined. The resin composition coated on the carrier film is impregnated into the fiber substrate u. By joining under reduced pressure, even if there is an unfilled portion in the interior of the fibrous substrate n or the joint between the layer of the tree a layer of the carrier materials 5a and 5b and the fibrous substrate 11, the pressure can be reduced. Or a substantially vacuum gap. As such another means for joining the fiber base material 11 to the carrier materials 5a, 5b under reduced pressure, for example, a vacuum box device, a vacuum press device, or the like can be used. Then, after the fiber base material 11 is joined to the carrier materials 5a and 5b, heat is applied to the temperature of the carrier material by heat treatment at a temperature of 101101166 15 201247414. Thereby, the decompression voids and the like which are generated above the melting temperature can be &amp; In the joining step of performing the two places, the infrared heating device and the other method of adding the film can be used, for example, and the like. '&quot; Summer, flat hot plate press pack The carrier materials 5a, 5b are operated by this method, and the carrier film can be peeled off after the resin is assembled. The prepreg 21 embedded in the fibrous substrate 11. The carrier fiber substrate 11 can be made to have a == method, and the thickness of the carrier material can be adjusted by adjusting the thickness of the prepreg, and the surface of the carbon fiber base material is biased to one side in the thickness direction. Hereinafter, the fiber substrate 3 is conveyed between the two die coaters by a coater including two J coaters and a second coater 1b as die coaters with reference to FIG. A resin varnish 4 is applied to each of the single sides on both sides thereof. The same coating machine can be used for the jth coating device 丨a and the second coating device ib, and different ones can be used. Moreover, as shown in FIG. 18, a roll coater can also be used for the 1st coating apparatus ia and the 2nd coating apparatus lb. Further, the coating pitch L and the tip overlapping distance D are preferably a certain distance as shown in Figs. 17 and 18, but may not have a certain distance as shown in Fig. 19. 101113166 16 201247414 Each of the first coating device 1a and the second coating device 1b has a coating tip end portion 2', and the coating tip end portion 2 is formed to be elongated in the width direction of the fiber base material 3. In addition, the first coating end portion 2a which is the coating end portion of the first coating device 1a protrudes toward one surface of the fiber base material 3, and the coating end portion of the second coating device 1b is the second coating tip end portion 2b. It protrudes toward the other side of the fibrous base material 3. Thereby, when the resin varnish 4 is applied, the first coating tip end portion 2a is in surface contact with one of the fiber base materials 3 via the resin varnish 4, and the second coating tip end portion 2b is further via the resin varnish 4 and the fiber base material 3 One touch. The amount of discharge per unit time of the resin varnish 4 ejected from the first coating device 1a and the second coating device ib may be the same or different. By varying the amount of discharge per unit time of the resin varnish, the thickness of the resin varnish 4 applied on the other side of the fiber substrate can be individually controlled, and the layer thickness of the resin layer can be easily adjusted. Use the temperature of drying and simmering to ride the heat to make the

In the case of the resin varnish, when the fibrous substrate is impregnated into the resin varnish, the solvent used is preferably a resin composition.

101113166 17 201247414: The thickness of the second resin layer 103 and the fourth resin layer ι7 of the symmetric prepreg is preferably 1 _ or more, and hereinafter, the thickness of the first resin layer 102 and the third resin layer 106 is usually It is preferably 2 3 (four) or more _ _ or less. Here, the thickness of the resin layer means the distance from the interface between the fiber base material layer and the resin layer to the interface on the opposite side of the resin layer, and does not include the resin impregnated in the fiber base material layer. Further, from the viewpoint of facilitating the control of the fun, the thickness α of the second resin layer (8) and the fourth resin layer 1G7 of the asymmetric prepreg and the first resin layer 1〇2 and the third resin layer 1〇 The ratio (C2/C1) of the thickness C1 of 6 is preferably in the range of 〇" &lt; C2/C1C0.9. Furthermore, the thickness of the tree layer can be measured by, for example, using a section of the hardened stalk which is sturdy and sturdy. The solid content of the resin varnish is not particularly a (10)% by weight or less, more preferably 50% by weight = upper tt40 by weight - the resin varnish can be further increased to a fiber weight of 65 or less. Thereby, the fat composition is impregnated into the fibrous base material, and I and the three. The temperature can be obtained by drying the material at 200 ° C or lower, for example, 80 ° C, and then returning to Fig. 1, which will be described in detail in the construction of the gentleman. The material of the slab (fiber base material layer) is used as the fiber base material for the first Μ, 哉 基材 base material layer 101 and the second fiber base material layer 105 in the present embodiment, and the first paper is And particularly limited, glass fiber substrate such as glass cloth 101113166 18 201247414; polybenzoxazole resin fiber, polyamide resin fiber, aromatic polyamine resin fiber, and wholly aromatic polyamide resin Polyurethane resin fiber such as fiber, polyester resin fiber, aromatic polyester resin fiber, polyester resin fiber such as scented fragrant fiber gambling fiber, and polyester resin fiber, gas resin fiber, etc. a synthetic fiber base material; an organic fiber base material such as a paper base material containing kraft paper, cotton linter paper, a mixed paper of cotton velvet and kraft pulp, etc., among which, strength, water absorption rate In particular, it is a glass cloth. Further, by using a glass cloth, the thermal expansion coefficient of the laminated board can be further reduced. As a glass fiber substrate used in the present embodiment, the basis weight (fiber substrate per 1) Weight) preferably 4 g/m2 150 g/m2 or less, more preferably 82 coffee 2 or more, 110 coffee 2 or less, further preferably 12 g/m 2 or more and 6 〇 g/m or less, further preferably 12 or more % g/claw 2 or less, particularly preferably It is 12 g/m2 or more and 24 g/m2 or less. If the basis weight is less than or equal to the above upper limit value, the 3/reparation of the resin composition of the fibrous substrate + can suppress strand voids (strand or insulation reliability) It is also possible to reduce the formation of through-holes using carbon dioxide, ultraviolet rays (UV, Μ*), excimers, etc. Further, if the soil weight is equal to or higher than the lower limit value, the glass fiber can be improved. The strength of the substrate or laminated board... The effect of the operation is improved, or the preparation of the prepreg is easy to suppress the reduction of the warpage of the substrate. 5 In the above-mentioned glass, the towel is difficult to ride. 101113166 201247414 C. The glass fiber substrate below C is more preferably a glass fiber substrate of 3.5 ppm/° C. or less. By using a glass fiber substrate having such a linear expansion coefficient, the laminate of the present embodiment can be further suppressed. Warp. Further, the rising modulus of the fiber substrate used in the embodiment is higher. It is preferably 60 GPa or more and 100 GPa or less, more preferably 65 GPa or more and 92 GPa or less, and further preferably 86 GPa or more and 92 GPa or less. By using a glass fiber substrate having such a Young's modulus, for example, it can be effectively suppressed. The connection reliability of the electronic component is further improved by the deformation of the wiring board caused by the reheating heat during semiconductor mounting. Further, the glass fiber substrate used in the embodiment preferably has a dielectric constant of 3 at 1 MHz. 8 or more and 7.0 or less, more preferably 3.8 or more and 6.8 or less, further preferably 3.8 or more and 5.5 or less. By using a glass fiber substrate having such a dielectric constant, the dielectric constant of the laminated plate can be further reduced, and A semiconductor package using a high speed signal is preferred. As the glass fiber base material having the linear expansion coefficient, the upward modulus, and the dielectric constant as described above, for example, E glass, S glass, NE glass, T glass, UN glass, quartz glass or the like can be preferably used. The first fibrous base material layer 1〇1 and the third fibrous base material layer 105 in the laminated plate 100a are configured to constitute the first resin layer ι2 and the second resin layer ι3, and the third resin layer 106, respectively. The resin composition of the four resin layers 107 is impregnated into the above-mentioned fibrous base material. Generally, the thickness of the fibrous base material layer is considered to be the thickness of the fibrous base material. 101113166 20 201247414 The thickness of the above loo fiber base material layer is not particularly limited, but is preferably more preferably &lt; m or less, more preferably 10 # m or more and 60 v m or less Π 35 or more. By using a fibrous base material having such a thickness, the operability at the time of manufacture of the prepreg is further improved, and the effect of reducing the thickness of the linger is remarkable. In the case where the thickness of the fibrous base material layer is less than or equal to the above upper limit value, the impregnation property of the resin composition in the virgin base material is increased to suppress the occurrence of a decrease in the strand void or the insulation reliability. Further, it is possible to form a via hole using a laser such as carbon dioxide, uv or excimer. In addition, when the thickness of the fiber base material layer is at least the above lower limit value, the result of the fiber filament or the body H can be improved, and the workability can be improved, or the preparation of the prepreg can be easily performed, or the reduction of the surface curvature of the substrate can be suppressed. The effect is reduced. The number of sheets of the fibrous base material used is not limited to one sheet, and a plurality of thin fibrous base materials may be used in a weight of four. In the case where a plurality of fiber base materials are stacked and used, the total thickness may satisfy the above range. The first fibrous base material layer 1〇1 and the third fibrous base material layer 105 in the laminated plate 100a may be the same or different. The laminated board 100a has a fiber base material layer in which a resin composition is impregnated into a fiber base material such as a glass fiber base material, thereby obtaining a multilayer wiring board having a low linear expansion coefficient and a high elastic modulus and being thin. In a semiconductor package in which a semiconductor wafer is mounted on a multilayer wiring board, warpage is less, and reliability of heat resistance and thermal shock resistance is excellent. Among them, the fibrous base material layer obtained by impregnating the resin composition with the glass substrate 101113166 21 201247414 is thermally expanded. It can achieve high strength, low water absorption, low (resin composition) as a resin composition impregnated in the fiber substrate, and it is good to have low _ swell and (four) sex reduction. The resin composition preferably contains a thermosetting resin. (thermosetting resin) 俾=:lipid ′ is not particularly limited, and preferably has a low line coefficient and a four-dimensional modulus, and (iv) excellent reliability in impact properties. Further, the glass-shift temperature of the thermosetting resin is preferably (10). c is above 35〇, more preferably. C or more below wc. By using a thermosetting resin having such a glass transition temperature, the effect of (9) reflow heat resistance further can be obtained. As a specific heat hardening (four) fat, for example: silk secret varnish resin, cresol secret clear _ fat, Wei A secret varnish tree material secret varnish age-type resin 'unmodified soluble 酴 _ resin (lion leph_lresin) , through tung oil, linseed oil, difficult oil, etc. to change the oil to f soluble soluble resin, etc. soluble secret type _ fat _ fat; double age A type epoxy resin, double age F type epoxy resin, double Phenol S type epoxy resin, bisphenol E type epoxy resin, double bismuth type epoxy resin, double 酴p type epoxy resin, double bis-type epoxy resin and other bisphenol type epoxy resin, phenol novolak type Novolac type epoxy resin such as epoxy resin or cresol novolak type epoxy resin, biphenyl type epoxy resin, joint 101113166 22 201247414 phenyl aralkyl type epoxy resin, aryl alkylene type epoxy resin, naphthalene Epoxy resin, bismuth epoxy resin, phenoxy epoxy resin, dicyclopentadiene epoxy resin, epoxy resin, diamond powder, epoxy resin Epoxy resin such as resin; resin with tri-brown ring such as urea (urea) resin or melamine resin, unsaturated polyester resin, double mala Imine resin, polyurethane resin, diallyl phthalate resin, polyoxyn epoxide resin, resin with benzoin ring, cyanate resin, polyimine resin, Polyamidoximine resin, stupid cyclobutene resin, and the like. One of these may be used alone, or two or more kinds having different weight average molecular weights may be used in combination, or two or more kinds may be used in combination with the prepolymers. Among these, a cyanate resin (prepolymer containing a cyanate resin) is particularly preferred. By using a cyanate resin, the coefficient of thermal expansion of the laminate can be reduced. Further, the cyanate resin is excellent in electrical characteristics (low dielectric constant, low dielectric loss tangent), mechanical strength, and the like. The cyanate resin can be obtained by, for example, reacting a halogenated cyanide compound with a phenol, or prepolymerizing it by heating or the like as necessary. Specific examples thereof include bisphenol-type cyanide such as a novolac type cyanate resin, a bisphenol A type cyanate resin, a bisphenol E type cyanate resin, and a tetradecyl bisphenol F type cyanate resin. Acid S is a resin which is obtained by the reaction of a naphthalene-based aromatic polyaniline surface with a halogenated nitrogen, a dicyclopentadiene type cyanate resin, and a biphenylalkyl type cyanate. . The towel of the material is preferably a secret varnish type cyanic acid tree 101113166 23 201247414. Hunting uses a varnish-type cyanate resin, and the crosslink density increases, and the finernity is improved. Therefore, the flame retardancy of the laminated board can be improved. The reason for this is that the awake and varnish-type cyanate resin forms a bismuth after the hardening reaction. Further, it is considered that the reason is that the novolac type cyanate resin has a high ratio of the benzene ring in its structure and is easily carbonized. Further, even when the thickness of the laminated board is 0.6 coffee or less, the resin-like laminated board produced by curing the secret varnish type vinegar resin has excellent rigidity. The rigidity (4) of this type of limb region is excellent in the reliability of the semiconductor component wire. #厂, as a secret varnish type citric acid _lip, for example, the following formula (1) can be used [Chemical Formula 1] Ό ch2. Λ'0, 〇(I) phenol represented by the general formula (I), main π η is an arbitrary integer. The average repeating unit of H cyanate (tetra) is more preferably 2 or more. When the above lower limit is not particularly limited, it is preferred that the heat resistance of the ester resin is increased by more than the lower limit value, and the upper limit of the novolac type cyanic acid η is not desorbed or volatilized at the time of heating. Further, when η is the above upper limit value ^, it is preferably 10 or less, more preferably 7 or less. The formability of the lipid layer is lowered. In addition, it is possible to suppress the melting viscosity and to suppress the tree 101113166 24 201247414 Further, as the cyanate resin, a naphthol type cyanate resin represented by the following formula (II) can be preferably used. The naphthol type cyanic acid hydrazine resin represented by the following formula (11) is, for example, a naphthol such as α-naphthol or a naphthol and a terephthalic acid, α,α'·dimethyl The naphthol aralkyl resin obtained by the reaction of oxy-p-nonylbenzene, hydroxy-2-propyl)benzene or the like is obtained by condensation with cyanic acid. The η of the formula (II) is preferably 1 Å or less. When n is 1 Torr or less, the resin viscosity does not become high, and the impregnation property to the fiber base material is good, and the performance as a laminate is not lowered. Further, it is less likely to cause polymerization in the molecule during the synthesis, and the liquid separation property at the time of washing is improved, and the tendency to lower the yield can be prevented. [Chemical 2]

