KR20160020351A - Breaking device - Google Patents

Breaking device Download PDF

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Publication number
KR20160020351A
KR20160020351A KR1020150103676A KR20150103676A KR20160020351A KR 20160020351 A KR20160020351 A KR 20160020351A KR 1020150103676 A KR1020150103676 A KR 1020150103676A KR 20150103676 A KR20150103676 A KR 20150103676A KR 20160020351 A KR20160020351 A KR 20160020351A
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KR
South Korea
Prior art keywords
wafer
pressing member
chuck table
divided
pressing
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KR1020150103676A
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Korean (ko)
Inventor
미노루 스즈키
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가부시기가이샤 디스코
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Publication of KR20160020351A publication Critical patent/KR20160020351A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
    • H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
    • H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
    • H01L2021/60172—Applying energy, e.g. for the soldering or alloying process using static pressure

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

An object of the present invention is to provide a breaking apparatus for dividing a wafer by using a ring frame according to the size of the wafer.
The braking device 10 includes a chuck table 11 for holding the workpiece 1, a pressing member 14 for pressing the wafer W along the line S to be divided of the wafer W held by the chuck table 11, 11 and the pressing member 14 relative to the wafer W so that the pressing member 14 is moved toward and away from the wafer W in the vertical direction so that the wafer W And a porous plate 17 formed at a predetermined hardness that is depressed by the pressing of the pressing member 14. The porous plate 17 is fixed to the suction surface 111a through the porous plate 17, When the wafer W to be held is pressed by the pressing member 14, the porous plate 17 is recessed along the line to be divided S, so that the wafer W is surely braked along the line to be divided S Lt; / RTI >

Description

Breaking device {BREAKING DEVICE}

The present invention relates to a braking device for dividing a wafer into individual chips.

A device such as IC or LSI is divided by the line to be divided and the wafer formed on the surface is divided along the line to be divided so as to be divided into individual chips to which the device is attached. As a method of dividing the wafer, a laser beam is irradiated from the surface side of the wafer along the line to be divided along the divided line to form a modified layer inside the wafer. Thereafter, a braking device having a blade is used, Thereafter, there is a method of dividing the wafer into individual chips starting from the modified layer by pressing the wafer with the blade (for example, refer to Patent Documents 1-3 below).

When dividing the wafer, a tape is attached to a ring-shaped ring frame having an opening at its center so as to prevent the individual chips from being scattered, and one side of the wafer is upwardly exposed to the tape exposed from the opening, So that the wafer is supported by the ring frame through the tape.

Japanese Patent Application Laid-Open No. 2009-148982 Japanese Patent Application Laid-Open No. 2013-038434 Japanese Patent Application Laid-Open No. 2013-058671

However, in order to divide the wafer along the line to be divided by pressing the blade, a line-shaped space is formed on the holding surface of the chuck table for holding the wafer so that the line to be divided of the wafer is not supported, Is pushed into the space to be widened. Therefore, it is not possible to perform the dividing process using the same chuck table for wafers having different intervals of the lines to be divided.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is an object of the present invention to divide wafers having different spacings of lines to be divided by using the same chuck table in a breaking apparatus for dividing a wafer by pressing.

A first invention is a braking device for forming a chip by dividing a wafer along a line to be divided along a line to be divided, the braking device comprising: an adhesive tape in which the opening of the ring frame having an inner diameter larger than the outer diameter of the wafer is sealed, A chuck table for holding a workpiece formed by adhering a wafer having a dividing point of one line type formed thereon, a pressing member for pressing the wafer held by the chuck table along the line to be divided, A pressing means for pressing the wafer against the wafer held by the chuck table by the pressing member so as to approach and separate the pressing member in the vertical direction, And the chuck table is provided with a porous plate And a holding section for holding the ring frame. The workpiece set is held by the chuck table, and the wafer is pressed and divided by the pressing member along the line to be divided.

In the braking device, the top surface of the ring frame held by the holding portion and the tip end portion of the pressing member are pressed against the suction surface by pressing the wafer held on the suction surface through the porous plate with the pressing member It is preferable that the front end portion of the pressing member which is approached is a height which does not contact the upper surface of the ring frame.

A second aspect of the present invention is a chuck table used in the braking device, wherein the suction surface of the chuck table is provided with a porous layer formed so that at least a region holding the wafer is depressed by the pressing member, So that the wafer can be divided by pressing the wafer along the line to be divided by the pressing member.

