KR20160132548A - An Apparatus for Grinding a Lead Frame and a Method for Grinding a Lead Frame - Google Patents

An Apparatus for Grinding a Lead Frame and a Method for Grinding a Lead Frame Download PDF

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Publication number
KR20160132548A
KR20160132548A KR1020150065190A KR20150065190A KR20160132548A KR 20160132548 A KR20160132548 A KR 20160132548A KR 1020150065190 A KR1020150065190 A KR 1020150065190A KR 20150065190 A KR20150065190 A KR 20150065190A KR 20160132548 A KR20160132548 A KR 20160132548A
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South Korea
Prior art keywords
lead frame
roller
coating
grinding
belt
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Application number
KR1020150065190A
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Korean (ko)
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KR101696875B1 (en
Inventor
김종식
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김종식
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Priority to KR1020150065190A priority Critical patent/KR101696875B1/en
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Application granted granted Critical
Publication of KR101696875B1 publication Critical patent/KR101696875B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

Abstract

The present invention relates to a lead frame grinding apparatus and a lead frame grinding method therefor, and more particularly, to a lead frame grinding apparatus and a lead frame grinding method for grinding an epoxy molding compound (EMC) coated on a lead frame of a semiconductor to form a uniform coated surface. To a grinding apparatus and a lead frame grinding method therefor. The lead frame grinding apparatus includes a transfer unit (18) for transferring a lead frame having a coating surface; A balance coating roller (11) disposed below the transfer unit (18) so as to be able to contact the surface of the lead frame; And a grinding coating belt 123 disposed above the transfer unit 18 and arranged to be movable up and down. The balance coating roller 11 and the grinding coating belt 123 are operated by different drive units And is rotated by the operation roller 13 and the back-up roller 162 which are driven by the driving force.

Description

[0001] The present invention relates to a lead frame grinding apparatus and a lead frame grinding method using the lead frame grinding apparatus,

The present invention relates to a lead frame grinding apparatus and a lead frame grinding method therefor, and more particularly, to a lead frame grinding apparatus and a lead frame grinding method for grinding an epoxy molding compound (EMC) coated on a lead frame of a semiconductor to form a uniform coated surface. To a grinding apparatus and a lead frame grinding method therefor.

The lead frame functions as a conductor for connecting the semiconductor chip to an external circuit, and simultaneously functions as a frame for fixing the semiconductor package to the electronic circuit board. The semiconductor chip disposed in the lead frame or the lead frame may be coated with an epoxy molding compound (EMC) to protect it from the external environment. During the coating process, the lead frame may be partially overcoated. This overcoated portion reduces the level of surface uniformity of the lead frame surface and can lead to defects in the semiconductor package. Therefore, the overcoated portion needs to be polished.

Prior art related to a semiconductor lead frame is disclosed in Patent Publication No. 1999-0002969. The prior art includes a first step of exposing a coin to be electrolytically polished using a mask; A second step of applying a predetermined potential between the coining portion and the machining electrode; A third step of spraying an electrolytic polishing solution on the exposed coin part to perform electrolytic polishing; And a fourth step of separating the mask from the lead frame after electrolytic polishing is performed on the coining portion.

Japanese Patent Application Laid-Open No. 10-2006-0112307 discloses a method of manufacturing a semiconductor device, comprising: a patterning step of integrally forming a plurality of leads on a prepared base material and a tip connecting portion interconnecting tips of the leads; And a step of pressing the lead frame by using a mold having a predetermined shape, wherein a cutting process for cutting the leading end connecting portion and a setting process for forming a step up and down with respect to a lead frame portion are performed simultaneously A method of manufacturing a lead frame including a lead frame punching molding process to be performed is disclosed.

The technique related to the lead frame disclosed in the prior art does not disclose a method of making the surface of the lead frame uniform, or has a problem that a complicated process condition is required. The thickness of the lead frame may be, for example, 100 to 300 占 퐉, and the EMC coating thickness may be 60 to 70 占 퐉. A grinding method which is highly reliable and is not complicated in the process is required to form the coating thickness surface of the lead frame having such a thickness level uniformly. The prior art does not disclose a technique or method suitable for such conditions.

The present invention has been made to solve the problems of the prior art and has the following purpose.

