KR20160015228A - 에칭 조성물 - Google Patents
에칭 조성물 Download PDFInfo
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- KR20160015228A KR20160015228A KR1020157033636A KR20157033636A KR20160015228A KR 20160015228 A KR20160015228 A KR 20160015228A KR 1020157033636 A KR1020157033636 A KR 1020157033636A KR 20157033636 A KR20157033636 A KR 20157033636A KR 20160015228 A KR20160015228 A KR 20160015228A
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- 238000005530 etching Methods 0.000 title claims abstract description 110
- 239000000203 mixture Substances 0.000 title claims abstract description 72
- 239000002904 solvent Substances 0.000 claims abstract description 25
- 150000003839 salts Chemical class 0.000 claims abstract description 17
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 12
- 150000001768 cations Chemical class 0.000 claims abstract description 9
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 9
- 125000001153 fluoro group Chemical group F* 0.000 claims abstract description 6
- 125000004437 phosphorous atom Chemical group 0.000 claims abstract description 6
- 150000001450 anions Chemical class 0.000 claims abstract description 5
- -1 metal complex ion Chemical class 0.000 claims description 93
- 238000000034 method Methods 0.000 claims description 43
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- 239000000758 substrate Substances 0.000 claims description 25
- 239000002841 Lewis acid Substances 0.000 claims description 15
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- 239000010419 fine particle Substances 0.000 claims description 14
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- 238000010438 heat treatment Methods 0.000 claims description 9
- 229910021645 metal ion Inorganic materials 0.000 claims description 8
- 150000001639 boron compounds Chemical class 0.000 claims description 7
- 239000002562 thickening agent Substances 0.000 claims description 6
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 4
- 229940085991 phosphate ion Drugs 0.000 claims description 4
- 229910052794 bromium Inorganic materials 0.000 claims description 3
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- 229910052740 iodine Inorganic materials 0.000 claims description 3
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/10—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a boron compound
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- Computer Hardware Design (AREA)
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- Electromagnetism (AREA)
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PCT/JP2014/002702 WO2014192266A1 (ja) | 2013-05-31 | 2014-05-22 | エッチング組成物 |
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CN (1) | CN105247663B (zh) |
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JP2005506705A (ja) | 2001-10-10 | 2005-03-03 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフトング | エッチングおよびドーピング複合物質 |
JP2008527698A (ja) | 2005-01-11 | 2008-07-24 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフトング | 二酸化ケイ素および窒化ケイ素の層のエッチングのためのプリント可能な媒体 |
JP2012033561A (ja) | 2010-07-28 | 2012-02-16 | Sanyo Chem Ind Ltd | 窒化ケイ素用エッチング液 |
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GB2276349A (en) * | 1993-03-25 | 1994-09-28 | Ciba Geigy Ag | Printing of porous substrates. |
GB2373367A (en) * | 2000-12-12 | 2002-09-18 | Univ Montfort | Formation and processing of porous semiconductors using etching solution of oxidant and fluorine-containing Lewis acid |
JP2005162786A (ja) * | 2003-11-28 | 2005-06-23 | Mitsubishi Gas Chem Co Inc | 洗浄液組成物 |
JP4225548B2 (ja) * | 2004-01-06 | 2009-02-18 | 三菱瓦斯化学株式会社 | エッチング液組成物及びエッチング方法 |
US9058975B2 (en) * | 2006-06-09 | 2015-06-16 | Lam Research Corporation | Cleaning solution formulations for substrates |
CN101639769B (zh) * | 2008-07-30 | 2013-03-06 | 国际商业机器公司 | 在多处理器系统上对数据集进行划分及排序的方法和装置 |
CN102138214B (zh) * | 2008-09-01 | 2014-06-04 | 默克专利股份有限公司 | 借助蚀刻的薄层太阳能电池组件的边缘去除 |
EP2438140A1 (en) * | 2009-06-04 | 2012-04-11 | Merck Patent GmbH | Two component etching |
CA2780291A1 (en) * | 2009-11-09 | 2011-05-12 | Carnegie Mellon University | Metal ink compositions, conductive patterns, methods, and devices |
JP2013533631A (ja) * | 2010-07-16 | 2013-08-22 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | エッチング後残渣を除去するための水性洗浄剤 |
JP2012099550A (ja) * | 2010-10-29 | 2012-05-24 | Sanyo Chem Ind Ltd | 窒化ケイ素用エッチング液 |
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2014
- 2014-05-22 KR KR1020157033636A patent/KR20160015228A/ko not_active Application Discontinuation
- 2014-05-22 JP JP2015519634A patent/JP6369460B2/ja not_active Expired - Fee Related
- 2014-05-22 WO PCT/JP2014/002702 patent/WO2014192266A1/ja active Application Filing
- 2014-05-22 CN CN201480030747.XA patent/CN105247663B/zh not_active Expired - Fee Related
- 2014-05-29 TW TW103118715A patent/TWI625381B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005506705A (ja) | 2001-10-10 | 2005-03-03 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフトング | エッチングおよびドーピング複合物質 |
JP2008527698A (ja) | 2005-01-11 | 2008-07-24 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフトング | 二酸化ケイ素および窒化ケイ素の層のエッチングのためのプリント可能な媒体 |
JP2012033561A (ja) | 2010-07-28 | 2012-02-16 | Sanyo Chem Ind Ltd | 窒化ケイ素用エッチング液 |
Also Published As
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CN105247663B (zh) | 2018-03-23 |
TWI625381B (zh) | 2018-06-01 |
CN105247663A (zh) | 2016-01-13 |
JPWO2014192266A1 (ja) | 2017-02-23 |
JP6369460B2 (ja) | 2018-08-08 |
TW201504396A (zh) | 2015-02-01 |
WO2014192266A1 (ja) | 2014-12-04 |
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