KR20160138956A - Method for manufacturing mask for use in vapor deposition, and method for manufacturing display device - Google Patents

Abstract

A method of manufacturing a vapor deposition mask is characterized by forming a first mask having a plurality of first openings as through holes of an evaporation material and arranging a first mask on the frame. When the first mask is formed, correction is performed in consideration of the shift amount of the opening position at the time of designing the position of the first opening in the frame.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a mask for vapor deposition,

The present disclosure relates to a method of manufacturing an evaporation mask and a method of manufacturing a display device used in deposition of a material.

For example, in an organic EL (Electro-Luminescence) display device, light from a white light emitting layer formed over all the pixels is separated into red (R), green (G), and blue Type, and each of the R, G, and B color light emitting layers is formed (divided) in each pixel. When the R, G, and B light emitting layers are formed for each pixel, each light emitting layer is formed by a vapor deposition method (vacuum vapor deposition method) using a metal mask.

The metal mask is provided with a plurality of openings that serve as through holes for the evaporation material, and the openings are formed by etching the thin metal base material (base metal) have. This metal mask is rarely used singly in the vapor deposition process and is used, for example, in a state of being assembled by welding or the like on a frame having high rigidity. This is because the thickness of the metal mask is thin, and the opening position can not be maintained with high precision in a single case. Therefore, for example, it is stretched in a biaxial direction with a predetermined elongation ratio (elongation ratio) and welded to the frame.

In the above-described metal mask, accuracy of opening position is required. For example, when the metal mask is stretched and attached to a frame, there is a method of adjusting the tensile amount while observing all of the opening positions with a measuring device while stretching. However, in this technique, it takes a considerable time to adjust the measurement and the tensile strength. Thus, there is a method of measuring the tensile strength of the opening of the metal mask while reducing the position of the opening, and adjusting the tensile strength while observing the data. In addition, there is a technique of adjusting the opening position of the outer periphery of the mask after welding the metal mask to the frame (for example, Patent Document 1).

Patent Document 1: Japanese Patent Application Laid-Open No. 2004-6257

However, in the technique of Patent Document 1 and the like, it is possible to design an ideal opening position in the outer peripheral portion of the mask, but there is room for improvement in the accuracy of the opening position in the central portion of the mask. Therefore, it is desired to realize a high-precision mask for vapor deposition.

Therefore, it is desirable to provide a method of manufacturing a mask for vapor deposition capable of realizing a high-precision deposition mask and a method of manufacturing a display apparatus.

A manufacturing method of a vapor deposition mask according to an embodiment of the present disclosure includes the steps of forming a first mask having a plurality of first openings as through holes of an evaporation material, In the step of forming the first mask, a correction is made in consideration of the opening position shift amount at the time of designing the position of the first opening in the frame.

A manufacturing method of a display device according to an embodiment of the present disclosure includes a step of forming an evaporation mask and a step of pattern-forming a material layer by using an evaporation mask. In the step of forming the vapor-deposition mask, a first mask having a plurality of first openings is formed as a through-hole of the evaporation material, a first mask is laid on the frame, The correction is performed in consideration of the amount of shift of the opening position when the frame is extended.

In the method of manufacturing a vapor deposition mask and the method of manufacturing a display device according to the embodiment of the present disclosure, a first mask having a plurality of first openings is formed as a through hole of an evaporation material, Frame. In the step of forming the first mask, when the position of the first opening is designed, correction is performed in consideration of the amount of shift of the opening position when the frame is extended. Thereby, when the first mask is laid on the frame, the first opening is disposed at a desired position, and an ideal opening position design becomes possible.

In the method of manufacturing a vapor deposition mask and the method of manufacturing a display device according to the embodiment of the present disclosure, a first mask having a plurality of first openings is formed as a through hole of an evaporation material, Frame. In the step of forming the first mask, when the position of the first opening is designed, correction is performed by adding the amount of shift of the opening position to the length of the frame when the first opening is designed. Thus, it is possible to design an ideal opening position by the length of the frame of the first mask. Therefore, a high-precision vapor deposition mask can be realized.

The above is also an example of the present disclosure. The effects of the present disclosure are not limited to those described above, and they may be different effects or may include other effects.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram showing the configuration of a deposition mask according to a first embodiment of the present disclosure; Fig.
FIG. 2 is a flow chart showing a manufacturing process of the vapor deposition mask shown in FIG. 1; FIG.
Fig. 3 is a flow chart showing a process relating to setting of electric pole conditions at the time of manufacturing the metal mask shown in Fig. 1; Fig.
4 is an XY plan view showing a configuration of a metal mask for setting a correction value shown in Fig.
5A is a schematic view showing the opening position and the thickness distribution before the frame welding of the metal mask shown in Fig.
Fig. 5B is a schematic view for explaining the opening position and the thickness distribution when the metal mask shown in Fig. 5A is welded to the frame. Fig.
6 is a schematic diagram showing a thickness measurement point at the time of calculating the opening position shift amount;
Fig. 7 is a characteristic diagram showing the thickness distribution at the measurement point shown in Fig. 6; Fig.
Fig. 8 is a characteristic diagram showing the opening position shift amount calculated from the thickness distribution shown in Fig. 7; Fig.
9 is a schematic diagram showing measurement points when a thickness distribution is measured in a plurality of systems;
Fig. 10 is a characteristic diagram showing the thickness distribution in the plural series shown in Fig. 9; Fig.
Fig. 11 is a characteristic diagram showing an opening position shift amount calculated from the thickness distribution shown in Fig. 10; Fig.
12 is a view schematically showing a configuration in the vicinity of an opening;
13A is a characteristic diagram for explaining a correction value set based on the opening position shift amount shown in Fig. 8; Fig.
13B is a characteristic diagram for explaining a correction value set based on the opening position shift amount shown in Fig.
14 is a schematic diagram showing the opening position and thickness of the metal mask designed with the opening position shift amount added thereto.
Fig. 15 is a schematic view showing the opening position and thickness of the metal mask shown in Fig. 14 after frame welding; Fig.
16 is a flow chart showing a manufacturing process of an evaporation mask according to a comparative example;
FIG. 17 is a flowchart for explaining an advantage of the method for manufacturing an evaporation mask shown in FIG. 1; FIG.
18 is a flow chart showing a manufacturing process of a deposition mask according to a second embodiment of the present disclosure;
19A is a schematic diagram of an XY plane for explaining measurement points and area sharing of an evaporation mask according to a second embodiment of the present disclosure;
Fig. 19B is a characteristic diagram showing the amount of opening position shift based on the thickness distribution at the measurement point shown in Fig. 19A. Fig.
20 is a characteristic diagram showing the amount of shift of the opening position calculated based on the thickness distribution of the sample of the metal mask.
21 is a characteristic diagram showing the amount of shift of the opening position calculated based on the thickness distribution of the sample of the metal mask.
22 is a characteristic diagram showing the amount of shift of the aperture position calculated based on the thickness distribution of the sample of the metal mask.
23 is a characteristic diagram showing the amount of shift of the opening position calculated based on the thickness distribution of the sample of the metal mask.
24 is a characteristic diagram showing the amount of shift of the opening position calculated based on the thickness distribution of the sample of the metal mask.
25 is a characteristic diagram showing the average value of the samples shown in Figs. 20 to 24 for each area. Fig.
26 is a characteristic diagram showing the opening position shift amount (A) before correction and the opening position shift amount (B) after correction of the sample of the metal mask according to Modification 1. Fig.
Fig. 27 is a characteristic diagram showing the opening position shift amount (A) before correction and the opening position shift amount (B) after correction of the sample of the metal mask according to Modification 1. Fig.
28 is a characteristic diagram showing the opening position shift amount (A) before correction and the opening position shift amount (B) after correction of the sample of the metal mask according to Modification 1. Fig.
29 is a characteristic diagram showing the opening position shift amount (A) before correction and the opening position shift amount (B) after correction of the sample of the metal mask according to Modification 1. Fig.
30 is a characteristic diagram showing the opening position shift amount (A) before correction and the opening position shift amount (B) after correction of the sample of the metal mask according to Modification 1. FIG.
31 is a view schematically showing a configuration in the vicinity of an opening;
32A is a schematic view for explaining a calculation model of the metal mask according to Modification 2. Fig.
32B is a schematic view for explaining a calculation model of the metal mask according to Modification 2. Fig.
32C is a schematic view for explaining a calculation model of the metal mask according to Modification 2. Fig.
Fig. 33 is a characteristic diagram showing an actually measured value of the opening position shift amount and a calculated value using the model shown in Fig. 32A. Fig.
Fig. 34 is a characteristic diagram showing an actually measured value of the opening position shift amount and a calculated value using the model shown in Fig. 32B; Fig.
Fig. 35 is a characteristic diagram showing an actually measured value of the opening position shift amount and a calculated value using the model shown in Fig. 32C. Fig.
36 is a flowchart showing a manufacturing process of a display device according to an application example;
37 is a schematic view for explaining the organic layer deposition step shown in FIG. 36;

