KR20160143535A - 도전성 기판 및 도전성 기판 제조 방법 - Google Patents

도전성 기판 및 도전성 기판 제조 방법 Download PDF

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Publication number
KR20160143535A
KR20160143535A KR1020160067337A KR20160067337A KR20160143535A KR 20160143535 A KR20160143535 A KR 20160143535A KR 1020160067337 A KR1020160067337 A KR 1020160067337A KR 20160067337 A KR20160067337 A KR 20160067337A KR 20160143535 A KR20160143535 A KR 20160143535A
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KR
South Korea
Prior art keywords
layer
blackening layer
blackening
copper
conductive substrate
Prior art date
Application number
KR1020160067337A
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English (en)
Korean (ko)
Inventor
에리코 사토
히로유키 와타나베
Original Assignee
스미토모 긴조쿠 고잔 가부시키가이샤
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Application filed by 스미토모 긴조쿠 고잔 가부시키가이샤 filed Critical 스미토모 긴조쿠 고잔 가부시키가이샤
Publication of KR20160143535A publication Critical patent/KR20160143535A/ko

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Quality & Reliability (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
KR1020160067337A 2015-06-04 2016-05-31 도전성 기판 및 도전성 기판 제조 방법 KR20160143535A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015113772A JP6365422B2 (ja) 2015-06-04 2015-06-04 導電性基板の製造方法
JPJP-P-2015-113772 2015-06-04

Publications (1)

Publication Number Publication Date
KR20160143535A true KR20160143535A (ko) 2016-12-14

Family

ID=57575479

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160067337A KR20160143535A (ko) 2015-06-04 2016-05-31 도전성 기판 및 도전성 기판 제조 방법

Country Status (3)

Country Link
JP (1) JP6365422B2 (ja)
KR (1) KR20160143535A (ja)
CN (1) CN106249938B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI654628B (zh) * 2017-12-01 2019-03-21 鼎展電子股份有限公司 黑著層及具有該黑著層的透明導電結構

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003151358A (ja) 2001-11-16 2003-05-23 Bridgestone Corp 透明導電性フィルムおよびタッチパネル
JP2011018194A (ja) 2009-07-09 2011-01-27 Shin Etsu Polymer Co Ltd 大型ディスプレイ用のセンサパネル
JP2013069261A (ja) 2011-09-08 2013-04-18 Dainippon Printing Co Ltd タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2835534B1 (fr) * 2002-02-06 2004-12-24 Saint Gobain CIBLE CERAMIQUE NiOx NON STOECHIOMETRIQUE
JP5056190B2 (ja) * 2007-06-14 2012-10-24 住友金属鉱山株式会社 耐熱遮光フィルムとその製造方法、及びそれを用いた絞り又は光量調整用装置
JP2008311565A (ja) * 2007-06-18 2008-12-25 Dainippon Printing Co Ltd ディスプレイ用複合フィルタ
JP5985812B2 (ja) * 2011-11-04 2016-09-06 Ｊｘ金属株式会社 印刷回路用銅箔
JP6099875B2 (ja) * 2011-11-22 2017-03-22 東レ株式会社 積層体の製造方法
KR20140023492A (ko) * 2012-08-16 2014-02-27 삼성코닝정밀소재 주식회사 스퍼터링 타겟 및 이에 의해 증착된 블랙 매트릭스를 포함하는 유기 발광 디스플레이 장치
WO2014035207A1 (ko) * 2012-08-31 2014-03-06 주식회사 엘지화학 전도성 구조체 및 이의 제조방법
JP2015064337A (ja) * 2013-08-30 2015-04-09 キヤノン株式会社 微細構造体の製造方法
KR102170097B1 (ko) * 2013-10-31 2020-10-26 스미토모 긴조쿠 고잔 가부시키가이샤 도전성 기판 및 도전성 기판 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003151358A (ja) 2001-11-16 2003-05-23 Bridgestone Corp 透明導電性フィルムおよびタッチパネル
JP2011018194A (ja) 2009-07-09 2011-01-27 Shin Etsu Polymer Co Ltd 大型ディスプレイ用のセンサパネル
JP2013069261A (ja) 2011-09-08 2013-04-18 Dainippon Printing Co Ltd タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置

Also Published As

Publication number Publication date
CN106249938A (zh) 2016-12-21
JP6365422B2 (ja) 2018-08-01
CN106249938B (zh) 2019-02-12
JP2017002328A (ja) 2017-01-05

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