KR20150062216A - Sawing Apparatus of Semiconductor Materials - Google Patents

Abstract

Disclosed is a cutting apparatus for a semiconductor material having a washing unit. According to an embodiment of the present invention, a cutting apparatus for a semiconductor material comprises: a unit picker returning a semiconductor material which is cut to an individual unit in a cutting unit to an arrangement unit; and a washing unit having a brush rubbing a semiconductor material by relative movement with the unit picker. The unit picker comprises: an absorption unit absorb a semiconductor material; and a dam member placed on an outer area, and being primarily in contact with the brush.

Description

[0001] Sawing Apparatus of Semiconductor Materials [0002]

The present invention relates to a semiconductor material cutting apparatus, and more particularly, to a semiconductor material cutting apparatus including a cleaning unit.

Generally, semiconductor materials include semiconductor chips and semiconductor packages. 2. Description of the Related Art A semiconductor chip is formed by integrating a highly integrated circuit such as a transistor and a capacitor in a plurality of regions arranged in a lattice pattern on a surface of a semiconductor wafer of a disk shape. Each region where such a circuit is formed is subjected to a step of cutting the semiconductor chip into individual semiconductor chips using a cutting apparatus.

After a semiconductor chip is mounted on a silicon semiconductor substrate as an individual unit, the semiconductor substrate is subjected to a molding process using an epoxy molding compound (EMC) on the top surface of the semiconductor substrate. A ball grid array (BGA) or a wire attached to a chip to conduct electricity to the chip is called a strip or a wafer level package (WLP) according to its shape. Such a strip or wafer level package is cut into individual semiconductor packages using a cutting device. This cutting process is referred to as singulation, and the device used for this is called a semiconductor material cutting device.

The semiconductor package individualized by the cutting device is adsorbed by the unit picker, and the unit picker moves to the cleaning part to remove foreign matter, debris, and the like from the surface of the semiconductor package, and then is transported to the sorting part. In the cleaning unit, a method is generally used in which the unit picker moves on the brush or the sponge or the like to remove foreign matter, debris, or the like by friction with the brush or the sponge. However, in the case of a material having a relatively low holding force due to a relatively small semiconductor package (usually referred to as 3 mm x 3 mm or less) or other reasons, since the unit picker is weak in suction force holding an individual semiconductor package, And the alignment state is changed.

Particularly, there is a problem in that the semiconductor package of the outermost column adsorbed by the unit picker suffers the greatest amount of force of the brush, so that the semiconductor package adsorbed by the unit picker is pushed or twisted in the correct position. In addition, there is also a problem that the edge of the absorption pad for absorbing the semiconductor package in the outermost row is worn by the contact of the brush, and the dust abrasion residue of the absorption pad is dropped.

Korean Patent Laid-Open Publication No. 10-2006-0002456 discloses a semiconductor manufacturing process cutting and processing apparatus, but does not solve the conventional problems.

Korean Unexamined Patent Application Publication No. 10-2006-0002456 (published on July 12, 2007)

An embodiment of the present invention is to provide a semiconductor material cutting apparatus capable of maintaining the alignment state of each of the semiconductor packages cut during cleaning of the semiconductor package.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a unit picker for transporting a semiconductor material cut in individual units to a cutting unit; And a cleaning unit including a brush which rubs the semiconductor material by a relative movement with the unit picker, wherein the unit picker comprises: a suction part for picking up the semiconductor material; And a dam member disposed in contact with the brush and primarily contacting the brush.

Wherein the bristles consist of a plurality of strands successively located, and a semiconductor material which rubs the semiconductor material from the strand adjacent to the semiconductor material by the dam member, which is provided between the strand and the semiconductor material when approaching the semiconductor material, A cutting device may be provided.

And the dam member is located on both outer sides of the suction unit with respect to the relative movement direction of the unit picker and the brush.

The unit picker may include a body part and a suction part for picking up the upper surface of the semiconductor material on the chuck table, and the dam member may be provided detachably on the outer periphery of the suction part.

Wherein the unit picker is rotatable by 90 degrees and the dam member is provided so as to surround the outer periphery of the semiconductor material so that the dam member is in primary contact with the brush even when the unit picker rotates by 90 degrees .