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description will be made in the following order.

1. First Embodiment (Example of mask manufacturing process in which correction is performed based on the opening position shift amount at the time of designing the opening position)

2. Second Embodiment (Example of Performing Correction Based on Opening Position Shift Amount by Area)

3. Modification 1 (Example in which the correction value for each area is obtained from the average value of a plurality of masks)

4. Modification 2 (Exemplary case in which parameters other than the thickness are considered when calculating the opening position shift amount)

5. Application Example (Example of Manufacturing Method of Organic EL Display Device)

≪ First Embodiment >

[Configuration]

Fig. 1 shows an XY plane configuration of a vapor deposition mask (vapor deposition mask 1) according to a first embodiment of the present disclosure. 1 also shows a sectional configuration of a metal mask (metal mask M1). The vapor deposition mask 1 is used for vapor deposition of an organic layer in a manufacturing process of a display device (an organic EL display device to be described later) using, for example, an organic EL device. The mask 1 has a metal mask M1 as a mask body and a frame 110 in which the metal mask M1 is laid.

The metal mask M1 is a metal foil made of a material containing at least one of nickel (Ni), invar (Fe / Ni alloy) and copper (Cu) Mu m. In the metal mask M1, a plurality of openings H1 are patterned as passing holes for passing the evaporation material. The plurality of openings H1 are arranged two-dimensionally as a whole, for example, in the form of a matrix. One opening H1 corresponds to an element region for forming one pixel region of the display device. The shape (planar shape) of the opening H1 is, for example, a rectangular shape, a square shape, a circular shape, or the like. Through this opening H1, deposition of, for example, a low molecular organic material or the like is performed. It is to be noted that the "metal mask M1" of this embodiment corresponds to a specific example of the "first mask" of the present disclosure, and the opening H1 corresponds to one embodiment of the "first opening" .

The metal mask M1 is fixed (stretched) to the frame 110 in a state in which a predetermined tensile force is applied, for example. Specifically, the outer edge portion of the metal mask M1 is bonded to the frame 110 by, for example, spot welding (for example, by electrical resistance or laser).

As a method of forming the metal mask M1, for example, a technique using electroplating (electroplating) or etching can be used. In the case of electric pole, a thin film layer made of the above-mentioned metal is grown (electrodeposited) on, for example, a patterned base material (model, base layer). Alternatively, in the case of etching, the metal foil is patterned by etching, for example, by photolithography. In any case, after the thin metal mask M 1 is formed, the metal mask M 1 is assembled to the frame 110 made of a highly rigid metal or the like by welding or the like. Although the details will be described later, the thickness of the metal mask M1 is not uniform in the surface and has a distribution. Particularly, when the metal mask M1 is formed by the electric pole in the above method, such a distribution of the thickness is generated in the mask plane.

The frame 110 is a frame-shaped member for supporting the metal mask M1, and is made of a metal or the like having high rigidity. The outer shape of the frame 110 is, for example, a rectangular shape, and a metal mask M1 is formed on four sides along the biaxial direction.

[Manufacturing Method of Evaporation Mask (1)] [

Hereinafter, a method of manufacturing the vapor deposition mask 1 will be described. Fig. 2 shows the flow of the production of the vapor deposition mask 1. In the present embodiment, the vapor deposition mask 1 is used. For example, it is produced as follows. That is, first, a preform mask Mf0 is produced (step S11). Subsequently, the optimum electric pole condition is set (or adjusted) by using the prepared electric pole mask Mf0 (step S12). Subsequently, a metal mask (metal mask M0) is fabricated using the set electroplating conditions (step S13). Subsequently, the opening position shift amount is calculated using the metal mask M0 (step S14).

Thereafter, a correction value is set based on the calculated opening position shift amount (step S15). Subsequently, the electrophotographic mask Mf1 for forming the metal mask M1 is fabricated by the opening position design in which the correction value is reflected (step S16). Subsequently, the metal mask M 1 is fabricated by using the electric pole mask Mf 1 (step S 17). The metal mask 1 produced in this manner is welded to the frame 110 (step S18), and the accuracy of the opening position is finally confirmed (step S19). In this manner, the vapor deposition mask 1 is completed. The details of each process (steps S11 to S19) will be described below.

