201244556 六、發明說明： 【發明所屬之技術領域】 本發明係關於堆積用預浸體。 【先前技術】 已知在電路基板上交互重疊絕緣層與導體層之堆積 (build-up)方式的積層佈線板之製造技術。 例如，專利文獻1中記載一種熱硬化性樹脂積層板之製造 方法，係將由對紙或布基材含浸熱硬化性樹脂清漆而成的預 浸體與金屬箔所構成之積層材料，夾置於鏡面板之間，進行 多數積層，並介隔著缓衝材、載體材而配置於熱板間，將熱 板加熱加壓，藉此而形成熱硬化性樹脂積層板，其中，缓衝 材係於其表面侧沿著各自之邊形成有突起。根據此方法，由 於在緩衝材之表面形成有沿著各邊之突起，故於加壓成形 時，積層材料之外周緣部較其他部分之壓力更高，於成形 時，内部樹脂漏出至外部之情況少。 又，專利文獻2中記載使用可加熱及加壓之真空積層裝 置’於經圖案加工之電路基盤上積層由支持基礎薄骐與樹月匕 組成物層所構成之接著薄膜的樹脂組成物層面的方法， 中，於真空積層裝置之至少一個加壓板與接著薄膜之支持武 礎薄膜面之間，設置較該接著薄膜表面積更小的防滲漏片 該防滲漏片係以不管在該接著薄膜的表面周圍任一點岣不 會漏出至外側的方式而設置，藉此可防止接著劑之滲漏。 101108591 4 201244556 又’專利文獻3中記載，以提供適合於無微波紋的聚苯喊 積層板之預浸體為技術課題’作為解決該技術課題之手段， 「採用由熱硬化性聚苯醚系樹脂組成物與基材複合而成之 預浸體，其中，其樹脂流動度(resinflow)係1%〜25%」。 [先前技術文獻] [專利文獻] 專利文獻1:日本專利特開平‘185408號公報 專利文獻2:日本專利特開平11-340625號公報 專利文獻3 :曰本專利特開2000-297165號公報 【發明内容】 然而，專利文獻1、2之預浸體由於係以應甩於真空層合 機時防止樹脂漏出作為课題’故並未考慮確保埋入内層電路 基板上之基板凹凸用的充分流動性。另一方面，使用此等習 知預浸體之積層板’係有在電路間殘留孔洞之問題。根據本 發明人等之確認，此種習知預浸體之樹脂流動度係5〜8重 量％左右，最高也僅有12重量％。故，本發明人等認為， 由於樹脂無法充分順應電路凹凸，而發生埋入不良之狀況。 然，在為了充分埋入電路凹凸而確保構成預浸體之樹脂層 的樹脂組成物流動性之情況，由於樹脂組成物之流動性變得 過大’故在真空層合時，樹脂層會流出，而使所得之積層板 的厚度發生誤差。如此’内層電路之埋入的提升與厚度精度 的提升係為相互取捨(trade-off)之關係。 101108591 5 201244556 專利文獻3記載之内容係以將熱硬化性聚苯醚系樹脂組 成物與基材複合而成之預浸體作為前提的技術，並未記載具 備不含聚苯醚之樹脂層的預浸體°又’專利文獻3記載之發 明係著眼於以環氧樹脂作為材料之覆鋼積層板具有在電氣 特性（尤其是高頻率區域之介電特性）不良的缺點，將聚苯醚 應用於覆銅積層板作為解決此問題之材料。因此，專利文獻 3記載之發明無法使用於具備含有以環氧樹脂作為主成分 之熱硬化性樹脂的樹脂層之預浸體技術。 又，於堆積用預浸體中，樹脂流動度與構成樹脂層之樹脂 組成物的種類係一體而不可分之構成。樹脂流動度係由樹脂 之黏度與樹脂反應之進行度的平衡所決定之參數。聚苯醚樹 脂之黏度高，由具備含有聚苯醚樹脂之樹脂層的預浸體，無 法獲得良好的内層電路埋入性。 本發明係有鑑於上述情況而完成者，目的在於，於具備含 有環氧樹脂等特定熱硬化樹脂之樹脂層的堆積用預浸體 中，提供可兼顧内層電路之埋入性的提升與厚度精度的提升 之堆積用預浸體。 根據本發明’提供—種堆制預纽，係具備：纖維基材； 以及设於上述纖維基材之雙面，並含有熱硬化性樹脂之樹脂 層； M m _從環氧難、氰酸賴脂及順丁婦二 醯亞胺化合物所選擇者· 101108591 201244556 依據 IPC-TM-650 Method 2.3.17,以 171 土3¾、l380±70kPa 之條件加熱加壓5分鐘所測定之樹脂流動度係15重量％以 上且.50重量％以下。 又，根據本發明，提供一種積層板，係具備： 核心層，其係於單面或雙面具有電路形成面；以及 堆積層，其係積層於上述核心層之上述電路形成面； 上述堆積層係將上述之堆積用預浸體硬化而形成者。 又，根據本發明，提供一種半導體裝置，係具備上述之積 層板、以及安裝於上述積層板之半導體元件。 此外，根據本發明，提供一種積層板之製造方法，係連續 進行以下步驟者： 層合步驟，其係於在單面或雙面具有電路形成面之核心層 的上述電路形成面，於加熱加壓下，將堆義預浸體予以層 合；以及 平滑化步驟’其係使經層合之上述堆義職體的表面平 滑，而獲得積層板；其中， 於上述層合步财，在以相對向之—對金屬板包夾上述核 心層與上述堆積用預浸體之狀態下，進行加熱及加壓； 作為上述堆積用騎體，係使用上述之_用預浸體。 根據本發明’係提供可兼顧内層電路埋入性之提升與厚度 精度之提升的堆積用預浸體。 上述目的及其他目的、特徵及優點，係可經由下述之較佳 101108591 201244556 實施形態及隨附之圖式而更為明白。 【實施方式】 本發明之預浸體係具備纖維基材與設於纖維基材雙面並 含有既定熱硬化性樹脂的樹脂層之堆積用預浸體。此預浸體 依據 IPC-TM_650 Method 2.3.17，以 171±3。〇、l380±70kPa 之條件加熱加壓5分鐘所測定之樹脂流動度(resin fl〇w)係 15重量％以上且50重量％以下。藉由使上述條件下所測定 之樹脂流動度為15重量％以上，可獲得内層電路之埋入性 優異的預is:體。又，藉由使樹脂流動度之上限為5 〇重量％ 以下，當將預浸體積層壓合時，可抑制來自預浸體之樹脂層 流出。因此，能夠實現當積層於具有電路形成面之核心層時 内層電路之埋入性優異，且可抑制積層壓合時來自預浸體之 樹脂層流出的堆積用預浸體。 又，本發明之預浸體在以相對向之-對橡膠板包夾該預浸 體之狀態下’於12(TC、2.5MPa之條件下力口熱及加壓時， 在俯視角度下從上述纖維基材之外緣溢出之樹脂層的重 量’相對於樹脂層之整體較佳為為5重量％以下。藉由如此 限定，可進一步提升所得積層板之厚度岣勻性。因此，能夠 實現當積層於具有電路形成面之核心層時内層電路之埋人 性優異’可抑制積層壓合時來自預浸體之樹腊層流出，且可 進一步提升厚度均勻性的堆積用預浸體。 另外，上述橡膠板係使用滿足下述⑴〜(iU)者。 101108591 8 201244556 (i) 依據JIS Κ 6253 A所測定之橡膠硬度為60。 (ii) 厚度 3mm (iii) 材質為矽 以下，針對本發明之實施形態，使用圖面進行說明。另外， 所有之圖面中，對於同樣構成要素係賦予同樣的符號，並適 當省略說明。 [預浸體] 圖1係表示本發明預浸體一例之圖。預浸體1係具備纖維 基材2與設於纖維基材2的雙面且含有熱硬化性樹脂之樹脂 詹3、4 °預浸體1係可將樹脂組成物含浸於纖維基材2而 形成。以下’針對使用於預浸體1之樹脂組成物p進行說明， 構成樹脂層3、4之樹脂組成物可互相相同亦可分別相異。 使用於預浸體1之樹脂組成物p係含有(A)熱硬化性樹 月曰（A)熱硬化性樹脂係從環氧樹脂、氰酸酯樹脂及順丁烯 二醯亞胺化合物所選擇者.，該等可含有一種或二種以上。樹 脂組成物P中之熱硬化性樹脂的含有量並無制限定，較佳 係樹脂組成物p整體的15〜8G重量％，更佳係25〜5〇重量 %。 作為環氧樹脂，例如可舉$雙紛A型魏樹脂、雙紛F 里％氧糾a、雙齡S型環氧樹脂、雙紛E型環氧樹脂、雔 酚Μ型環氧樹脂、雙酚p型環氧樹脂、雙酚z型環氧樹: 等之雙紛型環氧樹脂；紛·祕清漆型環氧樹脂、甲盼_齡酸 101108591 201244556 /月漆型環氧樹脂等之㈣清漆型環氧樹脂，·聯苯型環氧樹 =料枝商氧樹料之芳基佩型環氧樹脂；蔡㈣ i月曰’蒽型％氧樹赌；苯氧基型環氧樹月旨；二環戊二稀级 脂；降㈣型環氧樹脂；金剛朗環氧樹脂；㈣環 "旨等之環氧樹脂。可使用該等之中的1種，亦可併用2 種以上使用。 衰氧樹I之含有I並無制限定，較佳為樹脂組成物p 體的15〜8〇重量％。更佳為25〜50重量％。又，若併用 Γ之雙紛A型環氧樹脂、㈣f型環氧樹脂等的液狀環 ㈣脂，可提升對纖維基材之含浸性，故較佳。液狀環氣樹 月曰之含有量以樹脂組成物p整體的3〜14重量為佳。又苦 併用固態之雙盼A型每氧樹脂、雙盼F型環氧樹脂，則可 提升對導體之密著性。 作為氰酸醋樹脂之種類，並無特別限定，例如可舉出紛駿 清漆型氣義樹脂、祕奸型驗_脂、二環戊二歸梨 氰酸酿樹脂、聯苯型氰酸㈣脂、舰A型氰酸醋樹脂、 又紛E型氰酸g旨;^脂、四甲基雙紛F型氰義樹脂等之雙 紛型戴酸賴脂等。該等之中，從低熱膨脹性之觀點而言， 較佳為雙酚酚醛清漆型氰酸酯樹脂。又，亦可進一步併用1 種或2種以上之其他氰酸i旨樹脂，並無制限i氰酸g旨樹 月9較佳為樹脂組成物P整體的8〜2〇重量％。 作為順丁烯二酿亞胺化合物，可舉出雙順丁烯二醯亞胺、 101108591 201244556 雙順丁烯二醯亞胺與氰酸酯所構成的雙順丁烯二醯亞胺· 三畊樹脂(BT樹脂）。作為雙順丁烯二醯亞胺，例如可舉出 4,4’·二苯基曱烧順丁稀二g盘亞㉟、間_伸絲順丁稀二酿亞 胺、對-伸苯基順丁烯二醯亞胺、2,2，-[4_(4_順丁烯二醯亞胺 苯氧基)苯基]丙烧、雙-(3-乙基_5_甲基順丁烯二醯亞胺苯 基）甲烷、4·曱基-1，3-伸苯基雙順丁烯二醯亞胺、N，N，_伸乙 基二順丁烯二醯亞胺、N，N，-六亞甲基二順丁烯二醯亞胺 等。順丁烯二醯亞胺化合物較佳為樹脂組成物p整體的2〇 重量％以下。 樹脂組成物P較佳係含有⑻填充材。作為⑻填充材，例 如可舉出芯勒型橡膠粒子、交聯丙烯腈丁二烯橡膠粒子、交 聯苯乙烯丁二烯橡膠粒子、丙烯酸系橡膠粒子、聚矽氧粒子 等之有機填充材；滑石、煅燒黏土、未煅燒黏土、雲母、玻 璃等之矽酸鹽，氧化鈦、氧化鋁、矽石、熔融矽石等之氧化 物，碳酸鈣、碳酸鎂、水滑石等之碳酸鹽，水鋁石（b〇ehmite， aio(oh))、通常稱為「擬」水紹石之水紹石（亦即 Al2〇3 · χΗ20，其中X=1至2)、氫氧化鋁、氫氧化鎂、氫氧 化鈣等之氫氧化物，硫酸鋇、硫酸鈣、亞硫酸鈣等之硫酸鹽 或亞硫酸鹽，硼酸鋅、偏硼酸鋇、硼酸鋁、硼酸鈣、硼酸鈉 等之硼酸鹽，氮化鋁、氮化硼、氮化矽、氮化碳等之氮化物， 鈦酸鰓、鈦酸鋇等之鈦酸鹽等的無機填充材。可單獨使用兮 等中之1種，亦可併用2種以上。 101108591 11 201244556 该等之中’較佳為石夕石，而溶融石夕石（尤其是球狀炼融石夕 石）以低熱膨脹性優異之觀點而言為特佳。其形狀有破碎 狀、球狀，但配合目的，係採用為了確保對纖維基材之含浸 性，在降低樹脂組成物p之溶融黏度方面使用球狀石夕石等之 使用方法。 (B)填充材《平均粒徑並無特別限定，較佳為〇〇1〜3师， 特佳為0.02〜_。藉由使⑻填充材之粒徑為〇〇1哗以 上’可使清漆成為_度’將樹脂組成物p良好地含浸於纖 維基材中。X 藉由使粒徑為_以下，可抑制(B)填充材 於/月漆中的沈降等。其平均粒徑係例如可經由粒度分佈計 (島津製作所A司製’製品名··雷化繞射式粒度分佈測定裝 置SALD系列）進行測定。 又，填充材(B)並無特舰定’可使鮮均純為單分散 的填充材，亦可使用平均粒徑為多分散的填充材。此外，亦 可併用1種或2種以上之平均粒徑為單分散及/或多分散之 填充材。 平均粒徑¥以下之球狀石夕石（尤其是球狀炫融石夕石）更 佳’尤其以平均粒彳之球狀溶財石為特佳。藉 此，可提升(B)填充材之填充性。 ()真充材之3有3:並無特別限^，較佳係樹脂組成物p 整體的2〜70重量％，特佳為5〜6〇重量％。若含有量在上 述範圍内，尤其可作成低熱膨脹、低吸水之成品。視需要亦 101108591 12 201244556 可以樹脂層3、4來改變(B)填充材之含有量，尋求與導體之 密著及低熱膨脹的兼顧》 使用於預浸體1之樹脂組成物P並無特別限定，但較佳係 含有（C)偶合劑。（C)偶合劑係提升(A)熱硬化性樹脂與(B)填 充材之界面濕潤性，藉此對纖維基材均勻地固定(A)熱硬化 性樹脂及(B)填充材，可改良耐熱性，尤其是吸濕後的焊劑 耐熱性。 作為（C)偶合劑，若為一般所使用者，則可任意使用，具 體而言，較佳係使用由環氧矽烷偶合劑、陽離子矽烷偶合 劑、胺基矽烷偶合劑、鈦酸酯系偶合劑及聚矽氧油型偶合劑 中選擇之1種以上偶合劑。藉此，可提高與(B)填充材的界 面之濕潤性，藉此可提升财熱性。 (C)偶合劑之添加量係與(B)填充材之比表面積有關，故並 無特別限疋，相對於(B)填充材1〇〇重量份較佳為〇〇5〜3 重量份，尤其以0.1〜2重量份為佳。藉由將(c)偶合劑之含 ·* 有量相對於(B)填充材10〇重量份定為0.05重量份以上，可 -充分被覆(B)填充材，並可提升耐熱性。藉由將((：)偶合劑之 含有量相對於(B)填充材1〇〇重量份定為3重量份以下，可 使反應良好地進行，防止彎曲強度等之降低。201244556 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a prepreg for deposition. [Prior Art] A manufacturing technique of a build-up wiring board in which a build-up of an insulating layer and a conductor layer are overlapped on a circuit board is known. For example, Patent Document 1 describes a method for producing a thermosetting resin laminate, which is obtained by sandwiching a laminate of a prepreg and a metal foil obtained by impregnating a paper or a cloth substrate with a thermosetting resin varnish. Between the mirror panels, a plurality of layers are laminated, and a buffer material or a carrier material is placed between the hot plates, and the hot plate is heated and pressurized to form a thermosetting resin laminate. Protrusions are formed along the respective sides on the surface side thereof. According to this method, since the projections along the respective sides are formed on the surface of the cushioning material, the pressure of the peripheral portion of the laminated material is higher than that of the other portions during press molding, and the internal resin leaks to the outside during molding. There are few situations. Further, Patent Document 2 describes a resin composition layer formed by laminating a pattern of a base film composed of a base layer and a tree layer composition layer on a patterned circuit substrate using a vacuum laminating device capable of heating and pressurizing. In the method, between the at least one pressure plate of the vacuum laminating device and the supporting film surface of the film, a leakage preventing sheet having a smaller surface area than the film is disposed, regardless of the subsequent film. The point around the surface of the film is not leaked to the outside, thereby preventing leakage of the adhesive. 101108591 4 201244556 Further, in the patent document 3, a prepreg suitable for providing a polyphenylene laminate without micro-corrugation is a technical problem, and a method for solving the technical problem is as follows: "The thermosetting polyphenylene ether system is used. A prepreg obtained by compounding a resin composition and a substrate, wherein the resin flow rate (resinflow) is 1% to 25%". [Prior Art Document] [Patent Document] Patent Document 1: Japanese Patent Laid-Open No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 2000-297165. However, in the prepreg of Patent Documents 1 and 2, since it is a problem to prevent resin leakage when it is applied to a vacuum laminator, it is not considered to ensure sufficient fluidity for substrate unevenness embedded in the inner layer circuit board. . On the other hand, the use of such conventional laminates of prepregs is a problem of residual holes between circuits. According to the inventors of the present invention, the resin flowability of the conventional prepreg is about 5 to 8% by weight, and the maximum is only 12% by weight. Therefore, the inventors of the present invention thought that the resin could not sufficiently conform to the unevenness of the circuit, and the embedding failure occurred. However, in order to sufficiently embed the unevenness of the circuit and ensure the fluidity of the resin composition constituting the resin layer of the prepreg, the fluidity of the resin composition becomes excessively large, so that the resin layer flows out during vacuum lamination. The thickness of the resulting laminate is inaccurate. Such enhancement of the embedding of the inner layer circuit and improvement of the thickness precision are in a trade-off relationship. 