KR20160117260A - 광 조사 모듈 - Google Patents

광 조사 모듈 Download PDF

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Publication number
KR20160117260A
KR20160117260A KR1020160037006A KR20160037006A KR20160117260A KR 20160117260 A KR20160117260 A KR 20160117260A KR 1020160037006 A KR1020160037006 A KR 1020160037006A KR 20160037006 A KR20160037006 A KR 20160037006A KR 20160117260 A KR20160117260 A KR 20160117260A
Authority
KR
South Korea
Prior art keywords
light irradiation
metal base
substrate
led chips
irradiation module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020160037006A
Other languages
English (en)
Korean (ko)
Inventor
히로아키 와타나베
Original Assignee
호야 칸데오 옵트로닉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 호야 칸데오 옵트로닉스 가부시키가이샤 filed Critical 호야 칸데오 옵트로닉스 가부시키가이샤
Publication of KR20160117260A publication Critical patent/KR20160117260A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H01L33/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H01L25/0753—
    • H01L27/156—
    • H01L33/02—
    • H01L33/48—
    • H01L33/62—
    • H01L33/64—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H01L2924/12041—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires

Landscapes

  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
KR1020160037006A 2015-03-31 2016-03-28 광 조사 모듈 Withdrawn KR20160117260A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2015-074298 2015-03-31
JP2015074298A JP2016195177A (ja) 2015-03-31 2015-03-31 光照射モジュール

Publications (1)

Publication Number Publication Date
KR20160117260A true KR20160117260A (ko) 2016-10-10

Family

ID=57081398

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160037006A Withdrawn KR20160117260A (ko) 2015-03-31 2016-03-28 광 조사 모듈

Country Status (4)

Country Link
JP (1) JP2016195177A (enExample)
KR (1) KR20160117260A (enExample)
CN (1) CN106024803A (enExample)
TW (1) TW201636535A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220033222A (ko) * 2020-09-09 2022-03-16 (주)진영에이치앤에스 Uvc 엘이디 조립체

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111384037B (zh) * 2018-12-29 2025-03-07 西华大学 一种长灯丝以及一种灯丝网
KR102650608B1 (ko) * 2020-12-18 2024-03-25 세메스 주식회사 광 처리 부재, 그를 포함하는 기판 처리 장치 및 기판 처리 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5582967B2 (ja) 2010-10-27 2014-09-03 京セラ株式会社 光照射装置、光照射モジュール、および印刷装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196878A (ja) * 1986-02-25 1987-08-31 Koito Mfg Co Ltd 照明装置
JPS62229987A (ja) * 1986-03-31 1987-10-08 Koito Mfg Co Ltd 照明装置
JPH11298048A (ja) * 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Ｌｅｄ実装基板
JP4432275B2 (ja) * 2000-07-13 2010-03-17 パナソニック電工株式会社 光源装置
JP2007180320A (ja) * 2005-12-28 2007-07-12 Matsushita Electric Ind Co Ltd 発光モジュールとその製造方法
CN101076223A (zh) * 2006-09-26 2007-11-21 蔡勇 铝基板磁控溅射金属化电路板及led照明器件
US20080099772A1 (en) * 2006-10-30 2008-05-01 Geoffrey Wen-Tai Shuy Light emitting diode matrix
JP5330889B2 (ja) * 2009-04-14 2013-10-30 電気化学工業株式会社 照明用ｌｅｄモジュール
JP5526876B2 (ja) * 2010-03-09 2014-06-18 東京エレクトロン株式会社 加熱装置及びアニール装置
JP2012033742A (ja) * 2010-07-30 2012-02-16 Nk Works Kk 発光ダイオードを用いた光照射装置及び印刷装置
JP2015038902A (ja) * 2010-10-28 2015-02-26 国立大学法人九州工業大学 Ｌｅｄモジュール装置及びその製造方法
JP2013089769A (ja) * 2011-10-18 2013-05-13 Koito Mfg Co Ltd 発光モジュール
JP2013239673A (ja) * 2012-05-17 2013-11-28 Stanley Electric Co Ltd 発光装置、および車両用灯具

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5582967B2 (ja) 2010-10-27 2014-09-03 京セラ株式会社 光照射装置、光照射モジュール、および印刷装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220033222A (ko) * 2020-09-09 2022-03-16 (주)진영에이치앤에스 Uvc 엘이디 조립체

Also Published As

Publication number Publication date
JP2016195177A (ja) 2016-11-17
TW201636535A (zh) 2016-10-16
CN106024803A (zh) 2016-10-12

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000