KR20140134564A - Apparatus for grinding surface of substrate - Google Patents

Apparatus for grinding surface of substrate Download PDF

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Publication number
KR20140134564A
KR20140134564A KR1020130054642A KR20130054642A KR20140134564A KR 20140134564 A KR20140134564 A KR 20140134564A KR 1020130054642 A KR1020130054642 A KR 1020130054642A KR 20130054642 A KR20130054642 A KR 20130054642A KR 20140134564 A KR20140134564 A KR 20140134564A
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KR
South Korea
Prior art keywords
substrate
polishing
polishing apparatus
roller
present
Prior art date
Application number
KR1020130054642A
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Korean (ko)
Inventor
유상수
김기화
구성근
구종회
Original Assignee
해성디에스 주식회사
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Priority to KR1020130054642A priority Critical patent/KR20140134564A/en
Publication of KR20140134564A publication Critical patent/KR20140134564A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like

Abstract

According to an aspect of the present invention, there is provided a polishing apparatus comprising: a first polishing apparatus for polishing a first surface of a substrate; a substrate support member disposed to face the first polishing apparatus with the substrate interposed therebetween; A second polishing apparatus for polishing the second surface of the substrate, and a first supporting roller disposed so as to face the second polishing apparatus with the substrate interposed therebetween do.

Description

[0001] Apparatus for grinding surface of substrate [0002]

The present invention relates to an apparatus for polishing a surface of a substrate.

With the development of the electronic industry, there is an increasing demand for miniaturization and multifunctionalization of electronic components, and substrates on which electronic components are mounted are formed in various structures and shapes.

The substrate is manufactured to have various structures such as a circuit pattern, an insulating layer, etc. In some cases, a process of polishing a surface of a substrate to remove unnecessary layers or materials is required in order to manufacture the substrate.

Open Patent Publication No. 2011-0053753 discloses a polishing apparatus for a substrate having a chemical polishing section filled with an etching solution and a mechanical polishing section including a brush.

According to an aspect of the present invention, there is provided a device for polishing a surface of a substrate.

According to an aspect of the present invention, there is provided a polishing apparatus comprising: a first polishing apparatus for polishing a first surface of a substrate; a substrate supporting member disposed to face the first polishing apparatus with the substrate interposed therebetween; A second polishing apparatus for polishing the second surface of the substrate; and a first supporting roller disposed to face the second polishing apparatus with the substrate interposed therebetween, A surface polishing apparatus is provided.

Here, the first polishing apparatus may include two polishing rollers.

Here, a resin layer is formed on the first surface of the substrate, and the first polishing apparatus can remove at least a part of the resin layer.

Here, the conveying device may include a conveying belt that contacts one surface of the substrate supporting member, a driving unit that moves the conveying belt, and a support table that supports the conveying belt.

Here, the transfer device may include a second support roller disposed to face the first polishing apparatus with the substrate and the substrate support member interposed therebetween.

Here, the first polishing apparatus and the second polishing apparatus may be arranged such that the substrate passes through the first polishing apparatus and the second polishing apparatus.

In the substrate surface polishing apparatus according to one aspect of the present invention, since the substrate holding member is disposed between the transfer device and the substrate, damage to the transfer device by the first polishing device can be prevented.

According to an aspect of the present invention, there is provided a substrate surface polishing apparatus comprising: a polishing apparatus for polishing a substrate, the apparatus comprising: a polishing apparatus for polishing a surface of a substrate to be polished through a first polishing apparatus for polishing a first surface of the substrate; It is possible to prevent warping of the substrate to be polished.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing steps of polishing a surface of a substrate using a substrate surface polishing apparatus according to an embodiment of the present invention; FIG.
2 is an enlarged view of a substrate surface polishing apparatus according to an embodiment of the present invention.
3 is a schematic cross-sectional view showing a state of a substrate at a point I in Fig.
4 is a schematic cross-sectional view showing a state of a substrate at a point II in Fig.
5 is a schematic cross-sectional view showing a state of a substrate at a point III in Fig.
6 is a schematic cross-sectional view showing a state of a substrate at a point IV of Fig.
FIG. 7 is a schematic view showing step-by-step steps of polishing a surface of a substrate using a substrate surface polishing apparatus according to a modification of an embodiment of the present invention.
8 is an enlarged view of a substrate surface polishing apparatus according to a modification of the embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In the present specification and drawings, the same reference numerals are used for constituent elements having substantially the same configuration, and redundant description is omitted. In the accompanying drawings, there may be exaggerated portions for the sake of explanation.