Wherein the unit picker moves along the conveying rail and the cleaning unit is fixed to a moving region of the unit picker and has a fixed cleaning portion in which the semiconductor material and the brush are rubbed by the movement of the unit picker, And a movement cleaning section provided to be movable in a moving direction of the picker in a direction intersecting with the movement direction of the unit picker, wherein the semiconductor material and the brush are rubbed against each other, And a second dam member disposed on both outer sides of the semiconductor material with respect to the traveling direction of the brush of the movable cleaning unit.

The semiconductor material cutting apparatus according to the embodiment of the present invention can reduce or keep the force of the brush applied to each semiconductor package adsorbed on the unit picker by providing a dam member on the side of the semiconductor package adsorption section.

Therefore, even when a small semiconductor package is used, the picked up state can be stably fixed without causing a positional deviation. Therefore, even when the semiconductor package is mounted on the alignment table in the future, the semiconductor package can be placed in the correct position.

In addition, the number of brushes that apply force to the outermost semiconductor package can be reduced by preventing the dam member from damaging the brush for a predetermined time.

The semiconductor material cutting apparatus according to the embodiment of the present invention can clean the semiconductor package from all directions by operating the movable cleaning unit together with the stationary cleaning unit, thereby improving the cleaning rate.

1 is a view showing a semiconductor material cutting apparatus according to an embodiment of the present invention.
FIGS. 2 and 3 show a process of washing semiconductor material in a general cleaning unit. FIG. 2 shows a state in which the brush contacts the semiconductor material, and FIG. 3 shows a side view showing the state in which the brush pushes the semiconductor material.
FIGS. 4 and 5 illustrate a process of washing semiconductor material in a cleaning unit of a semiconductor material cutting apparatus according to an embodiment of the present invention. FIG. 4 shows a state in which the brush is in contact with a dam member, And is a side view showing a state of washing the semiconductor material.
6 is a view showing a method of joining a dam member according to an embodiment of the present invention.
7 is a view showing a method of joining a dam member according to another embodiment of FIG.
8 is a view showing a semiconductor material cutting apparatus according to another embodiment of the present invention.
9 is a bottom view showing a unit picker according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. The present invention is not limited to the embodiments shown, but may be embodied in other forms. For the sake of clarity of the present invention, the drawings may omit the parts of the drawings that are not related to the description, and the size of the elements and the like may be somewhat exaggerated to facilitate understanding.

1 is a view showing a semiconductor material cutting apparatus according to an embodiment of the present invention.

The semiconductor material of the present invention includes a semiconductor chip for cutting a wafer into individual circuit forming regions and a semiconductor package for cutting a strip or a wafer level package (WLP) . Hereinafter, embodiments of the present invention will be described using a strip-shaped semiconductor material, but a case of using a round wafer instead of a strip type is also included in the embodiment of the present invention.

1, the semiconductor material cutting apparatus 11 according to the embodiment of the present invention can individually sort the strip S supplied from the on-loader unit 10 into units of a semiconductor package (including P and semiconductor chips) have. Although not shown in detail in the drawing, the on-loader unit 10 includes a plurality of receiving portions (not shown) on which the strip S is seated, and the receiving portion is provided with a layer in the height direction, . ≪ / RTI > The strip S moved to the feeding position can be taken out of the inlet rail 22 by the blow of a pusher (not shown).

The cutting device 11 includes an inlet rail 22 on which the strip S carried out from the on-loader section 10 is seated and aligned and a strip S of the inlet rail 22, A cutter 40 for cutting the strip S conveyed from the inlet rail 22 into individual packages and a strip S cut at the cutter 40 to pick up the strip S, A unit picker 100 for conveying the cut strip S to a sorting apparatus (not shown), and a cleaning unit 50 for cleaning the cut strip S.

The division of the apparatus is merely a division according to the function, not the physical division, for convenience. Although the semiconductor material cutting apparatus according to the embodiment of the present invention can be included in one apparatus to function as a series of functions, even if some of the constitutions are constituted of separate apparatuses or are included in other apparatuses, .

Hereinafter, each configuration of the cutting apparatus 11 will be described in detail.

The inlet rail 22 includes a pair of rails spaced apart from each other so as to support both sides of the strip S from positions corresponding to the conveying positions of the on- The material picker 20 is mounted on the conveying rail 30 and is movable and is a means for conveying the strip S from the inlet rail 22 to the cut portion 40. The material picker 20 can pick up the strip S using an adsorption method.

