CN111491467A - Multilayer circuit board with outer core board and laminating method thereof - Google Patents
Multilayer circuit board with outer core board and laminating method thereof Download PDFInfo
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- CN111491467A CN111491467A CN202010298007.1A CN202010298007A CN111491467A CN 111491467 A CN111491467 A CN 111491467A CN 202010298007 A CN202010298007 A CN 202010298007A CN 111491467 A CN111491467 A CN 111491467A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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Abstract
The invention relates to a multi-layer circuit board with an outer core board and a laminating method thereof, wherein the laminating method of the multi-layer circuit board with the outer core board comprises the following steps: typesetting and pre-fixing at least three core plates and at least two first semi-curing sheets according to a preset requirement to obtain a pre-typesetting plate with the outermost layer being the core plate; arranging flexible layers on two outer sides of each pre-arranged plate to obtain a first pre-pressed plate; and pressing the first prepressing plate from two sides of the first prepressing plate to obtain the multilayer circuit board. The multilayer circuit board with the outer core board and the laminating method thereof can avoid the problem that the shrinkage of the outermost core board is unstable in the laminating process, and can predict the shrinkage of the outermost core board in the laminating process, thereby avoiding the problem that the multilayer circuit board is scrapped due to unstable shrinkage, improving the production qualification rate of the multilayer circuit board, and reducing the production cost.
Description
Technical Field
The invention relates to the technical field of multilayer circuit boards, in particular to a multilayer circuit board with an outer core board and a laminating method thereof.
Background
The high-speed development of electronic technology, electronic component's functional density is constantly promoting, and electronic components's integration degree is also constantly aggravating, impels the circuit board to develop towards the multilayer direction constantly. The multilayer circuit board is manufactured by pressing the multilayer core board at high temperature and high pressure. Because the expansion and contraction of different core plates have difference, in order to avoid quality problems in the processing process, the traditional method is to pre-release the expansion and contraction difference of the core plates to eliminate the difference. However, when the multilayer circuit board has an outer core board, that is, the outermost layer of the multilayer circuit board is the core board, since the shrinkage of the outer core board is extremely unstable in the lamination process, even if the expansion and shrinkage difference of the outer core board is pre-released, the whole multilayer circuit board is easily scrapped due to the fact that the shrinkage exceeds the preset value in the lamination process, and the yield is low.
Disclosure of Invention
Therefore, it is necessary to provide a multilayer circuit board with an outer core board and a laminating method thereof, aiming at the problems that the whole multilayer circuit board is easily scrapped and the yield is low due to the fact that the shrinkage exceeds the preset value in the laminating process.
In one aspect, a method for laminating a multilayer circuit board with an outer core board is provided, which comprises the following steps:
typesetting and pre-fixing at least three core plates and at least two first semi-curing sheets according to a preset requirement to obtain a pre-typesetting plate with the outermost layer being the core plate;
arranging flexible layers on two outer sides of the pre-arranged plate to obtain a first pre-pressed plate;
and pressing the first prepressing plate from two sides of the first prepressing plate to obtain the multilayer circuit board.
In one embodiment, the step of typesetting and pre-fixing at least three core boards and at least two first semi-curing sheets according to a preset requirement to obtain a pre-typesetting board with the outermost layers being the core boards comprises:
stacking at least three core plates and at least two first semi-cured sheets, wherein one first semi-cured sheet is arranged between every two adjacent core plates to obtain a first stacked structure;
and bonding and riveting the first laminated structure to obtain the pre-arranged board.
In one embodiment, the step of providing a flexible layer on both outer sides of the pre-laminated board to obtain a first pre-laminated board includes:
arranging the flexible layer on the upper side of the core plate on the uppermost layer of the pre-arranged plate; and arranging the flexible layer on the lower side of the core plate at the lowest layer of the pre-arranged plates.
In one embodiment, the step of pressing the first pre-pressing plate from both sides of the first pre-pressing plate to obtain the multilayer circuit board includes:
and pressing the first prepressing plate from the upper side and the lower side of the first prepressing plate by using two steel plates respectively to obtain the multilayer circuit board.
