KR20160028687A - Light emitting device package, light emitting device package module and lighting device - Google Patents

Abstract

To improve the uniformity of light, the present invention relates to a light emitting device package for reflecting light emitted to a back surface upwards, a light emitting device package module and a lighting device. The light emitting device package includes a substrate which has a light emitting device mounting surface on a lateral surface to emit light in a lateral direction, an electrode separation line, and a first electrode and a second electrode which protrude downwards to be electrically connected to a module substrate; a light emitting device which is mounted on the light emitting device mounting surface; and a reflection encapsulant which is formed on the substrate to reflect at least part of light generated from the light emitting device. In order that external light emitted to the back surface of the reflection encapsulant or the substrate is reflected upwards, a reflection inclined surface may be upwardly formed on the back surface of the reflection encapsulant or the back surface of the substrate.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device package, a light emitting device package module,

The present invention relates to a light emitting device package, a light emitting device package module, and a lighting device, and more particularly, to a light emitting device package, a light emitting device package module, and a lighting device that can reflect light irradiated to the rear face upward.

A light emitting diode (LED) is a kind of semiconductor device that can emit light of various colors by forming a light emitting source through the formation of a PN diode of a compound semiconductor. Such a light emitting device has a long lifetime, can be reduced in size and weight, and can be driven at a low voltage. In addition, these LEDs are resistant to shock and vibration, do not require preheating time and complicated driving, can be packaged after being mounted on a substrate or lead frame in various forms, so that they can be modularized for various purposes and used as a backlight unit A lighting device, and the like.

The light emitting device package module in which the light emitting device or the light emitting device packages are mounted on the module substrate can be used in various lighting devices and display devices such as fluorescent lamps, bulbs, and illumination lamps.

However, in the case of the conventional light emitting device package module in which a plurality of top light emitting type light emitting device packages are mounted, since the emitted light is mainly directed toward the object and the light is directly irradiated onto the object, Since a large number of light emitting device packages are consumed in order to secure a wide light emitting area, the light emitting efficiency is significantly lowered, irritation to the human body such as glare is caused, light uniformity is lowered, there was.

The present invention has been made to solve the above problems and it is an object of the present invention to provide a reflection type package in which light irradiated to a rear surface is reflected upward and light is indirectly irradiated to an object, A light emitting device package, a light emitting device package module, and a lighting device which can reduce the number of light emitting device packages to be installed, achieve high light emitting efficiency, reduce glare and achieve high quality lighting effects that are not irritating The purpose. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a light emitting device package including: a light emitting device mounting surface formed on a side surface so as to emit light laterally; an electrode separation line formed on the side surface; A substrate on which a first electrode and a second electrode are formed so as to protrude; A light emitting element mounted on a surface of the light emitting element; And a reflective encapsulant formed on the substrate so as to reflect at least a part of the light generated in the light emitting element, wherein the reflective encapsulant is formed on the substrate to reflect the external light to the backside of the substrate or the reflective encapsulant, A reflective inclined surface facing upward may be formed on the rear surface of the substrate or the rear surface of the reflective encapsulant.

According to an aspect of the present invention, the reflective inclined surface may be a reflective inclined surface inclined at a first upward inclination angle, and the first upward inclination angle of the reflective inclined surface may be 20 ° to 70 ° based on the vertical surface.

According to an aspect of the present invention, the substrate is a lead frame made of a metal, and the reflective inclined surface is inclined at a first upward inclination angle with respect to a rear surface or a lead surface of the lead frame, And may be at least a part of the rear surface of the bent lead frame.

According to an aspect of the present invention, the reflective encapsulant may be a molding resin material, and the first reflective bevel may be a rear portion of the reflective encapsulant that is inclined at a first upward inclination angle.

According to an aspect of the present invention, the reflective inclined surface may be inclined at a second upward inclination angle toward an upper side of the rear surface of the substrate or the rear surface of the reflective encapsulant so that external light irradiated to the rear surface of the substrate may be reflected upward And a third inclined reflecting surface inclined at a third upward inclined angle different from the second upward inclined angle.

According to an aspect of the present invention, the reflective inclined surface may be formed by selecting at least one of a convex convex surface, a concave concave surface, a convex convex spherical surface, a concave concave spherical surface, and combinations thereof.