Although not shown in the drawings, the inlet rail 22 or the material picker 20 may include an alignment unit (not shown) capable of aligning the position of the strip S. In addition, it is possible to correct the position of the strip S, which is distorted in the alignment unit, including the inspection vision (not shown) for inspecting the position of the strip S.

The cut section 40 includes a chuck table 41 provided with a strip S conveyed by the material picker 20 and fixed and fixed so as to be movable in a direction intersecting the conveyance rail 30, And a cutting blade 42 for cutting the strip S placed on the chuck table 41 in units of individual semiconductor packages P while moving relative to the chuck table 41. [

The cut portion 40 is provided on the movement path of the chuck table 41 so as to be movable up and down and moves to the upper portion of the chuck table 41 after the cutting operation is completed and the semiconductor package P And a brush (not shown) for removing scrap in contact with a scrap other than the scrap. The brush can be moved up and down by a linear motion device such as a pneumatic cylinder. The scrap removed by the brush can be removed by the conveyor belt 44.

The chuck table 41 is provided with a suction vacuum hole at a position corresponding to the position of the individual semiconductor material aligned in the strip S. Since the suction vacuum holes adsorb the individual semiconductor materials, it is possible to prevent the semiconductor materials from being twisted by the forces generated in the cutting process. The chuck table 41 is formed with a blade escape groove so as to be accommodated in a position corresponding to the semiconductor material cutting line formed in a lattice pattern on the strip S while the blade edge of the cutting blade 42 is not contacted. Therefore, when cutting the strip S on the chuck table 41 along the cutting line while the blade of the cutting blade 42 and the chuck table 41 move relative to each other, the blade edge of the blade passes through the blade escape groove, It is possible to cut the strip S without contacting the table 41.

Although not shown in the drawings, the cutting blade 42 is provided on the cutting unit 40 so as to cool the heat generated in the cutting process when the strip S is cut and to remove foreign matter such as debris, A nozzle (not shown) may be installed.

The semiconductor package (P), which has been cut at the cut portion, is transported to the alignment portion (12) by the unit picker (100). The unit picker 100 can move along the conveying rail 30 and is subjected to a cleaning process in the cleaning unit 50 in the process of moving to the alignment unit 12. [ The cleaning unit 50 can use a brush and washing water to remove burrs or scrap on the surface of the semiconductor package P or foreign matter remaining between adjacent semiconductor packages P without being removed. have. Although not shown in the drawing, the unit picker 100 passing through the cleaning unit 50 can dry the semiconductor package P through a drying unit (not shown). The drying unit may use a dry block or an air blower.

Hereinafter, the process of cleaning the semiconductor material P by the unit picker 100 passing through the cleaning unit 50 will be described with reference to the drawings. Hereinafter, the semiconductor material P may mean one piece cut into individual units or one unit before cutting. If there is a risk of confusion in the context, the semiconductor material (P) cut into individual units is called an individualized semiconductor material (P) to avoid confusion.

2 and 3 show a state in which the semiconductor material P is cleaned in the general cleaning unit 50. FIG. 2 shows a state in which the brush 51 contacts the semiconductor material P, FIG. 3 shows a state in which the brush 51 contacts the semiconductor material P. FIG. 51) push the semiconductor material (P).

The unit picker 100 can move along the transport rail 30 by adsorbing the upper surface of the semiconductor material P on the chuck table 41. [ The unit picker 100 includes a body part 111 and a suction part 110 located below the body part 111 and absorbing the semiconductor material P. [ The adsorption unit 110 is provided with a vacuum hole (not shown) to adsorb and fix the semiconductor material P by a pneumatic pressure. One unit picker 100 can adsorb individualized semiconductor materials P of various sizes. When the size of the individual semiconductor material P cut at this time is relatively large (usually 3 mm x 3 mm or more), the width of the semiconductor material P increases and the area of the adsorption increases proportionally. The attraction force applied to the material P increases. On the other hand, in the case where the size of the cut individual semiconductor material P is relatively small (usually 3 mm x 3 mm or less), since the width of the semiconductor material P is reduced and the area of the adsorption is narrowed, The attraction force applied to the semiconductor material P is reduced. Accordingly, in the case of a semiconductor material P having a small size of 3 mm x 3 mm or less or another kind of semiconductor material P having a weak holding force due to another reason, the vacuum force for holding the package of the unit picker is weak, The semiconductor material P adsorbed on the semiconductor material P may be twisted or pushed at a predetermined position.