In one embodiment, after typesetting and pre-fixing at least three core boards and at least two first semi-cured sheets according to a preset requirement, flexible layers are respectively arranged on two outer sides of the pre-typesetting board, and before the step of obtaining a first pre-pressing board, the method further comprises:
and arranging a first isolation layer between the outermost core plate and the flexible layer to obtain the pre-arranged plate.
In one embodiment, after the step of disposing the flexible layers on both outer sides of the pre-arranged board, before the step of pressing the first pre-pressed board from both sides of the first pre-pressed board, the method further includes:
and arranging a second isolation layer between the flexible layer and the laminated plate to obtain the first prepressing plate.
In one embodiment, the step of pressing the first pre-pressing plate from both sides of the first pre-pressing plate to obtain the multilayer circuit board includes:
and heating the flexible layer to enable the flexible layer to be in a flowing state or enable the flexible layer to be in an intermediate state between a curing state and the flowing state.
In one embodiment, the step of providing a flexible layer on both outer sides of the pre-laminated board to obtain a first pre-laminated board includes:
and arranging at least two flexible layers on two outer sides of the pre-arranged plate to obtain the first pre-pressed plate.
In one embodiment, after the step of obtaining the multilayer circuit board, the method further comprises: and carrying out post-process treatment on the multilayer circuit board.
The method for laminating the multilayer circuit board with the outer core board of the embodiment at least has the following advantages: (1) the problem of unstable shrinkage of the outermost core board in the laminating process can be avoided, and the shrinkage of the outermost core board in the laminating process can be predicted, so that the problem of scrapping of the multilayer circuit board caused by unstable shrinkage can be avoided, the production yield of the multilayer circuit board is improved, and the production cost is reduced; (2) the problem that the surface of the outermost core plate is uneven due to the covering effect of the flexible layer can be avoided in the pressing process; (3) the flexible layer adhesion can be avoided on the pressfitting board at the pressfitting in-process and cause the pressfitting board stained, guarantee that the pressfitting board can reuse.
In another aspect, a multilayer circuit board having an outer core board is provided, which is manufactured by the pressing method.
When the multilayer circuit board with the outer core board is produced, at least three core boards and at least two first semi-cured sheets are laminated, wherein one first semi-cured sheet is arranged between two adjacent core boards, so that a first laminated structure is obtained; bonding and riveting the first laminated structure to obtain a pre-arranged plate; arranging a flexible layer on the upper side of the core plate on the uppermost layer of the prearranged plate; arranging a flexible layer on the lower side of the core plate at the lowest layer of the prearranged plates; and pressing the first prepressing plate from the upper side and the lower side of the first prepressing plate by using two steel plates respectively to obtain the multilayer circuit board. According to the multilayer circuit board with the outer core board, in the pressing process, the problem that the shrinkage of the outermost core board is unstable in the pressing process can be solved, and the shrinkage of the outermost core board in the pressing process can be predicted, so that the problem that the multilayer circuit board is scrapped due to unstable shrinkage can be solved, the production yield of the multilayer circuit board is improved, and the production cost is reduced.
Drawings
FIG. 1 is a flow chart of a method for bonding a multilayer circuit board having an outer core substrate according to an embodiment;
FIG. 2 is a flow chart showing a method of bonding a multilayer wiring board having an outer core board according to another embodiment;
fig. 3 is a schematic structural view of a multilayer wiring board having an outer core board according to an embodiment.
Description of reference numerals:
100. prearranged plates, 110, a core plate, 120, a first semi-cured sheet, 200, a flexible layer, 300, a steel plate, 400, a first insulating layer, 500 and a second insulating layer.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
It should also be understood that in explaining the connection relationship or the positional relationship of the elements, although not explicitly described, the connection relationship and the positional relationship are interpreted to include an error range which should be within an acceptable deviation range of a specific value determined by those skilled in the art. For example, "about," "approximately," or "substantially" may mean within one or more standard deviations, without limitation.