(In the formula, R represents a hydrogen atom or a methyl group, and η represents an integer of 1 or more.) Further, as the cyanate resin, a dicyclopentadiene type cyan represented by the following formula (III) can be preferably used. Acid ester resin. The dicyclopentadiene type cyanate resin represented by the following formula (III) is preferably such that η of the following formula (III) is 〇 or more and 8 or less. When η is 8 or less, the resin viscosity does not become high, and the impregnation property to the fiber base material is good, and the performance as a laminate can be prevented from being lowered. Further, by using a dicyclopentadiene type cyanate resin, it is excellent in low hygroscopicity and chemical resistance. [化3] 101113166 25 201247414

(III) (n represents an integer of 0 or more and 8 or less) The lower limit of the weight average molecular weight (Mw) of the cyanate resin is not particularly limited, and is preferably Mw of 500 or more, and more preferably Mw of 6 or more. When Mw is at least the above lower limit value, the occurrence of stickiness can be suppressed in the case of producing a resin layer, and the transfer of the fat layer to the time phase or the generation of the target can be suppressed. Further, the upper limit of the Mw is not particularly limited, and is preferably, for example, 4 or less, more preferably leaking, _ or less. Further, when Mw is at most the above upper limit value, the reaction can be suppressed from becoming fast. When the circuit board is formed, it is possible to suppress the occurrence of molding failure or the decrease in interlayer peel strength. Such as cyanate resin, such as GPC (Gel Permeation)

Ch face at. Phy) (gel permeation chromatography, standard material: polystyrene conversion). Further, the cyanic acid resin may be used singly or in combination of two or more kinds of Mw, or two or more kinds thereof may be used in combination with the prepolymers. The content of the thermosetting resin to be contained in the resin composition is not particularly limited as long as it is appropriately adjusted according to the purpose. However, the total amount of the resin composition is preferably 5% by mass or more and 9 gram% or less, more preferably Iq quality% or more 8 〇 quality. /. The following 'excellent' is 2% by mass or more and 5〇 by mass. /〇The following. When the content of the thermosetting resin is at least the above lower limit value, the workability is improved, and it becomes easier to form a resin layer by 101113166 26 201247414. When the content of the thermosetting property is the above-mentioned I number = the strength or the resistance of the tree is increased, the coefficient of the wire of the can layer is lowered and the effect of reducing the warpage of the laminate is improved. As a thermosetting resin, 'in addition to cyanide-resin (especially secret-β-acid vinegar resin, naphthoquinone-type vinegar resin, dicyclopentadiene-type vinegar

In addition to the resin, an epoxy resin (substantially free of the element J) may be used or used in combination. Examples of the epoxy resin include a double-type A-type epoxy resin: a double-type (tetra)-type epoxy resin, a double-type epoxy resin, a fine 8-type epoxy resin, a double-aged Μ oxy resin, and a double needle. Epoxy resin, fine grease and other double-type epoxy resin, benzene _ varnish type epoxy resin, A ^ ^ 黍 two resin and other secret varnish (four) oxygen resin, joint stupid epoxy resin, • ^ this ring Oxygen resin 'biphenyl aromatic silk type epoxy resin, etc. aryl extended alkyl group % milk tree month '(4) type epoxy resin, naphthalene diene type epoxy resin, 4th official epoxy type naphthalene resin, naphthyl group_ Epoxy resin, naphthalene type tree-type epoxy resin and other naphthalene type epoxy resin, 'I type epoxy resin, this type, type % oxygen resin, dicyclopentadiene type epoxy resin, lower boxene type ring Oxygen resin, diamond-fired epoxy resin, first-type epoxy resin, and the like. As an epoxy resin, you can use it alone! These may be used in combination of two or more kinds of different weight average molecular weights, and may be used in combination with one or two of them in combination with the prepolymers. Among these epoxy resins, it is particularly preferred to be an aryl-based epoxy resin. By this, the heat resistance and flame retardancy of the moisture-absorbing solder can be improved. 101113166 27 201247414 The so-called arylalkylene type epoxy tree aryl aryl base epoxy resin. In the example, the daily repeating unit has a biphenyl difluorene-based epoxy resin, etc.: a one-type epoxy resin, a base epoxy resin. Among the biphenyl diphenyl f ° , preferably, it is represented by biphenyl dimethylene σν). The oxygen resin is, for example, of the following formula [Chemical Formula 4]

, 0' / Π - ^ UV) The _ repeating unit η represented by the above formula (IV) is an average of 1 or more, more preferably 2 or more, of an arbitrary integer. When the lower limit is not particularly limited, it is preferably a sister of a bismuth dimethylene type epoxy resin, which is difficult to be used above, so that the operation is easy to be tempered, and 153 is dissolved in a general-purpose solvent. Hereinafter, it is more preferably 5 or less. If the limit is not particularly limited, it is preferably 10 movability, and it is possible to use a resin-like epoxy resin which is made of an epoxy resin other than the above. Thereby, the thermal expansion property of the hydrocarbon can be entered. Improved edge heat resistance, low / condensed (four) fragrant _ structure of the secret varnish (four) oxygen resin is a secret varnish with NaH, thick four stupid U, extended triphenyl, and benzene, Lita condensed ring aromatic hydrocarbon structure Type epoxy resin. The secret varnish Wei oxide resin having a condensed ring aromatic tobacco structure can be arranged in a plurality of (four) fragrance ring rules 101113166 28 201247414, and thus is excellent in low thermal expansion property. Further, since the glass transition temperature is also high, the heat recovery property is excellent. Further, since the molecular weight of the repeating structure is large, the flame retardancy is superior to that of the conventional novolak-type epoxy resin, and the combination with the cyanate resin can improve the vulnerability of the cyanate resin. Therefore, by using the cyanate resin in combination, the glass transition temperature is further increased, so that it is excellent in mounting reliability in connection with lead-free. A novolac type epoxy resin having a condensed ring aromatic hydrocarbon structure is obtained by epoxidizing a novolac type phenol resin synthesized from a phenol compound, a formaldehyde compound, and a condensed cyclic aromatic hydrocarbon compound. The phenolic compound is not particularly limited, and examples thereof include phenol such as phenol, o-nonylphenol, m-nonylphenol, and p-cresol, 2,3-xylenol, 2,4-diphenylphenol, and 2,5. - Diterpene phenol such as dinonylphenol, 2,6-dioxanol, 3,4-dinonylphenol, 3,5-xylenol, and tridecylphenol such as 2,3,5-tridecylphenol Ethylphenol such as o-ethylphenol, m-ethylphenol or p-ethylphenol, alkylphenols such as isopropylphenol, butylphenol and t-butylphenol, o-phenylphenol, m-phenylphenol, Naphthalenediols such as p-phenylphenol, catechol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, resorcinol, catechol, Polyphenols such as benzenediol, pyrogallol, and phloroglucinol, alkyl polyphenols such as alkyl resorcinol, alkyl catechol, and alkyl hydroquinone. Among these, phenol is preferred in terms of cost and effect of providing a decomposition reaction. The aldehyde compound is not particularly limited, and examples thereof include furfural, trimeral aldehyde, trioxane, acetaldehyde, propionaldehyde, polyfurfural, trichloroacetaldehyde, and cyclohexamethylenetetramine, 101113166 29 201247414 Furfural, glyoxal, n-butyraldehyde, hexanal, allylaldehyde, benzaldehyde, crotonaldehyde, acrolein, tetraformaldehyde, phenylacetaldehyde, o-quinone furfural, salicylaldehyde, dihydroxybenzaldehyde, three Hydroxybenzaldehyde, 4-hydroxy-3-hydroxyaldehyde acetal, and the like. The condensed ring aromatic hydrocarbon compound is not particularly limited, and examples thereof include a naphthalene derivative such as a nonoxynaphthalene or a butoxynaphthalene, an anthracene derivative such as an anthracene oxime, a phenanthrene derivative such as methoxyphenanthrene, and the like. Tetrabenzene derivatives, disease derivatives, anthraquinone derivatives, derivative triphenylenes, and benzopyrene derivatives. The novolak-type epoxy resin having a condensed ring aromatic hydrocarbon structure is not particularly limited, and examples thereof include a decyloxynaphthalene-modified o-nonphenol novolac epoxy resin, and a butoxynaphthalene-modified decylphenol novolac varnish. Epoxy resin, and decyloxy naphthalene modified novolac epoxy resin. Among these, a novolac type epoxy resin having a condensed ring aromatic hydrocarbon structure represented by the following formula (V) is preferred. [Chemical 5]

(wherein Ar is a condensed cyclic aromatic hydrocarbon group; and R may be the same or different from each other, and is a hydrocarbon group selected from a hydrogen atom, a carbon number of 1 or more and 10 or less, or an aryl group such as a halogen, a phenyl group or a benzyl group, and an epoxy group. a group in the organic group of the propyl ether; η, P, and q are integers of 1 or more, and the values of p and q may be the same or different in each repeating unit) [Chem. 6] 101113166 30 201247414 &lt; Χ^- (ΑΠ) (Ar2)

(Ar in the formula (V) is a structure represented by (Arl) to (Ar4) in the formula (VI); R in the formula (VI) may be the same or different, and is selected from a hydrogen atom and a carbon number of 1. The above-mentioned 10 or less hydrocarbon group or halogen, aryl group such as phenyl group or benzyl group, and the group in the organic group containing a glycidyl ether) Further, as the epoxy resin other than the above, a naphthol type epoxy resin is preferable. A naphthalene type epoxy resin such as a naphthalene diphenol type epoxy resin, a bifunctional or tetrafunctional epoxy type naphthalene resin, or a naphthyl ether type epoxy resin. Thereby, heat resistance and low thermal expansion property can be further improved. Further, since the 7Τ-7Γ stacking effect of the naphthalene ring is higher than that of the benzene ring, it is particularly excellent in low thermal expansion property and low heat shrinkage property. Further, since the multi-ring structure has a high rigidity effect and the glass transition temperature is particularly high, the heat shrinkage change before and after the reflow is small. The naphthalene type epoxy resin may, for example, be represented by the following formula (VII-1); the naphthalene diphenol type epoxy resin may be represented by the following formula (VII-2); and the bifunctional or tetrafunctional epoxy type may be used. The naphthalene resin can be represented by the following formula (VII-3) (VII-4) (VII-5); and the stannaphthyl ether type epoxy resin can be represented, for example, by the following formula (VII-6). [Chemistry 7]

(η represents an average of 1 or more and 6 or less, and R represents a glycidyl group or a hydrocarbon group having a carbon number of 1,101,113,166, 2012, 2012,474, or more and 10 or less).

(VII-6) (wherein R1 represents a hydrogen atom or a fluorenyl group; and R2 each independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an aralkyl group, a naphthyl group, or a glycidyl ether group; The naphthyl group; 〇 and m are each an integer of 0 to 2, and any one of 〇 or m is 1 or more) The lower limit of the content of the epoxy resin is not particularly limited, and in the resin composition overall 101113166 32 201247414, It is preferably 1 mass. /❶ or more, more preferably 2% by mass or more. When the content is at least the above lower limit value, the reactivity of the cyanate g resin is improved, and the moisture resistance of the product to be described can be improved. The upper limit of the content of the epoxy resin is not particularly limited, but is preferably 55% by mass or less, and more preferably 4% by mass or less. When the content is at most the above upper limit, the heat resistance can be further improved. The lower limit of the weight average molecular weight (Mw) of the J-oxygen resin is not particularly limited, and is preferably Mw of 500 or more, and more preferably Mw of 8 or more. When the Mw is at least the above lower limit, the upper limit of the viscosity of the resin layer can be suppressed from being particularly limited, and it is preferably Mw of 20,000 or less, more preferably Mwl5 or less. When Mw is at most the above upper limit value, when the prepreg is produced, the impregnation property to the fiber base material is improved, and a more uniform product can be obtained. The Mw of the epoxy resin can be determined, for example, by GPC. Use cyanate resin (especially novolak type cyanate resin, naphthol type cyanate resin, dicyclopentadiene type cyanate resin) or epoxy resin (aryl extended alkyl type epoxy resin, In particular, in the case of a biphenyl dihydrazinyl type epoxy resin, a novolac type epoxy resin having a fluorene ring aromatic hydrocarbon structure, or a naphthol type epoxy resin, as a thermosetting resin, it is preferably Further, a phenol resin is used. Examples of the phenol resin include a novolac type phenol resin, a resol type phenol resin, and an aryl alkylene type phenol resin. As the phenol resin, one of these may be used alone, or two or more kinds having different weight average molecular weights may be used in combination, or one or two or more kinds may be used in combination with the prepolymers. Among these, an aryl alkyl phenol resin is particularly preferred. Thereby, it is possible to further improve the heat resistance of the wet zinc paste of 101113166 33 201247414. The arylalkylene type phenol resin may, for example, be a biphenyl dimethylene type phenol resin or the like. The biphenyl dimethylene ketone phenol resin is represented by the following formula (VIII). A soil type phenol resin can be, for example, [Chemical 11]