The braking device of the present invention comprises a chuck table for holding a workpiece in which a ring frame and a wafer are integrated through an adhesive tape, a pressing member for pressing the wafer along the line to be divided of the wafer held by the chuck table, When the wafer held on the suction surface of the chuck table is pressed by the pressing member, the porous plate is recessed along the line to be divided along with the wafer to be pressed. Therefore, It is not necessary to form a line-shaped space along the planned line to be divided.

Therefore, the wafer can be surely divided along the line to be divided, and even if a wafer having a different spacing on the line to be divided is held on the suction surface through the porous plate, the wafer can be divided by the pressing member.

When the upper surface of the ring frame held by the holding portion and the tip of the pressing member are pressed by the pressing member against the wafer held on the suction surface through the porous plate, Since the tip portion of the member is a height that does not contact the upper surface of the ring frame, the pressing member does not contact the ring frame.

Therefore, it is not necessary to use a ring frame having a size larger than the size of the wafer, so that the apparatus can be prevented from becoming larger.

The chuck table of the present invention has a porous layer which is depressed by the pressure of the pressing member on the suction surface of the chuck table and the porous layer is recessed along the line to be divided by the pressing of the pressing member, Chip can be divided into individual pieces.

Fig. 1 (a) is a perspective view showing an example of a work set, and Fig. 1 (b) is a sectional view showing a state in which a dividing base point is formed in a wafer.
2 is a cross-sectional view showing a configuration of a first example of a breaking apparatus.
3 is a sectional view showing an operational example of the first example of the breaking apparatus.
4 is a cross-sectional view showing a configuration of a second example of the breaking apparatus.
5 is a cross-sectional view showing an operational example of the second example of the breaking apparatus.
6 is a cross-sectional view showing the configuration of a third example of the breaking apparatus.
Fig. 7 is a sectional view showing an operational example of the third example of the braking device.

The wafer W shown in Fig. 1 is an example of a workpiece divided by the breaking apparatus 10 shown in Fig. As shown in Fig. 1 (a), a device D is formed on a surface Wa of a wafer W in each region partitioned by a grid-like dividing line S, as shown in Fig. The device D is not formed on the back surface Wb opposite to the surface Wa of the wafer W. [ The adhesive tape T is adhered to the back side of the annular ring frame F having an opening with an inner diameter larger than the outer diameter of the wafer W and the adhesive tape T T on the back surface Wb side with the surface Wa side of the wafer W facing upward. In this manner, the workpiece set 1 in which the ring frame F and the wafer W are integrated is formed through the adhesive tape T. The adhesive tape T is of a type which is constituted by, for example, a stretchable base material and an adhesive layer.

 When dividing the wafer W, a division origin point is previously formed along the line to be divided S. As shown in Fig. 1 (b), the surface Wa of the wafer W is held upward on the holding surface 3 of the processing table 2 holding the workpiece 1, The laser beam 5 having a wavelength which is transparent to the wafer W is condensed in the wafer W along the line to be divided S by the laser irradiation means 4 Thereby forming a corresponding line-shaped dividing point 6. A half cut is formed on the surface Wa to form a groove having a depth not to completely cut the wafer W along the line to be divided S by a cutting blade (not shown) .

2 includes a chuck table 11 for holding a workpiece 1 in which a dividing base point 6 is formed in a wafer W and a chuck table 11 for holding a chuck table 11 held by the chuck table 11, (Z-axis direction) with respect to the wafer W held by the chuck table 11, a pressing member 14 for pressing the pressing member 14 along the line S to be divided of the wafer W, And an index conveying means 16 for relatively indexing the chuck table 11 and the pressing member 14 in the Y-axis direction, a pressing member 15 for pressing the wafer W against the pressing member 14, And a porous plate 17 formed to have a hardness that is depressed by the pressing force of the pressing member 14. [

The chuck table 11 includes a frame 110, a wafer holding part 111 formed on the inner peripheral side of the frame 110 to hold the wafer W, And a frame holding unit 112 for holding the frame F. The upper surface of the wafer holding portion 111 is a suction surface 111a for sucking and holding the surface Wa of the wafer W. [ The wafer holding portion 111 is formed of a porous member such as porous ceramics and communicates with the suction source 13 through a first suction path 113 formed inside the frame 110. [ A rotating means 12 for rotating the chuck table 11 in a predetermined direction is connected to the lower portion of the frame 110.

The frame holding portion 112 is in communication with the suction source 13 through a second suction path 114 formed inside the frame 110. [ The upper surface of the ring frame F held by the frame holding portion 112 is lower than the suction surface 111a of the wafer holding portion 111 by holding the work set 1 with the chuck table 11, (On the -Z side).