As shown in fig. 1 and 2, in one embodiment, a method for bonding a multilayer circuit board having an outer core board is provided, which includes the following steps:
s100, typesetting and pre-fixing at least three core plates 110 and at least two first semi-curing sheets 120 according to preset requirements to obtain a pre-typesetting plate 100 with the outermost layers being the core plates 110. Thus, at least three core boards 110 and at least two first semi-curing sheets 120 are stacked and laid out according to preset requirements and fixed to obtain the pre-arranged board 100, and the outermost layer of the pre-arranged board 100 is the core board 110, so that preparation is performed for subsequent lamination. The core board 110 may be a copper-clad board; the typesetting of the at least three core boards 110 and the at least two first semi-curing sheets 120 according to the preset requirement means that the at least three core boards 110 and the at least two first semi-curing sheets 120 are aligned and then stacked. The number of the core plates 110 can be flexibly adjusted according to the actual processing requirement, and can be three, four, six or more. The number of the first semi-cured sheets 120 can be flexibly adjusted according to actual processing requirements, and can be two, three, five or more.
Specifically, the step of typesetting and pre-fixing at least three core boards 110 and at least two first semi-curing sheets 120 according to a preset requirement to obtain a pre-typesetting board 100 with the outermost layers being the core boards 110 includes: s110, stacking at least three core boards 110 and at least two first semi-cured sheets 120, wherein one first semi-cured sheet 120 is disposed between two adjacent core boards 110, so as to obtain a first stacked structure. Thus, at least three core boards 110 and at least two first semi-curing sheets 120 are oppositely arranged at intervals in a stacked manner, so that one first semi-curing sheet 120 is arranged between two adjacent core boards 110, and the typesetting requirement of the multilayer circuit board is met. And S120, bonding and riveting the first laminated structure to obtain the pre-arranged board 100. In this way, bonding and riveting are performed on the first stacked structure, so as to obtain a pre-arranged board 100 with high stability, which is prepared for a subsequent pressing process, wherein outermost layers (e.g., the uppermost layer and the lowermost layer) of the pre-arranged board 100 are the core boards 110.
The plurality of core boards 110 means at least three core boards 110, for example, three, four, five or more core boards 110, and can be flexibly selected according to actual needs. The core board 110 may be a copper clad board.
And S200, arranging flexible layers 200 on two outer sides of the pre-arranged plate 100 to obtain a first pre-pressed plate (not marked). So, in two outsides of arranging board 100 in advance, set up flexible layer 200 in outermost core 110's the outside promptly, thereby can avoid outermost core 110 in pressfitting in-process and rigid pressfitting board direct contact, also can utilize flexible layer 200 to exert the effort to core 110 to the pressfitting board and cushion and absorb, and then can avoid outermost core 110 to appear the unstable problem of shrinkage in the pressfitting in-process, can predict the shrinkage of outermost core 110 in the pressfitting in-process, thereby can avoid the condemned problem of multilayer circuit board because of the shrinkage is unstable, the production qualification rate of multilayer circuit board has been improved, and the production cost is reduced. The flexible layer 200 may be made of a second prepreg, a flexible board, or other materials with specific flexible properties; the flexible layer 200 is preferably a second prepreg, which saves material costs.
For convenience of describing the arrangement of the flexible layer 200, the uppermost layer and the lowermost layer of the pre-laminated board 100 are both the core boards 110, i.e. the first pre-laminated board is pressed from the upper and lower directions. Of course, in other embodiments, the first pre-pressing plate may also be pressed from both left and right directions, and at this time, the leftmost side and the rightmost side of the pre-arranged plate 100 are both the core plates 110.
