KR20160037736A - 프로세스 감시 장치 및 프로세스 감시 방법 - Google Patents

프로세스 감시 장치 및 프로세스 감시 방법 Download PDF

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Publication number
KR20160037736A
KR20160037736A KR1020150095159A KR20150095159A KR20160037736A KR 20160037736 A KR20160037736 A KR 20160037736A KR 1020150095159 A KR1020150095159 A KR 1020150095159A KR 20150095159 A KR20150095159 A KR 20150095159A KR 20160037736 A KR20160037736 A KR 20160037736A
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KR
South Korea
Prior art keywords
pattern
pattern image
image
resist
acquisition
Prior art date
Application number
KR1020150095159A
Other languages
English (en)
Korean (ko)
Inventor
나리아키 후지와라
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20160037736A publication Critical patent/KR20160037736A/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Biochemistry (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
KR1020150095159A 2014-09-29 2015-07-03 프로세스 감시 장치 및 프로세스 감시 방법 KR20160037736A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-198109 2014-09-29
JP2014198109A JP2016072335A (ja) 2014-09-29 2014-09-29 プロセス監視装置およびプロセス監視方法

Publications (1)

Publication Number Publication Date
KR20160037736A true KR20160037736A (ko) 2016-04-06

Family

ID=55604878

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150095159A KR20160037736A (ko) 2014-09-29 2015-07-03 프로세스 감시 장치 및 프로세스 감시 방법

Country Status (4)

Country Link
JP (1) JP2016072335A (zh)
KR (1) KR20160037736A (zh)
CN (1) CN105466947A (zh)
TW (1) TW201612509A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018028600A (ja) * 2016-08-17 2018-02-22 株式会社Ｓｃｒｅｅｎホールディングス データ補正装置、描画装置、データ補正方法、描画方法およびプログラム
JP2018059830A (ja) * 2016-10-06 2018-04-12 川崎重工業株式会社 外観検査方法
CN109065468B (zh) * 2018-09-12 2020-12-04 上海华力微电子有限公司 缺陷过滤系统及过滤方法和计算机存储介质
CN110021534B (zh) * 2019-03-06 2021-05-18 深圳思谋信息科技有限公司 一种避免假性瑕疵的晶圆流片表面平整度检测装置
CN109949305B (zh) * 2019-03-29 2021-09-28 北京百度网讯科技有限公司 产品表面缺陷检测方法、装置及计算机设备
CN116542934B (zh) * 2023-05-09 2023-12-22 哈尔滨工业大学重庆研究院 薄膜电容工艺检测方法及电子设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200517789A (en) * 2003-07-31 2005-06-01 Fuji Photo Film Co Ltd System for the manufacture of pattern, device and method for exposure
DE102004029014B4 (de) * 2004-06-16 2006-06-22 Leica Microsystems Semiconductor Gmbh Verfahren und System zur Inspektion eines Wafers
KR101376450B1 (ko) * 2011-06-01 2014-03-19 다이닛뽕스크린 세이조오 가부시키가이샤 화상취득장치, 패턴검사장치 및 화상취득방법
JP5826707B2 (ja) * 2012-05-31 2015-12-02 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置および基板検査方法

Also Published As

Publication number Publication date
TW201612509A (en) 2016-04-01
JP2016072335A (ja) 2016-05-09
CN105466947A (zh) 2016-04-06

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