Prior Art 1: Patent Publication No. 10-1999-0002969 (published by Samsung Aviation Industrial Co., Ltd., Jan. 15, 1999) Electrode Polishing Method for Lead Frame and Lead Frame Prior Art 2: Patent Publication No. 10-2006-0112307 (Samsung Techwin Co., Ltd., published on October 31, 2006) Method of manufacturing lead frame and press working device for lead frame applied thereto

An object of the present invention is to provide a lead frame grinding apparatus and a lead frame grinding method by which a uniform coated surface of a lead frame can be formed by contact between a belt surface and a roller surface.

According to a preferred embodiment of the present invention, a lead frame grinding apparatus comprises a transfer unit in which a lead frame having a coating surface is transferred; A balance coating roller disposed under the transfer unit so as to be able to contact the surface of the lead frame; And a grinding coating belt disposed above the transfer unit and arranged so as to be movable up and down. The balance coating roller and the grinding coating belt are rotated by the operation roller and the backup roller which are operated by different drive units.

According to another preferred embodiment of the present invention, a DLC (Diamond Like Carbon) coating is applied along the circumferential surface of the balance coating roller and a diamond coating is applied along the surface of the grinding coating belt.

According to another preferred embodiment of the present invention, a tension adjusting roller for adjusting the tension of the grinding coating belt is further included.

According to another preferred embodiment of the present invention, a method of grinding a lead frame includes the steps of: determining a pressure and a contact gap for grinding the coated surface of the lead frame; Moving the grinding coating belt positioned above the lead frame according to the pressure and the contact interval to adjust the distance between the transfer rollers disposed below the lead frame; Moving the lead frame between the grinding coating belt and the transfer roller by operating the transfer roller; And performing a grinding process on the coating surface of the lead frame while rotating the coating belt in a direction opposite to the rotation direction of the transport roller.

The lead frame grinding apparatus according to the present invention is highly reliable by mechanical polishing and processing while allowing overcoating of the coating surface of the lead frame to be eliminated. In addition, it is possible to control precision while making continuous operation possible. In addition, the grinding apparatus according to the present invention is easy to control the coating thickness while simplifying the polishing process.

Figs. 1A and 1B are a front view and a plan view, respectively, of an embodiment of a grinding apparatus according to the present invention.
FIG. 2A illustrates an example of a process of belt grinding in a grinding apparatus according to the present invention.
FIG. 2B illustrates an example of the progress of roller grinding in the grinding apparatus according to the present invention.
3A and 3B illustrate an embodiment of a grinding method of a lead frame coated surface according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the accompanying drawings, but the present invention is not limited thereto. In the following description, components having the same reference numerals in different drawings have similar functions, so that they will not be described repeatedly unless necessary for an understanding of the invention, and the known components will be briefly described or omitted. However, It should not be understood as being excluded from the embodiment of Fig.

Figs. 1A and 1B are a front view and a plan view, respectively, of an embodiment of a grinding apparatus according to the present invention.

1A and 1B, a grinding apparatus according to the present invention includes a transfer unit 18 to which a lead frame having a coating surface is transferred; A balance coating roller (11) disposed below the transfer unit (18) so as to be able to contact the surface of the lead frame; And a grinding coating belt 123 disposed above the transfer unit 18 and arranged to be movable up and down. The balance coating roller 11 and the grinding coating belt 123 are operated by different drive units And is rotated by the operation roller 13 and the backup roller 162 which are driven by the driving force.

The grinding apparatus according to the present invention has a function of adjusting the thickness of the coated surface of the lead frame. The adjustment of the thickness includes adjusting the average thickness of the coated surface and adjusting the level of surface uniformity such as average roughness. The surface of the lead frame may be a protective coating, for example, of a synthetic resin material such as an epoxy molding compound (EMC). A coating surface having various protective coatings or other purposes can be formed on the surface of the lead frame, and the grinding apparatus according to the present invention can be applied to the thickness control of various coating surfaces formed on the lead frame surface.

The grinding apparatus according to the present invention may be arranged in a suitable frame and may have various control units or display units for operation. The grinding apparatus can be operated according to a predetermined condition, for example, by a program, and the operating state can be displayed on the display unit. Further, the operating conditions are input through the input unit, whereby the grinding apparatus can be operated. The grinding apparatus according to the present invention is not limited by the operation method or the installation of additional apparatus for operation.