The cleaning unit 50 may be provided in a moving region where the unit picker 100 moves, and may be provided in the form of a brush 51, a sponge, or a combination thereof capable of rubbing the semiconductor material P. The brushes 51 may be formed of a plurality of strands to form one strand, and the plurality of strands may be disposed at a predetermined distance. The semiconductor material P is cut by the cutting blade 42 of the cutting portion 40 and debris such as burr or scrap is formed on the surface thereof and foreign matter that is not removed can remain . When the unit picker 100 carries the semiconductor material P to the alignment unit 12 and the inspection apparatus (not shown) inspects the individual semiconductor material P, if the above debris and foreign matter remain, . Such debris and foreign matter can be removed by friction with the brush 51, sponge, or the like.

The washing section 50 may hold the washing water between the brush strands or the bundles, or may hold the washing water between the sponges. The washing water accommodates debris and foreign matter removed by the brush 51 or a sponge, and helps the brush 51 or the sponge to remove debris and foreign matter more easily. The washing unit 50 may include a washing water supply unit 53 for supplying washing water and a washing water hole 52 connected to the washing water supplying unit 53 and provided between the brush bundles.

Hereinafter, the brush 51 is described as an example in the embodiment of the present invention and in the drawings. However, other brushes, sponges, EVA (ethylene-vinyl acetate copolymer) And a brush of various types such as a fixed brush, a rotary brush, a vibrating brush, and a bell sponge brush may be used in the case of a brush.

The attraction force of the semiconductor material P is proportional to the contact area of the individual semiconductor material P and the force of the brush 51 applied to the semiconductor material P is proportional to the contact area of the brush material It is proportional to the number. Usually a bundle of brushes 51 simultaneously applies a force to an individualized semiconductor material P.

Fig. 2 shows a state in which the brush 51 is in contact with the individualized semiconductor material P1 located at the outermost periphery. At this time, the individualized semiconductor material P1 in contact with the brush 51 is subjected to the force of the brush bundle 51a located at the outermost position. When the size of the individual semiconductor material P1 is small and the area of adsorption to the adsorption unit 110 is small, the force of the brush bundle 51a can not be surpassed, and the position of the individualized semiconductor material P1 varies. Fig. 3 shows a state in which the position of the individualized semiconductor material P1 has been changed so as to touch the semiconductor material P2. As the two semiconductor materials P1 and P2 are brought into contact with each other, the attraction force acts on the area of the two semiconductor materials, and there is a room for overcoming the force of the brush bundle 51a. However, Fig. 3 shows a state in which the brush bundle 51a located at the outermost portion is in contact with the brush bundle 51b positioned next to the brush bundle 51b, and the strands of the brush bundle 51a located at the outermost position are in contact with the semiconductor And has not passed over the material P1. Thus, two adjacent semiconductor materials P1 and P2 are subjected to a force by the two brush bundles 51a and 51b.

As described above, in the conventional semiconductor material cutting apparatus, there is a possibility that the position of the semiconductor material P is fluctuated in the process of cleaning the semiconductor material P. In particular, it can be seen that the individualized semiconductor material P1 located at the outermost periphery has a large possibility of positional variation.

4 and 5 illustrate how the semiconductor material P is washed in the cleaning unit 50 of the semiconductor material cutting apparatus according to the embodiment of the present invention. Fig. 5 is a side view showing a state in which the brush 51 cleans the semiconductor material P. Fig.

The unit picker 100 of the semiconductor material cutting apparatus according to the embodiment of the present invention includes a dam member (not shown) disposed on the outer periphery of the individualized semiconductor material P1 located at the first edge of the semiconductor material P adsorbed to the adsorption unit 110 120 are installed. The outer periphery of the semiconductor material P can be interpreted as the outer periphery of the adsorption unit 110. However, if the semiconductor material P is located outside the individualized semiconductor material P located at the first edge, .