(Fabrication of metal mask M0: S11 to S13)

The electrophotographic mask Mf0 is a mask for patterning a base material for plating the metal mask M0. The metal mask M0 is a mask sample for calculating the opening position shift amount to be described later and setting the correction value, and is not left (shipped) to the mask 1 for the finished product, and eventually discarded. For this reason, as the electrophotographic mask Mf0, for example, one having the same precision as the electrophotographic mask Mf1 (described later) may be used, but this electrophotographic mask Mf0 is finally Becomes unnecessary, and the electric pole mask Mf1 is written instead. Therefore, in order to reduce the cost, an inexpensive photomask such as a quartz glass or a film emulsion may be used for the electrophotographic mask (Mf0) for the outgoing condition. Although the design precision in the sheet or film is inferior to that of quartz or the like, it can be said that the accuracy is sufficient when only the condition setting and the correction value setting are intended. It should be noted that the "metal mask M0" of this embodiment corresponds to a specific example of the "second mask" of the present disclosure, and the opening H0 corresponds to one of the "second openings" .

When fabricating the metal mask M0, it is preferable to set an optimal electroplating condition (so-called electroplating). Fig. 3 shows an example of this electric pole condition. When the condition is met, the preforming condition (for example, the processing time or the layout of the partition in the plating) is adjusted for the base material formed by using the preforming mask Mf0 until the design error becomes the predetermined threshold value or less , And a metal mask (M0 _n ) (where n is an integer of 1 or more).

More specifically, first, a predetermined electroplating condition is set (step S21), and a metal mask (metal mask M0 ₁ ) is formed by plating using the set conditions (step S22). Subsequently, the thickness (thickness) of the manufactured metal mask M01 is measured (step S23), and a design error is calculated based on the measured thickness (step S24). The method of calculating the position error using this thickness is the same as the method of calculating the opening position shift amount described later. Then, it is determined whether or not the calculated design error is less than or equal to a predetermined threshold value (whether or not a desired accuracy is shown) (step S25). When the design error in the metal mask M0 ₁ is equal to or less than the predetermined threshold value (Y in step S25), the metal mask M01 is referred to as the metal mask M0 described above. On the other hand, when the design error in the metal mask M0 ₁ is larger than the predetermined threshold value (N in step S25), the process returns to step S21 to adjust the electric pole condition (set different pole condition) forming a metal mask (M0 _2)), and coated, in the same manner as described above, the thickness measurement is carried out, design error estimator, a threshold is determined. In this manner, the formation of the metal mask (metal mask M0 _n ) is repeated until the desired precision is obtained, and the optimum electroplating condition is selected. A metal mask (M0 _n ) formed in a preforming condition that can finally realize a desired precision is referred to as a metal mask (M0). Thus, a metal mask M0 is fabricated.

(Calculation of the opening position shift amount: S14)

Fig. 4 shows an XY plane configuration of the metal mask M0 before frame welding. As described above, in the metal mask M0 before the frame welding, the plurality of openings H0 are arranged so as to be equally spaced along the biaxial direction. Here, the image when the metal mask M0 is attached to the frame is shown in Figs. 5A and 5B. 5A and 5B also show a sectional configuration for explaining the thickness of the mask. The metal mask M0 is welded to the frame 110 while the metal mask M0 is stretched in four chambers (in two axial directions) at a predetermined elongation, and then the tensile force T is applied to the metal mask M0 Open. After the welding of the metal mask M0 to the frame 110, the opening H0 shifts (shifts) from the ideal position (design position) as shown in Fig. 5B. In addition, the shift amount of the position of the opening H0 is also uneven. As a result, the arrangement of the openings H0 after frame welding is disturbed and is not equally spaced (the intervals become uneven).

This is due to the fact that the metal mask M0 has a thickness distribution as shown in the lower portion of Fig. 5A. Particularly, in the metal mask M0 formed by electric pole, a thickness distribution tends to occur due to a variation in the plating growth rate. Here, the design error of the position of the opening of the metal mask M0 before the frame welding is of a degree that practically poses no problem (for example, on the order of sub-micron). However, when tension is applied during welding, the metal mask M0 expands and contracts due to the tensile force. At this time, if the metal mask M0 has a thickness distribution, the extension rate varies depending on the region. For example, in a region where the thickness is relatively large, the elongation is small (is difficult to elongate). In a region where the thickness is relatively small, the elongation is large (becomes easy to elongate). As a result, as shown in the lower portion of Fig. 5B, the position shift amount of the opening H0 becomes uneven, and the desired position design accuracy can not be obtained.

Thus, in the present embodiment, in order to correct the above-described opening position shift, the opening position shift amount is calculated using the metal mask M0 as a sample. At this time, the thickness (distribution of the thickness) of the metal mask M0 is measured, and the opening position shift amount is obtained by calculation using the thickness and the tensile factor at the time of the drawing as parameters. Further, the thickness of the metal mask M0 can be easily measured by using a measuring instrument such as a micrometer or a stepped system even in a state where the thickness of the metal mask M0 is not held by the frame 110. [

The thickness distribution and the opening position shift amount of the metal mask M0 will be described with reference to Figs. 6 to 11. Fig. 6 is a schematic diagram showing thickness measurement points. Fig. 7 is a characteristic diagram showing the thickness distribution at the measurement point shown in Fig. 6. Fig. Fig. 8 is a characteristic diagram showing the opening position shift amount (aperture position distribution) calculated from the thickness distribution shown in Fig. 7; Fig. Fig. 9 is a schematic diagram showing measurement points when a thickness distribution is measured in a plurality of systems. Fig. 10 is a characteristic diagram showing the thickness distribution in the plural series shown in Fig. 9. Fig. Fig. 11 is a characteristic diagram showing the opening position shift amount calculated from the thickness distribution shown in Fig. 10. Fig.

When the metal mask M0 has 3840 openings H0 in the X direction and 2160 openings in the Y direction, if the thickness of the metal mask M0 is set at a point corresponding to all the openings H0, Therefore, the measurement time is enormous. Therefore, in practice, the measurement is performed at a proper distance (at an optional position). For example, in the example shown in Fig. 6, 15 measurement points in the X direction and 7 measurement points in the Y direction (i.e., a total of 15 x 7 points) are assumed. Fig. 7 shows the distribution of the thicknesses of the positions (total of 15 positions) in the X direction in the sequence of the fourth direction in the Y direction among the measurement points of Fig. In this measurement result, the thickness is the largest at position 14 in X direction, and is the smallest at position 4 or 7 in X direction. In Fig. 8, when the position of each opening of the measurement point as shown in Fig. 7 is the same as the design position, the position shift amount is 0 (zero), and when the position is shifted to the positive direction in the X direction, In this case, the shift amount is represented by a negative value. For example, the opening H0 at the position 2 in the X direction indicates that the opening is shifted to the plus side in the X direction with respect to the design position. In this example, the opening position shift amount is set to 0 at both ends in the X direction (No. 1, No. 15) by setting conditions at the time of calculation.

9 shows measurement points of a total of 7 series in the Y direction 1 to 7. Fig. 10 shows the thickness distribution for each of the seven series shown in Fig. 9 in total. 11, the opening position shift amounts at both ends in the X direction (No. 1, No. 15) are set to 0 by setting conditions at the time of calculation.