The lead frame for the semiconductor package can be moved along the conveying unit 18 and the conveying unit 18 can be moved in the direction in which the conveying unit 18 is conveyed, As shown in Fig. The transfer unit 18 may be, for example, a Nip Roller or a pinch roller including roller units R1 and R2, but is not limited to any of the cylinders known in the art Shaped roller. The roller units R1 and R2 may be composed of a first conveying roller R1 and a second conveying roller R2 arranged to face each other and the lead frame may be conveyed through the roller units R1 and R2 have. The interval and the pressure of the roller units R1 and R2 facing each other can be adjusted and the roller units R1 and R2 can be operated by a drive unit 16 such as a motor. The first conveying roller R1 and the second conveying roller R2 may have a structure in which a plurality of rollers are continuously arranged, and the lead frame may include a first conveying roller R1 and a second conveying roller R2, Respectively.

The balance coating roller 11 may be a rotating roller having a cylindrical shape and a rotational axis disposed along the longitudinal direction, and may be coated with a material such as diamond like carbon (DLC) along the peripheral surface. DLC coatings are amorphous, carbon-based materials and have high hardness, high corrosion resistance and abrasion resistance. The balance coating roller 11 can be coated with a material having a high surface hardness and a low coefficient of friction and chemical stability. In addition, the substrate may be coated with an amorphous material to have a surface roughness (Ra) of 0.8 nm or less, for example, a mirror coating. The coefficient of friction of the material coated on the surface of the balance coating roller 11 may have the same or higher coefficient of friction than that of the coating material having a low coefficient of friction and becoming the surface coating of the grinding coating belt 123. Therefore, the coating surface of the lead frame can be reliably polished by the grinding coating belt 123 stably. The surface of the balance coating roller 11 needs to be coated with a material which stably supports the lead frame while being deformed by the pressure applied to the lead frame at the same time. The DLC coating is illustrative and the surface of the balance coating roller 11 can be coated with any material having similar physical properties and the present invention is not limited to the embodiments shown.

The surface of the lead frame can be polished or ground by the grinding coating belt 123. The grinding coating belt 123 can be arranged so as to be movable up and down, and can be moved downward and brought into contact with the balance coating roller 11. [ Concretely, when the lead frame is conveyed to the balanced coating roller 11, at the same time, the grinding coating belt 123 is moved downward and moved to a position adjacent to the surface of the balance coating roller 11 so as to be in contact with the surface of the lead frame . The coated surface of the lead frame can be polished by the grinding coating belt 123 by the grinding coating belt 123 while the lead frame is supported by the balance roller unit 11. [

The grinding coating belt 123 can be rotated by the first coating roller 12 and the second coating roller 121 and the rotation of the second coating roller 121 by the operation roller 13 can be controlled .

The first coating roller 12, the second coating roller 121, the grinding coating belt 123 and the operating roller 13 are supported by a plate-shaped moving unit 19 which is adjustable in height by a height adjusting unit 152, As shown in FIG. The mobile unit 19 may be moved up and down by a device such as a motor or by the operation of the height adjusting unit 152 in a screwed manner or by a method in which they are combined. And can be fixed at a position determined by the clamp unit 151 when the mobile unit 19 is positioned at a predetermined height.

Shaped arrangement unit 15 extending in the horizontal direction of the mobile unit 19 and extending perpendicularly to the mobile unit 19 can be coupled to the mobile unit 19. [ The first coating roller 12 and the second coating roller 121 may be disposed on the arrangement unit 15 up and down. The grinding coating belt 123 may be wound on the first coating roller 12 and the second coating roller 121 and rotated. And the grinding coating belt 123 can be rotated in contact with the coating surface of the lead frame.