101108591 5 201244556 The content described in Patent Document 3 is based on a prepreg obtained by combining a thermosetting polyphenylene ether-based resin composition and a substrate, and does not include a resin layer containing no polyphenylene ether. The invention described in the patent document 3 focuses on the disadvantage that the steel-clad laminate having epoxy resin as a material has poor electrical properties (especially dielectric properties in a high-frequency region), and the application of polyphenylene ether. Copper clad laminates are used as materials to solve this problem. Therefore, the invention described in Patent Document 3 cannot be used in a prepreg technique including a resin layer containing a thermosetting resin containing an epoxy resin as a main component. Further, in the prepreg for deposition, the resin fluidity is integral with the type of the resin composition constituting the resin layer. The resin fluidity is a parameter determined by the balance between the viscosity of the resin and the progress of the reaction of the resin. The polyphenylene ether resin has a high viscosity, and a prepreg having a resin layer containing a polyphenylene ether resin cannot obtain good inner layer circuit embedding property. The present invention has been made in view of the above-described circumstances, and it is an object of the present invention to provide a prepreg for depositing a resin layer containing a specific thermosetting resin such as an epoxy resin, and to improve the embedding property and thickness precision of the inner layer circuit. The pre-impregnation is used for the lifting of the stack. According to the present invention, a "preparation" is provided with: a fibrous base material; and a resin layer provided on both sides of the fibrous base material and containing a thermosetting resin; M m _ from epoxy hard, cyanic acid Selection of lysine and cis-butanyl quinone imine compound · 101108591 201244556 According to IPC-TM-650 Method 2.3.17, the resin fluidity measured by heating and pressurizing for 5 minutes under the conditions of 171 soil 33⁄4, l380±70kPa 15% by weight or more and .50% by weight or less. Moreover, according to the present invention, there is provided a laminated board comprising: a core layer having a circuit forming surface on one or both sides; and a buildup layer laminated on the circuit forming surface of the core layer; The above-mentioned prepreg for deposition is formed by hardening. Moreover, according to the present invention, there is provided a semiconductor device comprising the above laminated board and a semiconductor element mounted on the laminated board. Further, according to the present invention, there is provided a method of manufacturing a laminated board which is continuously subjected to the following steps: a lamination step of the above-mentioned circuit forming surface having a core layer of a circuit forming surface on one or both sides, heated and added Pressing, laminating the stack of prepregs; and smoothing step 'which smoothes the surface of the laminated body of the above-mentioned stack, and obtains a laminate; wherein, in the above-mentioned lamination, In the state in which the core layer and the stacking prepreg are sandwiched between the metal sheets, heating and pressurization are performed. As the stacking body, the above-mentioned prepreg is used. According to the present invention, a prepreg for deposition which can improve the embedding property of the inner layer circuit and the improvement of the thickness precision can be provided. The above and other objects, features and advantages of the present invention will become apparent from the accompanying drawings and appended claims. [Embodiment] The prepreg system of the present invention comprises a fibrous base material and a prepreg for depositing a resin layer provided on both sides of the fiber base material and containing a predetermined thermosetting resin. This prepreg is 171 ± 3 according to IPC-TM_650 Method 2.3.17. The resin flow rate (resin fl〇w) measured by heating and pressurizing for 5 minutes under conditions of 380 ± 70 kPa was 15% by weight or more and 50% by weight or less. By setting the resin fluidity measured under the above conditions to 15% by weight or more, a pre-is: body excellent in embedding property of the inner layer circuit can be obtained. Further, by setting the upper limit of the fluidity of the resin to 5 〇 by weight or less, when the prepreg volume is laminated, the resin layer from the prepreg can be prevented from flowing out. Therefore, it is possible to realize a prepreg for deposition which is excellent in embedding property of the inner layer circuit when laminated on the core layer having the circuit formation surface, and which suppresses the outflow of the resin layer from the prepreg when the laminate is laminated. Further, the prepreg of the present invention is subjected to heat and pressure at a temperature of 12 (TC, 2.5 MPa) in a state in which the prepreg is sandwiched between the opposite and the rubber sheets. The weight 'the weight of the resin layer overflowing from the outer edge of the fiber base material is preferably 5% by weight or less based on the entire resin layer. By thus being defined, the thickness uniformity of the obtained laminated plate can be further improved. When the core layer having the circuit forming surface is laminated, the inner layer circuit is excellent in burying property. The prepreg for stacking from the prepreg of the wax layer can be suppressed, and the thickness pre-dip can be further improved. The rubber sheet is used in accordance with the following (1) to (iU). 101108591 8 201244556 (i) The rubber hardness measured according to JIS Κ 6253 A is 60. (ii) The thickness is 3 mm (iii) The material is 矽 or less, and the present invention is In the drawings, the same components are denoted by the same reference numerals, and the description thereof will be appropriately omitted. [Prepreg] Fig. 1 is a view showing an example of the prepreg of the present invention. Pre The body 1 is provided with a fiber base material 2 and a resin provided on both sides of the fiber base material 2 and containing a thermosetting resin. The 3, 4 ° prepreg 1 can be formed by impregnating the fiber base material 2 with the resin composition. The resin composition p used in the prepreg 1 will be described below, and the resin compositions constituting the resin layers 3 and 4 may be the same or different. The resin composition used in the prepreg 1 contains p ( A) Thermosetting Tree Moon (A) The thermosetting resin is selected from the group consisting of an epoxy resin, a cyanate resin, and a maleimide compound. These may contain one type or two or more types. The content of the thermosetting resin in the composition P is not limited, but is preferably 15 to 8 G% by weight, more preferably 25 to 5 % by weight based on the entire resin composition p. Double-type A-type Wei resin, double-F, % oxygen correction, double-age S-type epoxy resin, double-layer E-type epoxy resin, phenolphthalein-type epoxy resin, bisphenol p-type epoxy resin, bisphenol Z-type epoxy tree: Double-type epoxy resin; etc.; secret varnish type epoxy resin, 甲盼_酸酸101108591 201244556 /月Epoxy