JP5235430B2 - 溶融金属吐出装置 - Google Patents
溶融金属吐出装置 Download PDFInfo
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- JP5235430B2 JP5235430B2 JP2008018605A JP2008018605A JP5235430B2 JP 5235430 B2 JP5235430 B2 JP 5235430B2 JP 2008018605 A JP2008018605 A JP 2008018605A JP 2008018605 A JP2008018605 A JP 2008018605A JP 5235430 B2 JP5235430 B2 JP 5235430B2
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- Prior art keywords
- molten metal
- nozzle
- syringe
- cylindrical portion
- columnar body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002184 metal Substances 0.000 title claims description 146
- 229910052751 metal Inorganic materials 0.000 title claims description 146
- 238000003860 storage Methods 0.000 claims description 22
- 239000007789 gas Substances 0.000 claims description 21
- 230000001590 oxidative effect Effects 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000004090 dissolution Methods 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 16
- 238000012423 maintenance Methods 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000005304 joining Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000003779 heat-resistant material Substances 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
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- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Claims (7)
- 溶融金属を対象物に吐出する溶融金属吐出装置であって、前記溶融金属を保持する筒状部と、
前記筒状部の一端に設けられ、前記対象物に前記溶融金属を吐出するノズルと、
前記筒状部の中を摺動し、保持される前記溶融金属を前記ノズルから吐出させる柱状体と、
前記筒状部と前記柱状体との間に設けられるフッ素樹脂又はこれを含有する樹脂であって耐熱性を有する環状シールと、
前記ノズルの溶融金属吐出口を含む一部のみが低酸素濃度の非酸化性ガス雰囲気で満たされており、
前記環状シールは、前記筒状部が保持され予め決められた最大量の前記溶融金属を前記筒状部が保持した場合に当該溶融金属が前記筒状部において占める範囲の上端から、前記柱状体を挿入する側の前記筒状部の端部までに設けられることを特徴とする溶融金属吐出装置。 - 前記ノズルは、前記溶融金属が流通する流通孔を備え、
前記柱状体は、前記ノズル側に、前記筒状部に保持される前記溶融金属をすべて吐出した場合に前記流通孔に嵌るピンを備える請求項1に記載の溶融金属吐出装置。 - 前記ノズルは、吐出される前記溶融金属が流通する先細りの流通孔を備える請求項1又は請求項2に記載の溶融金属吐出装置。
- 前記筒状部が保持する前記溶融金属を溶融した状態で維持するための保持加熱手段を備えることを特徴とする請求項1から請求項3のいずれか1項に記載の溶融金属吐出装置。
- 前記筒状部と、前記ノズルと、前記柱状体と、前記環状シールとを含む吐出部を支持して移動させる移動機構部と、
前記移動機構部による前記吐出部の移動を制御する移動制御部とを備える請求項1から請求項4のいずれか1項に記載の溶融金属吐出装置。 - 前記筒状部に供給される溶融金属を溶融した状態で貯留し、前記ノズルが前記移動機構部によって移動し、貯留された前記溶融金属の中に進入できる範囲に設けられる貯留槽を備え、
前記ノズルは、前記貯留槽から前記溶融金属を吸引し、
前記柱状体は、前記筒状部の中を摺動することにより、前記貯留槽に貯留される前記溶融金属を前記ノズルから吸引して、前記筒状部に保持させる請求項5に記載の溶融金属吐出装置。 - 前記ノズルと、前記貯留槽と、前記対象物との周囲を非酸化性ガス雰囲気で維持する雰囲気炉を備える請求項6に記載の溶融金属吐出装置。
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JP2008018605A JP5235430B2 (ja) | 2008-01-30 | 2008-01-30 | 溶融金属吐出装置 |
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JP2008018605A JP5235430B2 (ja) | 2008-01-30 | 2008-01-30 | 溶融金属吐出装置 |
Publications (2)
Publication Number | Publication Date |
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JP2009178639A JP2009178639A (ja) | 2009-08-13 |
JP5235430B2 true JP5235430B2 (ja) | 2013-07-10 |
Family
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Family Applications (1)
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JP2008018605A Active JP5235430B2 (ja) | 2008-01-30 | 2008-01-30 | 溶融金属吐出装置 |
Country Status (1)
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JP (1) | JP5235430B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5257390B2 (ja) * | 2010-03-23 | 2013-08-07 | 三菱電機株式会社 | 溶融金属吐出装置 |
JP5720616B2 (ja) * | 2012-04-18 | 2015-05-20 | 株式会社デンソー | はんだ供給装置 |
SE545308C2 (en) * | 2016-05-27 | 2023-06-27 | Universal Instruments Corp | Dispensing head having a nozzle heater device, system and method |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5321832U (ja) * | 1976-07-31 | 1978-02-23 | ||
JPS6336870A (ja) * | 1986-07-31 | 1988-02-17 | Juki Corp | 液体微量吐出装置 |
JPH01159077A (ja) * | 1987-12-17 | 1989-06-22 | Matsushita Electric Ind Co Ltd | ディスペンサー装置 |
JPH0398971U (ja) * | 1990-01-30 | 1991-10-15 | ||
JPH08105197A (ja) * | 1994-10-04 | 1996-04-23 | Yamamoto Seisakusho:Kk | コーキングガンにおけるピストン |
US5894994A (en) * | 1995-03-14 | 1999-04-20 | Nordson Corporation | Adjustable slot coating die |
JPH09246707A (ja) * | 1996-03-12 | 1997-09-19 | Matsushita Electric Ind Co Ltd | 半田吐出装置 |
JPH10118556A (ja) * | 1996-10-22 | 1998-05-12 | Hara Kasei Kk | 接着剤注入器 |
JP3295641B2 (ja) * | 1998-03-13 | 2002-06-24 | 株式会社日本製鋼所 | 金属材料の射出装置 |
US6291016B1 (en) * | 1999-06-02 | 2001-09-18 | Nordson Corporation | Method for increasing contact area between a viscous liquid and a substrate |
JP2004351480A (ja) * | 2003-05-29 | 2004-12-16 | Mitsubishi Electric Corp | ろう付け方法及びろう付け装置 |
JP2005349363A (ja) * | 2004-06-14 | 2005-12-22 | Melt Giken Kk | ホットメルト接着剤用ダイ |
JP2007275921A (ja) * | 2006-04-05 | 2007-10-25 | Mitsubishi Electric Corp | はんだ合金およびはんだ付方法 |
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