Here, in the calculation of the opening position shift amount, the metal mask M0 can be treated as a one-dimensional model (one-dimensional tensile model) along one die direction. For example, the opening position shift amount is calculated using a one-dimensional model along the X direction (rectangular long side direction) out of the biaxial directions of X and Y. [ Assuming that the metal mask M0 is extended to the frame 110, the metal mask M0 is stretched in two axial directions, for example, the X direction and the Y direction. For this reason, strictly speaking, the opening position shift amount is determined by the interaction between the tensile amount in the X direction and the tensile amount in the Y direction. However, in the present embodiment, The calculation is performed only in the direction of the action. Also, it is confirmed that the operation in the Y direction is sufficiently negligible by comparison with the actual measurement.

Fig. 12 (A) shows an image of the opening H0 of the metal mask M0. Actually, about 4000 openings H0 in the X direction and about 200 openings H in the Y direction are arranged. Here, three openings H0 (H0a, H0b) are shown for explanation, 3x2 = 6 .

As described above, the portion X1 extending along the X direction between the openings H0 can be used as an object of measurement of the thickness to calculate the shift amount of the opening position. The thickness t2 in the vicinity of the central opening H0b is larger than the thickness t1 in the vicinity of the opening H0a on both sides thereof as shown in Fig. 12B (t2 > t1). In addition, in the vicinity of the opening H0b, the width d2 along the Y direction of the elongated portion (the beam 121b) between the openings H0b becomes larger than the width d2 along the Y direction as the thickness t2 becomes larger. The width d1 of the beam 121a between the first and second end portions 121a and 121a is larger. The length s2 of the beam 121b along the X direction is shorter than the length s1 of the beam 121a. This is due to the nature of the electric pole. The portion having a relatively large thickness acts so that each of the width and length of the beam 121b is difficult to elongate. On the other hand, the portion having a relatively small thickness becomes the opposite, and it is easy to increase. In addition to the thicknesses t1 and t2, the widths d1 and d2 and the lengths s1 and s2 can be used as parameters for calculating the opening position shift amount, but only the thickness is used in the present embodiment. The case where the thickness and the width are taken into consideration, and the case where the thickness, the width and the length are considered will be described later (a modification example).

(Setting of correction value: S15)

As described above, the shift amount of the opening position at the time of the elongation to the frame 110 can be calculated from the thickness distribution of the metal mask M0. However, as long as the thickness distribution of the metal mask M0 exists, Can occur. In order to improve the accuracy under such circumstances, it is preferable to shift the opening position in advance in consideration of the opening position shift in the design stage. In other words, a correction value is set on the basis of the calculated opening position shift amount, and this correction value is fed back to the designing stage.

For example, as shown in Fig. 13A, a correction value is set based on the opening position shift amount (the example shown in Fig. 8). More specifically, as shown in Fig. 13B, correction values are set so that the position shift amounts in the X direction become 0 in the respective positions (1 to 15) in the X direction. For example, at position 3, since the shift is 7 (for example, 7 mu m) to the X direction plus side, "-7" is set as the correction value. In position 9, since the shift is made to the minus side in the X direction by 6, "+6" is set as the correction value. The correction values for these positions are fed back to the opening position designing step of the metal mask M1.

(Fabrication of metal mask M1: S16, S17)

When fabricating the metal mask M1, the opening position is designed by using the correction value based on the opening position shift amount set as described above. More specifically, a new electrophotographic mask Mf1 reflecting such correction values is formed, and the metal mask M1 is formed by using the electrophotographic mask Mf1. As the electric-charge mask Mf1, it is preferable to use a high-precision photomask. For example, a glass-made photomask coated with a chromium-plated glass or quartz glass having a small thermal expansion may be used.

Fig. 14 shows an XY plane configuration and a sectional configuration of the metal mask M1. In this way, in the metal mask M1 having the opening position design reflecting the correction value, the positions of the openings H1 do not become equal intervals. The position of the opening H1 is shifted depending on the thickness distribution by welding the metal mask M1 to the frame 110 at a predetermined elongation in the following step (step S18). As a result, as shown in Fig. 15, in a state in which it is laid on the frame 110, the opening position is close to the abnormal position (the openings H1 are arranged at equal intervals). Before the welding, the opening positions of the unequal intervals are arranged equidistantly after welding. Correction of the opening position shift amount may be performed with respect to the opening position in one axis (X direction), but correction may be performed with respect to two axes in the X direction and the Y direction. In the case of performing correction with respect to the two axes, the position shift amount in the X direction is obtained as described above, and similarly, the position shift amount in the Y direction is calculated on the basis of the thickness distribution in the Y direction (or Actually measured). Thereby, the correction values at the measurement points in the X direction and the Y direction (for example, a total of 105 points in 15 points in the X direction and 7 points in the Y direction) can be obtained. The aperture position correction based on this correction value can be independently performed in the X direction and the Y direction.

Finally, in the metal mask M1 laid on the frame 110, the aperture position accuracy is confirmed. Thus, the vapor-deposition mask 1 shown in Fig. 1 is completed.

[effect]

The metal mask M1 having a plurality of openings H1 is formed as a through hole of the evaporation material as described above and then the metal mask M1 ) Is laid on the frame 110 (it is bonded by welding or the like while applying tension). In designing the opening position of the metal mask M1, correction is performed in consideration of the shift amount of the opening position at the time when the frame 110 is extended. For example, the opening position shift amount is calculated from the thickness distribution of the metal mask M0, and the correction value is set based on the calculated opening position shift amount. The set correction value is reflected in the opening position design of the metal mask M1. Thereby, when the metal mask M1 is laid on the frame 110, the opening H1 is disposed at a desired position, and an ideal opening position design becomes possible. Therefore, it is possible to realize a high-precision deposition mask.

In addition, as described above, the opening position is shifted when the mask is laid. Until now, it has not been clarified whether the opening position shift is caused by the deviation of the tensile force or due to the elastic deformation. Under such circumstances, the applicant of the present invention grasped the metal mask M0 as a one-dimensional model and calculated the opening position shift amount from the thickness distribution thereof, thereby making it possible to predict the opening position shift amount at the time of the laying out in advance . As a result, it has been found that the deviation of the thickness of the metal mask M0 is a main cause of shift of the opening position at the time of the laying on the frame 110, and also the thickness distribution measurement and the calculation of the opening position shift amount Can be concentrated into a one-dimensional model.