(VIII) The biphenyl dimethyst position η represented by the above formula (VIII) is an arbitrary integer. The lower limit of n is not particularly limited to 2 or more. If η is the above The upper limit of the value is preferably 1 or more, and the heat is further. The upper limit of the repeating unit η is not particularly limited to increase the resistance, and more preferably 8 or less. If η is equal to or less than the above upper limit, it is preferably 12 to be compatible. It can improve the workability. It is the same as other resins by the above-mentioned cyanate resin (especially the secret varnish type succinic acid bicyclo red ___ and fat, with a base-based epoxy resin, especially Benzene dimethylene type epoxy tree... a _ ring material _ structure _ varnish type epoxy, Cai singer epoxy secret and aryl stretch silk meal resin combination, can control crosslink density, and easier The lower limit of the content of the phenolic tree is not particularly limited, and is preferably 1% by mass or more, and more preferably 5% by mass or more, based on the total amount of the resin composition. 'It can improve heat resistance. Also, the upper limit of the content of 10Π13Ι66 34 201247414 of lyophilic fat is not particularly limited. The total weight of the lipid composition is preferably 5 s mass% or less, more preferably 4 〇 mass% or less. If the content of the phenol resin is less than or equal to the above upper limit value, the characteristics of low thermal expansion can be improved. The weight average molecular weight of the aged resin (Mw) The lower limit of the method is not particularly limited, and Min Jia is Mw400 or more, and is preferably Mw500 or more. If Mw is more than the above lower limit, viscosity can be suppressed in the resin layer. It is not particularly limited, and it is preferably Mwl 8,000 or less, more preferably Mwl 5'000 or less. When Mw is at most the above upper limit value, the impregnation property in the fiber base material is improved in the production of the prepreg, and it is obtained. A more uniform product. The Mw of the phenol resin can be measured, for example, by Gpc. Further, the use of cyanate g resin (especially the secret varnish type gas acid riding resin: naphthalene-type cyanate-lipid, dicyclopentadienyl cyanide Acid resin), resin (square-based stretch-type resin, especially biphenyl dithylene-based resin), and epoxy resin (aryl-based epoxy resin, especially biphenyl dimethine Base type epoxy resin, condensed ring aromatic smoke structure When a combination of a varnish-type epoxy resin and a naphthalene-epoxy_) is used to form a substrate (particularly a circuit board), particularly excellent dimensional stability can be obtained. • The composition preferably contains an inorganic filler. In this way, even if the thickness of the laminate is reduced, the strength can be increased. Further, the low thermal expansion of the laminate can be further improved. (Inorganic filler) Examples of the inorganic filler include talc, Calcined clay, uncalcined 101113166 201247414 = soil, mica _, glass scale (four) salt; titanium oxide, oxygen, water, earth, two Chu cut, smelting dioxide oxide; carbonic acid, magnesium carbonate, hydrotalcite Recognize salt 'milk oxide Ming, magnesium hydroxide, hydroxide hydroxide; sulfur-&, side calcium, barium sulfite and other sulfates or sulfites; zinc borate, partial - 夂钡 33, fine, Shed acid scale salt; nitrogen she, said bismuth nitride, carbon nitride and other nitrides; barium titanate, barium titanate and other titanate. (2) As the inorganic filler, one of these may be used alone, or may be used in combination, in the above-mentioned, etc., particularly preferably cerium oxide, and is preferably a melting oxidizing dream in terms of excellent low thermal expansion property. . The shape of the melted oxidized carbofuran is broken and spherical. In order to ensure high filling of the inorganic filler and impregnation into the fibrous substrate, a method suitable for the purpose can be employed, for example, spherical cerium oxide or the like is used to lower the melt viscosity of the resin composition. The lower limit of the average particle diameter of the inorganic filler is not particularly limited, but is preferably 〇1 or more, and more preferably 〇1 or more. When the particle diameter of the inorganic filler is not less than the above lower limit, the viscosity of the varnish can be suppressed from being increased, and the workability in producing the prepreg can be improved. Further, the upper limit of the flat_path is not Tronidine, preferably 5.0 or less, and more preferably 2. When the particle diameter of the inorganic filler is not more than the above upper limit, it is possible to suppress the precipitation of the filler in the varnish, and to obtain a more uniform resin layer. Further, when the L/S of the conductor circuit of the inner substrate is less than 20/20 / zm, the insulation between the wirings can be suppressed from being affected. & The average particle size of the inorganic filler is determined by, for example, the laser diffraction type particle size distribution 10Π13166 36 201247414 疋 疋 ( (made by HORIBA, LA_秦), and the particle size distribution of the particles is determined on a volume basis. D5Q) is set to an average particle diameter. Further, the inorganic filler is not particularly limited, and an inorganic filler having an average particle diameter of monodisperse can be used. An inorganic filler having an average particle diameter of polydisperse can also be used. Further, one type or two or more types of inorganic fillers having an average particle diameter of monodisperse and/or polydisperse may be used. Preferably, the inorganic filler is a spherical spheroidal oxide having an average particle diameter of 5 G _ or less, more preferably an average particle diameter _, and a spherical shape of 2 G _ or less is further substituted for the filling of the inorganic filler. Sex. The content of the inorganic filler is not particularly limited, and is preferably 20% by weight or more and 8% by weight or less based on the total amount of the resin composition, more preferably 3% by weight or more and 5% by weight or less. If the content is in the above range, it is particularly low in thermal expansion and low in water absorption. Further, the resin composition used in the present embodiment may be formulated with a rubber, and for example, rubber particles may be used. Preferable examples of the rubber particles include core-shell type rubber particles, crosslinked (tetra) nitrile, digreen rubber, crosslinked stearky ethylene butadiene rubber particles, acrylic rubber particles, and polyfluorene oxide particles. The core-shell type rubber particles are rubber particles having a core layer and a shell layer. For example, the shell layer of the outer layer is composed of a glassy polymer, the core layer of the inner layer is composed of a rubbery polymer, or the shell layer of the outer layer is composed of a _ polymer. The intermediate layer is composed of a rubbery polymer. , a three-layer structure composed of glass. ° 101113166 37 201247414 The glassy polymer layer is composed of, for example, a polymer of decyl methacrylate or the like. The rubber polymer layer is composed of, for example, acrylic acid butyl polymer (butyl rubber). Specific examples of the core-shell type rubber particles include Staphyl〇id AC3822, AC3816N (trade name: manufactured by Ganz Chemical Co., Ltd.), and Metablen KW-4426 (trade name, manufactured by Mitsubishi Rayon Co., Ltd.). Specific examples of the particles of the crosslinked acrylonitrile-Butadiene rubber (NBR) include XER-91 (average particle diameter 0.5, manufactured by JSR Corporation). Specific examples of the cross-linked SBR (Styrene-Butadiene Rubber) particles include XSK_5〇〇 (average particle diameter & 5 &quot; m, manufactured by JSR Corporation). Specific examples of the acrylic rubber particles include Metablen W300A (average particle diameter 〇" #m), W45 〇 A (average particle diameter 0.2 ym) (manufactured by Mitsubishi Rayon Co., Ltd.), and the like. The poly-stone oxide particles are not particularly limited as long as they are organic-poly(oxygen)-like rubber elastic fine particles, and examples thereof include a poly-oxygen rubber (organic polyoxo-fired crosslinked elastomer). The microparticles and the core-shell structured particles obtained by coating the core portion of the poly-stone of the two-dimensionally crosslinked body with a three-dimensional crosslinked body are coated with a core. As the polyoxyethylene rubber microparticles, KMP-605, KMP-600, ΚΜΡ-597, KMP-594 (manufactured by Shin-Etsu Chemical Co., Ltd.), Torayfil E-500, T〇rayfil E_6〇〇 (T〇RAY. DOWCORNING) can be used. ) and other commercial products. The content of the rubber particles is not particularly limited, and the inorganic filler, the base 101113166 38 201247414, is preferably 2% by weight or more and 8% by weight or less, more preferably 30% by weight or more, based on the total amount of the resin composition. % to D.婪八曰治—Jerry/〇 below. When the right side is set to the range, it is especially low in water absorption. (Other additives) Further, an additive such as a coupling agent, a hardening accelerator, a hardener, a thermoplastic resin, or an organic filler may be appropriately blended in the resin composition as needed. The resin composition used in the present embodiment can be preferably used in a liquid form in which the above components are dissolved and/or dispersed by an organic solvent or the like. By the use of the coupling agent, the wettability of the interface between the thermosetting resin and the inorganic filler is improved, and the resin composition can be uniformly set in the fiber base material. Therefore, it is preferred to use a coupling agent to improve heat resistance, and in particular to improve solder heat resistance after moisture absorption. The coupling agent may be used as long as it is usually used as a coupling agent. Specifically, it is preferably selected from an epoxy decane coupling agent, a cationic decane coupling agent, an amino decane coupling agent, and a titanate coupling agent. And one or more coupling agents of the polyoxygenated oil type coupling agent. Thereby, the wettability with the interface with the inorganic filler can be improved, whereby the heat resistance can be further improved. The lower limit of the amount of the coupling agent to be added is not particularly limited, and is preferably 5% by mass or more, more preferably 〇 by mass or more, based on 100 parts by mass of the filler. When the content of the coupling agent is at least the above lower limit value, the filler can be sufficiently coated to improve heat resistance. Further, the upper limit of the amount of addition is not particularly limited, but is preferably 3 parts by mass or less, more preferably 2 101113166 39 201247414 parts by mass or less. When the eighth θ 右 right δ 蕙 is equal to or less than the above upper limit value, it is possible to suppress the decrease in the strength of the damper dam. As the hardening accelerator, a known one can be used. For example, there may be mentioned an organic metal salt such as a sulphuric acid sulphuric acid, a sulphuric acid sulphate, a succinate, a octanoic acid, a acetoacetone (II), a triethyl sulfonium ketone (III), a triethylamine or a tributylamine. a tertiary amine such as diazabicyclo[2,2,2]octane; 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl·4·B (tetra)&lt;lt ; 2_phenyl_4_methyl collar base material, 2 phenyl-4,5_ di-base base material; silk, double A, sulfhydryl (4) compound; acetic acid: benzoquinone ^ salicylic acid , such as organic acids such as benzophenone; guanidinium salts and the like, or a mixture thereof. As a kind of hardening promotion, it can be used alone or in combination with two or more kinds of derivatives. The rust salt compound represented by the following formula (IX), which contains such a derivative, is not particularly limited, and is, for example, a sulfonium salt compound.化X) RJ-PR* (wherein P represents a fill atom, R1, Han 2 xu R and R4 respectively represent a substituted or unsubstituted organic or heterocyclic organic group, or substituted or Unsubstituted aliphatic groups' and may be identical to each other and may be different; A- represents an anion having at least one n(n^l) valence proton donor having a proton released to the molecular group in the molecule, or The wrong anion) 101113166 40 201247414 The content of the hardening accelerator and the helmet is particularly limited, and it is preferably 0.01% by weight of the resin composition as a whole and 5 parts by weight of I. /,,, τ is in the range of /° or less, more preferably 1·1% by weight or more and 2% by weight or less. When the content is at least the above-mentioned lower limit of the scoop, the effect of promoting hardening can be sufficiently exerted. When the content is at most the above upper limit, the preservability of the prepreg can be further improved. In the present embodiment, H and the towel composition may further comprise a phenoxy resin, a polyimine resin, a poly-aniline resin, a polyphenylene-ester, a polyether fat-reducing, «resin, poly(10) resin, polyphenylene _ material _ resin; styrene-butadiene dimer copolymer, styrene. Ion red polymer or other copolymer, polystyrene _ heat by elastomer, hydrocarbon green plastic elastomer, polyamine amine elastomer, Thermoplastic elastomers such as poly-branched elastomers; polybutadiene, epoxy-modified polybutadiene, acryl-based modified polybutadiene, methacrylic ruthenium-based Elastomer. Examples of the phenoxy resin include a phenoxy resin having a double skeleton, a naphthyloxy resin, a strepoxy resin having an anthracene skeleton, and a benzene-based resin having a biphenyl skeleton. A phenoxy resin having a plurality of configurations of the skeletons can also be used. Among these, the phenoxy resin towel is made of a phenolic resin having a material skeleton and a double s skeleton. By virtue of the rigidity of the biphenyl skeleton, the glass transition temperature of the phenoxy resin can be increased, and the adhesion of the epoxy resin to the metal can be improved by the presence of the bisphenol s skeleton. As a result, the heat resistance of the laminated board can be improved, and the adhesion of the wiring layer to the laminated board of 101113166 201247414 can be improved when the circuit board is manufactured. Further, in the phenoxy resin, a phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton is preferably used. Thereby, in the production of the circuit board, the adhesion of the wiring layer to the laminated board can be further improved. Further, it is also preferred to use a phenoxy resin having a bisphenol acetophenone structure represented by the following formula (X). [Chem. 13]