The surface where the grinding coating belt 123 contacts the coating surface of the lead frame can be coated with an abrasive material. The abrasive material may be, for example, diamond and may be coated to a uniform thickness on the surface of the grinding coating belt 123. As described above, the friction coefficient of the abrasive material may be smaller than the coefficient of friction of the coating material of the balance coating roller 11. [ Therefore, the lead frame can be ground by the grinding coating belt 123 while being stably held on the circumferential surface of the balance coating roller 11. The rotating direction of the balance coating roller 11 and the rotating direction of the grinding coating belt 123 may be opposite to each other. For example, the balance coating roller 11 is rotated counterclockwise corresponding to the discharge direction of the lead frame, and the grinding coating belt 123 can be rotated clockwise. And the coated side of the grinding coating belt 123 can be polished with the EMC coated side of the lead frame.

The first coating roller 12 and the second coating roller 121 are coupled to the positioning unit 15 and the grinding coating belt 123 is rotated about the rotation of the first coating roller 12 and the second coating roller 121 . And the second coating roller 121 can be rotated by the operating roller 13 disposed in the moving unit 19. [ Specifically, the first coating roller 12a, the second coating roller 121a, and the actuation roller 13a, which are separated from the balance coating roller 11, can be moved downward as the mobile unit 19 moves . And the grinding coating belt 123 disposed in a position not to be in contact with the balance coating roller 11 can be moved downward. When the position of the movable unit 19 is determined, the position is fixed by the clamp unit 151, and the grinding coating belt 123 is placed so as to be in contact with the balance coating roller 11. [ The second coating roller 121 connected to the actuating roller 13 by the power transmitting means is rotated by the drive unit 13 such as a motor so that the grinding coating belt 123 Is rotated and the first coating roller 12 is rotated.

The grinding coating belt 123 may be rotated to apply pressure to the surface of the lead frame and the applied pressure may vary depending on the tension of the grinding coating belt 123. [ And a tension adjusting unit 124 for adjusting the tension of the grinding coating belt 123 may be disposed between the first coating roller 12 and the second coating roller 121. [ The tension adjustment unit 124 may have a roller structure that is rotated by the grinding coating belt 123. The grinding coating belt 123 rotates in an endless belt structure between the first coating roller 12 and the second coating roller 121 by applying a pressure in a direction perpendicular to the belt moving direction. It is possible to adjust the tension of the belt 123. Specifically, a tension adjusting unit 124 may be disposed on the rotating path of the grinding coating belt 123 so that the grinding coating belt 123 is rotated via the tension adjusting unit 124. The tension of the grinding coating belt 123 can be adjusted by moving the tension adjusting unit 124 in a direction perpendicular to the moving direction of the grinding coating belt 123.

Various tension control structures can be applied to the grinding apparatus according to the present invention and the present invention is not limited to the embodiments shown.

The lead frame on which the polishing of the coated surface is completed by the grinding coating belt 123 can be discharged by the transfer unit 18. The movable unit 19 may be moved upward or the operation of the actuating roller 13 may be interrupted for transferring the lead frame. And the lead frame can be discharged along the conveying unit 18 by the rotation of the balance roller unit 11. [

1, the balancing roller unit 11 is connected to the backup roller 162 and rotated, and the backup roller 162 can be rotated by the driving unit 16. As shown in Fig. The driving unit 16 may be a driving device such as a motor, a rotating unit is coupled to the rotating shaft of the motor, and an intermediate connecting unit may be provided if necessary. The rotational force of the driving unit 16 can be transmitted to the rotating shaft, the intermediate connecting unit, and the backup roller 162 by the power transmitting means such as a belt. And the balance roller unit 11 can be rotated by the backup roller 162. [ The conveying unit 18 can be operated by the backup roller 162 and the lead frame can be fed through the inlet IN and conveyed to the balance coating roller 11. [ Thereafter, the lead frame is adjusted in thickness by the grinding coating belt 123 and can be discharged to the outlet OUT by operation of the back-up roller 162 and thus the transfer unit 18.

Various driving apparatuses can be applied to the grinding apparatus according to the present invention, and the present invention is not limited to the illustrated embodiments.

The operation structure of the grinding coating belt 123 and the balance coating roller 11 will be described below.

FIG. 2A illustrates an example of a process of belt grinding in a grinding apparatus according to the present invention.

Referring to FIG. 2A, the first coating roller 12 and the actuating roller 13 may be disposed vertically with respect to the second coating roller 121. Specifically, one coating roller 12 may be disposed below the second coating roller 121, and the operation roller 13 may be disposed on a side surface of the second coating roller 121. And the first coating roller 12, the second coating roller 121 and the actuation roller 13 can be fixedly moved together with the moving unit 18 and the placement unit 15 described above.