Specifically, S210, disposing the flexible layer 200 on the upper side of the core board 110 on the uppermost layer of the pre-arranged board 100; the flexible layer 200 is provided on the lower side of the core plate 110 of the lowermost layer of the pre-arranged plates 100. Therefore, the flexible layers 200 are arranged on the upper side of the core board 110 on the uppermost layer and the lower side of the core board 110 on the lowermost layer, so that the core board 110 on the uppermost layer and the core board 110 on the lowermost layer are not directly contacted with the laminated board in the laminating process, the shrinkage of the core board 110 on the uppermost layer and the core board 110 on the lowermost layer in the laminating process can be predicted, the shrinkage of the core board 110 on the uppermost layer and the core board 110 on the lowermost layer is prevented from exceeding a preset value (the preset value can be a range value), and the production yield of the multilayer circuit board is ensured.
More specifically, the core board 110 of the lowermost layer of the pre-arranged board 100 is placed on one flexible layer 200, and one flexible layer 200 is placed on the core board 110 of the uppermost layer, thereby realizing the arrangement of the flexible layers 200 on both outer sides of the pre-arranged board 100.
It should be noted that the flexible layers 200 may be sequentially disposed on the upper side of the uppermost core board 110 and the lower side of the lowermost core board 110, or the flexible layers 200 may be disposed on the upper side of the uppermost core board 110 and the lower side of the lowermost core board 110 at the same time, so that the uppermost core board 110 and the lowermost core board 110 are prevented from directly contacting the laminated board.
And S300, pressing the first prepressing plate from two sides of the first prepressing plate to obtain the multilayer circuit board. Thus, the first pre-pressing plate is subjected to a pressing process, so that the at least three core plates 110 and the at least two first semi-cured sheets 120 can be tightly pressed into a whole, thereby obtaining the multilayer circuit board. Meanwhile, the shrinkage of the core plates 110 at the two outermost layers of the multilayer circuit board is within a preset value, the quality of the multilayer circuit board is good, and the production qualification rate is high.
The first prepressing plate can be pressed by means of the pressing plate, the first prepressing plate is in good contact with the first prepressing plate, and pressing quality is guaranteed. The laminated plate is preferably a rigid plate (e.g., a steel plate), which can be reused, has a small amount of deformation, and can reduce the influence on the core plate 110 during the lamination process.
Specifically, the step of pressing the first prepressing plate from both sides of the first prepressing plate to obtain the multilayer circuit board includes: and S310, respectively pressing the first prepressing plate from the upper side and the lower side of the first prepressing plate by using two steel plates 300 to obtain the multilayer circuit board. In this way, the first prepressing plate is pressed by a clamping structure formed by two steel plates 300 arranged at an interval, so that a multilayer circuit board is obtained by pressing. The steel plate 300 positioned on the upper side is in contact with the flexible layer 200 corresponding to the core plate 110 on the uppermost layer, and the steel plate 300 positioned on the lower side is in contact with the flexible layer 200 corresponding to the core plate 110 on the lowermost layer, so that the two steel plates 300 can be prevented from being in direct contact with the core plates 110 on the uppermost layer and the core plates 110 on the lowermost layer respectively, the problem of unstable shrinkage of the core plates 110 on the uppermost layer and the core plates 110 on the lowermost layer in the pressing process can be avoided, the shrinkage of the core plates 110 on the uppermost layer and the core plates 110 on the lowermost layer can be predicted, the shrinkage of the core plates 110 on the uppermost layer and the core plates 110 on the lowermost layer can be prevented from exceeding a preset value.
More specifically, a second half-curing is placed on the steel sheet 300 located at the lower side, and the core sheet 110 of the lowermost layer of the pre-arranged sheets 100 is placed on this flexible layer 200. A flexible layer 200 is further placed on the uppermost core plate 110, and an upper steel plate 300 is placed on the flexible layer 200. And applying a pressing force to at least one steel plate 300 to press-fit the multilayer wiring board having the outer core board 110.
