KR20160143535A - 도전성 기판 및 도전성 기판 제조 방법 - Google Patents
도전성 기판 및 도전성 기판 제조 방법 Download PDFInfo
- Publication number
- KR20160143535A KR20160143535A KR1020160067337A KR20160067337A KR20160143535A KR 20160143535 A KR20160143535 A KR 20160143535A KR 1020160067337 A KR1020160067337 A KR 1020160067337A KR 20160067337 A KR20160067337 A KR 20160067337A KR 20160143535 A KR20160143535 A KR 20160143535A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- blackening layer
- blackening
- copper
- conductive substrate
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 203
- 238000004519 manufacturing process Methods 0.000 title description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 153
- 229910052802 copper Inorganic materials 0.000 claims abstract description 152
- 239000010949 copper Substances 0.000 claims abstract description 152
- 238000005530 etching Methods 0.000 claims abstract description 59
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000001301 oxygen Substances 0.000 claims abstract description 48
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 48
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910001930 tungsten oxide Inorganic materials 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 44
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910000480 nickel oxide Inorganic materials 0.000 claims abstract description 32
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 23
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 21
- 239000010937 tungsten Substances 0.000 claims abstract description 21
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 108
- 229910052757 nitrogen Inorganic materials 0.000 claims description 54
- 238000004544 sputter deposition Methods 0.000 claims description 30
- 239000007789 gas Substances 0.000 claims description 28
- -1 nickel nitride Chemical class 0.000 claims description 14
- 238000002441 X-ray diffraction Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 150000004767 nitrides Chemical class 0.000 abstract description 3
- 239000012528 membrane Substances 0.000 abstract 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 24
- 239000010408 film Substances 0.000 description 22
- 239000000243 solution Substances 0.000 description 22
- 238000007747 plating Methods 0.000 description 20
- 239000010409 thin film Substances 0.000 description 19
- 229910052786 argon Inorganic materials 0.000 description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 230000009257 reactivity Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 238000007922 dissolution test Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 4
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 229910001080 W alloy Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Quality & Reliability (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015113772A JP6365422B2 (ja) | 2015-06-04 | 2015-06-04 | 導電性基板の製造方法 |
JPJP-P-2015-113772 | 2015-06-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20160143535A true KR20160143535A (ko) | 2016-12-14 |
Family
ID=57575479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160067337A KR20160143535A (ko) | 2015-06-04 | 2016-05-31 | 도전성 기판 및 도전성 기판 제조 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6365422B2 (ja) |
KR (1) | KR20160143535A (ja) |
CN (1) | CN106249938B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI654628B (zh) * | 2017-12-01 | 2019-03-21 | 鼎展電子股份有限公司 | 黑著層及具有該黑著層的透明導電結構 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003151358A (ja) | 2001-11-16 | 2003-05-23 | Bridgestone Corp | 透明導電性フィルムおよびタッチパネル |
JP2011018194A (ja) | 2009-07-09 | 2011-01-27 | Shin Etsu Polymer Co Ltd | 大型ディスプレイ用のセンサパネル |
JP2013069261A (ja) | 2011-09-08 | 2013-04-18 | Dainippon Printing Co Ltd | タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2835534B1 (fr) * | 2002-02-06 | 2004-12-24 | Saint Gobain | CIBLE CERAMIQUE NiOx NON STOECHIOMETRIQUE |
JP5056190B2 (ja) * | 2007-06-14 | 2012-10-24 | 住友金属鉱山株式会社 | 耐熱遮光フィルムとその製造方法、及びそれを用いた絞り又は光量調整用装置 |
JP2008311565A (ja) * | 2007-06-18 | 2008-12-25 | Dainippon Printing Co Ltd | ディスプレイ用複合フィルタ |
JP5985812B2 (ja) * | 2011-11-04 | 2016-09-06 | Jx金属株式会社 | 印刷回路用銅箔 |
JP6099875B2 (ja) * | 2011-11-22 | 2017-03-22 | 東レ株式会社 | 積層体の製造方法 |
KR20140023492A (ko) * | 2012-08-16 | 2014-02-27 | 삼성코닝정밀소재 주식회사 | 스퍼터링 타겟 및 이에 의해 증착된 블랙 매트릭스를 포함하는 유기 발광 디스플레이 장치 |
WO2014035207A1 (ko) * | 2012-08-31 | 2014-03-06 | 주식회사 엘지화학 | 전도성 구조체 및 이의 제조방법 |
JP2015064337A (ja) * | 2013-08-30 | 2015-04-09 | キヤノン株式会社 | 微細構造体の製造方法 |
KR102170097B1 (ko) * | 2013-10-31 | 2020-10-26 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 도전성 기판 및 도전성 기판 제조방법 |
-
2015
- 2015-06-04 JP JP2015113772A patent/JP6365422B2/ja active Active
-
2016
- 2016-05-31 KR KR1020160067337A patent/KR20160143535A/ko not_active Application Discontinuation
- 2016-06-01 CN CN201610382066.0A patent/CN106249938B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003151358A (ja) | 2001-11-16 | 2003-05-23 | Bridgestone Corp | 透明導電性フィルムおよびタッチパネル |
JP2011018194A (ja) | 2009-07-09 | 2011-01-27 | Shin Etsu Polymer Co Ltd | 大型ディスプレイ用のセンサパネル |
JP2013069261A (ja) | 2011-09-08 | 2013-04-18 | Dainippon Printing Co Ltd | タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN106249938A (zh) | 2016-12-21 |
JP6365422B2 (ja) | 2018-08-01 |
CN106249938B (zh) | 2019-02-12 |
JP2017002328A (ja) | 2017-01-05 |
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