KR20160108232A - 기판 처리 방법 및 기판 처리 장치 - Google Patents

기판 처리 방법 및 기판 처리 장치 Download PDF

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Publication number
KR20160108232A
KR20160108232A KR1020160026323A KR20160026323A KR20160108232A KR 20160108232 A KR20160108232 A KR 20160108232A KR 1020160026323 A KR1020160026323 A KR 1020160026323A KR 20160026323 A KR20160026323 A KR 20160026323A KR 20160108232 A KR20160108232 A KR 20160108232A
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KR
South Korea
Prior art keywords
substrate
liquid
gas
liquid film
discharge port
Prior art date
Application number
KR1020160026323A
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English (en)
Korean (ko)
Inventor
겐지 고바야시
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20160108232A publication Critical patent/KR20160108232A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020160026323A 2015-03-05 2016-03-04 기판 처리 방법 및 기판 처리 장치 KR20160108232A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015043708 2015-03-05
JPJP-P-2015-043708 2015-03-05
JPJP-P-2016-028312 2016-02-17
JP2016028312A JP6709555B2 (ja) 2015-03-05 2016-02-17 基板処理方法および基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020180039275A Division KR20180040127A (ko) 2015-03-05 2018-04-04 기판 처리 방법 및 기판 처리 장치

Publications (1)

Publication Number Publication Date
KR20160108232A true KR20160108232A (ko) 2016-09-19

Family

ID=56897760

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020160026323A KR20160108232A (ko) 2015-03-05 2016-03-04 기판 처리 방법 및 기판 처리 장치
KR1020180039275A KR20180040127A (ko) 2015-03-05 2018-04-04 기판 처리 방법 및 기판 처리 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020180039275A KR20180040127A (ko) 2015-03-05 2018-04-04 기판 처리 방법 및 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP6709555B2 (zh)
KR (2) KR20160108232A (zh)
CN (1) CN105938791B (zh)
TW (1) TWI617367B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200041990A (ko) * 2017-10-12 2020-04-22 가부시키가이샤 스크린 홀딩스 기판 처리 방법 및 기판 처리 장치
KR20220023287A (ko) * 2020-08-20 2022-03-02 가부시키가이샤 스크린 홀딩스 기판 처리 방법 및 기판 처리 장치

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6811619B2 (ja) * 2017-01-12 2021-01-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI643683B (zh) * 2017-10-19 2018-12-11 Scientech Corporation 流體供應裝置
KR102134261B1 (ko) * 2018-10-25 2020-07-16 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4343018B2 (ja) * 2004-04-20 2009-10-14 東京エレクトロン株式会社 基板の処理方法及び基板の処理装置
JP2007036152A (ja) * 2005-07-29 2007-02-08 Tokyo Seimitsu Co Ltd ウェーハ洗浄乾燥方法及びウェーハ洗浄乾燥装置
US7644512B1 (en) * 2006-01-18 2010-01-12 Akrion, Inc. Systems and methods for drying a rotating substrate
JP2008034428A (ja) * 2006-07-26 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2008243935A (ja) * 2007-03-26 2008-10-09 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5153296B2 (ja) * 2007-10-31 2013-02-27 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2013201334A (ja) * 2012-03-26 2013-10-03 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US10043653B2 (en) * 2012-08-27 2018-08-07 Taiwan Semiconductor Manufacturing Company Maranagoni dry with low spin speed for charging release
JP6317547B2 (ja) * 2012-08-28 2018-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP6242057B2 (ja) * 2013-02-15 2017-12-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6111104B2 (ja) * 2013-03-15 2017-04-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板洗浄乾燥方法および基板現像方法
JP2014194965A (ja) * 2013-03-28 2014-10-09 Dainippon Screen Mfg Co Ltd 基板処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200041990A (ko) * 2017-10-12 2020-04-22 가부시키가이샤 스크린 홀딩스 기판 처리 방법 및 기판 처리 장치
KR20220023287A (ko) * 2020-08-20 2022-03-02 가부시키가이샤 스크린 홀딩스 기판 처리 방법 및 기판 처리 장치

Also Published As

Publication number Publication date
CN105938791A (zh) 2016-09-14
JP6709555B2 (ja) 2020-06-17
CN105938791B (zh) 2019-07-09
JP2016167582A (ja) 2016-09-15
KR20180040127A (ko) 2018-04-19
TWI617367B (zh) 2018-03-11
TW201703882A (zh) 2017-02-01

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