FIG. 1 is a schematic view showing steps of polishing a surface of a substrate by using a substrate surface polishing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic view of a substrate surface polishing apparatus according to an embodiment of the present invention Fig.

1 and 2, the substrate surface polishing apparatus 100 according to an embodiment of the present invention polishes the surface of the substrate 200 while transferring the substrate 200 by a roll-to- And corresponds to one of the devices for performing the process of manufacturing the substrate for a lead frame.

The substrate surface polishing apparatus 100 according to the present embodiment is an apparatus for polishing the surface of the substrate 200 while transferring the substrate 200 by a roll-to-roll process, but the present invention is not limited thereto. That is, when the substrate has a shape of a panel, the substrate surface polishing apparatus according to the present invention may polish the surface of the substrate while transferring the substrate using a conveyor transfer method or the like.

The substrate surface polishing apparatus 100 receives a substrate 200 from a resin layer forming unit 300, which is an apparatus for performing a previous process, and polishes the surface of the substrate 200.

4 shows a substrate 200 having a resin layer forming part 300. The substrate 200 includes a raw material 210, a resin layer 220 formed on the top surface of the raw material 210, And an oxide layer 230 formed on the lower surface of the raw material 210. Details related thereto will be described later.

The substrate surface polishing apparatus 100 includes a first polishing apparatus 110, a substrate supporting member 120, a transfer apparatus 130, a second polishing apparatus 140, and a first supporting roller 150.

The first polishing apparatus 110 includes a first polishing roller 111a, a first polishing roller driving unit 111b, a second polishing roller 112a and a second polishing roller driving unit 112b.

The first polishing apparatus 110 performs a function of polishing a first surface S1 of the substrate 200 (see FIG. 2), wherein the first surface S1 of the substrate 200 is a surface of the substrate 200 The first polishing roller 111a of the first polishing apparatus 110 can contact the first polishing roller 111a. That is, the first surface S1 of the substrate 200 becomes the surface of the resin layer 220 at the beginning of the polishing process, and the resin layer 220 is gradually polished and removed, The exposed surface of the substrate.

The first polishing roller 111a and the second polishing roller 112a have polishing layers 111a_1 and 112a_1 in a cylindrical shape, respectively. Fine abrasive particles adhere to the abrasive layers 111a_1 and 112a_1, and a polishing action occurs when the abrasive particles come into contact with the surface of the substrate 200. [ Here, various particles such as diamond particles, ceramic particles, and synthetic resin particles can be applied as the abrasive particles.

The first polishing roller driving unit 111b rotates the first polishing roller 111a and adjusts the displacement of the first polishing roller 111a in the Z direction. For this purpose, the first polishing roller driving unit 111b, The first polishing roller 111a is provided with a motor (not shown) and a gear (not shown) to directly generate power or to receive rotation of the first polishing roller 111a, Configuration.

The second polishing roller driving unit 112b rotates the second polishing roller 112a and adjusts displacement of the second polishing roller 112a in the Z direction. To this end, the second polishing roller driving unit 112b rotates the second polishing roller 112a, The second polishing roller 112a is provided with a motor (not shown) and a gear (not shown) to directly generate power, or to receive rotation of the second polishing roller 112a, Configuration.