resin, etc. (4) varnish-type epoxy resin, · biphenyl type epoxy tree = aryl-based epoxy resin of material oxygen tree; Cai (four) i month 曰 '蒽 type oxygen tree gambling; benzene Oxygen type epoxy resin; dicyclopentane dilute fat; lower (four) type epoxy resin; Jinganglang epoxy resin; (d) ring " epoxy resin. One of these can be used. Further, it may be used in combination of two or more kinds. The content of the oxidizing tree I is not limited, and is preferably 15 to 8 % by weight of the resin composition p body, more preferably 25 to 50% by weight. The liquid ring (tetra) grease such as the A-type epoxy resin and the (iv) f-type epoxy resin can improve the impregnation property to the fiber substrate, which is preferable. The content of the liquid sulcus is preferably 3 to 14 by weight of the entire resin composition p. It is also difficult to improve the adhesion to the conductor by using the solid-state double-type A-type oxygen resin and the double-prevention F-type epoxy resin. The type of the cyanic acid vinegar resin is not particularly limited, and examples thereof include a clarified varnish type gas-based resin, a secret type test, a fat, a dicyclopentane ruthenium citrate resin, and a biphenyl type cyanate (tetra) resin. , ship A-type cyanate vinegar resin, and E-type cyanate g; ^ grease, tetramethyl double F-type cyanide resin and other double-type acid lyophile. Among these, a bisphenol novolac type cyanate resin is preferred from the viewpoint of low thermal expansion property. Further, one or two or more kinds of other cyanic acid-based resins may be used in combination, and it is preferable that the cyanic acid is not limited to 8 to 2% by weight of the entire resin composition P. Examples of the maleic iminoimine compound include bis-cis-butenediamine, 101108591 201244556, di-n-butylene imidate, and cyanate ester. Resin (BT resin). Examples of the bis-n-butylene diimide include 4,4′·diphenyl fluorene cis-butadiene di-g-sub-35, inter-extension cis-butyl diimide, and p-phenylene. Maleimide, 2,2,-[4-(4-methacrylimidophenoxy)phenyl]propane, bis-(3-ethyl-5-methyl-butenene Dimethyleneimine phenyl)methane, 4·mercapto-1,3-phenylenebissuccinimide, N,N,_ethylidene dimethyleneimine, N,N , hexamethylene dim-butenylene diimine, and the like. The maleimide compound is preferably 2% by weight or less based on the entire resin composition p. The resin composition P preferably contains (8) a filler. Examples of the (8) filler include organic fillers such as core rubber particles, crosslinked acrylonitrile butadiene rubber particles, crosslinked styrene butadiene rubber particles, acrylic rubber particles, and polyfluorene oxide particles; Oxalate of talc, calcined clay, uncalcined clay, mica, glass, etc., oxide of titanium oxide, aluminum oxide, vermiculite, molten vermiculite, carbonate of calcium carbonate, magnesium carbonate, hydrotalcite, etc. Stone (b〇ehmite, aio(oh)), commonly referred to as "study" of water, and water (also known as Al2〇3 · χΗ20, where X = 1 to 2), aluminum hydroxide, magnesium hydroxide, a hydroxide such as calcium hydroxide, a sulfate or a sulfite such as barium sulfate, calcium sulfate or calcium sulfite, a borate such as zinc borate, barium metaborate, aluminum borate, calcium borate or sodium borate, aluminum nitride An inorganic filler such as a nitride such as boron nitride, tantalum nitride or carbon nitride, or a titanate such as barium titanate or barium titanate. One type of ruthenium or the like may be used alone or two or more types may be used in combination. 101108591 11 201244556 Among these, 'Shi Xishi is preferred, and the molten Shishi stone (especially the spherical smelting stone) is particularly excellent from the viewpoint of excellent thermal expansion. The shape is a crushed shape or a spherical shape. However, in order to ensure the impregnation with the fibrous base material, a method of using a spherical stone or the like for reducing the melt viscosity of the resin composition p is used. (B) Filler The average particle diameter is not particularly limited, and is preferably 〇〇1 to 3 divisions, particularly preferably 0.02 to _. The resin composition p is satisfactorily impregnated into the fibrous base material by making the particle size of the (8) filler 〇〇1 哗 or more and allowing the varnish to become _degree. X By suppressing the particle size to _ or less, it is possible to suppress the sedimentation of the filler (B) in the varnish. The average particle size can be measured, for example, by a particle size distribution analyzer (product name: Shimadzu Corporation A product name, lightning diffraction type particle size distribution measuring device SALD series). Further, the filler (B) is not particularly fixed, and the filler may be a single-dispersion filler, and a filler having an average particle diameter of a plurality of dispersions may be used. Further, one or two or more kinds of fillers having an average particle diameter of monodisperse and/or polydisperse may be used in combination. It is more preferable that the spherical granules of the average particle diameter of ¥ hereinafter (especially the spheroidal shale stone) are particularly excellent in the globular solution of the average granules. Thereby, the filling property of (B) filler can be improved. (3) 3 of the true filler 3: There is no particular limitation, and it is preferably 2 to 70% by weight, particularly preferably 5 to 6 % by weight, based on the entire resin composition p. If the content is within the above range, it is especially useful as a finished product having low thermal expansion and low water absorption. 101108591 12 201244556 The resin composition 3, 4 can be used to change the content of the filler (B), and the adhesion to the conductor and the low thermal expansion can be considered. The resin composition P used in the prepreg 1 is not particularly limited. However, it is preferred to contain (C) a coupling agent. (C) The coupling agent improves the interfacial wettability of the (A) thermosetting resin and the (B) filler, thereby uniformly fixing the (A) thermosetting resin and the (B) filler to the fiber substrate, which can be improved. Heat resistance, especially solder heat resistance after moisture absorption. The (C) coupling agent may be used arbitrarily as a general user. Specifically, an epoxy decane coupling agent, a cationic decane coupling agent, an amino decane coupling agent, or a titanate coupling is preferably used. One or more coupling agents selected from the mixture and the polyoxygenated oil type coupling agent. Thereby, the wettability with the interface of the (B) filler can be improved, whereby the heat retention can be improved. (C) The amount of the coupling agent added is not particularly limited as long as it depends on the specific surface area of the filler (B), and is preferably 〇〇5 to 3 parts by weight based on 1 part by weight of the (B) filler. It is especially preferably 0.1 to 2 parts by weight. By setting the amount of the coupling agent (c) to be contained in an amount of 0.05 parts by weight or more based on 10 parts by weight of the (B) filler, the filler (B) can be sufficiently coated, and heat resistance can be improved. By setting the content of the (()) coupling agent to 3 parts by weight or less based on 1 part by weight of the (B) filler, the reaction can be favorably performed, and the reduction in bending strength or the like can be prevented.