On the other hand, in reality, it is difficult to eliminate the thickness distribution of the metal mask M0. Particularly, in the electric pole, the thickness fluctuates due to the unevenness of the flow of the plating liquid, the difference in current density due to the region on the base material in response to the positional relationship with the electrode, and the like. In general, since the electrode is disposed at the end portion on the base material, the plating growth rate at the center portion on the base material is slowed down. For this reason, the thickness at the central portion in the mask surface tends to be relatively thin. That is, the thickness distribution of the mask has a specific tendency due to the process conditions. Therefore, by calculating the opening position shift amount from such a thickness distribution and feeding back to the designing stage as a correction value, it becomes possible to design the opening position in which the opening position shift due to such process conditions is assumed in advance.

In this embodiment, for example, in the manufacturing process (S11 to S13 in Fig. 2) of the metal mask M0 and the calculating process of the opening position shift amount (S14), the design error or the opening position shift amount is calculated . Thereby, it is possible to set the high, the condition, or the correction value without welding the metal mask M0 to the frame 110. [

(Comparative example)

Fig. 16 shows a flow of mask production in the case of carrying out electrolytic conditioning by actual measurement as a comparative example of this embodiment. In this case, after a series of steps from the production of the electric pole mask (step S101), the electric pole condition setting (step S102), the metal mask production (step S103)) and the frame welding (step S104) (Step S105). In this way, when the opening position accuracy is actually measured, the measurement is performed in a state welded to the frame. When the metal mask is not welded to the frame, the metal mask is not flat and measurement is difficult.

Specifically, when the metal mask is welded to the frame (S104), the metal mask is pulled while measuring the opening position by using a dedicated measuring device, the tensile amounts of the four sides are slightly adjusted, and then the frame is welded. As a measuring instrument, a metal mask is placed on a measurement table, and measurement is carried out by a camera with a microscope, a laser interferometer and a scale moving along two axes, for example, the X direction and the Y direction, Dimensional side organ or a three-dimensional side organ of the type determined by the above-described method. Thereafter, the aperture position accuracy is measured by a dedicated measuring instrument similar to the above (S105).

As described above, in the case of actual measurement, a welding step (long-laying step) to the frame of the metal mask and a subsequent opening position precision step are required. Therefore, in the aperture accuracy determination (S106), if the desired accuracy is not obtained, the metal mask is removed from the frame, the weld surface of the frame is polished, and the surface is cleaned. These processes are time-consuming and can be performed once per day. As described above, every time the pole condition is reset, a process is required in which the metal mask is peeled off from the frame, polished, and cleaned.

On the other hand, in this embodiment, the measurement of the thickness of the metal mask M0 does not take much time. Since the thickness of the metal mask M0 can be easily measured by using a measuring device such as a micrometer or a stepped system, the process time can be shortened. For this reason, it is not so difficult to fabricate about four metal masks (M0 _n ) (n = 1 to 4) per day and measure the thickness for the pole condition (FIG. 3). As described above, by obtaining the design error by calculation from the thickness distribution, it is possible to repeat the process of placing the metal mask M0 on the frame 110 at least 10 times, and possibly several tens of times, . Then, only the metal mask M0 determined to have a desired accuracy by calculation may be welded to the frame for final confirmation to measure the precision. Therefore, it is possible to significantly shorten the time of the pole condition. Depending on the required specification of the accuracy, it is possible to shorten the period of one month or longer.

In addition, there is an advantage that the yield of the shipment product is improved by performing the accuracy determination before welding the metal mask M1 to the frame 110. [ Fig. 17 shows a manufacturing flow when the accuracy of the metal mask M1 is determined and then welded to the frame 110. Fig. When the design conditions (electroforming condition and opening position design) when manufacturing the metal mask M1 are determined by the above-described process, a plurality of metal masks M1 can be manufactured based on the design conditions. However, even if the metal mask M1 is fabricated under the same design conditions, the desired accuracy may not be obtained due to a conditional deviation or the like in the electroplating process. In this case, the thickness distribution of the metal mask M1 is measured (Step S32) before the metal mask M1 is manufactured (Step S31) and then welded to the frame 110 (Step S35) (Step S33). Then, the accuracy determination is performed based on this design error (step S34). When the desired accuracy is obtained (Y in step S34), the process proceeds to the frame welding step. On the other hand, when the desired precision is not obtained in the accuracy judgment (N in step S34), the process returns to the step of manufacturing the metal mask M1 again (the metal mask M1 is made again).

As described above, after the metal mask M1 is fabricated, only the frame having the desired accuracy can be welded to the frame 110. [ After that, aperture position measurement is performed (step S3))) 6), and accuracy check is performed (step S3))) 7). By making the evaporation mask 1 with such a flow, it is possible to judge whether or not it should be sent to the process of laying on the frame 110, and it is possible to reduce the number of masks which become inferior after the frame welding due to insufficient precision . That is, the yield of the final shipment product can be improved.

Hereinafter, mask masks according to other embodiments and modifications of this disclosure will be described. The same constituent elements as those of the first embodiment are denoted by the same reference numerals, and a description thereof will be omitted.

≪ Second Embodiment >

Fig. 18 shows a flow of manufacturing a deposition mask according to the second embodiment of the present disclosure. Also in this embodiment, a mask for vapor deposition is manufactured as follows, for example, in the same manner as the method for manufacturing the vapor deposition mask 1 of the first embodiment described above. That is, first, a preform mask Mf0 is produced (step S41). Subsequently, the optimum electric pole condition is set (or adjusted) by using the prepared electric pole mask Mf0 (step S42). Subsequently, a metal mask (metal mask M0) is fabricated using the set electroplating conditions (step S43). Subsequently, the opening position shift amount is calculated using the metal mask M0 (step S44). Thereafter, a correction value (representative correction value) is set based on the calculated opening position shift amount (step S45). Subsequently, the electrophotographic mask Mf1 to which the correction value is reflected is fabricated (step S46). Subsequently, the metal mask M1 is fabricated by using the electric pole mask Mf1 (step S47). The metal mask 1 thus manufactured is welded to the frame 110 (step S48), and the accuracy of the opening position is finally confirmed (step S49). In this way, the mask for vapor deposition is completed.

However, this embodiment differs from the first embodiment in the following points. In the present embodiment, in the opening position shift amount calculating step S44, the metal mask M0 is divided into a plurality of areas based on the trend (tendency) of the opening position shift amount. Further, in the correction value setting step (S45), representative correction values in the respective areas are set based on the opening position shift amount for each such area.

19A shows measurement points (X direction 0 to 32, Y direction 1 to 13) and areas A1 to A5 of the present embodiment. 19B is a characteristic diagram of an opening position shift amount in the X direction (long side direction) calculated on the basis of the thickness distribution of the metal mask M0. Also in this embodiment, the thickness distribution and the opening position shift amount are measured and calculated as a one-dimensional model along the X direction. In the examples of Figs. 19A and 19B, measurement and calculation were performed at 33 positions (0 to 32) in the X direction for each of the Y-direction 1 to 13 series.