According to an aspect of the present invention, there is provided a light emitting device package module comprising: a module substrate on which a light emitting device package is mounted, the module substrate having at least a plurality of spaced apart light emitting device package seats; At least one light emitting device package mounted in parallel so that a plurality of light emitting device package seats of the module substrate face side to side; And a reflective member installed on at least a portion of the module substrate other than the mounting surface of the light emitting device package, wherein the light emitting device package includes a light emitting device mounting surface formed on a side surface thereof so as to emit light laterally A substrate having a first electrode and a second electrode formed to protrude downward so as to be electrically connected to the module substrate; A light emitting element mounted on a surface of the light emitting element; And a reflective encapsulant formed on the substrate so as to reflect at least a part of the light generated in the light emitting device, wherein light emitted from the other encapsulant, which is irradiated to the back surface of the substrate or the reflective encapsulant, A reflective inclined surface facing upward may be formed on the rear surface of the substrate or the rear surface of the reflective encapsulant.

According to an aspect of the present invention, there is provided a lighting device comprising: a module substrate having at least spaced-apart spaced-apart light emitting device package seats formed in at least one row; At least one light emitting device package mounted in parallel so that a plurality of light emitting device package seats of the module substrate face side to side; And a reflective member installed on at least a portion of the module substrate other than the mounting surface of the light emitting device package, wherein the light emitting device package includes a light emitting device mounting surface formed on a side surface thereof so as to emit light laterally A substrate having a first electrode and a second electrode formed to protrude downward so as to be electrically connected to the module substrate; A light emitting element mounted on a surface of the light emitting element; And a reflective encapsulant formed on the substrate so as to reflect at least a part of the light generated in the light emitting device, wherein light emitted from the other encapsulant, which is irradiated to the back surface of the substrate or the reflective encapsulant, A reflective inclined surface facing upward may be formed on the rear surface of the substrate or the rear surface of the reflective encapsulant.

According to some embodiments of the present invention as described above, it is possible to form a reflection type package in which light is indirectly irradiated to an object, thereby irradiating light with a large area, thereby reducing the number of the light emitting device package And has high luminous efficiency, reduces glare phenomenon, and enables high-quality lighting that is not irritating, so that it is possible to produce high-value-added, high-quality products. Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view illustrating a light emitting device package and a light emitting device package module according to some embodiments of the present invention.
FIG. 2 is a partial cross-sectional view illustrating the light emitting device package and the light emitting device package module of FIG. 1;
3 is a cross-sectional view showing the light emitting device package of FIG. 2 in more detail.
4 is a perspective view showing an example of a substrate of the light emitting device package of FIG.
5 is a cross-sectional view illustrating a light emitting device package according to some other embodiments of the present invention.
6 is a perspective view showing an example of a substrate of the light emitting device package of Fig.
7 to 12 are cross-sectional views or perspective views illustrating light emitting device packages according to various other embodiments of the present invention.
13 is a perspective view illustrating a lighting apparatus according to some embodiments of the present invention.
14 is a plan view showing a light emitting device package arrangement state of a lighting apparatus according to some other embodiments of the present invention.
15 is a plan view showing a light emitting device package arrangement state of a lighting apparatus according to still another embodiment of the present invention.
16 is a plan view showing a light emitting device package arrangement state of a lighting apparatus according to still another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, if the element is inverted in the figures, the elements depicted as being on the upper surface of the other elements will have a direction on the lower surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

1 is a perspective view illustrating a light emitting device package 100 and a light emitting device package module 1000 according to some embodiments of the present invention. 2 is a partial sectional view showing the light emitting device package 100 and the light emitting device package module 1000 of FIG. 1, FIG. 3 is a sectional view showing the light emitting device package 100 of FIG. 2 in more detail, Is a perspective view showing an example of the substrate 10 of the light emitting device package 100 of Fig.

1 to 4, a light emitting device package 100 according to some embodiments of the present invention includes a substrate 10, a light emitting device 20, a reflective encapsulant 30, And may include a phosphor.

As shown in FIGS. 1 to 4, the substrate 10 is provided with a light emitting device mounting surface 10a on its side surface so as to emit light in the lateral direction, and is formed with an electrode separation line L, The first electrode 11 and the second electrode 12 are formed to protrude downwardly so that the wiring layer 130 of the module substrate 110 and the bonding medium B can be electrically connected to each other. Lt; / RTI >

More specifically, for example, the substrate 10 may be made of a material or a conductive material having appropriate mechanical strength and insulation that can support or accommodate the light emitting device 20. [

For example, the substrate 10 may be formed of a metal material such as aluminum, copper, zinc, tin, lead, gold, or silver, and may be a perforated or bent plate type lead frame.