樹脂組成物P可進一步含有(D)酚系或胺系之硬化劑。作 為酚系硬化劑，可將酚-酚醛清漆樹脂、烷基酚_酚醛清漆樹 脂、雙酚A酚醛清漆樹脂、二環戊二烯型酚樹脂、ZYL〇CK 101108591 13 201244556 型酴樹脂、萜烯改質酴樹脂、聚乙烯盼類等公知慣用者予以 單獨或組合2種以上使用。作為胺系硬化劑，可將3,3’·二 乙基-4,4’-二胺基一本基甲烧、4,4 ·二胺基二苯基曱烧、二 乙基曱苯二胺等之芳香族胺予以單獨或組合2種以上使用。 (D)酚硬化劑之調配量，當含有環氧樹脂作為(A)熱硬化性 樹脂之情況，與環氧樹脂之當量比（酚性經基當量/環氧基當 量）為0.1〜1.0為佳。藉此’未反應之盼硬化劑的殘留可消 失’而提升吸濕耐熱性。當併用環氧樹脂與氰酸酯樹脂作為 (A)熱硬化性樹脂之情況，尤其以〇.2〜0.5之範圍特佳。其 原因在於’紛樹脂不只作為硬化劑發揮作用，亦可促進氰酸 酯基與環氧基之硬化。 (D)胺硬化劑之調配量’與(A)熱硬化性樹脂之當量比較佳 為0.1〜2.0。藉此，未反應之酚硬化劑的殘留可消失，而提 升吸濕耐熱性。 樹脂組成物P中亦可視需要含有(E)硬化促進劑。作為(E) 硬化促進劑係可使用公知者。例如可舉出環烷酸鋅、環烷酸 敍、辛酸锡、辛酸鈷、雙乙醯丙酮鈷(II)、參乙醯丙酮鈷(III) 等之有機金屬鹽；三乙基胺、三丁基胺、二氮雜雙環[2,2,2] 辛烧荨之3級胺類；2-苯基-4-曱基味嗤、2·•乙基-4-乙基咪 唑、2-苯基·4•甲基咪唑、2_苯基_4_曱基_5羥基咪唑、孓苯 基4,5·二羥基咪唑等之咪唑類；酚、雙酚a、壬酚等之酚化 合物’錯酸、苯甲酸、水揚酸、對甲苯磺酸等之有機酸等； 101108591 201244556 或等之成合物。作為硬化促進劑，包含該 物，可單獨使用丨# 甲的何生 、 包含料之衍生物亦可併用2種以上。 足進劑之含有量並無特別限定，較佳 物P整體的0fK 日組成 使含有量在;:量％’特佳係。·2〜2重量％。藉由 其在5重量％^下量心上，可充分促進硬化，而藉由使 匕 从下，可防止預浸體1之保存性降低。 樹餘成物Ρ亦可併用苯_旨、聚醯亞賴脂、聚 &亞胺树脂、聚g|胺樹脂、聚醚賴脂、聚㈣脂、聚 Μ月曰、聚本乙歸樹脂等之熱可塑性樹脂；苯乙烯·丁二' 聚合體與苯乙松s丄 一締共 烯-異戊二烯共聚合體等之聚乙烯系熱可塑性 ^ -、聚馳系熱可塑性彈賴、歸㈣彈性體、聚㊉ 系彈性體等之熱可雜彈性體；聚T二稀、環氧基改質聚丁 :烯:丙烯酸系改質聚丁二烯、曱基丙烯酸系改質聚丁二烯 稀系彈丨生體。又，於該樹脂組成物P中，亦可視需要 =力顏料*料、消泡劑、勻平劑、紫外線吸收劑、發泡劑、 氧化劑莫隹燃劑、離子捕捉劑等之上述成分以外的添加物。 含浸樹脂IE成物卩之纖絲材2並純靠定，可舉出玻 璃=布、麵颂布等之玻璃纖絲材(玻璃布）；由以聚醯 Y t知、·戴維、芳香族聚醯胺樹脂纖維、全芳香族聚醯胺樹脂 ，維等之聚醯胺系樹脂纖維，聚S旨樹腊纖維、芳香族聚醋樹 月曰纖維、全芳麵聚㈣賴料之聚If、樹脂纖維，聚醯 月安树月g纖維’聚苯并十坐樹腊纖維，氟樹脂纖維等作為主 101108591 15 201244556 成分之織布或不織布所構成的合成纖維基材；以牛皮紙、棉 短絨(cotton linter)紙、短絨與牛皮紙漿之混抄紙等作為主成 分的紙基材·#之有機纖維基材等。該等之中以玻璃布為佳。 藉此，可獲得低吸水性且高強度、低熱膨脹性之預浸體。 構成玻璃布之玻璃係可舉例如E玻璃、C玻璃、A玻璃、 S玻璃、D玻璃、NE玻璃、T玻璃、Η玻璃、Q玻璃等。該 等之中較佳為Ε玻璃或Τ玻璃。藉此，可達成預浸體之高 彈性化’且可減小預浸體之熱膨脹係數。 將樹脂組成物Ρ含浸於纖維基材2之方法例如可舉出使用 樹脂組成物Ρ調製樹脂清漆V，並將纖維基材2浸潰於樹脂 清漆V之方法；利用各種塗佈器進行塗佈之方法；利用噴 霧益喷付之方法等。該等之中，較佳係將纖維基材2浸潰於 樹脂清漆V之方法。藉此，可提升樹驗成物Ρ對於纖維 基材2之含H另外’在將纖維基材2浸潰於樹脂清漆γ 之情況’可使用一般之含浸塗佈設備。 乙一醇、赛路棘 使用於樹脂清漆V之關較佳係對樹脂組成物Ρ中的樹 脂成分顯示良好的溶解性，但在不產生不良影響之範圍内， 亦可使用貧溶媒。顯示H轉性之溶媒可舉例如丙嗣、甲 基乙基酮、甲基異丁基酮、環己酮、環戊酮、四氫咬喃、二 曱基甲_、二甲基乙醯胺、二甲基亞石風 系、卡必醇系等。 樹脂清漆分並無制限定，較佳_脂組成物？ 101108591 201244556 之固形分20〜80重量％ 進一步提升樹脂清漆〜65，重量％。藉此，可 含浸樹脂組錄P之既H二=含Λ性。频維基材2 恤度並無特別限定，例如可拉士产 90〜2201等下進行乾燥 了猎由在 、 乾木而後得預浸體1。預浸體丨之尸诗 以20〜1〇〇μπι為佳。 厚度 預浸體1係可如圖1所示，以纖維基材2作為中心而呈右 相對較厚的樹脂層3盥相對才^中、而具有 材2作為中㈣具有實層4’亦可以纖維基 貫質上相同厚度之樹脂層。 浸^之_基材厚度方向之巾心5村與驗料= 之中心6偏離1脂層3、4之厚度，係關1所示之預ϋ 體1的截面圖中，以纖維基材厚度方向之中心5作為^ 線，由該纖維基材之厚度中W起至預浸體i之第i面S1 為止之距離T卜及至預浸體1之第2面S2為止之㈣T2 所得，使T1為較厚樹脂層3的厚度，Τ2為較薄樹脂層4 之厚度。如圖1所示’第2面幻係第！面Si之相反側的 面。當τ㈣時，幻以上且5以下為佳，15以上 且4.5以下較佳’ 2以上且4以下更佳。預浸體丄可以 IPC-TM-650 Method 2.3.Π 為基準，測定出於 171士3。〇、 1380±7GkPa之條件下加熱加壓5分鐘制定之樹脂流動 度，進行評估。 若預浸體之樹脂流動度為15重量％以上，則可製成佈線 電路之埋人性優異_浸體。又，_脂錢度若為％重 101108591 17 201244556 量％以下，當將預浸體予以積層壓合時，可抑制樹脂組成物 P之、"IL出。上限較佳為40重量％以下，更佳為3 5重量％以 下。藉此’將預浸體1堆積所得之積層板的厚度均勻性可提 高。 藉由將使用於預浸體1的樹脂組成物p中所含之環氧樹脂 專熱硬化性樹脂之平均分子量減小，可增大樹脂流動度。 又’藉由將使用於預浸體1的樹脂組成物P中所含之填充材 的含量應多，可減小樹脂流動度。 又’堆積用之預浸體1的性能亦可如以下般進行評估。亦 即’將預浸體1載置於2個金屬板之間，以120°C、2.5MPa 之條件介隔著橡膠板壓合60秒時，測定在俯視角度下從纖 維基材2之外緣溢出的樹脂層3、4之重量。此時，預浸體 1在俯視下之尺寸均定為200mmx200mm。金屬板係使用厚 度1.5mm之SUS。橡膠板係依據jis K 6253 A所測定之橡 爆'硬度為60、厚度3mm之石夕氧橡膠(silicon rubber)。具體 而言’係使用Nichigo-Morton(股）製CVP 300的熱壓合裝 置。將如此所測定之樹脂層3、4的溢出量相對於樹脂層3、 4整體定為5重量％以下’可提升將預浸體1堆積所得之積 層板的厚度均勻性。並於特別的下限，但相對於樹脂層3、 4整體以0重量％以上為佳。 藉由調配或增加使用於預浸體1的樹脂組成物P中所含之 液狀樹脂，上述樹脂層3、4之滲出量變大。又，藉由調配 101108591 18 201244556 或增加使用於預浸體1的樹脂組成物p中所含之苯氧樹脂等 重1：平均分子量超過iOOOO之高分子樹脂，可減少樹脂層 3、4之滲出量。 預/5：體1亦可介隔著金屬箔或薄膜而積層複數片。金屬箔 可舉例如銅及銅系合金、鋁及鋁系合金、銀及銀系合金金 及金系合金、鋅及鋅系合金、鎳及鎳系合金、錫及錫系合金、 鐵及鐵系合金等之金屬箔。其中以銅箔為佳。 "隔著金屬箔或薄膜積層複數片後，亦可加熱、加壓。加 熱之溫度並無特別限定，較佳為120〜23(rc，特佳為150 〜21(TC。又’加壓之壓力並無特別限定，較佳為1〜5Mpa， 特佳為2〜4MPa。藉由使用此種預浸體j ,可獲得介電特 性、高溫多濕化下之機械及電氣連接可靠度優異之積層板。 預π體1亦可捲繞積層為親狀。此時，亦可於單面或雙面 α置支持基材，在介隔著此支持基材之狀態下捲繞積層。作 為將預浸體1捲繞積層為輥狀之方法，例如可舉出以下者。 對纖維基材2含浸樹脂組成物Ρ後，與支持基材一起搬送 至輥式層合裝置，利用金屬輥或彈性材輥，將支持基材連續 地加麗及加熱至預浸體卜藉此進行層合。之後，藉由捲取 為輥狀，可將預浸體1捲繞積層為輥狀。 又，亦可利用輥將捲取為輥狀之片狀纖維基材2進行連續 搬送，對樹脂清漆V進行含浸及乾燥，藉此製造捲繞積層 為輥狀之預浸體1。 101108591 19 201244556 作為支持基材，可使用塑膠薄膜，可舉例如聚對苯二曱酸 乙二酯(PET)及聚萘二甲酸乙二醋(pen)等之聚酯、聚碳酸酯 (PC)、丙烯酸系樹脂(PMMA)、環狀聚烯烴、三乙醯纖維素 (TAC)、聚硫醚(PES)、聚醚酮、聚醯亞胺等。其中以pet 薄膜、PEN薄膜為佳，PET薄膜特佳。支持基材中，亦可 對樹脂層3、4之積層面施行霧化處理、電暈處理。為了於 預浸體1之熱硬化後將支持基材剝離，亦可於與預浸體1 接觸之面具有離型層。 又，於單面設置支持基材之情況，亦可於另一面設置保護. 材。此情況，可藉由搬送至輥式層合裝置，並從支持基材及 保護材雙方之面以金屬輥或彈性材輥加壓及加熱，進行層 合’俾使支持基材接合至第二面S2、使保護材接合至第一 面S1。作為保護材，例如可使用聚乙烯、聚丙烯、聚氣乙 烯等之聚烯烴；PET、PEN等之聚酯；pc;聚醯亞胺等之塑 膝'薄膜。保s蒦材之厚度較佳為5〜30μπι之範圍。 [積層板] 接著，對使用預浸體1之積層板進行說明。此積層板係具 備在單面或雙面具有電路形成面之核心層、與積層於核心層 之電路形成面的堆積層。堆積層係將上述預浸體丨硬化所形 成者。 核心層係玻璃環氧基板、金屬基板、聚酯基板、聚醯亞胺 基板、ΒΤ樹脂基板、熱硬化型聚苯醚基板等之基板的單面 101108591 20 201244556 或雙面具有_案加卫之電路形成面的片狀者核心層 亦進-步包含欲形成堆積層及佈線電路之中間製造物的内 層電路基板。 核^層之製方法並無特別限定，例如可使用兩面具有金 屬箱之核Μ孔機於既定處開孔，利㈣電解電鍵尋 求核心層之雙面的導通。域，藉由餘刻金屬f|而形成内層 電路。另外，内層電路部分可適當使用經施行黑化處理等粗 化處理者。又’開Π部可適#以導體财或麟糊膏掩埋。 ”亥積層板可如下述般製造。首先，準備捲繞成報狀之預浸 體1 ’與上述片狀之核心層—起搬送至層合機。層合機係具 備相對向之一對金屬板與斷熱橡膠等之板狀彈性體，在介隔 著彈性體包夾核心層與預浸體之狀態下，利用金屬板進行加 熱及加壓，而予以層合(層合步驟）。作為層合機，較佳係使 用於真空下進行加熱加壓之層合機（真空層合機）。作為金屬 板，例如可使用SUS鏡板。加熱及加壓較佳係於8〇〜 140°C、0.4〜1.5MPa之範圍内進行。 上述之層合步驟係可使用市售之真空層合機進行，例如可 使用Nichigo-Morton(股）製CPV 300所具備之真空加壓式壓 合機或與其同等者。 層合步驟之後，預浸體1之樹脂層3、4軟化，順著核心 層之内層佈線而變形為凹凸狀。因此，將經層合之堆積層與 核心層利用相對向之一對金屬板進行熱壓合，藉此進行經層 101108591 21 201244556 合之接著片的平滑化（平滑化步驟）。平滑化步驟係於大氣壓 下’利用經加熱之SUS鏡板等的金屬板將接著片加熱及加 壓而進行。用來進行平滑化的壓合較佳係於100〜170°c、 0.4〜1.5MPa之範圍内進行。 此種平滑化步驟係可使用市售之熱壓合裝置進行，亦可使 用例如具備有Nichigo-Morton(股)製CPV 300的熱壓合裝置 或與其同等者。 之後，將預浸體1之樹脂層3、4加熱，藉此使之硬化。 硬化之溫度並無特別限定，例如可於1〇〇〜250°C之範圍硬 化，較佳係可於150〜200〇C下硬化。硬化時間可定為30〜 7 5分鐘左右。 接著’對硬化之樹脂層照射雷射，形成開口部，並利用過 猛酸鹽、重鉻酸鹽等之氧化劑將雷射照射後之樹脂殘渣等除 去為佳。又’亦可將平滑之樹脂層表面同時粗化，可提升後 、只之利用錄金屬所形成的導電佈線電路之密著性。樹脂層係 可於上述粗化處理中均勻地施予微細之凹凸形狀。又，由於 樹月曰層表面之平滑性高，故可精度良好地形成微細的佈線電 路之後’於最外層形成防焊層，利用曝光、顯影，使連接 用電極部露出’俾可安裝半導體元件，施行麟金處理，切 斷為既疋之大小，而可獲得積層板。 當預浸體1夕4tL 从 之树脂量在第1面S1側與第2面S2側不同 之情況’亦即圖!丄 1園1中T1>T2之情況，較佳係將樹脂量多的 101108591 22 201244556 第1面si積層於電路形成面。藉此，可將樹脂充分供給至 佈線電路與預浸體之間所產生的空隙，而確保耐熱性。 [半導體裝置] 接著’針對半導體裝置進行說明。 該半導體裝置係可將半導體元件安裝於上述積層佈線板 而製造。半導體元件之安裝方法、密封方法並無特別限定。 例如可以下述方法製造。 首先，使用覆晶黏晶機(flip chip bonder)等，進行積層佈 線板上之連接用電極部與半導體元件之焊料凸塊的位置對 準。接著，使用IR回焊裝置、熱板、其他加熱裝置，將焊 料凸塊加熱至熔點以上，藉由將多層印刷佈線板與焊料凸塊 熔融接合，而進行連接。最後，於積層佈線板與半導體元件 之間填充液狀密封樹脂’使其硬化，藉此可獲得半導體裝置。 以上係參照圖式而對本發明之實施形態加以描述，但該等 僅為本發明之例示，亦可採用上述以外之各種構成。 , [實施例] 製作圖1所示之預浸體。 實施例及比較例中所使用之原材料如下。 無機填充材.球狀石夕石（Admatechs公司製，s〇-25R，平 均粒徑0.5μιη) 無機填充材··水铭石（Nabaltec公司製，αοη-30) 有機填充材：聚矽氧粒子（信越化學工業公司製， 101108591 23 201244556 KMP600，平均粒徑5μιη) 環氧樹脂：聯苯基総㈣⑽料環氧難（日本化藥 公司製，NC-3000) 環氧樹脂：二環戊二稀型紛輕清漆環氧樹脂(mc公司 製，HP-7200L、HP-7200) 環氧樹脂：雙盼A型液狀環氧樹脂（三菱化學公司製， jER-828) 環氧樹脂：雙紛F型液狀環氧樹脂（三菱化學公司製， jER-807) 氰酸酯樹脂：酚醛清漆型氰酸酯樹脂(l〇Nza公司製， Primaset PT-30) 順丁烯二醯亞胺化合物：κι化成工業公司製，BMI 7〇 酚硬化劑：酚醛清漆型酚樹脂（DIC公司製， TD-2090-60M ’ 60%(w/v)甲基乙基酮溶液） 胺硬化劑：3,3’-二乙基-4,4’-二胺基二苯基甲烷（日本化藥 公司製，Kayahard A-A) 苯氧樹脂：三菱化學公司製，γΧ6954ΒΗ30，30%〇Α〇 甲基乙基酮/環己酮溶液 聚乙烯縮醛樹脂：積水化學公司製，KS_10(羥基25m〇1 %) 硬化觸媒：2-乙基-4-曱基咪唑（四國化成公司製，2E4MZ) 偶合劑：N-苯基-3-胺基丙基三曱氧基矽烷(信越化學工業 101108591 24 201244556 公司製，ΚΒΜ-573) 偶合劑：環氧基矽烷(信越化學工業公司製，κβμ_4〇3) (實施例1) (1) 清漆之調製 將作為環氧樹脂之u二㈣環氧樹脂(Dic公司製， HP-7200)30重量份與雙盼F型液狀環氧樹脂(三菱化學公司 製，jER807)3重量份、作為氰酸醋樹脂之紛-祕清漆型氛 酸酯樹脂(LONZA公司製，primasetFM〇)14重量份、作為 苯氧樹脂之三菱化學公司製YX6954BH3G簡形分換算3 重里伤作為硬化觸媒之咪嗤（四國化成公司製，2 重量份以曱基乙細與環⑽之混合溶拌6()分鐘，使 之溶解。進-步添加作為偶合劑之N_苯基_3·胺基丙基三甲 氧基矽烷(信越化學工業公司製，KBM_573)〇丨重量份與作 為無機填充材之球狀石夕石（Admatechs公司製SO-25R，平约 粒徑0·5μπι)49.7重量份，以高速攪拌裝置攪拌1〇分鐘，製 ..作固形分65%之樹脂清漆。 (2) 樹脂片之製作 於厚度36μιη之PET(聚對苯二曱酸乙二酯）薄膜的單面， 使用刮刀式塗佈裝置，塗佈上述清漆，將其以16〇1之乾燥 裝置乾燥3分鐘，形成附有基材之樹脂片。 製作樹脂厚度係22μιη(樹脂片1)及13μιη(樹脂片2)之2 種樹脂片。 101108591 25 201244556 (3)預浸體之製作 使用玻璃織布(Unitika公司製，交叉型# j 〇 17，寬53 〇mm， 厚度15阿’布量Ug/m2)作為纖維基材，利用真空層合裝置 及熱風乾燥裝置，製造預浸體。 具體而言，係於玻璃織布之雙面，以上述樹脂片丨及樹脂 片2位於玻璃織布寬度方向的中心之方式，分別進行重疊， 於0.1MPa(750Torr)之減壓條件下，使用之層合報進行 接合。 其中，在玻璃織布的寬度方向尺寸的内侧區域，係於纖維 布之雙面側分別接合樹脂片1及樹脂片2之樹脂層，並且在 玻璃織布之的寬度方向尺寸的外側區域，接合樹脂片1及樹 脂片2的樹脂層彼此。 接著，將上述經接合者通過設定於120°C之橫搬送型熱風 乾燥裝置内2分鐘，藉此在不作用壓力之下進行加熱處理， 獲得厚度 40μιη(Τ1 : 17μιη，纖維基材：15μιη ’ T2 : 8μιη) 之預浸體。 (實施例2) (1) 清漆之調製 與實施例1同樣地調製。 (2) 樹脂片之製作 除了將基材上的樹脂厚度改變為20·5μιη(樹脂片1)與 13.5μιη(樹脂片2)以外，與實施例1同樣地製作。 101108591 26 201244556 (3)預浸體之製作 除了將玻璃織布改變為交叉型#1015(寬530mm，厚度 17μπι，布I I5g/m2)以外，與實施例τ同樣地製作。 (實施例3) 除了將樹脂級成物改變為表1所示之樹脂組成以外，與實 施例1同樣地製作清漆、樹脂片、預浸體。表1中，各成分 表示重量份。 (實施例4) (1) 清漆之調製 除了將樹脂組成物改變為表1所示之樹脂組成以外，與實 施例1同樣地調製。表1中，各成分係顯示重量份。 (2) 樹脂片之製作 除了將基材上的樹脂厚度改變為樹脂片1與樹脂片2均為 16叫1以外，與實施例1同樣地製作。 (3) 預浸體之製作 , 除了將玻璃織布改變為交叉型#1027(寬530mm，厚度 20μιη ’布量20g/m2)以外，與實施例1同樣地製作。 (實施例5、6) 除了將樹脂組成物改變為表丨所示之樹脂組成以外，與實 施例4同樣地製作清漆、樹脂片、預浸體。表〗中，各成分 係顯示重量份。 (比較例1、2) 101108591 27 201244556 除了將樹脂組成物改變為表1所示之樹脂組成以外，與實 施例1同樣地製作清漆、樹脂片、預浸體。表1中，各成分 係顯示重量份。 [樹脂流動度（重量％)] 使用實施例1〜5或比較例1、2之預浸體，依據 IPC-TM-650 Method 2.3.17進行測定。亦即，如圖2所示， 將實施例1〜5或比較例1、2之預浸體裁切為 l〇2mm><102mm之正方形，將其重憂4片，測定重量 (W0(g))。然後，於預浸體之最外層的雙面，對雙片貼附離 型薄膜（製品名：Sepanium 20M2C-S，製造指：Sun Aluminium 工業股份有限公司，尺寸：200mmx240mm(圖2(a))。之後’ 將預浸體配置於2片SUS板之間，於171°C、1.38MPa下進 行加熱加壓，進行5分鐘之熱板壓合（圖2(b))。接著，將離 型薄膜剝離，以預浸體之積層方向成為高度方向之方式，將 預浸體沖切為直徑81mm之圓柱狀（圖2(c))，測定所得圓柱 狀預浸體之重量（W2(g))。由式（1)求出樹脂流動度。結果示 於表1。另外，式⑴中，％係重量％。 [數1] W()-2xW2 λ、 樹脂流動度（％ ) = — ⑴ [樹脂滲出量] 將裁切成200mmx200mm之實施例1〜4或比較例1、2 101108591 28 201244556 的預浸體，使用Nichigo-Morton(股)製CVP300的熱壓合裝 置進行壓合，測定樹脂滲出量。具體而言’係將上述實施例 或比較例之預浸體載置於該熱壓合裝置的2個熱板 (SUS1.5mm)所包夾的2片橡膠板之間，以120°C、2.5MPa 之條件，壓合60秒。橡膠板係依據JIS K 6253 A所測定之 橡膠硬度為60。、厚度為3mm之矽氧橡膠。結果示於表j。 另外，表1中係於「樹脂流動度(橡膠板)(重量％)」之列顯 示結果。 以目視確認實施例1〜4之預浸體的樹脂滲出長度最大為 20mm以上。 [評估] 1.積層板之製造 使用Nichigo-Morton(股）製之2階段堆積層合機 CVP300，由實施例1〜4、比較例1、2的附有pet基材之 預浸體製造積層板。具體而言，使用厚度2〇〇gm之 -· ELC-4785GS-B(住友電木公司製，銅箔ΐ2μιη),以鑽孔機在 既定處開孔，利用非電解電鍍尋求導通，製作將鋼箔蝕刻而 具有電路形成面之核心層。