(wherein K may be the same or different from each other, and is a group selected from a hydrogen atom, a hydrocarbon group having 1 or more and 10 or less carbon atoms, or a halogen group; and R2 is a hydrocarbon group selected from a hydrogen atom and a carbon number of 1 or more and 10 or less. R3 is a hydrogen atom or a hydrocarbon group having 1 or more and 10 or less carbon atoms, and m is an integer of 0 or more and 5 or less.) The phenoxy resin having a bisphenol acetophenone structure has a bulk structure, and thus solvent solubility or The prepared thermosetting resin component is excellent in compatibility. Further, since a uniform rough surface can be formed with low roughness, the fine wiring formation property is excellent. The phenoxy resin having a bisphenol acetophenone structure can be synthesized by a known method such as a method in which a catalyst is used to quantify an epoxy resin and a desired resin. The phenoxy resin having a bisphenol acetophenone structure may contain a structure other than the bisphenol acetophenone structure of the formula (X), and the structure is not particularly limited, and examples thereof include bisphenol A type and bisphenol F. Type, bisphenol S type, biphenyl type, phenol novolac varnish 101113166 42 201247414 type, cresol novolak type structure, etc. Among them, a structure containing a biphenyl type is preferred because the glass transition temperature is high. The content of the double acetophenone structure of the formula (X) in the phenoxy resin having a acetophenone structure is not particularly limited, and is preferably 5 mol% or more and 95 mol% or less, more preferably 1 〇 mol% or more Mo G/. Hereinafter, it is further preferably - 15 mol% or more and 75 mol% or less. When the content is at least the above lower limit value, the effect of improving heat resistance and moisture resistance reliability can be sufficiently exhibited. Further, when the content is at most the above upper limit value, solvent solubility can be improved. The weight average molecular weight (Mw) of the phenoxy resin is not particularly limited, but is preferably Mw 5, _ or more and 100 or less, more preferably 1 Å or more and 7 Å or less, and still more preferably 20,000 or more. 5〇, 〇〇〇 below. When Mw is at most the above upper limit value, the solubility with the lyophile or the solubility in the solvent can be improved. When it is at least the above lower limit value, the film formability is improved, and it is possible to suppress an abnormality in the case of use in the manufacture of a circuit board. The content of the phenoxy resin is not particularly limited, and is preferably 5% by mass or more and 4% by mass or less, more preferably 2% by mass or more and 2% by mass or less, based on the resin composition excluding the filler. When the content is at least the above lower limit value, it is possible to suppress a decrease in the mechanical strength of the insulating resin layer or a decrease in the adhesion to the conductor circuit. When the value is at most the above upper limit, the increase in the thermal expansion coefficient of the insulating layer can be suppressed, and the heat resistance can be lowered. Additives other than the above components, such as a pigment, a dye, an antifoaming agent, a leveling agent, a UV absorber, a foaming agent, an antioxidant, a flame retardant, and an ion trap 101113166 43 201247414, may be added to the resin composition. Examples of the pigment include inorganic pigments such as kaolin, synthetic iron oxide red, cadmium yellow, nickel titanium yellow, yttrium yellow, hydrous chromium oxide, chromium oxide, cobalt aluminate, and synthetic ultramarine; polycyclic pigments such as phthalocyanine; and azo Pigments, etc. Examples of the dye include isoindolinone, isoporphyrin, quinophthalone, dibenzopyran, diketopoxime, oxime, piperidone, anthraquinone, indigo, and sulfonium. Hey. Ketone, Benzo sylvestin, violanthrone, ugly phthalocyanine, methine azo, and the like. (Laminated sheet with metal foil) Next, the metal foil-clad laminate 200 in the present embodiment will be described. The laminate 1a in the present embodiment may be a metal foil-clad laminate 2 having a metal foil 201 formed on at least one side as shown in Fig. 4. The thickness of the metal 4 is preferably! _ above 18 _ below. More preferably 2 or more and 12 or less. When the thickness of the metal foil 201 is within the above range, a fine pattern can be formed, and the laminated board can be made thinner. Examples of the metal constituting the metal crucible 2〇1 include copper and a copper alloy, a material, an alloy, a silver and a silver alloy, a gold and a gold alloy, zinc, and a rhodium and a gold alloy. Tin and tin alloys, iron and iron alloys, Kovar (trade name), 42 her, Invar or Super Invar alloys, W or Mr» Chu π '. Further, an electrolytic copper foil with a carrier or the like may be used. Further, in place of the metal foil 201, at least a single-layer layer 101113166 201247414 of the laminated board 100a in the present embodiment may be used. Examples of the film include polyethylene, polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyimide, and fluorine resin. A method of manufacturing the laminated board 200 with a metal case is as follows, for example. In the case of a laminate obtained by laminating two prepregs, the metal foil is superposed on the lower side or the single side of the first prepreg and the second prepreg of the laminated layer, using a laminator device or a vacuum. The pressurizing device engages the joints under high vacuum conditions. Or directly on the outer side of the first prepreg and the second prepreg, the metal foil is overlapped on the lower side or on one side. Then, a laminated plate is obtained by heating and pressurizing a prepreg, a metal foil, or the like by a vacuum press, or by heating with a dryer. (Laminated sheet with build-up layer) Next, the build-up board 300 with the build-up layer in the present embodiment will be described. The laminated board 100a may further form a build-up layer 303 including a fifth fibrous base material layer 301 and a resin layer on the upper portion of at least one side 10 of the laminated board as shown in Fig. 5 . Here, the fifth fibrous base material layer 301 may not be included. However, if the fifth fibrous base material layer 301 is included, the effect of preventing the warpage of the buildup-attached laminate 300 is improved. Further, at this time, in order to more effectively obtain the anti-turbine effect of the build-up board 300 with the build-up layer, it is preferable to form the one side 110 and the fifth fiber base material layer 301 in the lamination direction as shown in FIG. The distance from the center line A5 is set to D6, and when the distance between the surface 310 of the 101113166 45 201247414 layer and the center line A5 of the fifth fiber base layer is D7, the layer 3 is formed in such a manner as to satisfy the condition of D6 &gt; D7. 〇 3. The method of laminating the buildup layer 303 is not particularly limited, and may be the same as the method of laminating the buildup plate 100a. Other methods may be used. The material used in the buildup layer 303 is not particularly limited, and materials used in the laminate 100a may be used as appropriate, and other materials may be used. Further, the method of producing the buildup layer 303 is not particularly limited, and may be the same as the first prepreg 104 or the second prepreg 1〇8 in the present embodiment, and may be another manufacturing method. (Circuit Substrate) Next, the circuit board 400 in the present embodiment will be described. The laminate 100a can be used for the circuit substrate 400 as shown in FIG. The method of manufacturing the circuit board 400 is not particularly limited, and for example, there are the following methods. The via hole 405 for interlayer connection is formed in the metal foil-clad laminate 200 formed by the above method, and the wiring layer 401 is formed by a subtractive method, a semi-additive method, or the like. Thereafter, an optional build-up layer 303 is laminated, and the circuit board 400 is manufactured by repeating the steps of interlayer connection and circuit formation by an additive method. Here, some or all of the build-up layers may or may not comprise a fibrous substrate layer. (Circuit board with solder resist layer) Next, the circuit board 5A with the solder resist layer in the present embodiment will be described. The circuit substrate 400 may also be formed on at least one side of the circuit substrate, as shown in FIG. 8 , 101113166 46 201247414 11 〇 (the surface 31 of the build-up layer when the layer is opened) to form the sixth fiber substrate layer 501. The solder resist layer 5〇3 with the resin layer. Here, the sixth fiber base material layer 501 may not be included. However, if the sixth fiber base material layer 5〇1 is included, the warpage preventing effect of the circuit board 500 with the solder resist layer is improved. Further, at this time, in order to more effectively obtain the warpage preventing effect of the circuit board 5 with the solder resist layer, it is preferable to form a build-up layer in the lamination direction as shown in FIG. In the case where the surface of the layered layer 310) is spaced from the center line A6 of the sixth fiber substrate layer 501, the distance between the surface 51 of the solder resist layer and the center line of the sixth fiber substrate layer 501 is When the distance is set to D9, the solder resist layer 5〇3 is laminated in such a manner that the condition of D8 &gt; D9 is satisfied. The method of laminating the solder resist layer 503 is not particularly limited, and may be the same as the laminating method of the laminated board 10a or the build-up layer 3〇3 in the present embodiment, or may be another method. The material used in the barrier layer 503 is not particularly limited, and materials used in the laminate 100a or the buildup layer 3〇3 of the present embodiment can be suitably used, and other materials can be used. Further, the method for producing the solder resist layer 503 is not particularly limited, and may be the same as the first prepreg 1〇4, the second prepreg 1〇8, or the buildup layer 3〇3 in the present embodiment. It can also be used for other production methods. (Semiconductor Package) Further, the semiconductor package 6' shown in Fig. 1A can be manufactured by mounting the semiconductor element 601' in the circuit board 5A of the present embodiment. The semiconductor package 600 in the form of the present invention is not particularly limited, and is, for example, a laminated board 10a with a metal foil processed by a circuit, a build-up layer 303, a solder resist layer 5〇3, and a semiconductor element 601. By. The method of manufacturing the semiconductor package 600 is not particularly limited, and for example, there are the following methods. The semiconductor element 601 is mounted on the upper portion of the laminated board 1 〇〇a having the barrier layer 5〇3. At this time, the semiconductor element 6?1 and the wiring layer 401 are bonded to each other in the via hole 403 by the bump 603. Thereafter, underfill is performed by the underfill 605. In this way, a semiconductor package can be obtained. As described above, according to the present embodiment, the laminated board 100a with reduced warpage can be provided. In particular, it is also possible to effectively suppress the occurrence of warpage even when it is convenient to form a laminate having a thin thickness. Further, the circuit board using the laminated board 10a is excellent in mechanical properties such as warpage and dimensional stability, and excellent in moldability. Therefore, the laminated board 100a can be preferably used for applications requiring high reliability, high-density printed wiring boards and the like for reliability. The laminated board 10〇a can also reduce the occurrence of facial curvature in the above-mentioned circuit processing and subsequent processes. Therefore, the semiconductor package 600 in the present embodiment is less likely to cause warpage and cracking, and can be made thinner. Further, as shown in Figs. 11 to 16, a plurality of prepregs including a fibrous base material layer and a resin layer may be laminated between the first prepreg 104 and the second prepreg 108. In the following embodiments, the differences from the embodiment (A) will be mainly described. 101113166 48 201247414 <Embodiment (B)> Hereinafter, Embodiment (B) will be described. In the embodiment (B), the number n of layers of the fibrous base material layer contained in the laminated sheet is 3. According to this embodiment, the same effects as those of the embodiment (A) can be obtained. Further, since the number of layers η of the fibrous base material layer is larger than that of the embodiment (A), more excellent mechanical strength can be obtained. Further, when the number of layers in the fibrous base material layer is 3, the second fibrous base material layer 1〇1a and the fourth fibrous base material layer 10a5a represent the same fibrous base material layer. Therefore, the description will be made hereinafter using the first fibrous base material layer 101, the second fibrous base material layer 1〇1 & and the third fibrous base material layer 105. Fig. 11 is a cross-sectional view showing the configuration of a laminated board 100b in the present embodiment. The laminated board l〇〇b is a first prepreg 1〇4 including the first fibrous base material layer ι1, the first resin layer 102, and the second resin layer 103, and includes the first fibrous base material layer. a third prepreg 703 of the first resin layer 701 and the sixth resin layer 7〇2, and a third fiber base material layer 1〇5, a third resin layer 106, and a fourth resin layer 107 The second prepreg 1〇8 is formed, and the first fibrous base material layer 101 and the third fibrous base material layer 1〇5 are laminated on the outer side in the lamination direction. In this case, "disposed on the outer side" means that the center line A1 of the first fiber and the base material layer 101 and the second fiber base material layer 101a adjacent to the first fiber base material layer 101 are as shown in FIG. The distance from the center line A3 is set to D1, 101113166 49 201247414. When the distance between the center line A2 and the A3 of the third fiber base material layer 105 is D2, the conditions satisfying D3/3&lt;D1 and D3/3&lt;D2 are satisfied. Configure it in either way. Further, in order to more effectively obtain the warpage preventing effect of the laminated board, it is preferable to arrange it so as to satisfy the conditions of D4 &lt; D1 and D5 &lt; D2. Moreover, in order to obtain the anti-warpage effect of the laminated board more efficiently, it is preferable that the first fibrous base material layer 10 and the third fibrous base material layer are symmetrically symmetric with respect to the center line B1 of the laminated board, as shown in FIG. In the arrangement, it is more preferable to arrange the second fiber base material layer l〇la on the center line of the laminated plate (manufacturing method of the laminated board). The manufacturing method of the laminated board 10b in this embodiment is shown in FIG. 12 (a) - FIG. 12 (d) is a sectional view which shows the manufacture of the laminated board in this embodiment. First, the first prepreg 104' including the first fiber base layer 101, the first tree riding layer 1〇2, and the second resin layer 103 is prepared to include the second fiber material layer 101a, the fifth resin layer 701, and The sixth resin layer 702 is: r & 顶 〜 top immersion body 703, and includes a third fiber base material layer 105, a third resin layer 〇6, a pole Bt η, a fourth tree such as layer 107 Prepreg 108. At this time, the third prepreg 703 has the same thickness as the fifth resin layer 701 and the sixth tree layer, and the second fiber base layer is disposed on the center line 第三2 of the third prepreg 703 with respect to the thickness direction. The way it is formed. 3, the prepreg which will arrange the fiber substrate on the center line of the prepreg is called, 101113166 201247414 prepreg. The thickness of the fifth resin layer and the sixth resin layer 7〇2 of the symmetrical prepreg is usually 1 or more and 1 〇〇 Mm or less. Then, as shown in FIG. 12(a), the first prepreg is sequentially superposed on the outer side of the prepreg in the lamination direction of the first fibrous base layer 101 and the third fibrous base layer 105. Body 104, third prepreg 703 and second prepreg, 108. In this case, "disposed on the outer side" means that the center line A1 of the first fibrous base material layer 101 and the second fibrous base material layer adjacent to the first fibrous base material layer 101 are as shown in FIG. The distance from the center line A3 of la is set to D1, and when the distance between the center line A2 of the third fiber base material layer 105 and A3 is D2, any of the conditions of D3/3 &lt; D1 and D3/3 &lt; D2 is satisfied. The way to configure. Further, in order to more effectively obtain the warpage preventing effect of the laminated board, it is preferable to arrange as shown in Fig. 11 so as to satisfy the conditions of D4 &lt; D1 and D5 &lt; D2. Further, in order to more effectively obtain the warpage preventing effect of the laminated board, it is preferable to form the first fibrous base material layer 1〇1 and the third fibrous base material layer 105 as shown in Fig. 11 • for the center line of the laminated board B1 is symmetrically arranged, and it is more preferable to arrange the second fiber base material layer on the center line B1 of the laminate. Further, the method of laminating is not particularly limited, and for example, the same method as in the embodiment (A) can be used. Finally, the first pre-sports 1 and the third prepreg 101113166 51 201247414 703 and the second prepreg 108 which are heavy in the above manner are heated and pressed to form, as shown in FIG. 12(b). The laminated board 10b in the present embodiment is shown. Further, as shown in Fig. 12(c), a symmetrical prepreg having a different thickness is used, and the laminated plate 100b2 of the present embodiment as shown in Fig. 12(d) can be obtained. Further, the materials used in the laminates 100b and 100b2 in the present embodiment are not particularly limited, and the materials used in the embodiment (A) can be suitably used, and other materials can be used. Further, in the same manner as in the embodiment (A), the laminated board with the metal foil, the laminated board with the build-up layer, the circuit board, and the solder resist layer can be produced by using the laminated board 10b in the present embodiment. A laminate and a semiconductor package on which semiconductor elements are mounted. &lt;Embodiment (C)&gt; Hereinafter, embodiment (c) will be described. In the embodiment (C), the number of layers η of the fibrous base material layer contained in the laminated sheet is 4. According to this embodiment, the same effect of reducing warpage as in the embodiments (Α) and (Β) can be obtained. Further, since the number of layers η of the fiber base material layer is larger than that of the embodiment (Α) and (Β), more excellent mechanical strength can be obtained. Fig. 13 is a cross-sectional view showing the configuration of a laminated board 100c in the present embodiment. The laminated board 100c sequentially stacks the first prepreg 104' including the first fibrous base material layer 101, the first resin layer 102, and the second resin layer 103, and includes the second fibrous base material layer l〇la, the fifth resin. The third prepreg 703 of the layer 701 and the sixth resin layer 702 includes a fourth fiber base layer i〇5a, a seventh resin layer 101113166 52 201247414 801, and a fourth prepreg 803 of the eighth resin layer 802. And a second prepreg 108 comprising a third fibrous base material layer 105, a third resin layer 1〇6, and a fourth resin layer 1〇7, and further comprising a first fiber base in the lamination direction The material layer 101 and the third fiber base material layer 105 are laminated on the outer side. In this case, the phrase "disposed on the outer side" means that the center line A1 of the first fiber base material layer 101 and the second fiber base material layer adjacent to the first fiber base material layer 101 are formed as shown in FIG. The distance from the center line A3 of la is set to D1, and the distance between the center line A2 of the third fiber base material layer 105 and the center line A4 of the fourth fiber base material layer 10a adjacent to the third fiber base material layer 105 is set. In the case of D2, it is configured such that any of the conditions of D: 3M &lt; D1 and D3M &lt; D2 is satisfied. Further, in order to more effectively obtain the warpage preventing effect of the laminated board, it is preferable that the two are arranged in such a manner as to satisfy the conditions of D4 &lt; D1 and D5 &lt; D2. In order to obtain the anti-warpage effect of the laminated board more effectively, it is preferable that the first fiber base material layer 1〇1 and the third fiber base material layer 1〇5 are opposed to each other, and the center line of the laminated board is respectively symmetric as shown in the figure. More preferably, the second/second fiber base material layer and the fourth fiber base material layer 10a are symmetrically arranged with respect to the center line B1 of the laminated plate. (Manufacturing Method of Laminated Sheet) FIG. 16 is a view showing a method of manufacturing the laminated board of the present embodiment.