On the basis of any of the above embodiments, after typesetting and pre-fixing at least three core boards 110 and at least two first semi-cured sheets 120 according to a preset requirement, the flexible layers 200 are respectively disposed on two outer sides of the pre-arranged board 100, and before the step of obtaining a first pre-pressed board, the method further includes: s400, arranging a first isolation layer 400 between the core board 110 at the outermost layer and the flexible layer 200 to obtain the pre-arranged board 100. Therefore, the direct contact between the flexible layer 200 and the outermost core board 110 can be avoided, the problem that the surface of the outermost core board 110 is uneven due to the covering effect of the flexible layer 200 can be avoided in the pressing process of the outermost core board 110, and the product quality of the produced multilayer circuit board is further ensured. Wherein, first insulating layer 400 can choose for use the copper-clad plate that does not etch, and thickness can be at 0.4mm ~ 0.6mm, and the size of the copper-clad plate that does not etch (length and width etc.) size can match with the size of the pressfitting plate size.
Specifically, a second semi-curing process is performed on the steel plate 300 located at the lower side, an unetched copper clad laminate is placed on the flexible layer 200, and the core board 110 at the lowermost layer of the pre-arranged board 100 is placed on the unetched copper clad laminate. An unetched copper clad laminate is placed on the core board 110 at the uppermost layer, a flexible layer 200 is placed on the unetched copper clad laminate, and the steel plate 300 at the upper side is placed on the flexible layer 200. And applying a pressing force to at least one steel plate 300 to press-fit the multilayer wiring board having the outer core board 110.
Further, after the step of disposing the flexible layers 200 on both outer sides of the pre-laminated board 100, before the step of laminating the first pre-laminated board from both sides of the first pre-laminated board, the method further includes: and S500, arranging a second isolation layer 500 between the flexible layer 200 and the laminated plate to obtain a first pre-pressed plate. So, can avoid flexible layer 200 and pressfitting board direct contact, can avoid flexible layer 200 adhesion on the pressfitting board and cause the pressfitting board stained at the pressfitting in-process, guarantee that the pressfitting board can reuse. Wherein, the copper foil can be chooseed for use to second insulating layer 500, and the size (length and width etc.) size of copper foil can match with the size of pressfitting board size.
Specifically, a copper foil is placed on the steel plate 300 located at the lower side, a flexible layer 200 is placed on the copper foil, an unetched copper clad laminate is placed on the flexible layer 200, and the core board 110 of the lowermost layer of the pre-arranged board 100 is placed on the unetched copper clad laminate. Then an unetched copper clad laminate is placed on the core board 110 of the uppermost layer, a flexible layer 200 is placed on the unetched copper clad laminate, a copper foil is placed on the flexible layer 200, and the steel plate 300 on the upper side is placed on the copper foil. And applying a pressing force to at least one steel plate 300 to press-fit the multilayer wiring board having the outer core board 110.
On the basis of any of the above embodiments, the step of obtaining the multilayer circuit board by pressing the first pre-pressing plate from both sides of the first pre-pressing plate includes: the flexible layer 200 is heated to bring the flexible layer 200 into a fluid state or to bring the flexible layer 200 into an intermediate state between a cured state and a fluid state. So, in the pressfitting in-process, flexible layer 200 is in the flow state or makes flexible layer 200 between solidification state and flow state, thereby can apply the effort to outermost core 110 to the pressfitting board and carry out abundant buffering and absorption, the unstable problem of shrinkage appears in the pressfitting in-process in the outermost core 110 of avoiding that can be better, make the shrinkage of outermost core 110 in the pressfitting in-process more predictable and control, thereby the shrinkage of the outermost core 110 of avoiding that can be better exceeds the default, further guarantee the production quality of multilayer circuit board. Wherein, the flexible layer 200 can be heated in the form of pre-buried heating wires. The flow state may be a heat softened state; the intermediate state between the cured state and the flowing state of the flexible layer 200 may be when the flexible layer 200 is a second prepreg, such that the second prepreg is in a partially flowing state.