又，將實施例丨〜4、比較例1 2之預浸體裁切為葉片，放置於上述CVP300，暫時依附於 上述核心層’於真空層合機内進行120〇C、0.7MPa、}八铲 之真空層合’之後進行160〇c、〇 55MPa、2分鐘之熱壓：: 予以平滑化。之後，以170°C硬化。 101108591 29 201244556 2. 對電路之埋入性 以掃瞄式電子顯微性(SEM)觀察積層板之截面，確認樹脂 是否埋入至電路間。將樹脂埋入電路間者定為合格，而在電 路間殘留孔洞、埋入不充分者定為不合格。結果示於表1。 表1中，合格以◦表示，不合格以X表示。 3. 厚度偏差 以掃瞄式電子顯微性(SEM)觀察積層板之截面，測定相鄰 接的有銅佈線之部分與無銅佈線之部分的厚度差。 以n= 10測定厚度差，將平均未滿0.8 μπι者定為合格，平 均為0.8μιη以上者定為不合格。結果示於表1。表1中，合 格以〇表示，不合格以X表示。 101108591 30 201244556 【Id 比較例2 卜 1—H in »—H o 比較例1 in \〇 r-H CN o 實施例6 00 r-H 〇 o 實施例5 p r—H o 實施例4 vn r—Η V p o 寸 實施例3 1-H oi o 實施例2 <n o 實施例1 )< H <N o § 礙 率 2 2 諉 S 0Ϊ； ΎΙ/Τ2 ? 69.7 1—( CN 卜 〇 CN 〇 1—Η 〇 o r-H 40.7 (N 〇 Ο o o ί 42.5 J ΙΟ 卜 o o 49.7 m 寸 (N 〇 d o 40.7 00 00 m (N 〇 (N o »—H 49.7 m 寸 m CN 〇 o o — 49.7 m 寸 cn (N 〇 c> o »—H 球狀石夕石 水鋁石 聚矽氧粒子 環氡樹脂 環氧樹脂 環氧樹脂 液狀環氧樹脂 液狀環麟脂 氰酸酯掊t脂 順丁烯二醢亞胺化合物 酌硬化劑 胺硬化劑 苯氧樹脂 聚乙烯縮醛樹脂 〇米0坐 偶合劑 偶合劑 SO-25R ΑΟΗ-30 KMP600 NC-3000 HP-7200 HP-7200L 00 (N 00 ώ W 00 ώ W ·—1 PT-30 BMI-70 TD-2090-60M <5： 1 YX6954BH30 KS-10 2E4MZ KBM-573 KBM-403 X X 〇 X 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 電路埋入性 厚度偏差 ιέ I6S0U01 201244556 【圖式簡單說明】 圖1係示意性表示實施形態之預浸體的剖面圖。 圖2係實施例中測定預浸體的樹脂流動度之方法的說明 圖。 【主要元件符號說明】 1 堆積用預浸體 2 纖維基材 3 樹脂層 4 樹脂層 5 纖維基材厚度方向之中心 6 預浸體厚度方向之中心 S1 預浸體之第1面 S2 預浸體之第2面 T1 纖維基材厚度方向之中心至預浸體之第1面為止 的距離 T2 纖維基材厚度方向之中心至預浸體之第2面為止 .的距離 101108591 32The resin composition P may further contain (D) a phenol-based or amine-based hardener. As the phenolic curing agent, a phenol-novolac resin, an alkylphenol-novolak resin, a bisphenol A novolac resin, a dicyclopentadiene type phenol resin, and a ZYL〇CK 101108591 13 201244556 type resin, terpene A known one or more of the modified oxime resin and the polyethylene ray are used alone or in combination of two or more. As the amine-based hardener, 3,3'-diethyl-4,4'-diamino-mono-methyl, 4,4-diaminodiphenyl fluorene, diethyl anthracene The aromatic amines, such as an amine, are used individually or in combination of 2 or more types. (D) A compounding amount of a phenol curing agent, when an epoxy resin is contained as the (A) thermosetting resin, the equivalent ratio to the epoxy resin (phenolic basis weight/epoxy equivalent) is 0.1 to 1.0. good. Thereby, the residue of the unreacted hardener can be eliminated, and the moisture absorption heat resistance is improved. When an epoxy resin and a cyanate resin are used in combination as the (A) thermosetting resin, it is particularly preferably in the range of 〇. 2 to 0.5. The reason is that the resin acts not only as a hardener but also to harden the cyanate group and the epoxy group. The blending amount of the (D) amine hardener is preferably from 0.1 to 2.0 in comparison with the equivalent of the (A) thermosetting resin. Thereby, the residue of the unreacted phenol curing agent can be eliminated, and the moisture absorption heat resistance can be improved. The (E) hardening accelerator may be contained in the resin composition P as needed. As the (E) hardening accelerator, a known one can be used. For example, an organic metal salt such as zinc naphthenate, naphthenic acid, tin octylate, cobalt octoate, cobalt acetoacetate (II), and acetyl acetonide (III); triethylamine and tributyl a amine, a diazabicyclo[2,2,2] octylamine-based tertiary amine; 2-phenyl-4-indolyl miso, 2·•ethyl-4-ethylimidazole, 2-benzene Imidazoles such as keto-4-methylimidazole, 2_phenyl_4_fluorenyl-5 hydroxyimidazole, fluorenylphenyl 4,5-dihydroxyimidazole; phenolic compounds such as phenol, bisphenol a, indophenol, etc. An acid, a benzoic acid, a salicylic acid, an organic acid such as p-toluenesulfonic acid, or the like; 101108591 201244556 or an equivalent thereof. The hardening accelerator may be used alone or in combination of two or more kinds of derivatives of 丨#甲甲. The content of the foot-feeding agent is not particularly limited, and the 0fK-day composition of the entire product P is such that the content is in the amount of "%". · 2 to 2% by weight. By the amount of the core at 5 wt%, the hardening can be sufficiently promoted, and by keeping the crucible from below, the preservability of the prepreg 1 can be prevented from being lowered. The eucalyptus of the tree can also be used together with benzene _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Thermoplastic resin, etc.; polyethylene-based thermoplastics such as styrene-butadiene-polymer and phenyzine-isoprene-isoprene copolymer--, poly-gathering thermoplastics, and reversion (4) Thermally miscible elastomers such as elastomers, polydecene elastomers, etc.; poly T dilute, epoxy modified polybutene: olefin: acrylic modified polybutadiene, fluorenyl acrylic modified polybutadiene Rare bullets. Further, in the resin composition P, other components such as the above-mentioned components such as a force pigment*, an antifoaming agent, a leveling agent, an ultraviolet absorber, a foaming agent, an oxidizing agent, and an ion scavenger may be used. Additives. The fiber material 2 which is impregnated with the resin IE is purely fixed, and a glass fiber material (glass cloth) such as glass = cloth or crepe cloth; glass woven fabric (glass cloth); Polyamide polyamide resin fiber, wholly aromatic polyamide resin, vitamin polyamine resin fiber, poly S resin fiber, aromatic polyester vine fiber, and all aromatic poly (four) If, resin fiber, polyfluorene, yue tree, g fiber, polystyrene, sulphate fiber, fluororesin fiber, etc. as the main synthetic material of 101108591 15 201244556 woven or non-woven fabric; kraft paper, cotton An organic fiber substrate or the like which is a main component of paper base material such as cotton linter paper, mixed paper of short velvet and kraft pulp. Among these, glass cloth is preferred. Thereby, a prepreg having low water absorption, high strength, and low thermal expansion property can be obtained. Examples of the glass constituting the glass cloth include E glass, C glass, A glass, S glass, D glass, NE glass, T glass, bismuth glass, Q glass, and the like. Among these, bismuth or bismuth glass is preferred. Thereby, the high elasticity of the prepreg can be achieved and the thermal expansion coefficient of the prepreg can be reduced. The method of impregnating the resin substrate Ρ with the fiber base material 2 is, for example, a method of preparing the resin varnish V using the resin composition ,, and immersing the fiber base material 2 in the resin varnish V; coating with various coaters The method; the method of using the spray and the spray method. Among these, a method of impregnating the fibrous base material 2 with the resin varnish V is preferred. Thereby, it is possible to use a general impregnation coating apparatus by raising the test substance of the tree and the H containing the fiber substrate 2 and the case where the fiber base material 2 is immersed in the resin varnish γ. Ethyl alcohol and racestock are preferably used in the resin varnish V to exhibit good solubility in the resin component of the resin composition, but a poor solvent may be used insofar as it does not adversely affect. The solvent which exhibits H-transformation may, for example, be propylene glycol, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, cyclopentanone, tetrahydroanion, dimethyl hydrazine, dimethyl acetamide , dimethyl sapite, carbitol, etc. The resin varnish is not limited, but is preferably a fat composition. 