101113166 53 201247414 First, 'preparing the first prepreg 104' including the first fibrous base material layer 101, the first resin layer 1〇2, and the first resin layer 103 to include the second fibrous base material layer l〇la, fifth The resin layer 701 and the third prepreg 7〇3 of the sixth resin layer 7〇2 include the fourth fiber base material layer 1〇5a, the seventh resin layer 8〇1, and the fourth resin layer 802. The prepreg 803 and the second prepreg 1〇8 including the third fibrous base material layer 1〇5, the third resin layer 106, and the fourth resin layer 1〇7. At this time, the first prepreg 104 and the second prepreg 108 are asymmetric prepregs, and the third prepreg 703 and the fourth prepreg 803 are symmetric prepregs. Then, as shown in FIG. 14( a ), the first prepreg is sequentially superposed in such a manner that the first fibrous base material layer 101 and the third fibrous base material layer 105 are disposed on the outer side in the lamination direction of the prepreg. 104. A third prepreg 703, a fourth prepreg 8〇3, and a second prepreg 108. In this case, "disposed on the outer side" means that the center line A1 of the first fibrous base material layer 101 and the second fibrous base material layer adjacent to the first fibrous base material layer 1 〇1 are as shown in FIG. The distance from the center line A3 of 101 a is set to 〇1. The distance between the center line A2 of the third fiber base material layer 105 and the center line A4 of the fourth fiber base material layer i〇5a adjacent to the third fiber material layer 105 When it is set, the conditions of any of the conditions of D3/4&lt;D1 and D3/4&lt;D2 are satisfied. Further, in order to more effectively obtain the warpage preventing effect of the laminated board, it is preferable to arrange as shown in Fig. 13 so as to satisfy the conditions of D4 &lt; D1 and D5 &lt; D2. Moreover, in order to obtain the anti-warpage effect of the laminated board more effectively, it is preferable to display the first fibrous base material layer ι〇1 and the third fiber base material layer ι〇5 with respect to the laminated layer as shown in Fig. 11113166 54 201247414 13 The center line B1 of the plates is symmetrically arranged, and it is more preferable to satisfy the second fiber base material layer 10a and the fourth fiber base material layer; [05a is symmetrically arranged with respect to the center line B1 of the laminated board. Further, the method of laminating is not particularly limited, and for example, the same method as in the embodiment (A) or the embodiment (B) can be used. Finally, the first prepreg 104, the third prepreg 7〇3, the fourth prepreg 803, and the second prepreg 1〇8 which are overlapped in the above manner are formed by heating and pressurizing, thereby obtaining The laminated board 100c in this embodiment shown in Fig. 14 (b). Further, as shown in Fig. 15 (a), a symmetrical prepreg having different thicknesses can be obtained, and the laminated board i 〇〇 c2 in the embodiment of Fig. 15 (b) can also be obtained. Further, as shown in Fig. 16 (a), four asymmetrical prepregs are laminated, and the laminated plate i00c3 in the present embodiment as shown in Fig. 16 (b) can also be obtained. Further, the materials used in the laminates 10c, 10c, and 100c3 in the present embodiment are not particularly limited, and the materials used in the embodiment (A) or (B) can be suitably used. Other materials can be used. In the same manner as in the embodiment (A) or (B), the laminated board 100c' of the present embodiment can be used to form a laminated board with a metal foil, a laminated board with a build-up layer, a circuit board, and a solder resist. A laminate of layers and a semiconductor package on which semiconductor elements are mounted. The embodiments of the present invention have been described above, but these are examples of the present invention. Various configurations other than the above may be employed. For example, in the laminated board, the number of layers of the fibrous base material layer contained in 101113166 55 201247414 is ▼__7]&gt; (A) to (C), and the laminated board in the present embodiment can also be obtained. The present invention will be described by way of examples and comparative examples, but the present invention is not intended to be limited thereto. Further, in the examples, the parts are not particularly specified in parts by weight. Further, the thickness of the layer is expressed by the average film thickness. In the examples and comparative examples, the following raw materials were used. Epoxy Resin A: Biphenyl aryl silk type _ varnish epoxy resin (manufactured by Nippon Kayaku Co., Ltd., NC-3000) 'Epoxy resin B. Naphthalene skeleton modified A secret lacquer type epoxy resin company, EXA- 7320) Epoxy resin c: naphthalene diphenol diepoxypropyl ether (manufactured by DIC, EPICLON HP-4032D) Epoxy resin D: naphthalene ether type epoxy resin (manufactured by DIC Corporation, Hp_6〇〇〇) Epoxy resin E: Polyfunctional naphthalene type epoxy resin (manufactured by DIC Corporation, HP-4750) Cyanate resin A: Novolak type cyanate resin (manufactured by L〇nza Japan Co., Ltd., Primaset PT-30) Cyanate S resin B · Double-awaiting type A gas-acid resin (manufactured by L〇nza Japan Co., Ltd., Primaset BA230) Cyanate resin C: p-terephthalene modified naphthol aralkyl type cyanate resin represented by the formula (II) (naphthol aralkyl type phenol resin (produced by Dongdu Chemical Co., Ltd. 101113166 56 201247414 "SN-485") and cyanogen chloride) Phenolic resin A ··Biphenyl dimethylene phenol resin (Japan) Manufactured by a pharmaceutical company, GPH-103) Phenol Resin B: Naphthol aralkyl type phenol resin (manufactured by Dongdu Chemical Co., Ltd., SN-485), Bismaleimide Resin A (Manufactured by KI Chemical Industry Co., Ltd., BMI-70) Phenoxy Resin A: Phenoxy resin containing bisphenol acetophenone structure (synthesis example) Tetrakilyl biphenyl type ring is added to a reaction container of 1 L capacity Oxygen resin ("γχ_4000" manufactured by Japan Epoxy Resins Co., Ltd., epoxy equivalent 185 g/eq) 100 g, bisphenol acetophenone 80 g, and cyclohexanone 70 g were stirred and dissolved. Then, 0.4 g of a 50 wt% tetramethylsulfate solution was added dropwise, and the mixture was reacted at 180 ° C for 5 hours under a nitrogen atmosphere. After completion of the reaction, the precipitate was filtered, and vacuum-dried at 95 ° C for 8 hours using a vacuum dryer to obtain a weight average molecular weight of 38,000 represented by the above formula (X) and a glass transition temperature of 13 (TC). A phenoxy resin containing a bisphenol acetophenone structure. Filler A: Spherical silica dioxide (made by Admatechs Inc. 'SO-32R, average particle size 1 ym) Filler B: Spherical cerium oxide (Tokuyama) Manufactured by the company, NSS-5N, average particle size 75 nm) Filler C: Aluminum hydroxide (manufactured by Showa Denko, HP-360) 101113166 57 201247414 Filler D: Polysiloxane particles (manufactured by Shin-Etsu Chemical Co., Ltd., KMP600, Average particle size 5 /zm) Coupler A: 7-glycidoxypropyltrimethoxy decane (GE Toshiba Silicone, A187) Coupler B: Epoxy decane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM- 403E) Hardening catalyst A: Phosphorus-based catalyst of the rust salt compound of the above formula (IX) (manufactured by SUMITOMO BAKELITE Co., Ltd., C05-MB) Hardening catalyst B: dicyandiamide coloring agent A: phthalocyanine blue/benzene Mixture of imidazolone/methyl ethyl ketone (=1/1/8): (Shanyang pigment (Production) (Example) The laminate of the present embodiment was produced by the following procedure. First, the production of the prepreg will be described. The composition of the resin varnish used is not in Table 1, and the obtained prepreg is obtained. The thickness of each layer of 1 to 15 is shown in Table 2. In addition, the pi~pis shown in Tables 2 to 4 indicates the prepreg 1 pre-fork body 15, and the Unitika system shown in Table 2 indicates unitika Glass.