According to the present embodiment, the first polishing apparatus 110 is provided with two polishing rollers including a first polishing roller 111a and a second polishing roller 112a, but the present invention is not limited thereto. That is, there is no particular limitation on the number of polishing rollers provided in the first polishing apparatus according to the present invention. For example, the number of polishing rollers included in the first polishing apparatus may be one, three, four, or the like.

Meanwhile, the substrate support member 120 is disposed to face the first polishing apparatus 110 with the substrate 200 therebetween. The lower surface of the substrate 200 is brought into contact with the upper surface of the substrate supporting member 120 and the upper surface of the conveying belt 131 of the conveying device 130 is brought into contact with the lower surface of the substrate supporting member 120.

The substrate supporting member 120 has a ductility and is formed to have a predetermined thickness t1. Since the distance between the first polishing roller 111a and the second polishing roller 112a and the upper surface of the conveyance belt 131 becomes larger as the thickness of the substrate supporting member 120 becomes larger, And the second polishing roller 112a come into contact with the upper surface of the conveyance belt 131 is reduced. However, if the thickness of the substrate supporting member 120 is too large, flexibility is reduced, and it is difficult to handle and the feeding drive becomes difficult, so it is desirable to take an appropriate thickness. Therefore, the designer appropriately determines the thickness of the substrate supporting member 120 in consideration of the Z displacement fluctuation of the first polishing roller 111a and the second polishing roller 112a, the Z displacement fluctuation of the conveyance belt 131, and the like. do.

The substrate support member 120 may be made of various materials such as synthetic resin and thin metal thin plate. The substrate support member 120 is released from the supply roll SR, supports the substrate 200, Roll (RR).

The substrate support member 120 according to the present embodiment is configured to be released from the supply roll SR and finally recovered at the recovery roll RR, but the present invention is not limited thereto. That is, the substrate support member 120 according to the present invention may be configured to be configured in the form of a conveyor belt so as to rotate infinitely repeatedly.

The conveying device 130 is disposed below the substrate supporting member 120 and includes a conveying belt 131, a driving means 132, a support 133, and rollers R.

The conveying belt 131 is made of a rubber material such as natural rubber or synthetic rubber and contacts the lower surface of the substrate supporting member 120 and receives power from the driving means 132 to move.

The driving means 132 performs a function of moving the conveyance belt 131 and is constituted by belt driving means including a driving motor 132a, a driving pulley 132b and a driven pulley 132c.

The drive motor 132a is constituted by a motor with a built-in gear, and general DC motors, AC motors, servo motors, and the like can be applied without limitation.

According to the present embodiment, the drive motor 132a is constituted by a motor with a built-in gear, but the present invention is not limited thereto. That is, according to the present invention, the drive motor 132a is not constituted by a motor with a built-in gear, but a separate gear device can be provided. In some cases, the drive pulley 132b may be directly connected to the shaft of the drive motor 132a without using a gear device.

The drive pulley 132b transfers the power generated by the drive motor 132a to the driven pulley 132c using the drive belt B. [ The driven pulley 132c that receives the power transmits the power to the conveying belt 131 by contacting the inner portion of the conveying belt 131 to rotate the conveying belt 131. [

The driving means 132 according to the present embodiment is constituted by belt driving means, but the present invention is not limited thereto. That is, the driving means 132 according to the present invention may be configured by various types of power transmission means such as a gear transmission means, a friction wheel transmission means, and a rope transmission means.

On the other hand, the supporting table 133 supports the conveying belt 131 and has a shape of a panel. The support 133 supports not only the conveyance belt 131 but also a function of supporting the action of pressing the first and second polishing rollers 111a and 112a in the vertical direction of the substrate 200, .

The plurality of rollers R support the conveyance belt 131 and apply a predetermined tension to the conveyance belt 131 to smooth the conveyance of the conveyance belt 131.

