KR20170018069A - 롤 투 롤 웨이퍼 후면 입자 및 오염 제거 - Google Patents

롤 투 롤 웨이퍼 후면 입자 및 오염 제거 Download PDF

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Publication number
KR20170018069A
KR20170018069A KR1020177001599A KR20177001599A KR20170018069A KR 20170018069 A KR20170018069 A KR 20170018069A KR 1020177001599 A KR1020177001599 A KR 1020177001599A KR 20177001599 A KR20177001599 A KR 20177001599A KR 20170018069 A KR20170018069 A KR 20170018069A
Authority
KR
South Korea
Prior art keywords
substrate
cleaning article
particulate cleaning
removing particles
particulate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020177001599A
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English (en)
Korean (ko)
Inventor
크리스토퍼 에스. 응아이
후이시옹 다이
루도빅 고데
엘리 와이. 이에
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20170018069A publication Critical patent/KR20170018069A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/02041—
    • B08B1/001—
    • B08B1/008—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B6/00—Cleaning by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • H01L21/67028—
    • H01L21/67253—
    • H01L21/6831—
    • H01L21/68742—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020177001599A 2014-06-19 2015-05-28 롤 투 롤 웨이퍼 후면 입자 및 오염 제거 Ceased KR20170018069A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462014278P 2014-06-19 2014-06-19
US62/014,278 2014-06-19
US14/476,398 US9815091B2 (en) 2014-06-19 2014-09-03 Roll to roll wafer backside particle and contamination removal
US14/476,398 2014-09-03
PCT/US2015/033005 WO2015195292A1 (en) 2014-06-19 2015-05-28 Roll to roll wafer backside particle and contamination removal

Publications (1)

Publication Number Publication Date
KR20170018069A true KR20170018069A (ko) 2017-02-15

Family

ID=54870310

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177001599A Ceased KR20170018069A (ko) 2014-06-19 2015-05-28 롤 투 롤 웨이퍼 후면 입자 및 오염 제거

Country Status (6)

Country Link
US (1) US9815091B2 (https=)
JP (1) JP6573918B2 (https=)
KR (1) KR20170018069A (https=)
CN (1) CN106463385B (https=)
TW (1) TWI663629B (https=)
WO (1) WO2015195292A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240004230A (ko) * 2021-05-07 2024-01-11 케이엘에이 코포레이션 정전 기판 클리닝 시스템 및 방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
CN111250481B (zh) * 2020-01-17 2021-07-13 哈尔滨工业大学 一种利用可移动式静电电场吸附颗粒污染物的装置
JP7482657B2 (ja) * 2020-03-17 2024-05-14 東京エレクトロン株式会社 クリーニング方法及び半導体装置の製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06232108A (ja) * 1993-01-29 1994-08-19 Hitachi Ltd 異物除去方法
US5456758A (en) 1993-04-26 1995-10-10 Sematech, Inc. Submicron particle removal using liquid nitrogen
US5972051A (en) 1993-06-17 1999-10-26 Vlsi Technology, Inc Method and apparatus for removing particles from semiconductor wafer edges using a particle withdrawing means
JPH07275805A (ja) * 1994-04-05 1995-10-24 Nitto Seiki Kk 薄板状体の表面清掃装置
JPH08148461A (ja) * 1994-11-18 1996-06-07 Nitto Denko Corp 半導体ウエハに付着した異物の除去方法
EP0848415A1 (en) * 1995-08-31 1998-06-17 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
JPH1098090A (ja) * 1996-09-25 1998-04-14 Canon Inc 基板保持装置及び露光装置
JP3809503B2 (ja) * 1997-02-28 2006-08-16 野村マイクロ・サイエンス株式会社 半導体基板内部の洗浄方法および洗浄装置
US5753563A (en) 1997-07-30 1998-05-19 Chartered Semiconductor Manufacturing Ltd. Method of removing particles by adhesive
JP3616725B2 (ja) 1998-12-07 2005-02-02 信越半導体株式会社 基板の処理方法及び処理装置
US6244944B1 (en) 1999-08-31 2001-06-12 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US6523208B1 (en) 2000-03-24 2003-02-25 Xerox Corporation Flexible web cleaning system
JP2002083795A (ja) * 2000-09-07 2002-03-22 Toshiba Corp 半導体基板の洗浄方法およびその洗浄装置
JP4414116B2 (ja) * 2001-08-21 2010-02-10 芝浦メカトロニクス株式会社 基板清掃装置および基板清掃方法
US6695917B2 (en) * 2001-11-14 2004-02-24 Nordson Corporation Flow through felt dispenser
US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US20050210610A1 (en) * 2004-03-26 2005-09-29 Zih Corp. Apparatus and methods for cleaning the components of a feed device
TWI420579B (zh) * 2005-07-12 2013-12-21 創意科技股份有限公司 And a foreign matter removing method for a substrate
US7264539B2 (en) 2005-07-13 2007-09-04 Micron Technology, Inc. Systems and methods for removing microfeature workpiece surface defects
JP4607748B2 (ja) * 2005-12-02 2011-01-05 東京エレクトロン株式会社 基板のパーティクル除去方法、その装置及び塗布、現像装置
US7784146B2 (en) * 2006-01-09 2010-08-31 International Business Machines Corporation Probe tip cleaning apparatus and method of use
JP2011093113A (ja) * 2009-10-27 2011-05-12 Fujifilm Corp 積層基板の製造装置及び製造方法
JP6014477B2 (ja) * 2012-12-04 2016-10-25 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240004230A (ko) * 2021-05-07 2024-01-11 케이엘에이 코포레이션 정전 기판 클리닝 시스템 및 방법

Also Published As

Publication number Publication date
TW201604930A (zh) 2016-02-01
US9815091B2 (en) 2017-11-14
JP2017522726A (ja) 2017-08-10
US20150371879A1 (en) 2015-12-24
TWI663629B (zh) 2019-06-21
WO2015195292A1 (en) 2015-12-23
CN106463385A (zh) 2017-02-22
CN106463385B (zh) 2020-07-14
JP6573918B2 (ja) 2019-09-11

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