For example, the tip end portion of the pressing member 14 is formed in a straight line along the straight line of the line S to be divided of the wafer W shown in Fig. 1 (a). The pressing member (14) is connected to the pressing means (15). The pressing means 15 can press the wafer W through the pressing member 14 by lowering the pressing member 14 toward the wafer W. [ Further, the pressing member 14 may be formed in a circular shape like a blade.

The porous plate 17 is disposed on the suction surface 111a of the chuck table 11. The porous plate 17 is composed of a film or the like made of a sintered porous molded article of ultrahigh molecular weight polyethylene powder and may have a hardness which is depressed by the pressing force of the pressing member 14, A porous sheet (Sunmap HP-5320) may be used. This porous sheet has a hardness of Shore D42 in ASTM D2240. The porous plate 17 thus configured functions not only as a cushioning material when the wafer W is divided by the pressing member 14 but also the wafer W is dented by the load so that the wafer W can be separated from the dividing origin 6 It is possible to prevent disturbance from spreading to the starting point.

Next, an operation example of the breaking device 10 will be described. First, as shown in Fig. 2, the work set 1 is held by the chuck table 11. Fig. Concretely, the surface Wa of the wafer W is arranged on the porous plate 17 with the adhesive tape T facing upward, and the ring frame F is arranged on the frame holding portion 112. Subsequently, the surface Wa of the wafer W is sucked and held by exerting a suction action on the porous plate 17 via the wafer holding portion 111, and the wafer W is held by the frame holding portion 112 So that the ring frame F is sucked and held.

3, the pressing member 14 is disposed above the back surface Wb side of the wafer W, and the pressing member 14 is rotated in the Y direction as shown in Fig. 1 (a) Is positioned so as to face the line S to be divided of the wafer W facing in the axial direction. Subsequently, the pressing means 15 lowers the pressing member 14 in the -Z direction, and presses the wafer W from the adhesive tape T side at the tip end 14a of the pressing member 14. Then,

The porous plate 17 is depressed in accordance with the load applied to the wafer W by pressing the wafer W downward with the pushing member 14 so that the surface Wa of the wafer W Is pressed toward the porous plate (17) and widened. Then, the wafer W that can not withstand the pressing force is divided with the dividing origin 6 formed in the line S to be divided shown in Fig. 1 (a) as a starting point.

3, since the upper surface of the ring frame F is located lower than the suction surface 111a of the wafer holding portion 111, the ring frame F held by the frame holding portion 112 The upper surface of the pressing member 14 and the tip end of the pressing member 14 are positioned such that the tip end 14a of the pressing member 14 which is closest to the suction surface 111a of the wafer holding portion 111 is closer to the upper surface of the ring frame F That is, the tip end 14a of the pressing member 14 does not contact the upper surface of the ring frame F. [ Therefore, it is possible to prevent the distal end portion 14a of the pressing member 14 from coming into contact with the ring frame F and being broken when the wafer W is divided. Further, in the braking device 10, since the ring frame F corresponding to the size of the wafer W can be used, it is possible to prevent the apparatus from becoming excessively large. Even if the upper surface of the ring frame F is at the same height or higher than the suction surface 111a of the wafer holding portion 111, The distal end portion 14a of the pressing member 14 when it is closest to the suction surface 111a of the wafer holding portion 111 may be located above the upper surface of the ring frame F. [

The index conveying means 16 moves the pressing member 14 in the + Y direction, for example, so that the chuck table 11 and the pressing member 14 are relatively indexed And the pressing member 14 is positioned above the adjacent line to be divided S and the pressing member 14 is pressed in the same manner as described above. When the wafer W is divided along all of the lines S to be divided which face in the Y-axis direction, the rotating means 12 is operated to rotate the chuck table 11 by 90 degrees, The line to be divided S facing in the X-axis direction is directed in the Y-axis direction, and the same pressing is performed. The pressing means 15 terminates the braking of the wafer W at the time when it has been divided along all the divisional origin points 6. In this way, the wafer W is divided into chips including the device D. The chuck table 11 holding the wafer W may be configured so as to be index-fed in the Y-axis direction in addition to the configuration in which the pushing member 14 is index-fed in the Y-axis direction. That is, the chuck table 11 and the pressing member 14 may be relatively index-transferable.