Fiber Co., Ltd., Nitto Spinning Co., Ltd. said Ridong Textile Co., Ltd. Further, the prepregs 1 to 8 are asymmetric prepregs, and the prepregs 9 to 15 are symmetrical prepregs. ' (Prepreg 1) 1. Preparation of varnish of resin composition. Biphenyl ray-type secret varnish epoxy resin as epoxy resin A (Daily 101113166 58 201247414 Manufactured by Chemicals, NC-3000) 11.0 8.8 parts by weight of a biphenyl diindenyl phenol resin (GPH-103, manufactured by Nippon Kayaku Co., Ltd.) as a resin A, and a novolac type cyanate resin as a nitrite resin A (Lonza Japan Co., Ltd.) 1 part by weight of 'Priaset PT-30' was produced, and 4.0 parts by weight of a bisphenol hydrazine type cyanate resin (manufactured by Lonza Japan Co., Ltd., Primaset BA230) as a cyanate resin was dissolved and dispersed in methyl ethyl ketone. Further, spherical cerium oxide (manufactured by Admatech Co., Ltd. 'SO-32R, average particle diameter 1 "111) 60.0 parts by weight and 7-glycidoxypropyltrioxane as coupling agent a were added. Based on 0.2 parts by weight of 'A187, manufactured by GE Toshiba Silicone Co., Ltd.', a varnish A (resin was prepared by mixing with a high-speed stirrer for 3 minutes, and adjusting the non-volatile content to 50% by weight to prepare a resin composition. Varnish A) 2. Production of carrier material A resin coating varnish A was applied to a pET film (polyethylene terephthalate) in such a manner that the thickness of the dried resin layer was 13.0. 'On the Purex Film 'Thickness 36 (4) manufactured by DuPont Teijin Film Co., Ltd.), it was dried in a drying apparatus of (10) for 5 minutes. (4) Resin sheet A of the PET film for the first resin layer (carrier material A) In the same manner, the above resin varnish A is applied onto the PET film, and the thickness of the dried wax layer is 7 G #m, and dried in a dryer of (10) c for 5 minutes. Two resin layers are attached with PET film 10111 3166 59 201247414 Resin sheet B (carrier material B) 3. Preparation of prepreg The carrier material A for the first resin layer and the carrier material B for the second resin layer are oriented such that the resin layer faces the fiber substrate The method is configured on a glass fiber substrate (thickness 15 //111,1;11 out1^0 to 5? ratio 61* company made of glass woven fabric, E02Z 04 53SK, IPC standard 1015, linear expansion coefficient: 5.5 ppm/ On both sides of the °c), a vacuum laminate device and a hot air drying device shown in Fig. 3 are impregnated with a resin composition to obtain a prepreg having a PET film laminated thereon. Specifically, the carrier material A and the carrier material B are made The method is placed on the two sides of the glass fiber substrate in the center of the width direction of the glass fiber substrate, and 80% is used under the conditions of normal pressure and pressure reduction of 9.999 χ 104 Pa (about 750 Torr) or more. Here, in the inner region of the width direction dimension of the glass fiber substrate, the resin layers of the carrier material A and the carrier material B are bonded to both sides of the glass fiber substrate, respectively, and to the glass fiber substrate. In the outer side area of the width direction dimension, make The resin layers of the material A and the carrier material B are joined to each other. Then, the bonded person is allowed to pass through the hot air drying device set to 12 (rc lateral transfer type) for 2 minutes, whereby the heating can be performed without applying pressure. The prepreg 1 (P1) is obtained by treatment. At this time, the thickness (C1) of the first resin layer is 9 _, the thickness of the surface fiber substrate layer is 15 Mm, and the thickness of the second resin layer (€2) is 3 (four). The total thickness is 27 /zrn ' C2/C1 is 〇.33. Further, the thickness of the resin layer can be measured by cutting the cross section of the prepreg by using a slit, and observing it with an optical microscope. (Prepreg 2, 4, 5) The prepregs 2, 4, and 5 change the thickness (C1) of the first resin layer, the thickness (C2) of the second resin layer, and the glass fiber used as shown in Table 2 The substrate was produced in the same manner as the prepreg 1 except for the above. (Prepreg 3) 1. Preparation of the varnish B of the resin composition. The naphthalene skeleton as the epoxy resin B was modified to a cresol novolac type epoxy resin (manufactured by DIC Corporation, EXA_732), and was used as a cyanide. 12.0 parts by weight of a varnish-type cyanate resin (manufactured by L〇nza japan Co., Ltd., primaset PT-30) of the acid ester resin A, and the benzene having a bisphenol acetophenone structure prepared as the phenoxy resin a described above 5 parts by weight of the oxy resin, as a crosslinking catalyst of the hardening catalyst A, which is a salt-compounding compound of the above formula (IX) (manufactured by Sumit〇m〇BAKELITE Co., Ltd., C05_Mb), 2 parts by weight, dissolved and dispersed in A In the ethyl ethyl ketone. Further, spherical cerium oxide (manufactured by Admatechs Co., Ltd., SO_32R, average particle diameter i #m), 65 parts by weight, and spherical spheroidal dioxide (10), which is a filler B, is added as a filler A, and NSS is produced. -5N, an average particle diameter of 75 nm) 5. 〇 by weight, and as a coupling agent a, r-glycidoxypropyltrimethoxy oxime (GE TGshiba SiHe (manufactured by Me Company, 'A' 0.2 parts by weight, used The high-speed secret device was stirred for 3 minutes, and the non-volatile matter was adjusted to 50% by weight to prepare a varnish B (resin varnish b) of the resin composition. 101113166 201247414 2, Prepreg 3 prepreg was used. The resin varnish B obtained above was changed as shown in Table 2, and the thickness (C1) of the first resin layer, the thickness (C2) of the second resin layer, and the glass fiber substrate used 'except for the prepreg The body is manufactured in the same manner. (Prepreg 6) Pre-/Section 6 The thickness of the first resin layer (ci) and the thickness of the second resin layer (C2) are changed as shown in Table 2, and the glass to be used is used. The fiber base material was changed to a thickness of 28 /zm, and the TT glass woven fabric manufactured by Nitto Spinning Co., Ltd., WTX1035-53-X13 3. IPC Standard 1035, coefficient of linear expansion: 2.8 ppm/. (: 'Other than that, manufactured in the same manner as Prepreg 1. (Prepreg 7) 1. Preparation of varnish C of resin composition 8.0 parts by weight of a biphenyl aralkyl type novolak epoxy resin (manufactured by Nippon Kayaku Co., Ltd., NC-3000) as epoxy resin A, and a naphthalene skeleton modified as an epoxy resin b. (manufactured by DiC, EXA-7320), 3.0 parts by weight, as a bismaleimide resin a, a bismaleimide resin (manufactured by KI Chemical Industry Co., Ltd., ΒΜΙ-70) 20·0 parts by weight, as a hardening touch 3.5 parts by weight of dicyandiamide of the medium was dissolved and dispersed in methyl ethyl ketone. Further, 65.0 parts by weight of aluminum hydroxide (manufactured by Showa Denko Co., Ltd., ΗΡ-360) as a filler C was added and a coupling agent β was added. 0.15 parts by weight of epoxy decane (manufactured by Shin-Etsu Chemical Co., Ltd., ΚΒΜ·403Ε), stirred for 30 minutes using a high-speed stirring device, and adjusted to have a non-volatile content of 50% by weight, 101113166 62 201247414, to prepare a resin composition Varnish c (resin varnish c). 2, prepreg The manufacturing pre-texture 7 uses the resin varnish c obtained above, and changes the thickness (C1) of the first tree layer, the thickness (C2) of the second resin layer, and the glass fiber substrate used as shown in Table 2. In addition, it is manufactured in the same manner as the prepreg. (Prepreg 8) 1. Preparation of varnish D of resin composition. Biphenyl aralkyl type novolac epoxy resin as epoxy resin A. 15.0 parts by weight of an epoxy resin B, which is manufactured by Nippon Kayaku Co., Ltd., as an epoxy resin B, 2.0 parts by weight of an anthraquinone novolac type epoxy resin (EXA-7320, manufactured by DIC Corporation). C naphthalene di-di-epoxypropyl ether (manufactured by DIC Corporation, EPICLON HP-4032D) 6.0 parts by weight, as the cyanate resin C, represented by the formula (II) Basic cyanate resin (reactive naphthol aralkyl type phenol resin (manufactured by Dongdu Chemical Co., Ltd., &quot;&quot;SN-485") and cyanogen chloride) 16.0 parts by weight as a bismaleimide resin 6.5 parts by weight of a double-malay-imine resin (manufactured by KI Chemical Industry Co., Ltd., BMI-70) of A, as a hardening catalyst A 0.1 parts by weight of a phosphorus-based catalyst (manufactured by SUMITOMO BAKELITE Co., Ltd., C05-MB) which is a rust salt compound of the above formula (IX) is dissolved and dispersed in mercaptoethyl ketone. In addition, 40.0 parts by weight of spherical sulfur dioxide (manufactured by Admatech Co., Ltd., 'SO-32R, average particle diameter 1 // πι)) was added as a filler A, and spherical sulphur dioxide was used as a filler Β (made by Tokuyama Co., Ltd.). , NSS-5N, average particle size 101113166 63 201247414 75 legs) 7.0 parts by weight, as a filler D, agglomerated oxygen particles (manufactured by Shin-Etsu Chemical Co., Ltd., KMP600, average particle size 5 Mm) 7 〇 by weight and as an even Mixture B of epoxy decane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-40 Qin. 4 parts by weight, using a high-speed mixing device to give a drop of % minutes to make a non-volatile content of 50%. / 〇 to adjust the resin The varnish D (resin varnish D) of the composition. 2. The prepreg 8 was prepared by using the resin varnish d obtained above, and the thickness (C1) of the first resin layer and the second resin were changed as shown in Table 2. The thickness of the layer (C2) and the glass fiber substrate to be used were produced in the same manner as in the prepreg i. (Prepreg 9) 1. Preparation of the varnish E of the resin composition as a ring Oxygenated resin D naphthalene ether modified epoxy resin (manufactured by DIC Corporation, ΗΡ-6000) 10· 8 parts by weight of a varnish-type cyanate resin (Chromate PT-30, manufactured by Lonza Japan Co., Ltd.) as a cyanate resin A, 14.0 parts by weight, and a naphthol aralkyl type phenol resin as a phenol resin (East) 5.0 parts by weight of "SN-485" manufactured by Huacheng Co., Ltd. was dissolved and dispersed in mercaptoethyl ketone. Further, spherical cerium oxide as filler A was added (manufactured by Admatechs Co., Ltd., SO-32R, average particle size 1 〇) Parts by weight, spherical spheroidal dioxide as a filler β (manufactured by Tokuyama Co., Ltd., NSS-5N, average particle diameter: 75 nm), 5.0 parts by weight, as a coupling agent, 8-glycidoxypropyltrimethoxy 0.2 parts by weight of decane (manufactured by GE Toshiba Silicone Co., Ltd., A187), and 10 Π 13166 64 201247414 was stirred by a stirring device for 30 minutes to adjust the non-volatile content to 50% by weight. Varnish E) 2. Preparation of prepreg The prepreg 9 is obtained by using the resin varnish E obtained above, and changing the thickness (C1) of the first resin layer and the thickness (C2) of the second resin layer as shown in Table 2, And the glass fiber substrate used, except The ingot 1 was produced in the same manner. (Prepreg 10) 1. Preparation of the varnish F of the resin composition 15.6 parts by weight of a polyfunctional naphthalene type epoxy resin (HP-4750, manufactured by DIC Corporation) as the epoxy resin E 14.0 parts by weight of a novolac type cyanate resin (Primaset PT-30, manufactured by Lonza Japan Co., Ltd.) which is a cyanate resin A, and a phosphorus system which is a hardening catalyst and which meets the above-mentioned salt compound of the general formula (IX) Catalyst (manufactured by SUMITOMO BAKEUTE Co., Ltd., C05-MB) 0.2 parts by weight was dissolved and dispersed in mercaptoethyl ketone. Furthermore, 65.0 parts by weight of spherical spheroidal dioxide (manufactured by Admatechs Co., Ltd., SO-32R, average particle diameter 1 /im) was added as a filler A, and spherical sulphur dioxide as a filler B was produced (Tokuyama Co., Ltd., NSS-5N, an average particle diameter of 75 nm), 5.0 parts by weight, as a coupling agent A, T-glycidoxypropyltrimethoxy Oxime (manufactured by GE Toshiba Silicone Co., Ltd., A187) 0.2 parts by weight, using high speed search The mixing apparatus was stirred for 30 minutes, and adjusted so that the nonvolatile content became 50% by weight, and the varnish F (resin varnish F) of the resin composition was prepared. 2. Production of Prepreg 101113166 65 201247414 The prepreg 10 is obtained by using the resin varnish F obtained above, and changing the thickness (ci) of the first resin layer, the thickness (C2) of the second resin layer, and Make

In addition to the glass fiber substrate, it was made in the same manner as the prepreg 1. (Prepreg 11) The resin varnish A obtained above was impregnated with a glass fiber substrate (thickness 15 &quot;m, E-glass woven fabric manufactured by Unitika Glass Fiber Co., Ltd., E〇2Z 〇4 53SK, IPC standard 1015, line Expansion coefficient: 5·5 ppmn:), dried in a heating oven at 150 ° for 2 minutes to obtain a prepreg. At this time, the thickness of the glass fiber base material layer was 15 and the resin layer of the same thickness (6 em) was provided on both sides of the glass fiber base material layer, and the total thickness was 27 am. (Prepreg 12, 14) The prepregs 12 and 14 were produced in the same manner as the prepreg 1 except that the thickness of the resin layer and the glass fiber substrate used were changed as shown in Table 2. (Prepreg 13) The prepreg 13 is the same as the prepreg 11 except that the resin varnish B obtained above is used and the thickness of the resin layer and the glass fiber substrate used are changed as shown in Table 2. Way to manufacture. (Prepreg 15) The thickness of the resin layer was changed in the prepreg 15 as shown in Table 2, and the glass fiber substrate to be used was changed to a thickness of 28 / im, and the τ ray woven fabric manufactured by Nitto Spin Co., Ltd., WTX 1035-53 -Xl33, IPC Standard 1035, Linear Expansion Coefficient: 101113166 66 201247414 2.8 ppm/°C, except that it was produced in the same manner as the prepreg 11. (Prepreg 16) The prepreg 16 is the same as the prepreg 11 except that the resin varnish C obtained above is used and the thickness of the resin layer and the glass fiber substrate used are changed as shown in Table 2. Way to manufacture. (Prepreg 17) The prepreg 17 is the same as the prepreg 11 except that the resin varnish D obtained above is used and the thickness of the resin layer and the glass fiber substrate used are changed as shown in Table 2. Way to manufacture. In the examples 1 to 13 and the comparative examples 1 to 9, the prepreg 1 to 17 (abbreviated as P1 to 17 in the table) were used to produce a laminate, and the laminate and the semiconductor package were produced using the laminate. (Example 1) 1. Production of laminates The PET films of the respective two faces were peeled off from two sheets of prepreg 1 (P1) so that the first resin layers were laminated to each other, and the obtained laminate was laminated. On both sides of the body, 12/im copper foil (3EC-VLP foil manufactured by Mitsui Mining & Mining Co., Ltd.) is overlapped at 220. . At 2 MPa, heating and pressurization were carried out for 2 hours, whereby a laminated sheet with a metal foil was obtained. The thickness of the core layer (including the portion of the laminate) of the obtained metal foil-clad laminate was 0.054 mm. Further, the thickness of the prepreg or the resin layer used in the present embodiment/comparative example was hardly changed after the curing. Therefore, the thickness of the core layer (including the portion of the laminate) 101113166 67 201247414 becomes the total thickness of the prepreg. 2. Manufacture of a layered layer of 25 parts by weight of a novolak-type cyanate resin (Cdmaset m®) manufactured by Cyanate Resin A as a cyanate resin A, and a biphenyl aralkyl phenol novolak epoxy resin as A ( Manufactured by Nippon Kayaku Co., Ltd., NC-3_25 parts by weight, as the phenoxy resin A, 1 part by weight of a phenoxy resin containing bismuth phenylene resin, and an imidazole compound as a hardening agent (four countries) 4 parts by weight of blister-based imidazole) was dissolved and dispersed in methyl ethyl ketone. Further, spherical oxidized stone as a filler A was added (manufactured by Admatechs Co., Ltd., s〇32R average particle size 1) /zm) 39.4 parts by weight and 0.2 part by weight of glycidoxypropyl dimethoxydecane (manufactured by GE T〇shiba Silic〇ne Co., Ltd., A187) as a coupling agent a, using a high-speed (four) device (four) for 3Q minutes to be non-volatile The varnish G (resin varnish G) of the resin composition was prepared so as to be adjusted to 50% by weight. The resin varnish G was applied to the pET in such a manner that the thickness of the dried resin layer was 22.0 by using a die coater apparatus. Membrane (poly(p-butylene dicarboxylate), Du The Bondi Film Co., Ltd. manufactures PurexFilm, which has a thickness of 36, and is dried in a dry county of 16 G ° C for 5 minutes to obtain a resin film C (carrier material C) with a PET film for the first resin layer. Further, the resin varnish G was applied to the PET film in the same manner, and dried in a dry film of 101 166 166 68 201247414 for 5 minutes in a manner of drying the resin layer to a thickness of 11 ,, and obtained a second. A resin sheet D (carrier material D) to which a PET film is attached, a carrier material C for the first resin layer, and a carrier material D for the second resin layer in such a manner that the resin layer faces the fiber substrate Disposed on glass fiber substrate (thickness 15 #〇1, 1111 out1^0 to 3卩1061: company made of glass woven fabric, E02Z Ό4 53SK, IPC standard 1015, linear expansion coefficient: 5·5 ppm/°C) On both sides, the vacuum-forming device and the hot air drying device shown in FIG. 3 are impregnated with the resin composition to obtain a build-up layer A in which a PET film is laminated. Specifically, the carrier material C and the carrier material D are located at the glass fiber. The center of the width direction of the substrate overlaps the glass fiber base The two sides are joined by a laminating roll of 80 ° C under the conditions of a normal pressure and a reduced pressure of 9·999 χ 104 Pa (about 750 Torr). Here, in the inner side of the width direction of the glass fiber substrate The resin layer of the carrier material C and the carrier material D are respectively bonded to the both sides of the glass fiber substrate, and the resin layer of the carrier material C and the carrier material d is disposed in the outer side region of the width direction dimension of the glass fiber substrate. Engage each other. Then, the above-mentioned joined person is set to 12 〇. In the horizontally-transport type hot air drying device, the inside of the crucible is passed for 2 minutes, whereby the build-up layer A can be obtained by performing heat treatment without applying pressure. At this time, the thickness of the first resin layer ((:1) is 18 #m, the thickness of the glass fiber substrate layer is 15 //m, the thickness of the second resin layer (C2) is 7, and the total thickness is 40, C2 /C1 is ο·%. 10Π13166 69 201247414 3. Production of a solder resist layer 25 parts by weight of a novolac type cyanate resin (Primaset ρτ_3〇, manufactured by L〇nza Japan Co., Ltd.) as a cyanate resin A Oxygen resin bismuth phenyl aralkyl novolac epoxy resin (manufactured by Nippon Kayaku Co., Ltd., NC-3_) 25 parts by weight, as described above, a phenoxy compound The base resin 1 (parts by weight), an imidazole compound (manufactured by Shikoku Chemicals Co., Ltd., 1-benzyl-2-phenylmethane, sitting) 0.4 parts by weight of the base resin was dissolved and dispersed in methyl ethyl ketone. Further, spheroidal nitric oxide as a true filler A (manufactured by Admatechs Co., Ltd., s〇_32r, average particle diameter 1 &quot;m) 39 parts by weight, as a coupling agent A, r-glycidoxypropane C was added. Trimethoxy zephyr (manufactured by GE Toshiba Silicone Co., Ltd., A_. 2 parts by weight, 0.4 parts by weight in solid form as a coloring agent) A 2 blue: f and imidazole, methyl ethyl ketone (=1 / 1 / 8) mixture (Shanyang pigment A Division 'use the high-speed lion device to mix 3G minutes, adjust in a non-volatile way! · /. The varnish of the resin composition is adjusted (resin varnish only). The resin varnish is applied to the dried resin layer using a die-bonding machine device; the film is applied to the PET film at a degree of 14.0 &quot; m (poly pair) Stupid acid bismuth vinegar: manufactured by Tubang Teijin