The grinding coating belt 123 can be rotated by the first coating roller 12 and the second coating roller 121. The grinding coating belt 123 can be tensioned by an incentive control unit 124 disposed between the first coating roller 12 and the second coating roller 121. The actuation roller 13 and the second coating roller 121 may be connected to each other and rotated by a power transmission unit 132 such as a belt and the actuation roller 13 may be rotated by an appropriate drive unit. The second coating roller 121 may be provided with a rotation shaft 131 which can be connected to the operation roller 121 and the operation roller 13 rotates the rotation shaft 131 by the power transmission unit 132 And thus the second coating roller 121 can be rotated. And the grinding coating belt 123 is rotated in accordance with the rotation of the second coating roller 121 to rotate the first coating roller 12 and the tension adjusting unit 124. And the coating surface of the lead frame can be polished by the grinding coating belt 123. The grinding coating belt 123 can be rotated while maintaining a predetermined gap with the balance roller unit, and the predetermined interval can be adjusted by the movement of the mobile unit 19. [

FIG. 2B illustrates an example of the progress of roller grinding in the grinding apparatus according to the present invention.

2B, the balance coating unit 11 can be disposed at a certain distance from the first coating roller 12, and the lead frame fed through the inlet IN and conveyed by the conveying unit 18 And can be moved to the balance coating unit 11. The transfer unit 18 may be composed of a first transfer roller R1 and a second transfer roller R2 and the lead frame may be transferred between the first transfer roller R1 and the second transfer roller R2. The first feed roller R1 may be connected to the backup roller 162 and operated. The first conveying roller R1 and the second conveying roller R2 may be composed of a plurality of rollers connected to each other and the plurality of rollers may be connected to each one of the shafts or plate units and moved up and down at the same time . Accordingly, the interval between the first conveying roller R1 and the second conveying roller R2 can be adjusted. As described above, the first conveying roller R1 or the second conveying roller R2 may be a NIP Roller or a Pinch Roller, and the coated surface of the lead frame may be conveyed The flatness level can be adjusted by the pressure by the unit 18. Feeding of the lead frame via the inlet IN, feeding of the lead frame and discharging of the lead frame through the outlet OUT can be performed by the first feeding roller R1 and the second feeding roller R2.

When the drive unit 16 is operated, the rotation shaft 161 is rotated accordingly and the intermediate connection unit 163 connected by the power transmission unit 165 such as a belt can be rotated. Then, the backup roller 162 is rotated by the intermediate connecting unit 163, so that the balance roller unit 11 can be rotated. The first conveying roller R1 or the second conveying roller R2 may be connected to the backup roller 162 and the intermediate connecting unit 163 and may be rotated.

Various transfer structures can be applied to the grinding apparatus according to the present invention and the present invention is not limited to the embodiments shown.

Hereinafter, a grinding method of a lead frame by a grinding apparatus according to the present invention will be described.

3A and 3B illustrate an embodiment of a grinding method of a lead frame coated surface according to the present invention.

FIG. 3A shows a side view of an embodiment of a grinding apparatus according to the present invention, and FIG. 3B shows an embodiment of a process in which a coated surface of a lead frame is ground by the grinding apparatus shown in FIG.

As shown in FIG. 3B, a grinding method of a lead frame according to the present invention includes: a step (P31) of determining a pressure and a contact gap for grinding a coating surface of a lead frame; (P32) moving the grinding coating belt positioned above the lead frame according to the pressure and the contact interval to adjust the distance between the conveying rollers disposed below the lead frame; Moving the lead frame between the grinding coating belt and the transfer roller by operating the transfer roller (P33); And a step (P34) of grinding the coating surface of the lead frame while rotating the coating belt in a direction opposite to the rotation direction of the transport roller.