In the example shown in Fig. 19B, curves resemble those in the series 6, 7, and 8. That is, it can be seen that the position shift of the portion including the series 6, 7 and 8 has the same tendency. Similarly, series 12 and 13 have similar position shifts. This shows that the inside of the mask plane can be divided into a plurality of areas (areas A1 to A5) extending in the tensile direction (X direction) in response to the tendency of the opening position shift. This is because the thickness distribution of the metal mask M0 is generated in a similar manner for each area. For example, as described above, plating growth of the electric pole tends to slow the central portion of the base material. For this reason, it has line symmetry with the center of symmetry in the X direction (the same also in the Y direction) in the mask plane. Therefore, when the symmetry axis is placed at the center of the mask in the X direction, the amount of shift in the line symmetric portion is similar to that of the mask. From the similarity of the positional shift tendency as described above, the inside of the plane of the metal mask M0 can be grasped as a plurality of areas A1 to A5, and correction can be performed for each area.

Here, since the one-dimensional model is assumed according to the tensile direction (X direction), area dividing (areas A1 to A5) is made for each set of sequences having similar tendencies in opening position shift amount. More specifically, the areas A1 and A2, the areas A2 to A3, the areas A3 to 6 and 8, the area A4 to the series 9 to 11, A5) includes series 12 and 13, respectively.

After extracting the areas A1 to A5 having similar tendencies of the opening position shifts, representative correction values are set in each of the areas A1 to A5. For example, an average of the opening position shift amounts between the series in each area can be taken, and this average value can be used as a representative correction value. For example, in the area 1, the average value of the shift amounts of the first series of opening positions and the second series of opening position shifts can be used as the representative correction value of the area 1. In this way, the opening position shift amount calculation S44 and the correction value setting S45 are performed. In addition, the electrophotographic mask Mf1 is produced by the opening position design in which the set representative correction value is reflected for each area (S46). The other steps (S41 to S43, S47 to S49) of the present embodiment are the same as the steps (S11 to S13, S17 to S19) of the first embodiment.

Also in this embodiment, when the opening position is designed in the manufacturing process of the metal mask M1, the same effect as that of the first embodiment can be obtained by carrying out the correction by adding the opening position shift amount.

In the present embodiment, as described above, when calculating the opening position and setting the correction value, area division is performed to set representative correction values for each area. Thereby, it is not necessary to insert the correction value for each opening when designing the opening position, and it becomes better by putting a representative correction value in each area. For example, in the case of a vapor deposition mask for a display in which the number of pixels is 8 million or more, the numerical aperture is 8 million or more. However, as in the present embodiment, it is possible to perform correction for each area, can do. Actually, since there is a certain degree of variation in every lot, there is a higher practicality in the case of performing the correction for each area than in the case of performing correction for each opening.

In addition, for the opening position shift in the Y direction, the area division and the representative correction value can be set by the above-described technique. The X direction and the Y direction can be handled independently of each other, and correction values can be separately set. However, since the accumulation amount of the aperture position shift in the long side direction (X direction) of the display is large, the maximum shift amount is mostly generated in the long side direction. Therefore, a sufficient effect can be obtained by merely correcting the shift amount in the long-side direction only.

<Modification Example 1>

In the method of manufacturing the vapor deposition mask according to the second embodiment described above, a method of setting the correction value for each area has been described. However, even in the case of a metal mask manufactured under the same electrolytic condition, . Particularly, in the electrolytic process, the thickness distribution tends to be scattered every lot.

Thus, in this modified example, after the area is divided in the same manner as in the second embodiment, the average of the opening position shift amounts of the corresponding areas (the same areas) among the plurality of metal masks manufactured under the same pre- Lt; / RTI &gt; In other words, an average of the shift amounts of the opening positions of the areas in all the metal masks is taken. Hereinafter, an example will be described.

Figs. 20 to 24 show the opening position shift amounts calculated on the basis of the thickness distributions of five metal masks M0 (samples A to E) in total produced under the same electrodeposition conditions. As described above, in the samples (A to E), although there is a tendency similar roughly for each series or each area, it can be seen that there is a slight variation.

FIG. 25 shows the results obtained by taking an average for each area from these five samples (A to E). 19A), the groups 3 to 5 and 9 to 11 (corresponding to the areas A2 and A4), the series 6 to 8 (corresponding to the areas A2 and A4) of the series 1 and 2 (Corresponding to the area A3) of the series 12 and 13 and a group (corresponding to the area A5) of the series 12 and 13, respectively. More specifically, for example, the average value of the series of series 1 and 2 is calculated by dividing the opening position shift amount of the series 1 and 2 of the sample (A), the opening position shift amount of the series 1 and 2 of the sample (B) C are the average values of the aperture position shift amounts of the series 1 and 2 of the sample D and the aperture position shift amounts of the series 1 and 2 of the sample D and the aperture position shift amounts of the series 1 and 2 of the sample E.

The average value of each area in the plurality of metal masks M0 thus obtained is fed back to the designing step of the metal mask M1 as a representative correction value in the same manner as in the second embodiment. Thereby, the same effects as those of the second embodiment can be obtained, and correction can be made taking into consideration the deviation from each rod. It is possible to realize higher precision. Further, in the case of actually performing the aperture position design correction, since the mask Mf1 is one, it is most practicable to take an average for each area from a plurality of metal masks as in this modification.

(Correction effect)

Figs. 26 to 30 show the amounts of shift of the opening position (A in each drawing) of the samples A to E of this modification and the amount of positional shift (actually, ). &Lt; / RTI &gt; The post-correction distribution of (B) is a calculated value obtained by subtracting one representative correction value set by the above-described technique for each area in the characteristic diagram of (A). Each figure also shows the maximum value (max), the minimum value min, and the maximum width (maximum value of the shift amount in the X direction: Range) of the position shift amount. In all of the samples (A to E), both of the maximum value, the minimum value, and the maximum width are halved (or reduced) in the characteristic diagram after the correction. These results show that the opening position accuracy is improved by the correction at the time of designing the opening position.

<Modification Example 2>

In the above-described embodiment, the opening position shift amount is calculated based on the thickness (thickness distribution) of the metal mask M0. However, other parameters besides the thickness may be used for calculating the opening position shift amount. Fig. 31 (A) shows an image of the opening H0 of the metal mask M0. Actually, about 4000 openings H0 in the X direction and about 200 openings H in the Y direction are arranged. Here, three openings H0 (H0a, H0b) are shown for explanation, 3x2 = 6 .

As in the first embodiment, a portion X1 extending along the X direction between the openings H0 can be measured as a one-dimensional model. As shown in Fig. 31 (B), the thickness t2 in the vicinity of the central opening H0b is larger than the thickness t1 in the vicinity of the opening H0a on both sides thereof (t2 > t1). In addition, in the vicinity of the opening H0b, the width d2 along the Y direction of the elongated portion (the beam 121b) between the openings H0b is larger than the width d2 between the openings H0a The width d1 of the beam 121a of the optical fiber 121a. 31 (C), the length s2 of the beam 121b along the X direction is shorter than the length s1 of the beam 121a. This is due to the nature of the electric pole. A relatively large portion of the thickness acts so that each of the width and length of the beam 121b is difficult to elongate. On the other hand, the portion having a relatively small thickness is reversed, and it is easy to expand.