101108591 201244556 Solid content 20~80% by weight Further enhance the resin varnish ~65, wt%. Thereby, the impregnated resin group P can be both H=inclusive. The frequency of the base material is not particularly limited. For example, it can be dried under the conditions of 90 to 2201, and the prepreg 1 is obtained after the dry wood. It is better to use 20~1〇〇μπι for the pre-impregnation body. The thickness prepreg 1 can be as shown in FIG. 1 , with the fiber substrate 2 as the center and the right relatively thick resin layer 3 盥 in the middle, and the material 2 as the middle (4) having the solid layer 4 ′ The fiber is based on a resin layer of the same thickness. The thickness of the base layer 6 of the substrate thickness direction of the substrate is offset from the thickness of the first lipid layer 3, 4, and the thickness of the fiber substrate is shown in the cross-sectional view of the precursor 1 shown in FIG. The center 5 of the direction is obtained as the ^ line from the thickness W of the fiber base material to the distance ith from the i-th surface S1 of the prepreg i and the (four) T2 to the second surface S2 of the prepreg 1 to make T1 For the thickness of the thicker resin layer 3, Τ2 is the thickness of the thinner resin layer 4. As shown in Figure 1, the second face is the first! The face on the opposite side of the surface Si. When τ (tetra), the magic is above 5 and preferably, 15 or more and 4.5 or less is preferably 2 or more and 4 or less. The prepreg can be measured at 171 ± 3 based on IPC-TM-650 Method 2.3. The resin flow rate was determined by heating and pressurizing for 5 minutes under conditions of 1380 ± 7 GkPa. When the resin fluidity of the prepreg is 15% by weight or more, the wiring circuit can be made excellent in burying property. Further, if the amount of the fat is 0.01% by weight, the amount of the resin composition P can be suppressed, and the IL composition can be suppressed when the prepreg is laminated. The upper limit is preferably 40% by weight or less, more preferably 5% by weight or less. Thereby, the thickness uniformity of the laminate obtained by stacking the prepreg 1 can be improved. By reducing the average molecular weight of the epoxy resin-specific thermosetting resin contained in the resin composition p used in the prepreg 1, the resin fluidity can be increased. Further, the content of the filler contained in the resin composition P used in the prepreg 1 should be large, and the resin fluidity can be reduced. Further, the performance of the prepreg 1 for deposition can be evaluated as follows. That is, the prepreg 1 was placed between two metal plates, and was pressed by a rubber plate at a temperature of 120 ° C and 2.5 MPa for 60 seconds, and was measured from the fiber substrate 2 in a plan view angle. The weight of the resin layer 3, 4 overflowing from the edge. At this time, the size of the prepreg 1 in plan view was set to 200 mm x 200 mm. The metal plate is made of SUS having a thickness of 1.5 mm. The rubber sheet is a rubber rubber having a hardness of 60 and a thickness of 3 mm as measured by jis K 6253 A. Specifically, it is a thermocompression bonding apparatus using CVP 300 manufactured by Nichigo-Morton Co., Ltd. The amount of overflow of the resin layers 3 and 4 thus measured is 5% by weight or less with respect to the entire resin layers 3 and 4', and the thickness uniformity of the laminate obtained by depositing the prepreg 1 can be improved. It is preferably a lower limit, but it is preferably 0% by weight or more based on the entire resin layers 3 and 4. The amount of bleeding of the resin layers 3 and 4 is increased by blending or increasing the liquid resin contained in the resin composition P used in the prepreg 1. Further, by displacing 101108591 18 201244556 or by adding a phenoxy resin or the like contained in the resin composition p of the prepreg 1 to a polymer resin having an average molecular weight of more than 10,000, the bleed out of the resin layers 3 and 4 can be reduced. the amount. Pre/5: The body 1 may be laminated with a plurality of sheets via a metal foil or a film. Examples of the metal foil include copper and copper alloys, aluminum and aluminum alloys, silver and silver alloy gold and gold alloys, zinc and zinc alloys, nickel and nickel alloys, tin and tin alloys, iron and iron systems. Metal foil such as alloy. Among them, copper foil is preferred. " After laminating a plurality of sheets through a metal foil or a film, it may be heated and pressurized. The temperature of the heating is not particularly limited, but is preferably 120 to 23 (rc, particularly preferably 150 to 21 (TC. Further, the pressure of the pressurization is not particularly limited, and is preferably 1 to 5 MPa, particularly preferably 2 to 4 MPa. By using such a prepreg j, a laminate having excellent dielectric properties and excellent mechanical and electrical connection reliability under high temperature and high humidity can be obtained. The pre-π body 1 can also be wound up to form a parent shape. The support substrate may be placed on one side or both sides, and the laminate may be wound in a state in which the support substrate is interposed. As a method of winding the prepreg 1 into a roll, for example, the following may be mentioned. After impregnating the fiber substrate 2 with the resin composition, it is transported to the roll laminating device together with the support substrate, and the support substrate is continuously heated and heated to the prepreg by a metal roll or an elastic material roll. After that, the prepreg 1 can be wound into a roll shape by winding up into a roll shape. Further, the sheet-like fibrous base material 2 wound into a roll shape can be continuously conveyed by a roll. The resin varnish V is impregnated and dried to produce a prepreg 1 having a roll-formed roll. 101108591 19 201244556 As the supporting substrate, a plastic film can be used, and examples thereof include polyester such as polyethylene terephthalate (PET) and polyethylene naphthalate (pen), polycarbonate (PC), and acrylic. Resin (PMMA), cyclic polyolefin, triacetyl cellulose (TAC), polysulfide (PES), polyether ketone, polyimide, etc. Among them, pet film, PEN film is preferred, PET film is excellent. In the support substrate, the atomization treatment and the corona treatment may be applied to the layers of the resin layers 3 and 4. In order to peel the support substrate after the thermal hardening of the prepreg 1, the prepreg may also be used. The contact surface has a release layer. Further, when the support substrate is provided on one side, the protective material may be provided on the other side. In this case, it can be transported to the roll laminating device and from the support substrate and The surface of both sides of the protective material is pressed and heated by a metal roll or an elastic material roll, and lamination is performed to bond the support substrate to the second surface S2, and the protective material is bonded to the first surface S1. As the protective material, for example, it can be used. Polyolefins such as polyethylene, polypropylene, polyethylene, etc.; polyesters such as PET and PEN; pc; plastic knee-thick films such as polyimine The thickness of the slab is preferably in the range of 5 to 30 μm. [Laminated board] Next, a laminated board using the prepreg 1 will be described. The laminated board has a circuit forming surface on one or both sides. a core layer and a deposition layer formed on a circuit layer formed on the core layer. The deposition layer is formed by curing the prepreg. The core layer is a glass epoxy substrate, a metal substrate, a polyester substrate, and a polyimide substrate. a single-sided 101108591 20 201244556 of a substrate such as a ruthenium resin substrate or a thermosetting polyphenylene ether substrate, or a chip-like core layer having a circuit forming surface on both sides of the reinforced case also includes a layer to be formed and a wiring to be formed. An inner layer circuit substrate of an intermediate fabrication of the circuit. The method for producing the core layer is not particularly limited. For example, a core boring machine having a metal case on both sides can be used to open a hole at a predetermined place, and the (4) electrolytic key can be used to find the double-sided conduction of the core layer. The domain forms an inner layer circuit by engraving the metal f|. Further, the inner layer circuit portion can be suitably used as a roughening processor such as a blackening process. Also, the opening section can be buried in a conductor or a forest paste. The "Hybrid laminate" can be manufactured as follows. First, the prepreg 1' to be wound up in a newspaper shape is transported to the laminator in a sheet-like core layer. The laminator has a pair of opposite metals. The plate-shaped elastic body such as a plate and a heat-insulating