The leadframe can be, for example, an EMC coating, and can be partially overcoated. The grinding apparatus can improve the surface characteristics of the coated surface of the lead frame while removing such overcoated portions. The pressure and contact interval for grinding mean the pressure on the coating surface of the lead frame of the grinding belt, and the contact interval means the separation distance between the surface of the grinding belt and the balance coating unit 11. [ When the pressure and the contact interval are determined, the movable unit 19 can be moved downward along the vertical axis unit 31 according to the operation of the height adjustment unit 152 accordingly. When the actuating roller 13a and the first coating roller 12a are moved downward and the movable unit 19 is lowered to a predetermined position, Position. Whereby the distance between the grinding coating belt and the balance coating roller 11 is adjusted (P32).

The lead frame can be fed through the inlet and can be conveyed to the balance coating roller 11 by the conveying unit 18 (P33). And the coated surface of the lead frame can be polished by the grinding coating belt (P34). The grinding coating belt and the balancing roller unit 11 can be rotated in opposite directions and the lead frame can be polished while passing through the balance roller unit 11. When the polishing is completed, To the outlet (OUT). And the lead frame can be discharged through the outlet OUT.

The coated surface of the lead frame can be polished by various methods to improve the surface characteristics and the present invention is not limited to the embodiments shown.

The lead frame grinding apparatus according to the present invention is highly reliable by mechanical polishing and processing while allowing overcoating of the coating surface of the lead frame to be eliminated. In addition, it is possible to control precision while making continuous operation possible. In addition, the grinding apparatus according to the present invention is easy to control the coating thickness while simplifying the polishing process.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention . The invention is not limited by these variations and modifications, but is limited only by the claims appended hereto.

11: balance coating roller 12, 12a: first coating roller
13, 13a: Actuation roller 15:
16: drive unit 18:
19: moving unit 121, 121a: second coating roller
123: grinding coating belt 124: tension adjusting unit
131: rotation shaft 132: power transmission unit
151: clamp unit 152: height adjustment unit
161: rotating shaft 162: backup roller
163: intermediate connection unit 165: power transmission unit
M: Motor R1, R2: Roller unit

Claims (4)

A transfer unit (18) for transferring a lead frame having a coating surface;
A balance coating roller (11) disposed below the transfer unit (18) so as to be able to contact the surface of the lead frame; And
And a grinding coating belt (123) disposed above the transfer unit (18) and arranged to be movable up and down,
Wherein the balance coating roller (11) and the grinding coating belt (123) are rotated by an actuating roller (13) and backup roller (162) actuated by different drive units. The leadframe grinding apparatus according to claim 1, wherein the balance coating roller (11) is coated with a diamond like carbon (DLC) coating along the circumferential surface thereof and is diamond coated along the surface of the grinding coating belt (123). 2. The lead frame grinding apparatus according to claim 1, further comprising a tension adjusting roller (124) for adjusting the tension of the grinding coating belt (123). Determining pressure and contact spacing for grinding of the coated surface of the lead frame;
Moving the grinding coating belt positioned above the lead frame according to the pressure and the contact interval to adjust the distance between the transfer rollers disposed under the lead frame;
Moving the lead frame between the grinding coating belt and the transfer roller by operating the transfer roller; And
And rotating the coating belt in a direction opposite to the rotation direction of the conveying roller while advancing a grinding process on the coating surface of the lead frame.
KR1020150065190A 2015-05-11 2015-05-11 An Apparatus for Grinding a Lead Frame and a Method for Grinding a Lead Frame KR101696875B1 (en)

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KR1020150065190A KR101696875B1 (en) 2015-05-11 2015-05-11 An Apparatus for Grinding a Lead Frame and a Method for Grinding a Lead Frame

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000052113A (en) 1999-01-29 2000-08-16 윤종용 Test signal generating circuit for semiconductor device
KR20060112307A (en) 2005-04-25 2006-10-31 삼성테크윈 주식회사 Method for manufacturing a lead frame and press system for the same
JP2012020390A (en) * 2010-07-16 2012-02-02 Yoshikawa Kogyo Co Ltd Platy member polishing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000052113A (en) 1999-01-29 2000-08-16 윤종용 Test signal generating circuit for semiconductor device
KR20060112307A (en) 2005-04-25 2006-10-31 삼성테크윈 주식회사 Method for manufacturing a lead frame and press system for the same
JP2012020390A (en) * 2010-07-16 2012-02-02 Yoshikawa Kogyo Co Ltd Platy member polishing device

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