Purex Film, thickness 36 // m), dried in a drying device of C for 5 minutes to obtain the first resin,

It is attached with PET-like resin sheet E (carrier material E). In the same manner, the resin varnish is applied to the pet film, and dried in a dryer at 160 ° C for 5 minutes in a manner that the thickness of the dried resin layer is 9.0101166 201247414, and the second resin layer is obtained. A resin film F (carrier material F) to which a PET film is attached. The carrier material E for the first resin layer and the cut material F for the second resin layer are disposed on the glass fiber substrate so as to face the fiber substrate so as to face the fiber substrate (thickness 15 m, manufactured by Unitika Glass Fiber Co., Ltd.) E-glass woven fabric, E02Z 04 53SK, IPC standard 1015, linear expansion coefficient: 5·5 PPm/t) on both sides, obtained by laminating resin composition by vacuum laminating device and hot air drying device shown in Fig. 3 There is a solder mask layer A of PET film. Specifically, the carrier material E and the carrier material F are respectively superposed on both sides of the glass fiber substrate so as to be at the center in the width direction of the glass fiber substrate, and are decompressed from normal pressure by 9.999 x 104 Pa (about 750 Torr) or more. Under the conditions of 'bonding using a laminating roller at 80 ° C. Here, in the inner region of the width direction dimension of the glass fiber substrate, the resin layers of the carrier material E and the carrier material F are bonded to the both sides of the glass fiber substrate, respectively, and the dimensions of the glass fiber substrate are in the width direction. In the outer region, the carrier materials E and the resin layers of the carrier material F are bonded to each other. Then, the above-mentioned joined person is set to 12 〇. The horizontal transfer type of the hot air drying device is passed for 2 minutes, whereby the solder resist layer A can be obtained by heat treatment without applying pressure. At this time, the thickness (9) of the first resin layer is 1 〇 (4), the thickness of the glass fiber substrate layer is 15 , and the thickness (C2) of the second resin layer is 5 Å, total 101 Π 3166 71 201247414 thickness is 30, C 2 / C 1 Is 0.5. 4. Manufacturing of Circuit Board Using the metal foil-clad laminate obtained above as a core substrate, the ΡΕτ film on the first resin layer side of the buildup layer A obtained above is peeled off, and the first resin layer is formed on both sides thereof. The front and back of the inner circuit board of the circuit pattern (residual copper ratio: 7〇%, L/5=: 50/50 //m). The vacuum pressurizing laminator apparatus was used for vacuum heating and press forming at a temperature of 150 ° C, a pressure of 1 MPa, and a time of 120 seconds. Thereafter, the film was heat-cured by a hot air drying device at 22 Torr for 60 minutes to peel off the PET film on the second resin layer side. Then, a blind hole (non-through hole) is formed by a carbonic acid laser, and then the swelling liquid in the hole and the surface of the resin layer at 60 ° C (Atotech Japan)

It was immersed in 'Swelling Dip Securigant P) for 5 minutes, and further immersed in an aqueous solution of 80 ° C (Atotech Japan, Concentrate Compact CP) for 10 minutes, and then neutralized to carry out roughening treatment. After the steps of degreasing, catalyst application and activation, an electroless copper plating film of about 0.5 〆m is formed to form an anti-electric clock layer, and a non-electrolytic copper film is used as a power supply layer to form a 10/zm copper plating pattern. Implement L/s = 5〇/5〇 to process the microcircuit of the claw. Then, after 6 minutes of annealing treatment at 2 Torr &lt; t by a hot air drying apparatus, the power supply layer was removed by rapid etching. Then, the pET film on the first resin layer side of the solder resist layer A obtained above was peeled off to overlap the first resin layer, and a vacuum pressure type laminator device was used at a temperature of 150 C, a pressure of 1 MPa, and a time of 120 seconds. Vacuum heating and pressing into 101113166 72 201247414 shape. Thereafter, the film was heat-cured at 220 ° C for 60 minutes by a hot air drying device. The pET film on the second resin layer side was peeled off. Then, blind holes (non-through holes) are formed by carbonic acid laser to expose the pads or the like on which the semiconductor elements are mounted. Finally, a non-electrolytic nickel plating layer including 3 on the circuit layer exposed from the solder resist layer A and a Q1 layer on the electroless forged gold layer thereon are formed, and the obtained substrate is cut into 50 mm&gt;;&lt; 50 mm size, to obtain a circuit board for semiconductor packaging. 5. Manufacturing of semiconductor package A semiconductor device having a solder bump (a thermoelectric power generation (TEG) wafer size of 20 mm x 20 mm and a thickness of 725 /zm) was mounted on a semiconductor by a flip chip bonding apparatus. On the circuit board for packaging. Then, after the solder bumps are melt-bonded by an infrared (IR) infrared reflow furnace, a liquid sealing resin (CRP-X4800B, manufactured by SUMITOMO BAKELITE Co., Ltd.) is filled, and the liquid sealing resin is cured to obtain a semiconductor package. . Further, the liquid sealing resin was cured under the conditions of a temperature of 150 ° C for 120 minutes. Further, the solder bump of the above-mentioned semiconductor element was formed using an error-free solder composed of Sn/Ag/Cu. (Examples 2 to 8, 12, and 13) A metal-clad laminate was produced in the same manner as in Example 1 except that the prepregs 2 to 10 were used in each of Examples 2 to 8, 12, and 13, respectively. Board, circuit board, and semiconductor package. 101113166 73 201247414 (Example 9) The PET film on both sides of each prepreg 4 was peeled off in the order of the prepreg 4, the prepreg 14, and the prepreg 4, so that the first resin layer of the prepreg 4 was A laminate with a metal foil, a circuit board, and a semiconductor package were produced in the same manner as in Example 1 except that a total of three prepregs were laminated in contact with the prepreg 14 side. (Example 10) The PET film on both surfaces of each prepreg 4 was peeled off in the order of the prepreg 4, the prepreg 14, the prepreg 14, and the prepreg 4 so that the first prepreg 4 was A laminate with a metal foil, a circuit board, and a semiconductor package were produced in the same manner as in Example 1 except that a total of four prepregs were laminated so as to be in contact with the prepreg 14 side. (Example 11) The PET film on each of the four prepreg 4 (P4) was peeled off, and a total of four prepregs were laminated so that the first resin layer of the prepreg 4 was oriented toward the center of the laminate. A laminate, a circuit board, and a semiconductor package with a metal foil were produced in the same manner as in Example 1 except for the above. (Comparative Examples 1 to 7) A laminate with a metal foil and a circuit board were produced in the same manner as in Example 1 except that each of the prepregs 11 to 17 was laminated in each of Comparative Examples 1 to 7. , semiconductor packaging. (Comparative Examples 8 and 9) 101113166 74 201247414 A metal foil-clad laminate was produced in the same manner as in Example 1 except that three or four prepregs 14 were laminated in each of Comparative Examples 8 and 9. , circuit board, semiconductor package. The following evaluations were made on the laminated plates, circuit boards, and semiconductor seals with metal cases obtained by the respective examples and comparative examples. Each evaluation and evaluation method are shown below. The results obtained are shown in Tables 3 and 4. Moreover, the amount of change in the warpage of the substrate in the examples and the comparative examples (the amount of warpage of the substrate of Comparative Example A) (the amount of warpage of the substrate in the example) is shown in Table 5 ^ (1) Subsurface curvature of the substrate The metal foil-clad laminates prepared in the examples and the comparative examples were cut in a size of 270 mm x 350 mm near the center, and the metal foil was peeled off by an etching solution, and cut into a size of 5 mm x 50 mm at intervals of 30 mm. A total of 12 samples of substrate warpage were obtained. The substrate warpage of the obtained sample was measured at room temperature using a temperature-variable laser three-dimensional measuring machine (LS200-MT100MT50: manufactured by T-TEC Co., Ltd.). The measurement range was determined at 48. In the range of mmx48 mm, a laser is applied to one side of the substrate for measurement, and the difference between the farthest point and the closest point from the distance between the laser heads is set as the amount of complication of each piece' The amount of warpage of the substrate was set. (2) The conduction test was performed using Flying pr〇be Checker (l 116X-YC Hitester. manufactured by Hioki Electric Co., Ltd.) to make 101113166 75 201247414 in three examples and comparative examples. The semiconductor package is measured by the conduction of the solder bumps through the circuit terminals between the semiconductor element and the circuit board, and is set as an initial value. Then, after being treated under (9) ° C and 60% humidity conditions for 40 hours, IR back is used. The welding furnace (peak temperature: 260. 〇 treatment 3 times, the conduction is measured in the same manner, and the resistance value is increased by 5% or more from the initial value, and it is determined as the disconnection at the time of installation. Here, the disconnection occurs at the initial value. In the case of In addition, the measurement position of each semiconductor package is 6 ι, and the total measurement is 183. Each symbol is as follows. ◎ : No break position. The position is 1 to ]0%. Δ: the broken part is 11 to 50%. X : The broken part is 51% or more. (3) The temperature cycle (TC, Temprature Cycle) is tested at 60 ° C, 60%. The semiconductor package produced in the four examples and the comparative examples was subjected to treatment for 40 hours, and then treated three times in an IR reflow furnace (peak temperature: 260 ° C) in the atmosphere at -55 ° C (15 minutes). 125. (: (15 minutes) 500 cycles were processed. Then, using an ultrasonic imaging device ("FS300" manufactured by Hitachi Construction Machinery Finetec Co., Ltd.), it was observed whether or not an abnormality occurred in the semiconductor element or the solder bump. Solder bumps are free of abnormalities. 〇: Turtles 101113166 76 201247414 are observed in one of the semiconductor components and/or solder bumps, but there is no problem in practical applications. △. In one part of semiconductor components and/or solder bumps Crack observed in There is a problem in practical use. X: Both the semiconductor element and the solder bump are cracked and cannot be used. In order to confirm the effect of using the laminated board of this embodiment, the comparison of the glass fiber base material layer is shown in Table $ The amount of change in the warpage of the substrate of the examples and the comparative examples in which the thickness (type) is equal to the number of sheets. If the thickness of the glass fiber substrate layer is different, the radius of curvature of the substrate warpage is different, and as a result, the amount of the substrate is small. In the case of the comparative examples and the comparative examples, it is necessary to make the above-mentioned systems in advance. As is apparent from Table 5, in Examples 1 to 13, the amount of warpage of the slabs was reduced as compared with the comparative examples of the comparative examples. Thereby, it was confirmed that the laminates of Examples 1 to 13 were less warped than the Comparative Examples 1 to 9 and the laminated sheets. Further, as can be seen from Table 4, the semiconductor package obtained in Comparative Examples 1 to 9 (the smaller the thickness of the core layer, the more the breakage portion in the conduction test, the semiconductor component in the field, and the /JDt cycle test) Or the solder bumps in the solder bumps have poor reliability, and on the other hand, as can be seen from Table 3, the semiconductor package obtained in the embodiments 1 to 13 has a broken portion in the non-conducting test or is small. In the temperature cycle test, there is no turtle in the semiconductor component or the bismuth tin bump, which is less or less, and has excellent connection reliability. 'Production 101113166 77 201247414 [Table i] Resin varnish A Resin varnish B Resin varnish C Resin varnish D Resin Varnish E Resin Varnish F Epoxy Resin A 11.0 8.0 15.0 Epoxy Resin B 12.0 3.0 2.0 Epoxy Resin C 6.0 Epoxy Resin D 10.8 Epoxy Resin E 15.6 Cyanate Resin A 16.0 12.0 14.0 14.0 Cyanate Ester B 4.0 Cyanide Acid ester resin C 16.0 Phenol resin A 8.8 Barium resin B 5.0 Double maleimide resin A 20.0 6.5 Phenoxy resin A 5.6 Filler A 60.0 65.0 40.0 65.0 65.0 Filling B 5.0 7.0 5.0 5.0 Filler C 65.0 Filler D 7.0 Coupler A 0.2 0.2 0.2 0.2 Coupler B 0.5 0.4 Hardener Catalyst A 0.2 0.1 0.2 Hardener Catalyst B 3.5 78 101113166 201247414 [CN&lt;] Total Thickness (&quot;m ) vo vo O o Ο 〇 ο Ο 〇 Ο Ο ο ο 1 Ο Ο 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 o ο Ο o ο ε ο ο Ο 韬m inch C\ in ι〇ro m 1 t I 1 II - resin thickness) (//m) Os Os ο iTi »—H On os 1 1 1 1 1 II oo ( N § § 00 (Ν gg 00 CN 00 (Ν 00 (N § 00 (Ν § § S _ w box: send Jd jd ja jd jd rag g jd g ~u^ ®4 •^2 ifnJ • mm4 ·&lt UD m D m DD m cn m DD cn Ρ UPPPP Ρ •PPPPP Ρ Ρ Ρ 举 举 爸 ~~g $ 发 D. a. a Q. & ο- α. Q. D, cu CL a. aa ο. Cu &, aa aa aa aaaa & Q. a fiber m in yn in &lt;n in 00 CN υΊ &lt;〇ir&gt; 00 CN 00 &lt;N iTi in 00 cs ιη ιη IPC type | #1015 I | #1035 I | #1280 1 1 #2319 1 | #2319 I | #1035 1 | #2319 1 1 #2319 1 | #1035 I | #1035 1 1 #1015 #1035 | #1280 1 #2319 #1035 #2319 #2319 mm ΓΛ ΓΛ mmm cn cn ΓΛ f^i — m Μ X cn cn &gt;Λ &gt;&lt; ΓΛ U^&gt; ιΛ &gt;&lt; mm ¥ Μ 〇g to »r&gt; m iTi ΓΛ iT) m ^Ti un ^r&gt; m C/3 m ^r&gt; CO \r\ m V) »r) mg S g S sg SS g S gs S g N &lt; U OQ CQ X PQ CP X &gt;&lt; N &lt; U CO X PQ PQ s $ gg H s SHH ( N 〇i 2 Ον ON w &gt; ω WW tu w W m ω ω W Resin sheet with PET film Second resin layer thickness (μιη) 卜O &lt;N On &lt;N o Vi (N &lt;N oo 1 1 1 1 1 1 1 thickness of the first resin layer ((iv) mv〇CN (N κη mv〇m &lt;n cn Ό 1 1 1 1 1 I 1 &lt;&lt; CQ &lt; c &lt; UQ ω (Xl &lt;;&lt; ω &lt;&lt; ο Q Resin Qingdian 殓飧 飧飧 飧飧 飧飧 * * * * * ας urn BK: ii m os; jJm ας *+7» iim ox; iim =5 iJtn ας i)tn as; Dm ας 荜 rate shopping rate 荜荜% 荜 rate 5: CN &amp; m Ph 2 Ρη CL, 00 ON Ph 〇CL. S: CN 5: ΓΛ r*H IX ν 〇 欺 欺

