KR20150140571A - 리소그래피 장치 및 물품 제조 방법 - Google Patents

리소그래피 장치 및 물품 제조 방법 Download PDF

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Publication number
KR20150140571A
KR20150140571A KR1020150076148A KR20150076148A KR20150140571A KR 20150140571 A KR20150140571 A KR 20150140571A KR 1020150076148 A KR1020150076148 A KR 1020150076148A KR 20150076148 A KR20150076148 A KR 20150076148A KR 20150140571 A KR20150140571 A KR 20150140571A
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KR
South Korea
Prior art keywords
substrate
imprint
disk
conveying path
units
Prior art date
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Ceased
Application number
KR1020150076148A
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English (en)
Korean (ko)
Inventor
요시카즈 미야지마
히토시 나카노
Original Assignee
캐논 가부시끼가이샤
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Publication of KR20150140571A publication Critical patent/KR20150140571A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Library & Information Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
KR1020150076148A 2014-06-06 2015-05-29 리소그래피 장치 및 물품 제조 방법 Ceased KR20150140571A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014118132A JP2015231036A (ja) 2014-06-06 2014-06-06 リソグラフィ装置、および物品製造方法
JPJP-P-2014-118132 2014-06-06

Publications (1)

Publication Number Publication Date
KR20150140571A true KR20150140571A (ko) 2015-12-16

Family

ID=54769492

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150076148A Ceased KR20150140571A (ko) 2014-06-06 2015-05-29 리소그래피 장치 및 물품 제조 방법

Country Status (5)

Country Link
US (1) US9915881B2 (enExample)
JP (1) JP2015231036A (enExample)
KR (1) KR20150140571A (enExample)
CN (1) CN105319861B (enExample)
TW (1) TWI582544B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190003354A (ko) * 2017-06-30 2019-01-09 캐논 가부시끼가이샤 임프린트 장치 및 물품 제조 방법
KR20190013512A (ko) * 2017-07-27 2019-02-11 캐논 가부시끼가이샤 임프린트 장치 및 물품 제조 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6821414B2 (ja) * 2016-12-13 2021-01-27 キヤノン株式会社 インプリント装置、及び物品の製造方法
JP6942487B2 (ja) * 2017-03-03 2021-09-29 キヤノン株式会社 インプリント装置、インプリント方法、および物品製造方法
JP7112220B2 (ja) * 2017-05-12 2022-08-03 キヤノン株式会社 方法、装置、システム、および物品の製造方法
US12044962B2 (en) * 2019-04-19 2024-07-23 Canon Kabushiki Kaisha Forming apparatus, forming method, and article manufacturing method

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US4878086A (en) * 1985-04-01 1989-10-31 Canon Kabushiki Kaisha Flat panel display device and manufacturing of the same
TW448487B (en) * 1997-11-22 2001-08-01 Nippon Kogaku Kk Exposure apparatus, exposure method and manufacturing method of device
JPH11329937A (ja) * 1998-05-19 1999-11-30 Nikon Corp リソグラフィシステム
WO2000051172A1 (en) * 1999-02-26 2000-08-31 Nikon Corporation Exposure system, lithography system and conveying method, and device production method and device
KR20040044447A (ko) * 2001-08-20 2004-05-28 가부시키가이샤 니콘 마스크 교환방법 및 노광장치
JP2005159293A (ja) * 2003-09-18 2005-06-16 Nec Kagoshima Ltd 基板処理装置及び処理方法
TWI333233B (en) * 2004-06-10 2010-11-11 Applied Materials Inc Small lot size lithography bays
KR20060007211A (ko) 2004-07-19 2006-01-24 삼성전자주식회사 노광 시스템
US7924406B2 (en) * 2005-07-13 2011-04-12 Asml Netherlands B.V. Stage apparatus, lithographic apparatus and device manufacturing method having switch device for two illumination channels
US20070200276A1 (en) * 2006-02-24 2007-08-30 Micron Technology, Inc. Method for rapid printing of near-field and imprint lithographic features
JP2007292933A (ja) * 2006-04-24 2007-11-08 Nsk Ltd 露光装置
JP2009059992A (ja) * 2007-09-03 2009-03-19 Renesas Technology Corp 半導体装置の製造方法
US8143602B2 (en) 2009-03-25 2012-03-27 Taiwan Semiconductor Manufacturing Company, Ltd. High-volume manufacturing massive e-beam maskless lithography system
JP2011009362A (ja) * 2009-06-24 2011-01-13 Tokyo Electron Ltd インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
JP2011210992A (ja) 2010-03-30 2011-10-20 Canon Inc リソグラフィーシステム、及びリソグラフィーシステムの制御方法、それを用いたデバイスの製造方法及び物品の製造方法
JP5411201B2 (ja) * 2010-05-21 2014-02-12 東京エレクトロン株式会社 インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
JP5611112B2 (ja) * 2010-05-21 2014-10-22 東京エレクトロン株式会社 インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
JP2012099663A (ja) * 2010-11-02 2012-05-24 Toshiba Corp マスク搬送システムおよびマスク搬送用アダプタ
NL2008157A (en) * 2011-02-22 2012-08-24 Asml Netherlands Bv Lithographic apparatus and lithographic projection method.
KR102185752B1 (ko) * 2011-10-26 2020-12-02 브룩스 오토메이션 인코퍼레이티드 반도체 웨이퍼 취급 및 이송
US9287150B2 (en) * 2012-10-09 2016-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Reticle transfer system and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190003354A (ko) * 2017-06-30 2019-01-09 캐논 가부시끼가이샤 임프린트 장치 및 물품 제조 방법
KR20190013512A (ko) * 2017-07-27 2019-02-11 캐논 가부시끼가이샤 임프린트 장치 및 물품 제조 방법

Also Published As

Publication number Publication date
JP2015231036A (ja) 2015-12-21
TWI582544B (zh) 2017-05-11
TW201546570A (zh) 2015-12-16
US9915881B2 (en) 2018-03-13
US20150355558A1 (en) 2015-12-10
CN105319861B (zh) 2017-11-24
CN105319861A (zh) 2016-02-10

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