On the basis of any of the above embodiments, the step of providing the flexible layer 200 on both outer sides of the pre-laminated board 100 to obtain the first pre-laminated board includes: at least two flexible layers 200 are arranged on both outer sides of the pre-embossed sheet 100, resulting in a first pre-embossed sheet. So, through the quantity of the flexible layer 200 between the outermost core board 110 of reasonable selection and the pressfitting board, thereby adjustment pressfitting board that can be nimble is exerted to the effort of outermost core board 110, and then the unstable problem of shrinkage appears in pressfitting in-process in the outermost core board 110 of avoidance that can be better, make the shrinkage of outermost core board 110 in the pressfitting in-process more foresee and control, thereby the shrinkage of avoiding outermost core board 110 that can be better exceeds the default, further guarantee the production quality of multilayer circuit board. Wherein, the flexible layer 200 can be two, three or more; preferably, two core boards are used, so that the problem of unstable shrinkage of the outermost core board 110 during the lamination process can be avoided, and the lamination process is stable.
On the basis of any of the above embodiments, after the step of obtaining the multilayer wiring board, the method further includes: and carrying out post-process treatment on the multilayer circuit board. Thus, after the press-fit treatment, the flexible layer 200 is removed to obtain a multilayer circuit board, and the multilayer circuit board is subjected to post-process treatments such as drilling, solder resist, surface treatment and the like, so that a final product is obtained.
The method for laminating the multilayer circuit board with the outer core board 110 of the embodiment at least has the following advantages: (1) the problem that the shrinkage of the outermost core board 110 is unstable in the laminating process can be avoided, and the shrinkage of the outermost core board 110 in the laminating process can be predicted, so that the problem that the multilayer circuit board is scrapped due to unstable shrinkage can be avoided, the production yield of the multilayer circuit board is improved, and the production cost is reduced; (2) the problem that the surface of the outermost core plate 110 is uneven due to the covering effect of the flexible layer 200 of the outermost core plate 110 can be avoided in the pressing process; (3) the flexible layer 200 adhesion can be avoided on the pressfitting board at the pressfitting in-process and cause the pressfitting board stained, guarantee that the pressfitting board can reuse.
In one embodiment, as shown in fig. 3, there is further provided a multilayer circuit board having an outer core 110, the multilayer circuit board being manufactured by the press-fitting method according to any of the above embodiments.
When the multilayer circuit board with the outer core board 110 of the above embodiment is produced, at least three core boards 110 and at least two first semi-cured sheets 120 are stacked, wherein one first semi-cured sheet 120 is arranged between two adjacent core boards 110, so as to obtain a first stacked structure; bonding and riveting the first laminated structure to obtain a pre-arranged board 100; arranging a flexible layer 200 on the upper side of the core plate 110 on the uppermost layer of the pre-arranged plate 100; arranging a flexible layer 200 on the lower side of the core plate 110 at the lowest layer of the prearranged plates 100; the first pre-pressed board is pressed from the upper side and the lower side thereof by two steel plates 300, respectively, to obtain a multilayer wiring board. In the multi-layer circuit board with the outer-layer core board 110 of the embodiment, in the pressing process, the problem that the shrinkage of the outermost core board 110 is unstable in the pressing process can be avoided, and the shrinkage of the outermost core board 110 in the pressing process can be predicted, so that the problem that the multi-layer circuit board is scrapped due to unstable shrinkage can be avoided, the production yield of the multi-layer circuit board is improved, and the production cost is reduced.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method for laminating a multilayer circuit board with an outer core board is characterized by comprising the following steps:
typesetting and pre-fixing at least three core plates and at least two first semi-curing sheets according to a preset requirement to obtain a pre-typesetting plate with the outermost layer being the core plate;
arranging flexible layers on two outer sides of the pre-arranged plate to obtain a first pre-pressed plate;
and pressing the first prepressing plate from two sides of the first prepressing plate to obtain the multilayer circuit board.