In addition, the substrate 10 may be a printed circuit board (PCB) in which a wiring layer is formed of a first electrode and a second electrode in which an epoxy resin sheet is formed in multiple layers instead of the lead frame. In addition, the substrate 10 may be a Flexible Printed Circuit Board (FPCB) of a flexible material.

The substrate 10 may be a synthetic resin substrate such as resin or glass epoxy, or a ceramic substrate in consideration of thermal conductivity.

The substrate 10 may be made of at least one selected from EMC (Epoxy Mold Compound), PI (polyimide), ceramic, graphene, glass synthetic fiber and combinations thereof in order to improve workability Lt; / RTI >

1 to 4, the light emitting device 20 may be a flip chip LED (Light Emitting Diode) mounted on the light emitting device mount 10a.

However, the light emitting device 20 is not limited to the drawings, and may be a light emitting diode (LED) of a horizontal or vertical type using a bonding wire.

The light emitting device 20 may be formed of a semiconductor. For example, LEDs of blue, green, red, and yellow light emission, LEDs of ultraviolet light emission, and LEDs of infrared light emission, which are made of a nitride semiconductor, can be applied.

The light emitting device 20 can be formed by epitaxially growing nitride semiconductors such as InN, AlN, InGaN, AlGaN, and InGaAlN on a sapphire substrate for growth or a silicon carbide substrate by a vapor phase growth method such as MOCVD To grow. The light emitting device 20 may be formed using semiconductors such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, and AlInGaP in addition to the nitride semiconductor. These semiconductors can be stacked in the order of an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer. The light emitting layer (active layer) may be a laminated semiconductor having a multiple quantum well structure or a single quantum well structure or a laminated semiconductor having a double hetero structure. In addition, the light emitting device 20 can be selected to have an arbitrary wavelength depending on the application such as display use and illumination use.

Here, as the growth substrate, an insulating, conductive or semiconductor substrate may be used if necessary. For example, the growth substrate may be sapphire, SiC, Si, MgAl ₂ O ₄ , MgO, LiAlO ₂ , LiGaO ₂ , GaN. A GaN substrate, which is a homogeneous substrate, is preferable for epitaxial growth of a GaN material, but a GaN substrate has a problem of high production cost due to its difficulty in manufacturing.

Sapphire and silicon carbide (SiC) substrates are mainly used as the different substrates. Sapphire substrates are more utilized than expensive silicon carbide substrates. When using a heterogeneous substrate, defects such as dislocation are increased due to the difference in lattice constant between the substrate material and the thin film material. Also, due to the difference in the thermal expansion coefficient between the substrate material and the thin film material, warping occurs at a temperature change, and warping causes a crack in the thin film. This problem may be reduced by using a buffer layer between the substrate and the GaN-based light emitting laminate.

In addition, the substrate for growth may be completely or partially removed or patterned in order to improve the optical or electrical characteristics of the LED chip before or after the growth of the LED structure.

For example, in the case of a sapphire substrate, the substrate can be separated by irradiating the laser to the interface with the semiconductor layer through the substrate, and the silicon or silicon carbide substrate can be removed by a method such as polishing / etching.

Another supporting substrate may be used for removing the growth substrate. In order to improve the light efficiency of the LED chip on the opposite side of the growth substrate, the supporting substrate may be bonded using a reflective metal, As shown in FIG.

In addition, patterning of the growth substrate improves the light extraction efficiency by forming irregularities or slopes before or after the LED structure growth on the main surface (front surface or both sides) or side surfaces of the substrate. The size of the pattern can be selected from the range of 5 nm to 500 μm and it is possible to make a structure for improving the light extraction efficiency with a rule or an irregular pattern. Various shapes such as a shape, a column, a mountain, a hemisphere, and a polygon can be adopted.

The light emitting device 20 may be a flip chip type having a signal transmission medium such as a bump or a solder in addition to the pad. In addition, the bonding wire may be applied to the terminal, or may be applied only to the first terminal or the second terminal A light emitting element to which a bonding wire is applied, a horizontal type, a vertical type light emitting element, or the like can be applied.

In addition, the first pad and the second pad may have various shapes other than a rectangular shape, and may have a finger structure having a plurality of fingers on one arm, for example.

1, one or more light emitting devices 20 may be provided on the substrate 10, or a plurality of light emitting devices 20 may be provided on the substrate 10. [

1 to 4, the reflective encapsulant 30 is formed of a molding resin material (not shown) formed on the substrate 10 so as to reflect at least a part of light generated from the light emitting device 20, As shown in FIG.

Here, in the reflective encapsulant 30, the electrode separation line L and the reflective cup portion may be integrally molded by a mold.

The reflective encapsulant 30 may be formed of an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition, a modified silicone resin composition, a polyimide resin composition, a modified polyimide resin composition, a polyphthalamide (PPA), a polycarbonate resin , A polyphenylene sulfide (PPS), a liquid crystal polymer (LCP), an ABS resin, a phenol resin, an acrylic resin, a PBT resin, a Bragg reflection layer, an air gap, It can be done by selecting more than one.

The reflective encapsulant 30 may be made of at least one selected from the group consisting of EMC including a reflective material, white silicon containing a reflective material, a photoimageable solder resist (PSR), and combinations thereof.

More specifically, for example, the reflective encapsulant 30 may be a silicone resin composition, a modified epoxy resin composition such as a silicone-modified epoxy resin, a modified silicone resin composition such as an epoxy-modified silicone resin, a polyimide resin composition , Modified polyimide resin composition, resin such as polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin and PBT resin have.

It is also possible to add a light reflecting material such as titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, chromium, have.

1 to 4, a rear surface of the substrate 10 or a reflective surface of the reflective encapsulant 30 may be formed on the rear surface of the substrate 10 or the reflective encapsulant 30, A reflective inclined surface RF directed upward can be formed on the back surface of the encapsulant 30.

The external light may be light emitted from the adjacent light emitting device or another light emitting device package and irradiated to the back surface of the substrate 10 or the reflective encapsulant 30, And may be light emitted from all types of light sources irradiated to the rear surface of the encapsulant 30.

2, the reflection inclined surface RF is a reflection inclined surface inclined at a first upward inclination angle A1, and the first upward inclination angle A1 of the reflection inclined surface RF is And may be from 20 degrees to 70 degrees with respect to the vertical plane.

The reflective inclined surface RF can be applied to various types of reflectors and can be applied to metal materials such as silver, gold, platinum, copper, aluminum, and chrome as well as epoxy resin compositions, silicone resin compositions, (PPA), a polycarbonate resin, a polyphenylene sulfide (PPS), a liquid crystal polymer (LCP), an ABS resin, a phenol resin , An acrylic resin, a PBT resin, a Bragg reflection layer, an air gap, a total reflection layer, a metal layer, and a combination thereof.

The reflection inclined surface RF may be formed by selecting at least one of EMC including a reflective material, white silicon containing a reflective material, a photoimageable solder resist (PSR), and combinations thereof.

More specifically, for example, the reflective beveled surface RF may be formed of a modified silicone resin composition such as a silicone resin composition or a silicone-modified epoxy resin, a modified silicone resin composition such as an epoxy-modified silicone resin, a polyimide resin composition, Resins such as modified polyimide resin composition, polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin and PBT resin can be applied .

It is also possible to add a light reflecting material such as titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, chromium, have.

2, the reflective encapsulant 30 is a molding resin material, and the reflective inclined surface RF is inclined at a first upward inclination angle A1. It may be a rear portion.

Here, the reflective inclined surface RF may be the same material as the reflective encapsulant 30. However, the material of the reflective inclined surface RF is not limited thereto, and a reflective layer different from the reflective encapsulant 30 may be formed on the reflective encapsulant 30.

1 to 4, the phosphor 40 is filled in the reflection cup portion of the reflective encapsulant 30, and may have the following composition formula and color.

Oxide system: yellow and green Y ₃ Al ₅ O ₁₂ : Ce, Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce

(Ba, Sr) ₂ SiO ₄ : Eu, yellow and orange (Ba, Sr) ₃ SiO ₅ : Ce

The nitride-based: the green β-SiAlON: Eu, yellow _{L 3 Si 6 O 11: Ce} , orange-colored α-SiAlON: Eu, red _{CaAlSiN 3: Eu, Sr 2 Si} 5 N 8: Eu, SrSiAl 4 N 7: Eu

The composition of the phosphor should basically correspond to stoichiometry, and each element may be substituted with another element in each group on the periodic table. For example, Sr can be substituted with Ba, Ca, Mg, etc. of the alkaline earth (II) group, and Y can be replaced with lanthanum series of Tb, Lu, Sc, Gd and the like. Ce, Tb, Pr, Er, Yb and the like, and the active agent may be used alone or as a negative active agent for the characteristic modification.

In addition, the phosphor 40 may include materials such as a quantum dot. The phosphor, such as the oxide, nitride, silicate, and QD materials described above, may be used alone or in combination.

QD can be composed of a core (3 to 10 nm) such as CdSe and InP, a shell (0.5 to 2 nm) such as ZnS and ZnSe, and a ligand for stabilizing the core and the shell. Can be implemented.

In addition, the coating method of the phosphor 40 may be at least one of a method of being roughed on an LED chip or a light emitting element, a method of covering a film, a method of attaching a sheet form such as a film or a ceramic phosphor.

Dispensing and spray coating are common methods of spraying, and dispensing includes mechanical methods such as pneumatic method and screw, linear type. It is also possible to control the amount of dyeing through a small amount of jetting by means of a jetting method and control the color coordinates thereof. The method of collectively applying the phosphor 40 on the wafer level or the light emitting device substrate by a spray method can easily control productivity and thickness.

The method of directly covering the light emitting device or the LED chip in a film form can be applied by a method of electrophoresis, screen printing or phosphor molding, and the method can be different according to necessity of application of the side of the LED chip.

In order to control the efficiency of the long-wavelength light-emitting phosphor that reabsers light emitted from a short wavelength among two or more kinds of phosphors having different emission wavelengths, two or more kinds of phosphor layers having different emission wavelengths can be distinguished. A DBR (ODR) layer may be included between each layer to minimize absorption and interference.

In order to form a uniform coating film, the phosphor may be formed into a film or ceramic form and then attached onto the LED chip or the light emitting device.

In order to make a difference in light efficiency and light distribution characteristics, a photoelectric conversion material may be located in a remote format. In this case, the photoelectric conversion material is located together with a transparent polymer, glass, or the like depending on its durability and heat resistance.

Since the phosphor coating technique plays a major role in determining the optical characteristics in the light emitting device, control techniques such as the thickness of the phosphor coating layer and the uniform dispersion of the phosphor have been studied variously. QD can also be placed in the LED chip or the light emitting element in the same manner as the phosphor, and can be positioned between the glass or translucent polymer material for light conversion.

Here, the reflective cup portion of the reflective encapsulant 30 may be filled with the fluorescent material 40 and / or various fillers. The filler may be glass, acrylic, epoxy resin, EMC, epoxy resin composition (PP), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), silicone resin composition, modified epoxy resin composition, modified silicone resin composition, polyimide resin composition, modified polyimide resin composition, , ABS resin, phenol resin, acrylic resin, PBT resin, and the like.

Therefore, as shown in FIGS. 1 to 4, the external light, which is emitted from the neighboring other light emitting device 20 through the fluorescent material 40, When the light reaches the reflective inclined surface RF of the light emitting device package 100, the light can be reflected upward toward the object by the reflective inclined surface RF, whereby the object is irradiated with indirect illumination light, rather than direct illumination light, Luxurious lighting is possible.

Therefore, a plurality of reflection-type packages in which light is indirectly irradiated to an object can be formed as a module to irradiate light in a wide area, thereby reducing the number of light emitting device packages to be installed, Can be reduced to obtain an irritating and high-quality illumination effect.

FIG. 5 is a cross-sectional view illustrating a light emitting device package 200 according to some embodiments of the present invention, and FIG. 6 is a perspective view illustrating an example of a substrate 10 of the light emitting device package 200 of FIG.

5 and 6, the reflective inclined surface RF of the light emitting device package 200 according to some other embodiments of the present invention may be formed to have a first upward inclination angle A1, And may be at least a part of the rear surface of the lead frame bent at the first upward inclination angle A1 with respect to the rear surface or the lead surface.

Here, the reflective inclined surface RF may be the same material as the substrate 10, that is, the lead frame. However, the material of the reflective inclined surface RF is not limited thereto, and it is also possible to form a reflective layer on the lead frame different from the lead frame.

Therefore, the reflective inclined surface RF may be a metal material having excellent reflectivity such as silver, gold, platinum, copper, aluminum, and chrome.

7 and 8 are cross-sectional views illustrating light emitting device packages 300 (400) according to various other embodiments of the present invention.

7, the reflection inclined surface RF of the light emitting device package 300 according to various other embodiments of the present invention reflects the external light irradiated to the rear surface of the substrate 10 upward, A second reflective inclined surface RF2 tilted at a second upward inclination angle A2 upwardly directed to the rear surface of the substrate 10 or the rear surface of the reflective encapsulant 30 so as to allow the second upward inclination angle A2 inclined at a third upward tilting angle A3 different from the third upward tilted angle RF3.

Here, for example, the third upward inclination angle A3 may be larger than the second upward inclination angle A2.

8, the reflection inclined surface RF of the light emitting device package 400 according to various other embodiments of the present invention may be configured such that the external light irradiated to the rear surface of the substrate 10 is reflected upward A fourth reflective inclined surface RF4 tilted to the rear surface of the substrate 10 or the rear surface of the reflective encapsulant 30 at a fourth upward inclination angle A4 upward and a fourth upward inclination angle And a fifth reflection inclined surface RF5 inclined at a fifth upward inclination angle A5 different from the fifth upward inclination angle A4.

Here, for example, the fourth upward inclination angle A4 may be larger than the fifth upward inclination angle A5.

7 and 8, the angle of the second reflection slope A2, the third reflection slope A3, the fourth reflection slope A4, the fifth reflection slope A5, And the height, etc., it is possible to precisely adjust the direction of the reflected light, the distribution of partial light, and the angle of light irradiation.

Here, the reflection inclined surface RF may be formed in a polygonal or polygonal shape, such as two or more angles as described above, that is, a triangle, a quadrangle, or the like.

9 to 12 are cross-sectional views or perspective views illustrating light emitting device packages 500, 600, 700, and 800 according to various other embodiments of the present invention.

9, the reflection inclined surface RF may be a light emitting device package 500 having a convex convex surface RF6, or may be a light emitting device package 500 having a concave curved surface RF7, Emitting device package 700 having a convex spherical surface RF8 as shown in Fig. 11 or a light emitting device package 700 having a concave spherical surface RF9 as shown in Fig. 12, (800) may be applied.

Therefore, as shown in FIGS. 9 to 12, the shape of the reflection slope RF can be adjusted to precisely adjust the direction of the reflected light, the distribution of partial light, and the angle of light irradiation.

1, the light emitting device package module 1000 according to some embodiments of the present invention includes at least a plurality of light emitting device package seats spaced apart from each other by at least a distance, A module substrate 110 formed on the module substrate 110, at least one light emitting device package 100 mounted side by side so as to be parallel to a surface of the module substrate 110, And a reflective member 120 installed on at least a portion of the remaining portions of the light emitting device package.

The module substrate 110 may be a module substrate of various types such as a bar type or a flat type having a wiring layer 130 and the reflective member 120 may be mounted on the module substrate 110 Various reflective members such as a reflective sheet, a white molding member, a reflective layer, and a reflective pigment can all be applied.

In addition, the light emitting device package 100 may have the same configuration and function as the light emitting device package 100 according to some embodiments of the present invention shown in FIGS. 1 to 12. A detailed description thereof will be omitted.

13 is a perspective view illustrating a lighting apparatus 2000 according to some embodiments of the present invention.

13, the illumination device 2000 according to some embodiments of the present invention includes a light emitting device package module 1000 according to some embodiments of the present invention shown in FIGS. 1 to 12 And various cords, terminals, a power supply unit, a reflector, a protective panel, and a transparent panel, which are necessary for illumination, may be additionally provided.

13, the illumination device 2000 according to some embodiments of the present invention includes a light emitting device package 100 and a light emitting device package module 1000 including the light emitting device package module 1000, As shown in FIG. In addition, the illumination device 2000 may be applied to all types of conventional lighting devices such as a bulb type, a ceiling, a work, and the like.

14 to 16 are plan views showing a light emitting device package arrangement state of a lighting apparatus according to some other embodiments of the present invention.

As shown in FIGS. 14 to 16, the light emitting device packages 100 are spaced apart from each other by a predetermined distance or more on the module substrate, and at least the straight multiples of FIG. 14, the jiggag heat of FIG. 15, And the like.

Therefore, even a small number of the light emitting device packages can be arranged in various forms in various portions, so that illumination can be efficiently performed in various spaces of various angles.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: substrate
10a: Scene of light emitting element room
L: electrode separation line
11: first electrode
12: Second electrode
20: Light emitting element
30: Reflective bag material
40: phosphor
RF: Reflective slope
A1: first upward inclination angle
A2: 2nd upward inclination angle
A3: Third upward inclination angle
A4: fourth upward inclination angle
A5: fifth upward inclination angle
LF: Lead side
RF1: first reflection slope surface
RF2: second reflection slope
RF3: third reflection slope
RF4: fourth reflection slope
RF5: fifth reflection slope
RF6: convex surface
RF7: concave surface
RF8: convex spherical
RF9: concave spherical surface
100: Light emitting device package
110: module substrate
120: reflective member
130: wiring layer
B: bonding medium
1000: Light emitting device package module
2000: Lighting system

Claims (8)

A substrate on which a light emitting element mounting surface is formed on a side surface so as to emit light in a lateral direction, a first electrode and a second electrode are formed so as to protrude downward so as to be electrically connected to the module substrate,
A light emitting element mounted on a surface of the light emitting element; And
And a reflective encapsulant formed on the substrate to reflect at least a part of the light generated in the light emitting device,
Wherein a reflective inclined surface facing upward is formed on a back surface of the substrate or a rear surface of the reflective encapsulant so as to reflect external light emitted to the back surface of the substrate or the reflective encapsulant upward. The method according to claim 1,
Wherein the reflective inclined surface is a reflective inclined surface inclined at a first upward inclination angle and the first upward inclined angle of the reflective inclined surface is in a range of 20 to 70 degrees with respect to a vertical surface. The method according to claim 1,
Wherein the substrate is a lead frame made of a metal,
Wherein the reflective inclined surface is at least a part of the rear surface of the lead frame or the rear surface of the lead frame bent at the first upward inclination angle with respect to the lead surface formed to incline at a first upward inclination angle. The method according to claim 1,
Wherein the reflective encapsulant is a molding resin material,
Wherein the first reflective inclined surface is a rear surface portion of the reflective encapsulant that is inclined at a first upward inclination angle. The method according to claim 1,
The reflective inclined surface may include a second reflective inclined surface that is inclined at a second upward inclination angle toward the back surface of the substrate or the rear surface of the reflective encapsulant so as to reflect the external light irradiated to the rear surface of the substrate upward, And a third reflective beveled surface inclined at a third upward oblique angle different from the two upward oblique angle. The method according to claim 1,
Wherein the reflective inclined surface comprises at least one selected from at least one of a convex convex surface, a concave concave surface, a convex convex spherical surface, a concave concave spherical surface, and combinations thereof. A module substrate on which a light emitting device package mounting surface is formed which is spaced apart from each other by at least a spacing distance and is arranged in at least one row;
At least one light emitting device package mounted in parallel so that a plurality of light emitting device package seats of the module substrate face side to side; And
And a reflective member provided on at least a portion of the module substrate other than the mounting surface of the light emitting device package,
Wherein the light emitting device package includes:
A substrate on which a light emitting element mounting surface is formed on a side surface so as to emit light in a lateral direction, a first electrode and a second electrode are formed so as to protrude downward so as to be electrically connected to the module substrate,
A light emitting element mounted on a surface of the light emitting element; And
And a reflective encapsulant formed on the substrate to reflect at least a part of the light generated in the light emitting device,
Wherein a reflective inclined surface facing upward is formed on a rear surface of the substrate or on a rear surface of the reflective encapsulant so as to reflect upward light of the substrate or another light emitting device package irradiated to the rear surface of the reflective encapsulant. A module substrate on which a light emitting device package mounting surface is formed which is spaced apart from each other by at least a spacing distance and is arranged in at least one row;
At least one light emitting device package mounted in parallel so that a plurality of light emitting device package seats of the module substrate face side to side; And
And a reflective member provided on at least a portion of the module substrate other than the mounting surface of the light emitting device package,
Wherein the light emitting device package includes:
A substrate on which a light emitting element mounting surface is formed on a side surface so as to emit light in a lateral direction, a first electrode and a second electrode are formed so as to protrude downward so as to be electrically connected to the module substrate,
A light emitting element mounted on a surface of the light emitting element; And
And a reflective encapsulant formed on the substrate to reflect at least a part of the light generated in the light emitting device,
And a reflective inclined surface facing upward is formed on a back surface of the substrate or a rear surface of the reflective encapsulant so as to reflect upward light of the substrate or another light emitting device package irradiated to the back surface of the reflective encapsulant.

Images