rubber is laminated and laminated (layering step) by heating and pressurizing the metal layer with the core layer and the prepreg interposed therebetween. The laminator is preferably a laminator (vacuum laminator) which is heated and pressurized under vacuum. As the metal plate, for example, a SUS mirror plate can be used. Heating and pressurization are preferably carried out at 8 〇 to 140 ° C. The above laminating step can be carried out using a commercially available vacuum laminator, for example, a vacuum pressurizing press equipped with a CPV 300 manufactured by Nichigo-Morton Co., Ltd. or After the lamination step, the resin layers 3 and 4 of the prepreg 1 are softened and deformed into irregularities along the inner layer wiring of the core layer. Therefore, the laminated layer and the core layer are used to face each other. A pair of metal plates are thermocompression-bonded, thereby performing a layer 101108591 21 201244556 Smoothing of the adhesive sheet (smoothing step). The smoothing step is performed by heating and pressurizing the adhesive sheet with a metal plate such as a heated SUS mirror plate under atmospheric pressure. It is preferably carried out in the range of 100 to 170 ° C and 0.4 to 1.5 MPa. Such a smoothing step can be carried out using a commercially available thermal compression bonding apparatus, and for example, a CPV having Nichigo-Morton Co., Ltd. can be used. The thermocompression bonding apparatus of 300 is equivalent to the same. After that, the resin layers 3 and 4 of the prepreg 1 are heated to harden them. The curing temperature is not particularly limited, and may be, for example, 1 to 250 ° C. The range is hardened, and it is preferably hardened at 150 to 200 ° C. The hardening time can be set to about 30 to 75 minutes. Then, the hardened resin layer is irradiated with a laser to form an opening, and the peroxylate is utilized. The oxidizing agent such as dichromate removes the resin residue after laser irradiation, etc. It is also possible to simultaneously roughen the surface of the smoothed resin layer, and to improve the conductive wiring circuit formed by using the metal after the lifting. Adhesion. The resin layer can be In the roughening treatment, the fine concavo-convex shape is uniformly applied. Further, since the smoothness of the surface of the eucalyptus layer is high, a fine wiring circuit can be formed with high precision, and then a solder resist layer is formed on the outermost layer, and exposure is performed. Development, the connection electrode portion is exposed, and the semiconductor element can be mounted, subjected to a gold treatment, and cut into a size to obtain a laminate. When the prepreg 1 is 4 tL, the amount of resin is from the first surface S1. In the case where the side is different from the second surface S2 side, that is, in the case of T1 > T2 in the 丄1园1, it is preferable that 101108591 22 201244556 first surface si having a large amount of resin is laminated on the circuit forming surface. Thereby, the resin can be sufficiently supplied to the gap generated between the wiring circuit and the prepreg to ensure heat resistance. [Semiconductor device] Next, the semiconductor device will be described. This semiconductor device can be manufactured by mounting a semiconductor element on the above laminated wiring board. The method of mounting the semiconductor element and the sealing method are not particularly limited. For example, it can be produced by the following method. First, the position of the connecting electrode portion on the laminated wiring board and the solder bump of the semiconductor element are aligned using a flip chip bonder or the like. Next, the solder bumps were heated to a temperature higher than the melting point by using an IR reflow device, a hot plate, or another heating device, and the multilayer printed wiring board was joined to the solder bumps by fusion bonding. Finally, a liquid sealing resin is filled between the laminated wiring board and the semiconductor element to be cured, whereby a semiconductor device can be obtained. The embodiments of the present invention have been described above with reference to the drawings, but these are merely examples of the present invention, and various configurations other than the above may be employed. [Examples] A prepreg shown in Fig. 1 was produced. The raw materials used in the examples and comparative examples are as follows. Inorganic filler. Spherical stone stone (made by Admatechs, s〇-25R, average particle size 0.5μιη) Inorganic filler · Shui Mingshi (made by Nabaltec, αοη-30) Organic filler: Polysiloxane particles (manufactured by Shin-Etsu Chemical Co., Ltd., 101108591 23 201244556 KMP600, average particle size 5μιη) Epoxy resin: biphenyl hydrazine (tetra) (10) epoxy resin (Nippon Chemical Co., Ltd., NC-3000) Epoxy resin: dicyclopentadiene Type light varnish epoxy resin (made by mc company, HP-7200L, HP-7200) Epoxy resin: double-looking type A liquid epoxy resin (manufactured by Mitsubishi Chemical Corporation, jER-828) Epoxy resin: double F Liquid epoxy resin (manufactured by Mitsubishi Chemical Corporation, jER-807) Cyanate resin: Novolac type cyanate resin (manufactured by 〇Nza Co., Ltd., Primaset PT-30) Maleimide compound: κι Chemical Industry Co., Ltd., BMI 7 phenol phenol hardener: novolak phenol resin (made by DIC, TD-2090-60M '60% (w/v) methyl ethyl ketone solution) Amine hardener: 3,3' -Diethyl-4,4'-diaminodiphenylmethane (Kayahard AA, manufactured by Nippon Kayaku Co., Ltd.) Phenoxy resin: Mitsubishi Company system, γΧ6954ΒΗ30,30%〇Α〇methylethyl ketone/cyclohexanone solution Polyvinyl acetal resin: Hydration Chemical Co., Ltd., KS_10 (hydroxyl 25m〇1%) Hardening catalyst: 2-ethyl-4- Mercaptoimidazole (2E4MZ, manufactured by Shikoku Chemicals Co., Ltd.) Coupling agent: N-phenyl-3-aminopropyltrimethoxy decane (Shin-Etsu Chemical Industry 101108591 24 201244556, ΚΒΜ-573) Coupler: Epoxy Base decane (manufactured by Shin-Etsu Chemical Co., Ltd., κβμ_4〇3) (Example 1) (1) Modification of varnish 30 parts by weight of epoxy resin (u) 3 parts by weight of F-type liquid epoxy resin (manufactured by Mitsubishi Chemical Corporation, jER807), 14 parts by weight of cis varnish-type acrylate resin (primaset FM) manufactured by LONZA Co., Ltd. YX6954BH3G, which is a resin of Mitsubishi Chemical Co., Ltd., converts 3 parts of the wound into a hardening catalyst. It is made by Shikoku Kasei Co., Ltd., and 2 parts by weight of a mixture of thiol ethane and ring (10) is mixed for 6 minutes. Dissolved. Add N-phenyl-3-aminopropyltrimethoxydecane as a coupling agent (Shin-Etsu Chemical) Manufactured by the company, KBM_573), by weight, and 49.7 parts by weight of a spherical shoal (SO-25R, manufactured by Admatech Co., Ltd., flat particle size: 0.5 μm) as an inorganic filler, and stirred for 1 minute with a high-speed stirring device. Made of 65% solid resin varnish. (2) The resin sheet was formed on one side of a PET (polyethylene terephthalate) film having a thickness of 36 μm, and the varnish was applied by a doctor blade coating device, and dried by a drying apparatus of 16 〇1. After 3 minutes, a resin sheet with a substrate was formed. Two kinds of resin sheets of a resin thickness of 22 μm (resin sheet 1) and 13 μm (resin sheet 2) were produced. 101108591 25 201244556 (3) The prepreg was produced using a glass woven fabric (manufactured by Unitika Co., Ltd., cross type # j 〇17, width 53 〇mm, thickness 15 Å Ug/m2) as a fibrous substrate, using a vacuum layer The device and the hot air drying device are used to manufacture a prepreg. Specifically, it is laminated on the both sides of the glass woven fabric so that the resin sheet 丨 and the resin sheet 2 are located at the center in the width direction of the glass woven fabric, and are used under a reduced pressure of 0.1 MPa (750 Torr). The stratified report is joined. In the inner region of the width direction of the glass woven fabric, the resin layers of the resin sheet 1 and the resin sheet 2 are joined to the both sides of the fiber cloth, and the outer regions of the width direction of the glass woven fabric are joined. The resin layers of the resin sheet 1 and the resin sheet 2 are mutually. Next, the above-mentioned joined person was passed through a horizontal transfer type hot air drying device set at 120 ° C for 2 minutes, thereby performing heat treatment under no-pressure to obtain a thickness of 40 μm (Τ1 : 17 μιη, fiber substrate: 15 μιη ' T2: 8μιη) prepreg. (Example 2) (1) Preparation of varnish Modulation was carried out in the same manner as in Example 1. (2) Preparation of Resin Sheet A pellet was produced in the same manner as in Example 1 except that the thickness of the resin on the substrate was changed to 20·5 μm (resin sheet 1) and 13.5 μm (resin sheet 2). 