As described above, in the braking device 10, since the porous plate 17 having a degree of depression is formed on the suction surface 111a of the chuck table 11 by depression of the pressing member 14, When the wafer W held by the suction surface 111a of the table 11 is pressed by the pressing member 14, the porous plate 17 is dented along the line to be divided S, It is possible to reliably break the wafer W along the line to be divided S even without forming a line-shaped space along the dividing line S on the suction surface 111a of the chuck table 11. [

The braking device 10a shown in Fig. 4 is a second example of the braking device. The breaking device 10a has a chuck table 20 for holding the work set 1 shown in Fig. 1 and has the same configuration as the braking device 10 except for this. The chuck table 20 includes a frame 200, a wafer holding portion 201, and a frame holding portion 202. A rotating means 22 for rotating the chuck table 20 in a predetermined direction is connected to the lower portion of the frame 200. The wafer holding portion 201 is in communication with the suction source 23 through the first suction path 203 formed in the frame 200. [ The frame holding section 202 is in communication with the suction source 23 through the second suction path 204 formed in the frame 200. [

4, a porous layer 21 is provided above the suction surface 201a of the wafer holding portion 201 to be depressed by the pressing member 14. As shown in Fig. The porous layer 21 has the same hardness as that of the porous plate 17 described above.

Next, an operation example of the breaking apparatus 10a will be described. 5, the surface Wa of the wafer W is placed on the porous layer 21 with the adhesive tape T facing upward, and the chuck table 20 is placed on the porous layer 21, The work set 1 is held. Subsequently, the tip of the pressing member 14 is positioned so as to face the line S to be divided of the wafer W, which is directed in the Y-axis direction shown in Fig. 1A, and the pressing unit 15 presses The member 14 is lowered in the -Z direction and the pressing member 14 presses the wafer W through the adhesive tape T. [

At this time, the porous layer 21 is dented according to the load applied to the wafer W, and the surface Wa of the wafer W is pressed toward the porous layer 21 and widened. In this manner, the wafer W which can not withstand the pressing force is divided based on the dividing origin 6. The pressing member 15 is moved up in the + Z direction by the pressing means 15 at the time when it is divided along all the dividing points 6 as in the case of the breaking apparatus 10 and the braking with respect to the wafer W is performed And terminates.

The braking device 10b shown in Fig. 6 includes a chuck table 30 having a clamp holding mechanism 302 for holding a ring frame as a third example of the braking device. More specifically, the chuck table 30 includes a frame 300, a wafer holding portion 301, and a clamp holding mechanism 302 for holding the ring frame F by clamping. At a lower portion of the frame 300, a rotating means 32 for rotating the chuck table 30 in a predetermined direction is connected. The wafer holding portion 301 is communicated with the suction source 33 through a suction path 306 formed in the frame 300. [ The suction surface 301a of the wafer holding portion 301 is provided with the same porous layer 31 as the porous layer 21 of the breaking device 10a shown in Figs.

The clamp holding mechanism 302 includes a frame arrangement portion 303 in which the ring frame F is arranged, a shaft portion 304 attached to one end of the frame arrangement portion 303, And a clamp unit 305 for fixing the ring frame F disposed in the frame arrangement unit 303. [

Next, an operation example of the breaking apparatus 10b will be described. First, as shown in Fig. 7, the work table 1 is held by the chuck table 30. Fig. Concretely, the surface Wa of the wafer W is disposed on the porous layer 31 with the adhesive tape T facing upward, and the ring frame F is disposed on the frame arrangement portion 303. Subsequently, the clamp portion 305 is rotated about the shaft portion 304, and the upper portion of the ring frame F is pressed and fixed.

After the workpiece set 1 is held by the chuck table 30, the tip end portion 14a of the pressing member 14 is moved to the line along which the wafer W is to be divided And the pressing member 14 is lowered in the -Z direction by the pressing means 15 so that the wafer W from the side of the adhesive tape T at the tip end portion 14a of the pressing member 14 ). At this time, the porous layer 31 is dented according to the load applied to the wafer W, and the surface Wa of the wafer W is pressed toward the porous layer 31 to spread, And is divided based on the starting point (6). The pressing member 15 is moved up in the + Z direction by the pressing means 15 at the time when it is divided along all the dividing points 6 as in the case of the breaking apparatus 10a and the braking with respect to the wafer W is performed And terminates.

As described above, in the braking devices 10a and 10b, the porous layers (not shown) formed on the suction surfaces 201a and 301a of the chuck tables 20 and 30 at predetermined hardness that are depressed by the pressure of the pressing member 14 The wafer W held by the chuck tables 20 and 30 is pressed by the pressing member 14 through the porous layers 21 and 31 so that the porous layers 21 and 31 themselves It is possible to form the wafers W along the line to be divided S without forming line-shaped spaces along the lines to be divided S on the suction surfaces 201a and 301a, It is possible to reliably brak.