The second polishing apparatus 140 performs a function of polishing the second surface S2 of the substrate 200 and includes a third polishing roller 141 and a third polishing roller driving unit 142. [

Here, the second surface S2 of the substrate 200 means a portion of the substrate 200 where the third polishing roller 141 of the second polishing apparatus 140 can contact. That is, the second surface S2 of the substrate 200 becomes the surface of the oxide layer 230 at the beginning of the polishing process, and the oxide layer 230 is gradually polished and removed, Lt; / RTI >

The third polishing roller 141 is formed with a polishing layer 141a in a cylindrical shape. Fine abrasive grains adhere to the abrasive layer 141a, and a polishing action occurs when the abrasive grains come into contact with the surface of the substrate 200. [ Here, various particles such as diamond particles, ceramic particles, and synthetic resin particles can be applied to the abrasive grains, and the Flat Convolute Wheel, High Cut Flap Brush, and Leveling Convolute Wheel, which are commercially available as polishing rollers, can be used as they are. The abrasive layer 141a of the third abrasive roller 141 preferably has abrasive grains having lower strength and hardness than the abrasive grains used for the first abrasive roller 111a and the second abrasive roller 112a This is because only the oxide layer 230 is formed on the second surface S2 of the substrate 200 of the present embodiment, not on the resin layer.

The third polishing roller driving unit 142 rotates the third polishing roller 141 and adjusts displacement of the third polishing roller 141 in the Z direction. To this end, the third polishing roller driving unit 142 rotates the third polishing roller 141, The third polishing roller 141 is provided with a motor (not shown) and a gear (not shown) to directly generate power or to receive rotation of the third polishing roller 141, Configuration.

On the other hand, the first supporting roller 150 is arranged to face the second polishing apparatus 140 with the substrate 200 therebetween.

That is, the first support roller 150 contacts the upper surface of the substrate 200, and functions to support the vertical force acting by the second polishing apparatus 140.

As the material of the first support roller 150, a hard metal may be used. The cemented carbide may be a sintered alloy mainly composed of tungsten or the like and joined with a metal such as cobalt, nickel or iron. The cemented carbide is excellent in hardness and strength, and has high abrasion resistance and high compressive strength.

According to this embodiment, the cemented carbide alloy is used as the material of the first support roller 150, but the present invention is not limited thereto. That is, as the material of the first support roller 150 according to the present invention, various materials can be used, and among various materials, a material having relatively high hardness and high strength is preferable.

Hereinafter, the polishing of the surface of the substrate using the above-described substrate surface polishing apparatus 100 will be described with reference to FIGS. 1 to 6. FIG.

Fig. 3 is a schematic cross-sectional view showing the appearance of the substrate at the point I in Fig. 1, and Fig. 4 is a schematic cross-sectional view showing the appearance of the substrate at the point in Fig. FIG. 5 is a schematic cross-sectional view showing a state of the substrate at the point III in FIG. 1, and FIG. 6 is a schematic cross-sectional view showing the state of the substrate at the point IV in FIG.

First, the state of the substrate 200 before entering the resin layer forming unit 300 will be described.

3 is a cross-sectional view of the substrate 200 at one point I before entering the resin layer forming unit 300. The substrate 200 of the substrate 200 has a groove (not shown) 210a are formed. Here, the raw material 210 of the substrate 200 is made of copper, but the present invention is not limited thereto. That is, as the raw material 210 of the substrate 200, various kinds of materials used for lead frames other than copper may be used.

Subsequently, the substrate 200 enters the resin layer forming unit 300.

A resin layer 220 is formed on the surface of the base material 210 of the substrate 200 where the groove 210a is formed. As the resin material forming the resin layer 220, various materials such as a polyimide resin and a general PSR (Photo Sensitive Resist) resin can be used.

The oxide layer 230 is formed on the lower surface of the raw material 210 where the resin layer 220 is not formed on the surface of the substrate 200 due to the heat or the like which acts on the resin layer forming part 300. 4 is a cross-sectional view of a substrate 200 at one point II between a resin layer forming portion 300 and a substrate surface polishing apparatus 100, A resin layer 220 is formed on the upper surface of the substrate 210 and an oxide layer 230 is formed on the lower surface of the substrate 210 of the substrate 200.

