KR20150135050A - 용융 금속 토출장치 및 용융 금속 토출방법 - Google Patents

용융 금속 토출장치 및 용융 금속 토출방법 Download PDF

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Publication number
KR20150135050A
KR20150135050A KR1020150008488A KR20150008488A KR20150135050A KR 20150135050 A KR20150135050 A KR 20150135050A KR 1020150008488 A KR1020150008488 A KR 1020150008488A KR 20150008488 A KR20150008488 A KR 20150008488A KR 20150135050 A KR20150135050 A KR 20150135050A
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KR
South Korea
Prior art keywords
molten metal
nozzle
syringe
shaft
discharging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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KR1020150008488A
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English (en)
Korean (ko)
Inventor
케이치 쿠라모치
마사요시 신카이
Original Assignee
미쓰비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 미쓰비시덴키 가부시키가이샤 filed Critical 미쓰비시덴키 가부시키가이샤
Publication of KR20150135050A publication Critical patent/KR20150135050A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H01L21/4853—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H01L21/67144—
    • H01L23/4275—

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020150008488A 2014-05-22 2015-01-19 용융 금속 토출장치 및 용융 금속 토출방법 Ceased KR20150135050A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-106387 2014-05-22
JP2014106387A JP6157408B2 (ja) 2014-05-22 2014-05-22 溶融金属吐出装置および溶融金属吐出方法

Publications (1)

Publication Number Publication Date
KR20150135050A true KR20150135050A (ko) 2015-12-02

Family

ID=54431856

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150008488A Ceased KR20150135050A (ko) 2014-05-22 2015-01-19 용융 금속 토출장치 및 용융 금속 토출방법

Country Status (5)

Country Link
US (1) US20150336195A1 (https=)
JP (1) JP6157408B2 (https=)
KR (1) KR20150135050A (https=)
CN (1) CN105097611A (https=)
DE (1) DE102014226286A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210000091U (ko) * 2019-07-05 2021-01-13 김창규 화장품용 충진노즐의 가열장치
CN112627662A (zh) * 2020-12-28 2021-04-09 北京北方华创微电子装备有限公司 半导体工艺设备及开门机构

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211610A (zh) * 2016-07-27 2016-12-07 无锡深南电路有限公司 一种pcb线路加工方法和喷涂设备
IL283235B2 (en) 2018-11-20 2026-03-01 Fujifilm Electronic Mat Usa Inc Solvent purification systems and methods
CN112643165A (zh) * 2020-12-29 2021-04-13 深圳市福英达工业技术有限公司 熔融焊接材料的装置及建立电子连接的方法
CN118695917A (zh) 2022-02-25 2024-09-24 三菱电机株式会社 熔融金属喷出装置及熔融金属喷出方法
CN120791065B (zh) * 2025-09-15 2025-11-18 深圳市紫宸激光设备有限公司 一种用于软钎焊接的锡球备料装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04279258A (ja) * 1991-03-06 1992-10-05 Nippon Steel Corp 連続鋳造用溶湯供給ノズル
JPH0588668U (ja) * 1991-10-23 1993-12-03 日本電気ホームエレクトロニクス株式会社 外部ヒータを有する定量吐出装置
JPH09201558A (ja) * 1996-01-29 1997-08-05 Techno Kapura:Kk 塗布装置
JPH09246707A (ja) * 1996-03-12 1997-09-19 Matsushita Electric Ind Co Ltd 半田吐出装置
JP3585659B2 (ja) * 1996-08-21 2004-11-04 三菱電機株式会社 ペースト材料吐出装置
JP4272413B2 (ja) * 2002-11-18 2009-06-03 株式会社ソディックプラステック コールドチャンバダイカスト成形機の射出装置及びその計量方法
JP2009006233A (ja) * 2007-06-27 2009-01-15 Victor Co Of Japan Ltd 液体吐出用ノズル装置及びそれを備えた液体塗布装置
JP2011121070A (ja) * 2009-12-08 2011-06-23 Hitachi Global Storage Technologies Netherlands Bv ヘッド・ジンバル・アセンブリの製造方法及びヘッド・ジンバル・アセンブリの接続パッドを相互接続する装置
JP5257390B2 (ja) * 2010-03-23 2013-08-07 三菱電機株式会社 溶融金属吐出装置
JP2013028101A (ja) * 2011-07-29 2013-02-07 Seiko Epson Corp 液体噴射ヘッド及び液体噴射装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210000091U (ko) * 2019-07-05 2021-01-13 김창규 화장품용 충진노즐의 가열장치
CN112627662A (zh) * 2020-12-28 2021-04-09 北京北方华创微电子装备有限公司 半导体工艺设备及开门机构

Also Published As

Publication number Publication date
JP2015221452A (ja) 2015-12-10
JP6157408B2 (ja) 2017-07-05
CN105097611A (zh) 2015-11-25
DE102014226286A1 (de) 2015-11-26
US20150336195A1 (en) 2015-11-26

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