1: Work set 2: Machining table
3: holding surface 4: laser irradiation means
5: laser beam 6:
10, 10a, 10b: breaking device 11: chuck table
110: frame 111: wafer holding part
111a: suction surface 112: frame holding portion
113: first suction path 114: second suction path
12: rotating means 13: suction source
14: pressing member 15: pressing means
16: index conveying means 17: porous plate
20: chuck table 200: frame
201: Wafer holding portion 201a: Suction surface
202: frame holding section 203: first suction path
204: second suction passage 21: porous layer
22: rotating means 23: suction source
30: chuck table 300: frame
301: Wafer holding portion 301a: Suction surface
302: clamp holding mechanism 303:
304: shaft portion 305: clamp portion
306: suction path 31: porous layer
32: rotating means 33: suction source

Claims (3)

A breaking apparatus for forming a chip by dividing a wafer along a line to be divided,
A chuck table for holding a workpiece constituted by adhering a wafer having a line-shaped dividing origin corresponding to the expected dividing line to an adhesive tape on which the opening of the ring frame having an inner diameter larger than the outer diameter of the wafer is sealed, ,
A pressing member that presses the wafer held by the chuck table along the line to be divided,
An index conveying means for relatively conveying the chuck table and the pressing member with an index;
Pressing means for pressing the wafer with the pressing member by moving the pressing member in a vertical direction toward and away from the wafer held by the chuck table,
The porous plate is pressed by the pressing member to be dented.
And,
Wherein the chuck table has a suction surface for sucking and holding one surface of the wafer and a holding portion for holding the ring frame,
Holding the work set with the chuck table, and pressing the wafer along the line to be divided with the pressing member to divide the wafer. 2. The apparatus according to claim 1, wherein the upper surface of the ring frame held by the holding portion and the tip portion of the pressing member are pressed against the suction surface by the pressing member when the wafer held on the suction surface through the porous plate is pressed by the pressing member Wherein a front end portion of the pressing member closest to the front end is a height that does not contact the upper surface of the ring frame. A chuck table for use in the braking device according to any one of claims 1 to 3,
Wherein the suction surface of the chuck table is provided with a porous layer formed so that at least a region holding the wafer is depressed by the pressing force of the pressing member,
So that the wafer can be divided by pressing the wafer along the line to be divided by the pressing member.
KR1020150103676A 2014-08-13 2015-07-22 Breaking device KR20160020351A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-164763 2014-08-13
JP2014164763A JP2016040810A (en) 2014-08-13 2014-08-13 Breaking device

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KR (1) KR20160020351A (en)
CN (1) CN105374708A (en)
TW (1) TW201606868A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7217585B2 (en) 2017-04-13 2023-02-03 株式会社ディスコ Division method
KR20190092926A (en) 2018-01-31 2019-08-08 가부시기가이샤 디스코 Wafer processing method
JP7020675B2 (en) * 2018-02-26 2022-02-16 三星ダイヤモンド工業株式会社 Wafer with Low-k film splitting method

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JP2009148982A (en) 2007-12-20 2009-07-09 Daitron Technology Co Ltd Wafer breaking apparatus
JP2013038434A (en) 2012-09-13 2013-02-21 Daitron Technology Co Ltd Braking device
JP2013058671A (en) 2011-09-09 2013-03-28 Disco Abrasive Syst Ltd Breaking device

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JP2556856Y2 (en) * 1991-07-10 1997-12-08 株式会社ディスコ Frame clamping mechanism in dicing machine
JPH08236484A (en) * 1995-02-28 1996-09-13 Hitachi Ltd Method and device for breaking semiconductor wafer
JP3088327B2 (en) * 1997-03-24 2000-09-18 鹿児島日本電気株式会社 Glass substrate cutting method
JP2003197581A (en) * 2001-10-18 2003-07-11 Fujitsu Ltd Plate supporting member and method of using the same
JP6043149B2 (en) * 2012-10-29 2016-12-14 三星ダイヤモンド工業株式会社 Breaking device for brittle material substrate and method for breaking brittle material substrate
US20150299020A1 (en) * 2012-11-28 2015-10-22 Corning Incorporated Pads, methods of forming scribing mark, and methods of cutting a sheet of glass

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2009148982A (en) 2007-12-20 2009-07-09 Daitron Technology Co Ltd Wafer breaking apparatus
JP2013058671A (en) 2011-09-09 2013-03-28 Disco Abrasive Syst Ltd Breaking device
JP2013038434A (en) 2012-09-13 2013-02-21 Daitron Technology Co Ltd Braking device

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JP2016040810A (en) 2016-03-24
TW201606868A (en) 2016-02-16
CN105374708A (en) 2016-03-02

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