Subsequently, the substrate 200 enters the first polishing apparatus 110.

The first polishing roller 111a of the first polishing apparatus 110 rotates by the first polishing roller driving unit 111b while pressing the resin layer 220 formed on the substrate 200, The resin layer 220 formed on the first surface S1 is polished and removed by a predetermined depth.

The second polishing roller 112a is rotated by the second polishing roller driving part 112b while pressing the resin layer 220 of the substrate 200 to polish the resin layer 220 of the substrate 200 to form a predetermined The remaining portion except for the resin layer portion 220a disposed in the groove 210a is removed. At this time, the substrate supporting member 120 not only helps to remove the resin layer 220 by supporting the substrate 200, but also supports the first and second polishing rollers 111a and 111b by the thickness of the substrate supporting member 120 The first polishing roller 111a and the second polishing roller 112a are prevented from coming into contact with the conveyance belt 131 by further separating the conveyance belt 112a from the conveyance belt 131. [ In addition, the transfer device 130 is driven to assist transfer of the substrate support member 120 and the substrate 200. 5 is a sectional view of the substrate 200 at one point III between the first polishing apparatus 110 and the second polishing apparatus 140. The substrate 200 at one point III has a groove 210a The remaining portion of the resin layer 220 except for the resin layer portion 220a disposed therein is removed.

Subsequently, the substrate 200 enters the second polishing apparatus 140.

The third polishing roller 141 of the second polishing apparatus 140 is rotated by the third polishing roller driving section 142 while pressing the second surface S2 of the substrate 200 to thereby rotate the second surface S2 of the substrate 200, (S2). That is, the third polishing roller 141 polishes and removes the oxide layer 230 located on the second surface S2 of the substrate 200. [ At this time, the first support roller 150 contacts the upper surface of the substrate 200 and supports the vertical force acting from the second polishing apparatus 140, thereby assisting the polishing action. 6 is a cross-sectional view of the substrate 200 at one point IV passing through the second polishing apparatus 140. As shown in Fig.

On the other hand, the substrate 200 having passed through the second polishing apparatus 140 is transferred to a plating process, which is the next step. Since the plating process is beyond the scope of the present embodiment, a detailed description thereof will be omitted.

In the substrate surface polishing apparatus 100 according to the embodiment of the present invention described above, since the substrate support member 120 is disposed between the transfer device 130 and the substrate 200, The first polishing roller 111a and the second polishing roller 112a of the first polishing apparatus 110 are further separated from the upper surface of the conveyance belt 131 by the thickness of the first polishing roller 111a and the second polishing roller 112b, It is possible to reduce the risk of damage to the conveyance belt 131 caused by the contact between the two polishing rollers 112a and the conveyance belt 131. [ Particularly, when the width of the conveyance belt 131 is larger than the width of the substrate 200, or when the substrate 200 leaves the conveyance line during the process, there is a greater risk of damage to the conveyance belt 131, The risk of damaging the conveyance belt 131 due to the presence of the substrate supporting member 120 can be reduced.

The substrate surface polishing apparatus 100 according to an aspect of the present invention is configured such that the substrate 200 is moved by the first polishing roller 111a and the second polishing roller 112a via the first polishing apparatus 110 The substrate 200 is subjected to upward force by the third polishing roller 141 while passing through the second polishing apparatus 140 so that the substrate 200 which is generated during the process is pressed against the substrate 200, It is possible to prevent warpage of

7 and 8, a substrate surface polishing apparatus 200 according to a modified example of the embodiment of the present invention will be described below. In the substrate surface polishing apparatus 100 according to the embodiment of the present invention described above, We will focus on the different points.