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99I-U0I s 201247414 斗e&lt;] 1 Example 13 丨I 0.08 I | ριο+ριο| &lt;N m 00 ◎ ◎ | Example 0.08 1 P9+P9 I ◎ ◎ Example 11 2 P4+P4+P4 +P4 inch v〇v〇◎ ◎ ίο g P4+P14+P14+P4 inch 〇〇v〇◎ ◎ Example 9 3 P4+P14+P4 CO ◎ ◎ |Example 8| g 1 P8+P8 1 (N ◎ 〇丨 Example 7| s P7+P7 CN 〇〇丨 Example 6| 0.08 1 P6+P6 1 &lt;N s ◎ ◎ 丨 例 Example 5| s 1 P5+P5 1 &lt;N 00 00 ◎ 〇| Miscellaneous 4| ο P4+P4 CN ss ◎ 〇|你_3| 1 012 1 P3+P3 (N 〇〇|Example 2| 0.08 P2+P2 CN 00 〇〇1 Example 11 1 0.054 1 1 Pi+ Pi 1 CN a 〇〇 core layer thickness (mm) core layer layer number substrate 勉 curvature / ^ m) conduction TC tender [inch &lt;] Comparative Example 9 inch 〇Ρ 14 + Ρ 14 + Ρ 14 + Ρ 14 〇〇 Comparative Example 8 Cn c&gt; Ρ14 + Ρ14 + Ρ14 CO 〇〇Comparative Example 7 (N Ο 1 Ρ17 + Ρ17 CN m (N 〇&lt;] Comparative Example 6 (Ν Ο Ρ 16 + Ρ 16 (N 〇 &lt; 1 Comparative Example 5 0.08 1 Ρ 15 + Ρ15 1 CN r—^ 〇&lt;1 Comparative Example 4 &lt;Ν Ο Ρ14 + Ρ14 (N &lt;N On 〇&lt; Comparative Example 3 0.1 2 1 Ρ13 + Ρ13 1 &lt;N 〇&lt;1 Comparative Example 2 0.08 1 Ρ12 + Ρ12 1 (N (N as &lt;1 X Comparative Example 1 1 0.054 1 1 pii+pn 1 &lt; NXX core layer thickness (/ /m) Core layer constituent layer substrate Zhaoqu amount (//m) Conduction test TC test Example 13 ΓΟ ΓΠ Comparative example 5 Example 12 Comparative example 5 Example 11 Comparative example 9 Example 10 m Comparative example 9 Example 9 Comparative Example 8 Example 8 σ\Comparative Example 7 Example 7 比较\Comparative Example 6 Example 6 CN Comparative Example 5 Example 5 々Comparative Example 4 Example 4 Os Comparative Example 4 Example 3 Ο Comparative Example 3 Example 2 Comparative Example 2 Example 1 CN Comparative Example 1 /—v ® 4.0 φ|丨i 1 Electricity s s s Comparative object 0009912112 201247414 This application claims a Japanese patent application for application on the next day of April, 2011. Based on the priority of No. 90469, the contents of the factory and its contents are incorporated herein. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the invention will be apparent from the appended claims appended claims κ Fig. 1 is a cross-sectional view showing the configuration of a laminated board in the present embodiment. Fig. 2 is a cross-sectional view showing a manufacturing step of the laminated board in the embodiment. FIG. 3 is a cross-sectional view showing a method of manufacturing a prepreg according to the present embodiment, showing a configuration of a laminated metal plate with a metal drop in the present embodiment. FIG. 6 is a cross-sectional view showing a configuration of a build-up layer in the present embodiment, and FIG. 7 is a cross-sectional view showing a structure of a build-up layer in the present embodiment. FIG. FIG. 9 is a cross-sectional view showing a configuration of a solder resist layer in the present embodiment. FIG. The structure of the semiconductor chip in the present embodiment is shown in Fig. U. Fig. U shows the structure of the laminated board in the present embodiment. A cross-sectional view showing a manufacturing step of the laminated board in the present embodiment. Fig. 13 is a cross-sectional view showing the configuration of the laminated board in the present embodiment. 101113166 201247414 Fig. 14 is a cross-sectional view showing a manufacturing step of the laminated board in the embodiment. Fig. 15 is a cross-sectional view showing a manufacturing step of the laminated board in the embodiment. Fig. 16 is a cross-sectional view showing a manufacturing step of the laminated board in the embodiment. Fig. 17 is a cross-sectional view showing a method of manufacturing a prepreg according to the embodiment. Fig. 18 is a cross-sectional view showing a method of manufacturing a prepreg according to the embodiment. Fig. 19 is a cross-sectional view showing a method of manufacturing a prepreg according to the embodiment. [Main component code description] 1 Coating device la First coating device lb Second coating device 2 Coating tip portion 2a First coating tip portion 2b Second coating tip portion 3, 11 Fiber substrate 4 Resin varnish 5a, 5b carrier material 21 prepreg 60 vacuum laminating device 61 laminating roller 62 hot air drying device 100a, 100b, 100b2, 100c, 100c2, 100c3 laminated plate 101 first fibrous substrate layer 101113166 82 201247414 101a second fiber base Material layer 102 first resin layer 103 second resin layer 104 first prepreg 105 third fiber base material layer 105a fourth fiber base material layer 106 third resin layer 107 fourth resin layer 108 second prepreg 110, 111 face 200 laminated board with metal foil 201 metal foil 300 laminated board with added layer 301 fifth fiber base material layer 303 build-up layer 310 surface of layered circuit 400 circuit board 401 wiring layer 403, 405 through hole 500 Solder mask circuit board 501 sixth fiber base layer 503 solder mask 101113166 83 201247414 510 solder mask surface 600 semiconductor package 601 semiconductor component 603 bump 605 bottom Charge 701 Fifth resin layer 702 Sixth resin layer 703 Third prepreg 801 Seventh resin layer 802 Eighth resin layer 803 Fourth prepreg A A2, A3, A4, A5, A6, B1 Center line D , D Bu D2, D4, D5, D6, D7, D8, D9 Distance D3 Thickness of laminate L Coating distance 101113166 84

Claims (1)

201247414 VII. Patent application scope: 1. A laminated board which is formed by a plurality of prepregs having a fibrous base material layer and a resin layer and having a wiring layer formed on the upper portion or formed with a buildup layer; In the direction of the lamination, the distance between the towel core and the line of the second fiber substrate layer of the first base layer is set to be the same as that of the first fiber substrate layer. Ό1, the center line of the third fiber base material layer disposed adjacent to the other, and the distance between the center and the line of the fourth fiber base material layer of the first fiber and the fourth base material layer are set to D2, When the thickness of the laminated board is D3, and the number of layers of the fiber base material layer of the supplementary layer is n (where n is an integer of 2 or more), any of the following formulas (1) and (2) is satisfied. One: D3/n&lt;Dl (1) D3/n&lt;D2 (2). 2. A laminate according to the scope of the patent application, wherein: • in the direction of the lamination, the distance between the v-solid surface and the center line of the first fibrous substrate layer is set to D4, and the above-mentioned gamma, L. And &gt;, the distance between the center lines of the third fiber base material layer is set to any one of the following conditions (7) and (4): 101113166 85 201247414 D4 &lt; D1 (3) D5 &lt; D2 (4). 3. The laminated board according to claim 1, wherein the first fibrous base material layer and the third fibrous base material layer are symmetrically arranged with respect to a center line of the laminated sheet in the lamination direction. 4. The laminate of claim 1, wherein all of the fibrous substrate layers in the laminate are symmetrically disposed with respect to a center line of the laminate in the lamination direction. 5. The laminate according to the first aspect of the invention, wherein the number of layers η of the fibrous base material layer is 2 or more and 6 or less. 6. The laminated board of claim 1, wherein the laminated board has a thickness of 0.6 mm or less. 7. The laminated board of claim 1, wherein the laminated board has a linear expansion coefficient of 1 ppm/° C. or more and 20 ppm/° C. or less. 8. The laminate of claim 1, wherein the metal foil is formed on at least one side of the laminate. 9. The laminate according to claim 1, wherein the first fibrous base material layer and the third fibrous base material layer have a thickness of 5 μm or more and 100 /zm or less. 10. The laminate of claim 1, wherein the fiber base material constituting the first fiber base layer and the third fiber base layer is a glass cloth. The laminate comprising the fifth fibrous substrate layer. The laminate of the fifth aspect of the laminate is further formed on the upper portion of the laminate, and the layer of the five-fiber substrate is formed in the direction of the laminate. The distance between the one surface and the center line included in the buildup layer is D6, and the distance between the core lines satisfies D6 &gt; D7 when the surface of the buildup layer and the fifth fiber base material layer are D7. . A circuit board of any of the items 11 of the present invention, which comprises the laminated board of the i-th aspect of the patent application. The circuit board of claim 12, wherein a solder resist layer including a sixth fiber base material layer is further formed on an upper portion of the circuit board, and the (five) plane or the buildup layer is formed in a stacking direction The distance between the surface and the center line of the sixth fiber base material is D8, and when the surface of the solder resist layer and the first distance are set to D9, D8 &gt; D9 is satisfied. The circuit board of the center line of the six-fiber base material layer is a semiconductor element. The semiconductor package is mounted on the board of the patent application range 101113166 87 201247414. A method for producing a laminate comprising a method of laminating a plurality of prepregs including a fiber base layer and a resin layer, and forming a wiring layer or a buildup layer formed with a buildup layer; And comprising: a first step of preparing a plurality of prepregs comprising the prepreg of the fibrous substrate layer on one side in a thickness direction; and a second step, which is to be closest in the lamination direction The distance between the center line of the first fibrous base material layer disposed on one surface and the center line of the second fibrous base material layer adjacent to the first fibrous base material layer is set to be the closest to the other side. The distance between the center line of the three-fiber base material layer and the + center line of the fourth fiber base material layer adjacent to the third fiber base material layer is D2, and the thickness of the laminated plate is D3, and the laminated layer is formed. When the number of layers of the fiber base material layer of the sheet is n (where η is an integer of 2 or more), the plurality of prepregs are overlapped so as to satisfy any of the conditions of the following formulas (1) and (7), D3 /n&lt;Dl (1) D3/n&lt;D2 (2); and the third step, which is The above plurality of prepregs are formed by overlapping. 16. The method for manufacturing a laminate according to claim 15 (4), wherein 101113166 88 201247414 is in the second step, the distance between the one surface and the center line of the first fibrous substrate layer in the lamination direction When D4 is set, the distance between the other surface and the center line of the third fibrous base material layer is D5, and further satisfy the conditions of the following formulas (3) and (4), D4 &lt; D1 (3) D5 &lt; D2 (4) The plurality of prepregs are overlapped. The manufacturing method of the laminated board of claim 15, wherein in the second step, the first fibrous base material layer and the third fibrous base material layer are opposite to each other in the lamination direction The center lines of the laminate are symmetrically arranged to overlap the plurality of prepregs. 18. The method of manufacturing a laminate according to claim 15, wherein in the second step, all the fiber substrate layers in the laminate are in a stacking direction with respect to a center line of the laminate The plurality of prepregs are overlapped in a symmetric manner. 19. The method for producing a paste laminate according to the application of the paste 16th to 18th, wherein the number of layers η of the fiber base material layer is 2 or more and 6 or less. 90 101113166