In this modified example, the thicknesses t1 and t2 and the widths d1 and t2 of the one-dimensional model portion X1 described above only consider the thicknesses t1 and t2 (corresponding to the first embodiment: (model 3) in which the thicknesses t1 and t2, the widths d1 and d2, and the lengths s1 and s2 are considered will be described. In the model X1, only the thickness is considered, that is, the elongation of the opening portion and the elongation of the non-opening portion in the X direction are not distinguished (Fig. 32A). The model 2 does not discriminate between the elongation of the opening portion and the elongation of the non-opening portion in the X direction, considering the thickness and width in the portion X1 (Fig. 32B). The model 3 assumes that only the beams 121a and 121b extend in the X direction in consideration of the thickness, width, and length in the portion X1 (FIG. 32C).

In each of the above-mentioned three kinds of models (1 to 3), the measured value and the calculated value were compared. Fig. 33 shows measured values (Fig. 33 (A)) and calculated values of model 1 (Fig. 33 (B)). Fig. 34 shows the measured values (Fig. 34 (A)) and the calculated values of the model 2 (Fig. 34 (B)). 35 shows the measured values (Fig. 35 (A)) and the calculated values of the model 3 (Fig. 35 (B)). In addition, the measured value is an actual measurement of the opening position with the metal mask laid on the frame. In the calculation values of the models 1 to 3, the position shift amounts at the end portions 1 and 15 in the X direction were set to zero. It is assumed that the opening position of the mask peripheral portion is stuck to the frame 110 as an abnormal position (design position). In addition, the total number of Y-directional sequences is 7, and the number of measurement portions of each sequence is 15 in the X-direction. Therefore, the total number of curves in each drawing is seven.

As a result, it can be seen that the calculated value of any model has the same tendency as the measured value, and it can be seen that any model can obtain the correction effect. In particular, it has been found that the calculated value of the model (2) in Fig. 34 is closest to the actual measurement value. That is, it has been found that more accuracy can be obtained when thickness and width are considered. It was also found that there is no problem even if the tension in the direction perpendicular to the tensile direction (X direction) (Y direction) is neglected.

<Application example>

An application example of the vapor deposition mask described in the above embodiment mode and modification examples will be described. The vapor deposition mask or the vapor deposition mask production method of the above embodiment can be suitably used, for example, in the manufacturing process of the organic EL display device.

Fig. 36 shows a flow of manufacturing the organic EL display device. Thus, the organic EL display device includes a first electrode forming step (step S51), an organic layer deposition step (step S52), a second electrode forming step (step S53))) and a sealing step (step S54). Among them, in the organic layer deposition step (S52), for example, when forming an organic electroluminescent layer by vapor deposition, an evaporation mask such as the above embodiment can be used.

Figure 37 shows an image of an organic layer deposition process. As described above, in vapor deposition, for example, in the vapor deposition apparatus, vapor deposition mask 1 (frame 110, metal mask M 1) is brought into close contact with substrate 11 above evaporation source 13 State at a constant speed. The organic material (organic EL material 12) from the evaporation source 13 diffuses as vapor 12a and adheres to the substrate 11 through the evaporation mask 1. [

As described above, in the manufacturing process of the organic EL display device, by using the evaporation mask of the above-described embodiment or the like, high-precision pixel design becomes possible, and high definition of the pixel can be realized. In addition, it is expected that the number of pixels is increased and brightness is increased.

Although the embodiments, modifications, and examples have been described above, the present disclosure is not limited to these embodiments, and various modifications are possible. For example, in the above-described embodiments and the like, the case where the opening position shift amount is obtained by calculation based on the distribution of the thickness of the metal mask and the like is described as an example, but the present disclosure is not limited thereto. For example, after the metal mask is formed, the opening position may be measured in a state where the metal mask is actually welded to the frame. In this case, the correction value may be set based on the measured opening position shift amount. However, as described in the above embodiments and the like, it is preferable to obtain the shift amount of the opening position by calculation because the number of steps and the processing time can be greatly reduced.

In the above-described embodiments and the like, the case where the metal mask is manufactured by using the electric pole is described as an example. However, the present disclosure can be applied even when the metal mask is produced by etching.

Further, in the above-described embodiments and the like, the mask for vapor deposition has been described as an example used in the manufacturing process of the organic EL display device. However, the deposition mask of the present disclosure is not limited to an organic material, and may be applied to a deposition process such as a metal material, a dielectric material, or the like. Alternatively, it may be a mask for exposure or printing as well as for deposition, and it can be widely applied to masks required to have high definition.

The effects described in the above embodiments are merely examples, and they may be different effects or may include other effects.

The present disclosure can be configured as follows.

(One)

Forming a first mask having a plurality of first openings as through holes of the evaporation material,

The first mask is laid on the frame,

Wherein the first mask is formed by applying a correction to the frame in consideration of the shift amount of the opening position when the frame is extended when designing the position of the first opening.

(2)

When forming the first mask,

Preparing a second mask having a plurality of second openings,

The aperture position shift amount is calculated using the second mask,

A correction value is set based on the calculated opening position shift amount,

The method for manufacturing an evaporation mask as set forth in (1), wherein, when designing the position of the first opening, correction is performed using the correction value.

(3)

And the opening position shift amount is calculated on the basis of the distribution of the thickness of the second mask.

(4)

The method for manufacturing an evaporation mask according to (3), wherein the opening position shift amount is calculated using a one-dimensional model in which only the first direction of the mask stretching direction at the time of frame assembly is considered.

(5)

Wherein the first mask and the second mask have a rectangular shape,

The method for manufacturing an evaporation mask as set forth in (4), wherein the first direction is the rectangular long side direction.

(6)

(4) or (5), wherein the amount of shift of the opening positions of the both ends of the second mask in the first direction is set to zero (zero).

(7)

When forming the first mask,

The second mask is formed a plurality of times while adjusting the process conditions until the design error becomes a predetermined threshold value or less,

The method of manufacturing an evaporation mask according to the above (2), wherein a process condition in which the design error is less than or equal to the threshold value is set as a process condition of the first mask.

(8)

Measuring a width of the beam portion between the second openings in the second direction orthogonal to the first direction along the second direction,

And the opening position shift amount is calculated on the basis of the measured thickness and the width.

(9)

Measuring a length of the beam portion along the first direction,

And the opening position shift amount is calculated on the basis of the measured thickness, the width, and the length.