FIG. 7 is a schematic view showing a process-by-process step of polishing a surface of a substrate using a substrate surface polishing apparatus according to a modification of an embodiment of the present invention, and FIG. 8 is a modification Fig. 2 is an enlarged schematic view of a substrate surface polishing apparatus relating to the present invention.

7, a substrate surface polishing apparatus 400 according to a modification of the embodiment of the present invention includes a first polishing apparatus 410, a substrate holding member 420, a transfer apparatus 430, A polishing apparatus 440, and a first support roller 450.

The first polishing apparatus 410 functions to polish the first surface S1 of the substrate 200 (see FIG. 8), and includes a first polishing roller 411 and a first polishing roller driving unit 412 do. Here, the first surface S1 of the substrate 200 means a portion of the substrate 200 where the first polishing roller 411 of the first polishing apparatus 410 can contact. That is, the first surface S1 of the substrate 200 becomes the surface of the resin layer 220 at the beginning of the polishing process, and the resin layer 220 is gradually polished and removed, The exposed surface of the substrate.

The first polishing roller 411 is formed with a polishing layer 411a in a cylindrical shape. The abrasive layer 411a has fine abrasive particles adhered thereto, so that a polishing action occurs when the abrasive layer 411a comes into contact with the surface of the substrate 200. [ Here, various particles such as diamond particles, ceramic particles, and synthetic resin particles can be applied as abrasive particles.

The first polishing roller driving unit 412 functions to rotate the first polishing roller 411. To this end, the first polishing roller driving unit 412 includes a motor (not shown), a gear (not shown) So that the first polishing roller 411 can be driven to rotate by receiving external power without directly generating power.

On the other hand, the substrate supporting member 420 is arranged to face the first polishing apparatus 410 with the substrate 200 therebetween. The lower surface of the substrate 200 contacts the upper surface of the substrate support member 420 and the upper surface of the second support roller 431 of the transfer device 430 contacts the lower surface of the substrate support member 420.

The substrate support member 420 has a ductility and is formed to have a predetermined thickness t2. Since the distance between the first polishing roller 411 and the second support roller 431 of the transfer device 430 becomes larger during the polishing process as the thickness of the substrate supporting member 420 becomes larger, The risk of contact with the second support roller 431 is reduced. However, if the thickness of the substrate supporting member 420 is too thick, it is preferable to take an appropriate thickness because the flexibility is reduced and it is difficult to handle and the feeding drive becomes difficult. Accordingly, the designer appropriately determines the thickness of the substrate supporting member 420 in consideration of the Z displacement fluctuation of the first polishing roller 411, the Z displacement fluctuation of the second support roller 431, and the like.

The substrate support member 420 may be made of various materials such as a synthetic resin and a thin metal plate. The substrate support member 420 is released from the supply roll SR, supports the substrate 200, Roll (RR).

The substrate support member 420 according to one modification of this embodiment is configured to be released from the supply roll SR and finally recovered at the recovery roll RR, but the present invention is not limited thereto. That is, the substrate support member 420 according to the present invention may be configured to be configured in the form of a conveyor belt and rotate in an infinitely repeated manner.

The transfer device 430 is disposed below the substrate supporting member 420 and includes a second supporting roller 431, driving rollers 432a and 432b, and driving roller driving units 433a and 433b.

The second support roller 431 is disposed to face the first polishing apparatus 410 with the substrate 200 and the substrate support member 420 interposed therebetween.

That is, the second support roller 431 contacts the lower surface of the substrate support member 420 and performs the function of supporting the vertical force acting from the first polishing apparatus 410.

As the material of the second support roller 431, a hard metal may be used. The cemented carbide may be a sintered alloy mainly composed of tungsten or the like and joined with a metal such as cobalt, nickel or iron. The cemented carbide is excellent in hardness and strength, and has high abrasion resistance and high compressive strength.