101108591 26 201244556 (3) Preparation of prepreg The same procedure as in Example τ was carried out except that the glass woven fabric was changed to cross type #1015 (width 530 mm, thickness 17 μm, cloth I I5g/m2). (Example 3) A varnish, a resin sheet, and a prepreg were produced in the same manner as in Example 1 except that the resin composition was changed to the resin composition shown in Table 1. In Table 1, each component represents parts by weight. (Example 4) (1) Preparation of varnish The preparation was carried out in the same manner as in Example 1 except that the resin composition was changed to the resin composition shown in Table 1. In Table 1, each component shows a part by weight. (2) Preparation of Resin Sheet A sample was produced in the same manner as in Example 1 except that the thickness of the resin on the substrate was changed to be 1 for both the resin sheet 1 and the resin sheet 2. (3) Preparation of prepreg The same procedure as in Example 1 was carried out except that the glass woven fabric was changed to a cross type #1027 (width 530 mm, thickness 20 μm η fabric amount: 20 g/m2). (Examples 5 and 6) A varnish, a resin sheet, and a prepreg were produced in the same manner as in Example 4 except that the resin composition was changed to the resin composition shown in Table 。. In the table, each component shows the parts by weight. (Comparative Examples 1 and 2) 101108591 27 201244556 A varnish, a resin sheet, and a prepreg were produced in the same manner as in Example 1 except that the resin composition was changed to the resin composition shown in Table 1. In Table 1, each component shows parts by weight. [Resin fluidity (% by weight)] The prepregs of Examples 1 to 5 or Comparative Examples 1 and 2 were used, and were measured in accordance with IPC-TM-650 Method 2.3.17. That is, as shown in Fig. 2, the prepregs of Examples 1 to 5 or Comparative Examples 1 and 2 were cut into squares of 1 〇 2 mm >< 102 mm, and the weight was determined to be 4 pieces, and the weight was measured (W0 (g )). Then, on both sides of the outermost layer of the prepreg, a release film is attached to the double sheet (product name: Sepanium 20M2C-S, manufactured by: Sun Aluminium Industrial Co., Ltd., size: 200 mm x 240 mm (Fig. 2(a)) Then, the prepreg was placed between two SUS plates, and heated and pressed at 171 ° C and 1.38 MPa, and hot plate was pressed for 5 minutes (Fig. 2 (b)). Next, the release was carried out. The film was peeled off, and the prepreg was punched into a columnar shape having a diameter of 81 mm (Fig. 2(c)) so that the lamination direction of the prepreg was in the height direction, and the weight of the obtained cylindrical prepreg was measured (W2 (g) The resin fluidity was determined from the formula (1). The results are shown in Table 1. In the formula (1), % is % by weight. [Number 1] W () - 2 x W2 λ, resin fluidity (%) = - (1) [Resin Exudation Amount] The prepregs of Examples 1 to 4 or Comparative Examples 1 and 2, 101,108,591, and 28, 2012, 556, which were cut into 200 mm x 200 mm, were pressed together using a thermocompression bonding apparatus of CVP300 manufactured by Nichigo-Morton Co., Ltd., and the resin was measured. The amount of exudation. Specifically, the prepreg of the above embodiment or the comparative example is placed on two hot plates (SUS 1.5 mm) of the thermocompression bonding apparatus. The two rubber sheets of the sandwich were pressed at a temperature of 120 ° C and 2.5 MPa for 60 seconds. The rubber sheet was a rubber having a rubber hardness of 60 and a thickness of 3 mm as measured according to JIS K 6253 A. The results are shown in Table J. The results are shown in the column of "resin fluidity (rubber sheet) (% by weight)" in Table 1. It was visually confirmed that the resin exudation length of the prepregs of Examples 1 to 4 was 20 mm at the maximum. [Evaluation] 1. The production of laminates was carried out using a two-stage stacker CVP300 manufactured by Nichigo-Morton Co., Ltd., and the prepreg with pet substrate of Examples 1 to 4 and Comparative Examples 1 and 2. In order to manufacture a laminate, specifically, a thickness of 2〇〇gm-·ELC-4785GS-B (made by Sumitomo Bakelite Co., Ltd., copper foil ΐ2μιη) is used to open a hole in a predetermined place with a drilling machine, and to conduct conduction by electroless plating. A core layer having a circuit forming surface was formed by etching a steel foil. Further, the prepregs of Examples 丨 to 4 and Comparative Example 1 2 were cut into blades, placed on the CVP 300, and temporarily attached to the core layer in vacuum. After the vacuum lamination of 120〇C, 0.7MPa, and eight shovel in the laminator, 160〇c, 〇 55MPa, 2 minutes hot pressing:: It is smoothed. After that, it is hardened at 170 ° C. 101108591 29 201244556 2. Observing the embedding property of the circuit The scanning electron micrograph (SEM) is used to observe the cross section of the laminate. Whether or not the resin is buried between the circuits. If the resin is buried in the circuit, it is acceptable, and if the holes are left between the circuits and the embedding is insufficient, it is considered to be unacceptable. The results are shown in Table 1. In Table 1, the pass is indicated by ◦ and the pass is indicated by X. 3. Depth of thickness The cross section of the laminate was observed by scanning electron microscopy (SEM), and the difference in thickness between the adjacent portion of the copper wiring and the portion of the copper-free wiring was measured. The thickness difference was measured by n = 10, and the average of less than 0.8 μπι was determined to be acceptable, and the average of 0.8 μm or more was determined to be unacceptable. The results are shown in Table 1. In Table 1, the acceptance is indicated by 〇, and the failure is indicated by X. 101108591 30 201244556 [Id Comparative Example 2 Bu 1 -H in »-H o Comparative Example 1 in \〇rH CN o Example 6 00 rH 〇o Example 5 pr-H o Example 4 vn r-Η V po inch Example 3 1-H oi o Example 2 <no Example 1) < H <N o § Intrusion rate 2 2 诿S 0Ϊ; ΎΙ/Τ2 ? 69.7 1—( CN 〇CN 〇1—Η 〇o rH 40.7 (N 〇Ο oo ί 42.5 J ΙΟ oo 49.7 m inch (N 〇do 40.7 00 00 m (N » (N o »—H 49.7 m inch m CN 〇oo — 49.7 m inch cn (N 〇 c> o »—H Sphere-like stone sillite gibbsite polyfluorene oxide ring oxime resin epoxy resin liquid epoxy resin liquid cyclamate 掊t-butyl succinimide Compound discriminant hardener amine hardener phenoxy resin polyethylene acetal resin glutinous rice 0 sitting couple coupling agent SO-25R ΑΟΗ-30 KMP600 NC-3000 HP-7200 HP-7200L 00 (N 00 ώ W 00 ώ W ·- 1 PT-30 BMI-70 TD-2090-60M <5: 1 YX6954BH30 KS-10 2E4MZ KBM-57 3 KBM-403 XX 〇X 〇〇〇〇〇〇〇〇〇〇〇〇 Circuit embedding thickness deviation έ I6S0U01 201244556 [Brief description of the drawings] Fig. 1 is a cross-sectional view schematically showing a prepreg according to an embodiment. Fig. 2 is an explanatory view showing a method of measuring the resin fluidity of the prepreg in the embodiment. [Explanation of main component symbols] 1 Prepreg for deposition 2 Fibrous substrate 3 Resin layer 4 Resin layer 5 Center of thickness direction of the fiber substrate 6 The center of the thickness direction of the prepreg S1 The first surface of the prepreg S2 The second surface T1 of the prepreg The distance T2 from the center of the fiber substrate in the thickness direction to the first surface of the prepreg The distance from the center to the second side of the prepreg. 101108591 32