(10)

(1) to (9) for correcting the opening position shift amount in each of the first and second directions orthogonal to each other in the mask stretching direction when designing the position of the first opening, Wherein the mask is made of a metal.

(11)

(1) to (9) for correcting the opening position shift amount in either of the first and second directions perpendicular to each other in the mask stretching direction when designing the position of the first opening. A method for manufacturing an evaporation mask as set forth in any one of claims 1 to 5.

(12)

The method for manufacturing an evaporation mask according to any one of (2) to (11), wherein, when the correction value is set, the amount of positional shift of the selective second opening in the entire opening of the second mask is used.

(13)

The second mask is divided into a plurality of areas each having a similar tendency of the opening position shift amount,

The method of manufacturing an evaporation mask as set forth in any one of (2) to (12) above, wherein, when designing the position of the first opening, correction is performed using a representative correction value set for each of the areas.

(14)

The method of manufacturing an evaporation mask according to (13), wherein the plurality of areas are divided along a first direction of a mask stretching direction and are divided along a second direction orthogonal to the first direction .

(15)

(14), wherein the representative correction value is set using an average of the opening position shift amounts in each of the plurality of areas.

(16)

Forming a plurality of said second masks,

Wherein the representative correction value is set using an average of shift amounts of opening positions of the corresponding areas between a plurality of the second masks.

(17)

The method of manufacturing an evaporation mask as set forth in any one of (2) to (16), wherein the first and second masks are formed by electroforming.

(18)

The mask used for forming the second mask may be formed by a vapor deposition method described in any one of (2) to (16), wherein the mask used for forming the second mask is made of a less expensive material than the mask used for forming the first mask. A method of manufacturing a mask.

(19)

When forming the first mask, a glass mask is used,

The method for manufacturing an evaporation mask according to (18), wherein a film mask is used to form the second mask.

(20)

The method of manufacturing an evaporation mask according to any one of (2) to (19), wherein the first and second masks are formed by etching.

(21)

When forming the first mask,

Preparing a second mask having a plurality of second openings,

The opening position shift amount is measured while the second mask is laid on the frame,

A correction value is set on the basis of the measured opening position shift amount,

The method for manufacturing an evaporation mask as set forth in (1), wherein, when designing the position of the first opening, correction is performed using the correction value.

(22)

Forming a vapor deposition mask,

Patterning the material layer using the deposition mask,

When forming the vapor deposition mask,

Forming a first mask having a plurality of first openings as through holes of the evaporation material,

The first mask is laid on the frame, and further,

Wherein the first mask is corrected in consideration of an opening position shift amount when the frame is extended when the first opening is designed.

(23)

(22), wherein the material layer is an organic electroluminescent layer.

The present application claims priority based on Japanese Patent Application No. 2014-69045, filed on March 28, 2014, by the Japanese Patent Office, which is incorporated herein by reference in its entirety.

It will be understood by those skilled in the art that various modifications, combinations, subcombinations, and modifications may be made in response to design requirements and other factors, which are intended to be within the scope of the appended claims or their equivalents.

Claims (23)

Forming a first mask having a plurality of first openings as through holes of the evaporation material,
The first mask is stretched in a frame,
Wherein the first mask is formed with a correction for adding a shift amount of the opening position to a length of the frame when the first opening is designed. The method according to claim 1,
When forming the first mask,
Preparing a second mask having a plurality of second openings,
The aperture position shift amount is calculated using the second mask,
A correction value is set based on the calculated opening position shift amount,
Wherein the correction using the correction value is performed when designing the position of the first opening. 3. The method of claim 2,
And the opening position shift amount is calculated on the basis of the distribution of the thickness of the second mask. The method of claim 3,
Wherein the opening position shift amount is calculated by using a one-dimensional model in which only the first direction of the mask pulling direction at the time of frame assembly is taken into account. 5. The method of claim 4,
Wherein the first and second masks have a rectangular shape,
Wherein the first direction is a rectangular long-side direction. 5. The method of claim 4,
Wherein the opening position shift amount of both ends of the second mask in the first direction is set to 0 (zero). 3. The method of claim 2,
When forming the first mask,
The second mask is formed a plurality of times while adjusting the process conditions until the design error becomes a predetermined threshold value or less,
Wherein a process condition in which the design error is less than or equal to the threshold value is set as a process condition of the first mask. The method of claim 3,
Measuring a width of the beam portion between the second openings in the second direction orthogonal to the first direction along the second direction,
And the opening position shift amount is calculated on the basis of the measured thickness and the width. 9. The method of claim 8,
Measuring a length of the beam portion along the first direction,
And the opening position shift amount is calculated based on the measured thickness, the width, and the length. The method according to claim 1,
Wherein correction is carried out in each of the first and second directions perpendicular to each other in the mask stretching direction in consideration of the opening position shift amount when designing the position of the first opening. The method according to claim 1,
Characterized in that, when designing the position of the first opening, correction is made in the first and second directions orthogonal to each other in the mask stretching direction in consideration of the opening position shift amount . 3. The method of claim 2,
Wherein the amount of shift of the position of the selective second opening in the entire aperture of the second mask is used when setting the correction value. 3. The method of claim 2,
The second mask is divided into a plurality of areas each having a similar tendency of the opening position shift amount,
Wherein the correction using the representative correction value set for each of the areas is performed when designing the position of the first opening. 14. The method of claim 13,
Wherein each of the plurality of areas is extended along a first direction of the mask stretching direction and is divided along a second direction orthogonal to the first direction. 15. The method of claim 14,
Wherein the representative correction value is set using an average of the opening position shift amounts in each of the plurality of areas. 15. The method of claim 14,
Forming a plurality of said second masks,
Wherein the representative correction value is set using an average of shift amounts of opening positions of the corresponding areas between a plurality of the second masks. 3. The method of claim 2,
Wherein the first mask and the second mask are formed by electroforming. 3. The method of claim 2,
Wherein the mask used when forming the second mask is made of a material having a lower cost than a mask used when forming the first mask. 19. The method of claim 18,
When forming the first mask, a glass mask is used,
Wherein a film mask is used for forming the second mask. 3. The method of claim 2,
Wherein the first and second masks are formed by etching. The method according to claim 1,
When forming the first mask,
Preparing a second mask having a plurality of second openings,
The opening position shift amount is measured while the second mask is laid on the frame,
A correction value is set on the basis of the measured opening position shift amount,
Wherein the correction using the correction value is performed when designing the position of the first opening. Forming a vapor deposition mask,
Patterning the material layer using the deposition mask,
When forming the vapor deposition mask,
Forming a first mask having a plurality of first openings as through holes of the evaporation material,
The first mask is laid on the frame, and further,
Characterized in that the first mask is subjected to correction in consideration of an opening position shift amount at the time of designing the position of the first opening in the frame. 23. The method of claim 22,
Wherein the material layer is an organic electroluminescent layer.

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