On the other hand, the driving rollers 432a and 432b rotate in contact with the lower surface of the substrate supporting member 420, thereby performing the function of assisting the conveyance of the substrate supporting member 420 and the substrate 200. [

The driving roller driving units 433a and 433b rotate the driving rollers 432a and 432b to rotate the driving rollers 433a and 433b. And is configured to directly generate power, or to receive drive power from the outside without generating direct power, and to drive the drive rollers 432a and 432b, respectively.

The second polishing roller 441 having the polishing layer 441a and the second polishing roller 442 including the second polishing roller driving part 442 perform the function of polishing the second surface S2 of the substrate 200, The configuration of the apparatus 440 is the same as the configuration of the second polishing apparatus 140 including the third polishing roller 141 and the third polishing roller driving unit 142 in which the polishing layer 141a of the above- Therefore, detailed description thereof will be omitted here.

The configuration of the first support roller 450 disposed to face the second polishing apparatus 440 with the substrate 200 interposed therebetween is the same as that of the second polishing apparatus 440 with the substrate 200 of the above- Since the first supporting roller 150 is disposed to face the first supporting roller 140, detailed description thereof will be omitted.

Hereinafter, with reference to Figs. 7 and 8, a polishing operation of the substrate surface using the substrate surface polishing apparatus 400 according to one modification of the embodiment of the present invention will be described.

The process of the substrate 200 moving through the resin layer forming unit 300 and the structure of the substrate 200 are the same as those of the above-described embodiment, and thus description thereof is omitted here.

The substrate 200 emerging from the resin layer forming unit 300 enters the first polishing apparatus 410.

The first polishing roller 411 of the first polishing apparatus 410 rotates by the first polishing roller driving unit 412 while pressing the resin layer 220 formed on the substrate 200, The resin layer 220 formed on the first surface S1 is polished and removed by a predetermined depth except for the resin layer portion 220a disposed in the groove 210a. At this time, the substrate supporting member 420 not only helps remove the resin layer 220 by supporting the substrate 200, but also supports the first polishing roller 411 by the thickness of the substrate supporting member 420, 431 so as to prevent the first polishing roller 411 from contacting the second support roller 431. [ In addition, the transfer device 430 is driven to assist transfer of the substrate support member 420 and the substrate 200.

The substrate 200 then passes through a second polishing apparatus 440 in which the second polishing roller 441 is pressed against the second polishing roller driving unit 442 while pressing the second surface S2 of the substrate 200 So that the second surface S2 of the substrate 200 is polished. That is, the second polishing roller 441 polishes and removes the oxide layer 230 located on the second side S2 of the substrate 200. At this time, the first support roller 450 contacts the upper surface of the substrate 200, and supports the vertical force acting from the second polishing apparatus 440 to assist the polishing action.

Since the substrate support member 420 is disposed between the transfer device 430 and the substrate 200 in the substrate surface polishing apparatus 400 according to the modification of this embodiment, The first polishing roller 411 of the first polishing apparatus 410 is further separated from the second supporting roller 431 so that the first polishing roller 411 is brought into contact with the second supporting roller 431 in the manufacturing process The risk of damage to the second support roller 431 can be reduced. Particularly when the width of the second support roller 431 is greater than the width of the substrate 200 or when the substrate 200 leaves the transfer line during the process, The risk of damage to the second support roller 431 due to the presence of the substrate support member 420 can be reduced.

The substrate surface polishing apparatus 400 according to an aspect of the present invention is configured such that the substrate 200 is subjected to upward and downward force by the first polishing roller 411 via the first polishing apparatus 410, The substrate 200 is then urged by the second polishing roller 441 from the bottom to the top while passing through the second polishing apparatus 440, thereby preventing the substrate 200 from being warped during the process.

In addition, the transfer device 430 of the substrate surface polishing apparatus 400 according to an aspect of the present invention does not include a conveyance belt unlike the present embodiment, so that the configuration is simplified, and in the case where the conveyance belt is provided A more space margin is provided as much as the thickness of the conveyance belt, so that the polishing action of the thicker substrate 200 can be easily performed.

