KR20160071369A - 성막 마스크 및 그의 제조 방법 - Google Patents
성막 마스크 및 그의 제조 방법 Download PDFInfo
- Publication number
- KR20160071369A KR20160071369A KR1020167006834A KR20167006834A KR20160071369A KR 20160071369 A KR20160071369 A KR 20160071369A KR 1020167006834 A KR1020167006834 A KR 1020167006834A KR 20167006834 A KR20167006834 A KR 20167006834A KR 20160071369 A KR20160071369 A KR 20160071369A
- Authority
- KR
- South Korea
- Prior art keywords
- mask
- thin film
- opening
- metal thin
- magnetic metal
- Prior art date
Links
- 230000015572 biosynthetic process Effects 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000002184 metal Substances 0.000 claims abstract description 141
- 229910052751 metal Inorganic materials 0.000 claims abstract description 141
- 239000010409 thin film Substances 0.000 claims abstract description 81
- 239000010408 film Substances 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 229910001374 Invar Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H01L51/56—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
-
- H01L51/0011—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013214099A JP2015074826A (ja) | 2013-10-11 | 2013-10-11 | 成膜マスク及びその製造方法 |
JPJP-P-2013-214099 | 2013-10-11 | ||
PCT/JP2014/076762 WO2015053250A1 (ja) | 2013-10-11 | 2014-10-07 | 成膜マスク及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20160071369A true KR20160071369A (ko) | 2016-06-21 |
Family
ID=52813066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020167006834A KR20160071369A (ko) | 2013-10-11 | 2014-10-07 | 성막 마스크 및 그의 제조 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2015074826A (zh) |
KR (1) | KR20160071369A (zh) |
CN (1) | CN105612271A (zh) |
TW (1) | TW201520349A (zh) |
WO (1) | WO2015053250A1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102091560B1 (ko) * | 2015-06-12 | 2020-03-20 | 가부시키가이샤 아루박 | 기판 보지 장치, 성막 장치 및 기판 보지 방법 |
US11233199B2 (en) * | 2016-02-10 | 2022-01-25 | Hon Hai Precision Industry Co., Ltd. | Vapor deposition mask manufacturing method, vapor deposition mask, and organic semiconductor element manufacturing method |
JP6341434B2 (ja) * | 2016-03-29 | 2018-06-13 | 株式会社ブイ・テクノロジー | 成膜マスク、その製造方法及び成膜マスクのリペア方法 |
JP6465075B2 (ja) * | 2016-05-26 | 2019-02-06 | 大日本印刷株式会社 | 蒸着マスク、フレーム付き蒸着マスク、有機半導体素子の製造方法、及びに有機elディスプレイの製造方法 |
CN106206990B (zh) * | 2016-08-29 | 2018-05-08 | 昆山国显光电有限公司 | Oled器件及制作方法、蒸镀基板制作方法 |
US10982316B2 (en) * | 2016-09-30 | 2021-04-20 | Dai Nippon Printing Co., Ltd. | Vapor deposition mask, frame-equipped vapor deposition mask, vapor deposition mask preparation body, vapor deposition pattern forming method, method for producing organic semiconductor element, and method for producing organic EL display |
CN113737128A (zh) | 2017-01-31 | 2021-12-03 | 堺显示器制品株式会社 | 蒸镀掩模、蒸镀掩模及有机半导体元件的制造方法 |
CN108666420B (zh) * | 2017-03-27 | 2021-01-22 | 京东方科技集团股份有限公司 | 掩模板及其制作方法 |
CN107195794B (zh) | 2017-06-06 | 2019-07-30 | 京东方科技集团股份有限公司 | 一种柔性显示基板及其制作方法、显示面板、显示装置 |
CN107385391A (zh) | 2017-07-14 | 2017-11-24 | 京东方科技集团股份有限公司 | 掩膜板、oled显示基板及其制作方法、显示装置 |
CN107858645B (zh) * | 2017-12-15 | 2019-10-01 | 武汉华星光电半导体显示技术有限公司 | 金属掩膜板 |
CN108277454B (zh) * | 2018-04-23 | 2021-01-26 | 京东方科技集团股份有限公司 | 精细掩模板及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004190057A (ja) | 2002-12-09 | 2004-07-08 | Nippon Filcon Co Ltd | パターニングされたマスク被膜と支持体からなる積層構造の薄膜パターン形成用マスク及びその製造方法 |
JP2008274373A (ja) | 2007-05-02 | 2008-11-13 | Optnics Precision Co Ltd | 蒸着用マスク |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006216289A (ja) * | 2005-02-02 | 2006-08-17 | Seiko Epson Corp | マスク及び有機エレクトロルミネッセンス装置の製造方法 |
JP4867255B2 (ja) * | 2005-09-28 | 2012-02-01 | 凸版印刷株式会社 | 有機el用メタルマスク及び有機el素子の製造方法 |
JP2013173968A (ja) * | 2012-02-24 | 2013-09-05 | V Technology Co Ltd | 蒸着マスク及び蒸着マスクの製造方法 |
US9108216B2 (en) * | 2012-01-12 | 2015-08-18 | Dai Nippon Printing Co., Ltd. | Vapor deposition mask, method for producing vapor deposition mask device and method for producing organic semiconductor element |
TW201546306A (zh) * | 2012-01-12 | 2015-12-16 | 大日本印刷股份有限公司 | 拼版蒸鍍遮罩準備體及拼版蒸鍍遮罩 |
-
2013
- 2013-10-11 JP JP2013214099A patent/JP2015074826A/ja active Pending
-
2014
- 2014-10-07 WO PCT/JP2014/076762 patent/WO2015053250A1/ja active Application Filing
- 2014-10-07 KR KR1020167006834A patent/KR20160071369A/ko not_active Application Discontinuation
- 2014-10-07 CN CN201480055662.7A patent/CN105612271A/zh active Pending
- 2014-10-08 TW TW103134972A patent/TW201520349A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004190057A (ja) | 2002-12-09 | 2004-07-08 | Nippon Filcon Co Ltd | パターニングされたマスク被膜と支持体からなる積層構造の薄膜パターン形成用マスク及びその製造方法 |
JP2008274373A (ja) | 2007-05-02 | 2008-11-13 | Optnics Precision Co Ltd | 蒸着用マスク |
Also Published As
Publication number | Publication date |
---|---|
TW201520349A (zh) | 2015-06-01 |
JP2015074826A (ja) | 2015-04-20 |
WO2015053250A1 (ja) | 2015-04-16 |
CN105612271A (zh) | 2016-05-25 |
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WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |