KR20160023554A - 압력 센서 모듈 및 압력 센서 모듈의 제조 방법 - Google Patents

압력 센서 모듈 및 압력 센서 모듈의 제조 방법 Download PDF

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Publication number
KR20160023554A
KR20160023554A KR1020150111360A KR20150111360A KR20160023554A KR 20160023554 A KR20160023554 A KR 20160023554A KR 1020150111360 A KR1020150111360 A KR 1020150111360A KR 20150111360 A KR20150111360 A KR 20150111360A KR 20160023554 A KR20160023554 A KR 20160023554A
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KR
South Korea
Prior art keywords
circuit board
molding
molding resin
pressure sensor
flat surface
Prior art date
Application number
KR1020150111360A
Other languages
English (en)
Korean (ko)
Inventor
야스아키 카네코
Original Assignee
가부시키가이샤 테지케
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 테지케 filed Critical 가부시키가이샤 테지케
Publication of KR20160023554A publication Critical patent/KR20160023554A/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G01L19/0654—Protection against aggressive medium in general against moisture or humidity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0048—Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
KR1020150111360A 2014-08-21 2015-08-07 압력 센서 모듈 및 압력 센서 모듈의 제조 방법 KR20160023554A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-168749 2014-08-21
JP2014168749A JP6435468B2 (ja) 2014-08-21 2014-08-21 圧力センサモジュール及び圧力センサモジュールの製造方法

Publications (1)

Publication Number Publication Date
KR20160023554A true KR20160023554A (ko) 2016-03-03

Family

ID=55535507

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150111360A KR20160023554A (ko) 2014-08-21 2015-08-07 압력 센서 모듈 및 압력 센서 모듈의 제조 방법

Country Status (2)

Country Link
JP (1) JP6435468B2 (ja)
KR (1) KR20160023554A (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000046669A (ja) 1998-07-30 2000-02-18 Tokin Corp 圧力センサ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3374620B2 (ja) * 1995-10-25 2003-02-10 松下電工株式会社 半導体圧力センサ
JP2000356561A (ja) * 1999-04-14 2000-12-26 Denso Corp 半導体歪みセンサ
US6441503B1 (en) * 2001-01-03 2002-08-27 Amkor Technology, Inc. Bond wire pressure sensor die package
JP2004340891A (ja) * 2003-05-19 2004-12-02 Mitsubishi Electric Corp 圧力センサ装置
JP4049167B2 (ja) * 2005-05-11 2008-02-20 ヤマハ株式会社 蓋体フレーム、半導体装置、及びその製造方法
JP2006300774A (ja) * 2005-04-21 2006-11-02 Denso Corp ダイヤフラム型圧力検出装置
JP2012173006A (ja) * 2011-02-17 2012-09-10 Yazaki Corp 圧力検知装置
JP2014093451A (ja) * 2012-11-05 2014-05-19 Denso Corp モールドパッケージの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000046669A (ja) 1998-07-30 2000-02-18 Tokin Corp 圧力センサ

Also Published As

Publication number Publication date
JP6435468B2 (ja) 2018-12-12
JP2016045049A (ja) 2016-04-04

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