The configuration, operation, and effect of the substrate surface polishing apparatus 400 according to one modification of the embodiment of the present invention other than the configurations, operations, and effects discussed above are the same as those of the substrate surface polishing apparatus 100 according to the embodiment of the present invention, Functions and effects of the present invention, and therefore will not be described herein.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, You will understand the point. Accordingly, the true scope of protection of the present invention should be determined only by the appended claims.

INDUSTRIAL APPLICABILITY The present invention can be applied to industries related to an apparatus for polishing a substrate surface.

100, 400: substrate surface polishing apparatus 110, 410: first polishing apparatus
120, 420: substrate supporting member 130, 430:
140, 440: second polishing apparatus 150, 450: first supporting roller

Claims (6)

A first polishing apparatus for polishing the first surface of the substrate;
A substrate support member disposed to face the first polishing apparatus with the substrate therebetween;
A transfer device for contacting with one surface of the substrate support member;
A second polishing apparatus for polishing a second surface of the substrate; And
And a first support roller disposed to face the second polishing apparatus with the substrate interposed therebetween. The method according to claim 1,
Wherein the first polishing apparatus includes two polishing rollers. The method according to claim 1,
Wherein a resin layer is formed on a first surface of the substrate, and the first polishing apparatus removes at least a part of the resin layer. The method according to claim 1,
The transfer device
A conveyance belt in contact with one surface of the substrate support member;
Driving means for moving the conveyance belt; And
And a support table for supporting the conveyance belt. The method according to claim 1,
Wherein the transfer device includes a second support roller disposed to face the first abrading device with the substrate and the substrate supporting member interposed therebetween. The method according to claim 1,
Wherein the first polishing apparatus and the second polishing apparatus are arranged such that the substrate passes through the first polishing apparatus and the second polishing apparatus.
KR1020130054642A 2013-05-14 2013-05-14 Apparatus for grinding surface of substrate KR20140134564A (en)

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Cited By (7)

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KR20180055129A (en) * 2016-11-16 2018-05-25 주식회사 케이씨텍 Substrate procesing apparatus and polishing belt assembly using the same
KR20180114709A (en) * 2017-04-11 2018-10-19 주식회사 케이씨텍 Substrate processing apparatus
KR20190005384A (en) * 2017-07-06 2019-01-16 주식회사 케이씨텍 Substrate transfer conveyor and substrate polishing system comprising the same
KR101962090B1 (en) * 2018-12-03 2019-03-26 권종진 Wafer polishing apparatus and method thereof
KR20190054697A (en) * 2017-11-14 2019-05-22 주식회사 케이씨텍 Substrate polishing appartus
KR20190066781A (en) * 2017-12-06 2019-06-14 주식회사 케이씨텍 Substrate polishing appartus
CN114952592A (en) * 2021-02-26 2022-08-30 海成帝爱斯株式会社 Substrate surface grinding device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180055129A (en) * 2016-11-16 2018-05-25 주식회사 케이씨텍 Substrate procesing apparatus and polishing belt assembly using the same
KR20180114709A (en) * 2017-04-11 2018-10-19 주식회사 케이씨텍 Substrate processing apparatus
KR20190005384A (en) * 2017-07-06 2019-01-16 주식회사 케이씨텍 Substrate transfer conveyor and substrate polishing system comprising the same
KR20190054697A (en) * 2017-11-14 2019-05-22 주식회사 케이씨텍 Substrate polishing appartus
KR20190066781A (en) * 2017-12-06 2019-06-14 주식회사 케이씨텍 Substrate polishing appartus
KR101962090B1 (en) * 2018-12-03 2019-03-26 권종진 Wafer polishing apparatus and method thereof
CN114952592A (en) * 2021-02-26 2022-08-30 海成帝爱斯株式会社 Substrate surface grinding device
KR20220122278A (en) * 2021-02-26 2022-09-02 해성디에스 주식회사 Apparatus for grinding surface of substrate

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