2. A method according to claim 1, wherein the step of laying out and pre-fixing at least three core boards and at least two first semi-cured sheets to obtain a pre-laid board with the core boards as outermost layers comprises:
stacking at least three core plates and at least two first semi-cured sheets, wherein one first semi-cured sheet is arranged between every two adjacent core plates to obtain a first stacked structure;
and bonding and riveting the first laminated structure to obtain the pre-arranged board.
3. A method for laminating a multilayer wiring board having an outer core as claimed in claim 1, wherein the step of providing a first pre-press plate by providing a flexible layer on both outer sides of the pre-press plate comprises:
arranging the flexible layer on the upper side of the core plate on the uppermost layer of the pre-arranged plate; and arranging the flexible layer on the lower side of the core plate at the lowest layer of the pre-arranged plates.
4. A method for bonding a multilayer wiring board having an outer core as claimed in claim 1, wherein the step of bonding the first prepreg from both sides of the first prepreg to obtain the multilayer wiring board comprises:
and pressing the first prepressing plate from the upper side and the lower side of the first prepressing plate by using two steel plates respectively to obtain the multilayer circuit board.
5. A method according to any one of claims 1 to 4, wherein after the steps of laying out at least three core boards and at least two first semi-solid sheets according to the predetermined requirements and pre-fixing the same, flexible layers are provided on both outer sides of the pre-laid boards, and before the step of obtaining the first pre-pressed boards, the method further comprises:
and arranging a first isolation layer between the outermost core plate and the flexible layer to obtain the pre-arranged plate.
6. A method for laminating a multilayer wiring board having an outer core as claimed in claim 5, wherein after the step of providing a flexible layer on both outer sides of the pre-laminated board, and before the step of laminating the first pre-laminated board from both sides of the first pre-laminated board, the method further comprises:
and arranging a second isolation layer between the flexible layer and the laminated plate to obtain the first prepressing plate.
7. A method for bonding a multilayer wiring board having an outer core as claimed in any one of claims 1 to 4, wherein the step of bonding the first prepreg from both sides of the first prepreg to obtain the multilayer wiring board comprises:
and heating the flexible layer to enable the flexible layer to be in a flowing state or enable the flexible layer to be in an intermediate state between a curing state and the flowing state.
8. A method for laminating a multilayer wiring board having an outer core as claimed in any one of claims 1 to 4, wherein a flexible layer is provided on both outer sides of said pre-laminated board, and the step of obtaining a first pre-laminated board comprises:
and arranging at least two flexible layers on two outer sides of the pre-arranged plate to obtain the first pre-pressed plate.
9. A method for laminating a multilayer wiring board having an outer core board according to any one of claims 1 to 4, wherein the flexible layer includes a second prepreg.
10. A multilayer wiring board having an outer core, characterized in that the multilayer wiring board is produced by the press-fitting method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010298007.1A CN111491467A (en) | 2020-04-16 | 2020-04-16 | Multilayer circuit board with outer core board and laminating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010298007.1A CN111491467A (en) | 2020-04-16 | 2020-04-16 | Multilayer circuit board with outer core board and laminating method thereof |
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| CN111491467A true CN111491467A (en) | 2020-08-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010298007.1A Pending CN111491467A (en) | 2020-04-16 | 2020-04-16 | Multilayer circuit board with outer core board and laminating method thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012140907A1 (en) * | 2011-04-14 | 2012-10-18 | 住友ベークライト株式会社 | Laminate sheet, circuit board, semiconductor package, and method for producing laminate sheet |
| CN205793734U (en) * | 2016-05-27 | 2016-12-07 | 广州杰赛科技股份有限公司 | The pressing structure of printed wiring board capable of preventing layer deviation |
-
2020
- 2020-04-16 CN CN202010298007.1A patent/CN111491467A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012140907A1 (en) * | 2011-04-14 | 2012-10-18 | 住友ベークライト株式会社 | Laminate sheet, circuit board, semiconductor package, and method for producing laminate sheet |
| CN205793734U (en) * | 2016-05-27 | 2016-12-07 | 广州杰赛科技股份有限公司 | The pressing structure of printed wiring board capable of preventing layer deviation |
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