CN105097611A - 熔融金属喷出装置以及熔融金属喷出方法 - Google Patents

熔融金属喷出装置以及熔融金属喷出方法 Download PDF

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Publication number
CN105097611A
CN105097611A CN201510037359.0A CN201510037359A CN105097611A CN 105097611 A CN105097611 A CN 105097611A CN 201510037359 A CN201510037359 A CN 201510037359A CN 105097611 A CN105097611 A CN 105097611A
Authority
CN
China
Prior art keywords
molten metal
nozzle
pressure cylinder
shaft
ejection device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510037359.0A
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English (en)
Chinese (zh)
Inventor
仓持敬一
新饲雅芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN105097611A publication Critical patent/CN105097611A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201510037359.0A 2014-05-22 2015-01-26 熔融金属喷出装置以及熔融金属喷出方法 Pending CN105097611A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014106387A JP6157408B2 (ja) 2014-05-22 2014-05-22 溶融金属吐出装置および溶融金属吐出方法
JP2014-106387 2014-05-22

Publications (1)

Publication Number Publication Date
CN105097611A true CN105097611A (zh) 2015-11-25

Family

ID=54431856

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510037359.0A Pending CN105097611A (zh) 2014-05-22 2015-01-26 熔融金属喷出装置以及熔融金属喷出方法

Country Status (5)

Country Link
US (1) US20150336195A1 (https=)
JP (1) JP6157408B2 (https=)
KR (1) KR20150135050A (https=)
CN (1) CN105097611A (https=)
DE (1) DE102014226286A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211610A (zh) * 2016-07-27 2016-12-07 无锡深南电路有限公司 一种pcb线路加工方法和喷涂设备
CN112643165A (zh) * 2020-12-29 2021-04-13 深圳市福英达工业技术有限公司 熔融焊接材料的装置及建立电子连接的方法
CN120791065A (zh) * 2025-09-15 2025-10-17 深圳市紫宸激光设备有限公司 一种用于软钎焊接的锡球备料装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL283235B2 (en) 2018-11-20 2026-03-01 Fujifilm Electronic Mat Usa Inc Solvent purification systems and methods
KR200492999Y1 (ko) * 2019-07-05 2021-01-14 김창규 화장품용 충진노즐의 가열장치
CN112627662B (zh) * 2020-12-28 2022-12-09 北京北方华创微电子装备有限公司 半导体工艺设备及开门机构
CN118695917A (zh) 2022-02-25 2024-09-24 三菱电机株式会社 熔融金属喷出装置及熔融金属喷出方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04279258A (ja) * 1991-03-06 1992-10-05 Nippon Steel Corp 連続鋳造用溶湯供給ノズル
JPH09246707A (ja) * 1996-03-12 1997-09-19 Matsushita Electric Ind Co Ltd 半田吐出装置
US5829689A (en) * 1996-01-29 1998-11-03 Samsung Aerospace Industries, Ltd. Solder spreading apparatus
CN1711145A (zh) * 2002-11-18 2005-12-21 沙迪克普拉斯泰克株式会社 冷室压铸机中的注射装置及其使用的测量方法
JP2011194456A (ja) * 2010-03-23 2011-10-06 Mitsubishi Electric Corp 溶融金属吐出装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0588668U (ja) * 1991-10-23 1993-12-03 日本電気ホームエレクトロニクス株式会社 外部ヒータを有する定量吐出装置
JP3585659B2 (ja) * 1996-08-21 2004-11-04 三菱電機株式会社 ペースト材料吐出装置
JP2009006233A (ja) * 2007-06-27 2009-01-15 Victor Co Of Japan Ltd 液体吐出用ノズル装置及びそれを備えた液体塗布装置
JP2011121070A (ja) * 2009-12-08 2011-06-23 Hitachi Global Storage Technologies Netherlands Bv ヘッド・ジンバル・アセンブリの製造方法及びヘッド・ジンバル・アセンブリの接続パッドを相互接続する装置
JP2013028101A (ja) * 2011-07-29 2013-02-07 Seiko Epson Corp 液体噴射ヘッド及び液体噴射装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04279258A (ja) * 1991-03-06 1992-10-05 Nippon Steel Corp 連続鋳造用溶湯供給ノズル
US5829689A (en) * 1996-01-29 1998-11-03 Samsung Aerospace Industries, Ltd. Solder spreading apparatus
JPH09246707A (ja) * 1996-03-12 1997-09-19 Matsushita Electric Ind Co Ltd 半田吐出装置
CN1711145A (zh) * 2002-11-18 2005-12-21 沙迪克普拉斯泰克株式会社 冷室压铸机中的注射装置及其使用的测量方法
JP2011194456A (ja) * 2010-03-23 2011-10-06 Mitsubishi Electric Corp 溶融金属吐出装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211610A (zh) * 2016-07-27 2016-12-07 无锡深南电路有限公司 一种pcb线路加工方法和喷涂设备
CN112643165A (zh) * 2020-12-29 2021-04-13 深圳市福英达工业技术有限公司 熔融焊接材料的装置及建立电子连接的方法
CN120791065A (zh) * 2025-09-15 2025-10-17 深圳市紫宸激光设备有限公司 一种用于软钎焊接的锡球备料装置
CN120791065B (zh) * 2025-09-15 2025-11-18 深圳市紫宸激光设备有限公司 一种用于软钎焊接的锡球备料装置

Also Published As

Publication number Publication date
JP2015221452A (ja) 2015-12-10
JP6157408B2 (ja) 2017-07-05
KR20150135050A (ko) 2015-12-02
DE102014226286A1 (de) 2015-11-26
US20150336195A1 (en) 2015-11-26

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Application publication date: 20151125