JP6369460B2 - エッチング組成物 - Google Patents

エッチング組成物 Download PDF

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Publication number
JP6369460B2
JP6369460B2 JP2015519634A JP2015519634A JP6369460B2 JP 6369460 B2 JP6369460 B2 JP 6369460B2 JP 2015519634 A JP2015519634 A JP 2015519634A JP 2015519634 A JP2015519634 A JP 2015519634A JP 6369460 B2 JP6369460 B2 JP 6369460B2
Authority
JP
Japan
Prior art keywords
etching
etching composition
boron
composition
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015519634A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2014192266A1 (ja
Inventor
児玉　俊輔
俊輔 児玉
智明 塚原
智明 塚原
恭 神代
恭 神代
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2014192266A1 publication Critical patent/JPWO2014192266A1/ja
Application granted granted Critical
Publication of JP6369460B2 publication Critical patent/JP6369460B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Photovoltaic Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
JP2015519634A 2013-05-31 2014-05-22 エッチング組成物 Expired - Fee Related JP6369460B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013116099 2013-05-31
JP2013116098 2013-05-31
JP2013116099 2013-05-31
JP2013116098 2013-05-31
PCT/JP2014/002702 WO2014192266A1 (ja) 2013-05-31 2014-05-22 エッチング組成物

Publications (2)

Publication Number Publication Date
JPWO2014192266A1 JPWO2014192266A1 (ja) 2017-02-23
JP6369460B2 true JP6369460B2 (ja) 2018-08-08

Family

ID=51988318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015519634A Expired - Fee Related JP6369460B2 (ja) 2013-05-31 2014-05-22 エッチング組成物

Country Status (5)

Country Link
JP (1) JP6369460B2 (zh)
KR (1) KR20160015228A (zh)
CN (1) CN105247663B (zh)
TW (1) TWI625381B (zh)
WO (1) WO2014192266A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115820256B (zh) * 2022-11-25 2024-05-24 嘉兴市小辰光伏科技有限公司 用于提升太阳能电池绒面均匀性的添加剂及其使用工艺

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2276349A (en) * 1993-03-25 1994-09-28 Ciba Geigy Ag Printing of porous substrates.
GB2373367A (en) * 2000-12-12 2002-09-18 Univ Montfort Formation and processing of porous semiconductors using etching solution of oxidant and fluorine-containing Lewis acid
DE10150040A1 (de) 2001-10-10 2003-04-17 Merck Patent Gmbh Kombinierte Ätz- und Dotiermedien
JP2005162786A (ja) * 2003-11-28 2005-06-23 Mitsubishi Gas Chem Co Inc 洗浄液組成物
JP4225548B2 (ja) * 2004-01-06 2009-02-18 三菱瓦斯化学株式会社 エッチング液組成物及びエッチング方法
DE102005007743A1 (de) 2005-01-11 2006-07-20 Merck Patent Gmbh Druckfähiges Medium zur Ätzung von Siliziumdioxid- und Siliziumnitridschichten
US9058975B2 (en) * 2006-06-09 2015-06-16 Lam Research Corporation Cleaning solution formulations for substrates
CN101639769B (zh) * 2008-07-30 2013-03-06 国际商业机器公司 在多处理器系统上对数据集进行划分及排序的方法和装置
JP5575771B2 (ja) * 2008-09-01 2014-08-20 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング エッチングによる薄層ソーラーモジュールの端部除去
US8647526B2 (en) * 2009-06-04 2014-02-11 Merck Patent Gesellschaft Mit Beschrankter Haftung Two component etching
WO2011057218A2 (en) * 2009-11-09 2011-05-12 Carnegie Mellon University Metal ink compositions, conductive patterns, methods, and devices
EP2593964A4 (en) * 2010-07-16 2017-12-06 Entegris Inc. Aqueous cleaner for the removal of post-etch residues
JP2012033561A (ja) * 2010-07-28 2012-02-16 Sanyo Chem Ind Ltd 窒化ケイ素用エッチング液
JP2012099550A (ja) * 2010-10-29 2012-05-24 Sanyo Chem Ind Ltd 窒化ケイ素用エッチング液

Also Published As

Publication number Publication date
CN105247663A (zh) 2016-01-13
CN105247663B (zh) 2018-03-23
TW201504396A (zh) 2015-02-01
TWI625381B (zh) 2018-06-01
JPWO2014192266A1 (ja) 2017-02-23
WO2014192266A1 (ja) 2014-12-04
KR20160015228A (ko) 2016-02-12

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