The dam member 120 may be provided on both sides before and after the advancing direction of the unit picker 100 so that the brush 51 firstly contacts the semiconductor material P before the brush 51 contacts the semiconductor material P. [ Lt; / RTI > The unit picker 100 reciprocates the washing unit 50 to effectively remove debris or foreign matter from the semiconductor material P. [ The dam member 120 is preferably provided on both sides of the semiconductor material P because the direction in which the brush 51 approaches the semiconductor material P can be both directions.

That is, in the case where the dam member is not provided, when the unit picker is washed at the upper portion of the brush due to the reciprocating movement of the unit picker, the sweeping force of the brush is applied to the semiconductor material of the first row and the last row. The most amount of force is applied to the dam member and a uniform force can be applied to the semiconductor material.

4 shows a state in which the brush bundle 51a located at the outermost portion of the brush 51 is in contact with the dam member 120 and bent. Up to this point, since the dam member 120 supports the force applied by the brush bundle 51a, the individualized semiconductor material P1 located at the edge is not subjected to the force of the brush 51. [

5 is a view showing a state in which the semiconductor material P (P1), which has passed through the dam member 120 in order from the strand adjacent to the semiconductor material P in the brush bundle 51a that has been hung on the dam member 120 as the unit picker 100 moves, ). Therefore, the brush 51 that applies the force to the individualized semiconductor material P1 is only a brush strand that passes over the dam member 120. [ 3 and 5, it can be seen that the force of the brush 51 applied to the individualized semiconductor material P1 located at the outermost position by the dam member 120 decreases.

FIG. 6 is a view showing a method of joining the dam member 120 according to an embodiment of the present invention, and FIG. 7 is a view showing a joining method of the dam member 122 according to another embodiment of FIG.

The dam members 120 and 122 may be detachably coupled as shown in FIG. 6, and may be integrally formed with the adsorption unit 110 as shown in FIG. 6 shows that the dam member 120 is provided on the outer periphery of the adsorption unit 110 and the dam member 120 is engaged with the body part 111 by the bolt 121. Fig. 7 shows the dam member 122 which is integrally formed and protruded at the end of the adsorption section 110. As shown in Fig. If the suction unit 110 is made of a rubber material, the dam member 122 may also be made of a rubber material. In this case, the dam member 122 can be bent so that the brush strand can be more easily handed in the direction of the semiconductor material P. However, care must be taken not to apply a force to the semiconductor material P as the dam member 122 is bent.

Although not shown in the drawing, the dam member 120 may be formed of various materials. The dam member 120 may be bonded or bonded to the body portion 111 or the absorption portion by welding or the like, And it is obvious that they may be integrally formed on the body portion.

Further, the dam member according to the embodiment of the present invention may be different in the type and size of the dam member, the installation interval of the dam member, and the like depending on the type and size of the material. The spacing between the outermost material and the dam member may preferably be similar or slightly larger than the spacing between the cut semiconductor materials. However, when the gap between the outermost semiconductor material and the dam member is too large, the frictional resistance between the outermost semiconductor material and the brush increases regardless of the resistance attenuated by the dam member. Therefore, It is desirable to select and adjust the gap between the material and the dam member at an appropriate level.

Although not shown separately in the drawings of the present invention, when the dam member is coupled to the body portion or the suction portion by bolts or the like, it may further include a gap adjusting means of the dam member.

The height of the dam member may vary depending on the thickness of the adsorbing portion, the type and thickness of the semiconductor material, and preferably the height of the semiconductor material adsorbed on the adsorbing portion of the unit picker or higher than the semiconductor material. That is, in the case of a method of being coupled to the body part, a value obtained by combining the thickness (height) of the suction part and the thickness (height) of the semiconductor material will correspond to the height of the dam member. It is preferable that the dam member protrudes corresponding to the thickness (height).

It has been explained that both sides of the semiconductor material P are rubbed while the unit picker 100 reciprocates on the brush 51 of the fixed cleaning part 50 to remove debris or foreign matter from the semiconductor material P. Respectively. However, in order to more effectively remove debris or foreign matter from the semiconductor material P, it is preferable that the brush 51 rub around the periphery of the semiconductor material P. [ For example, the brush 51 does not only rub against the left and right sides of the semiconductor material P but also does not rub against the semiconductor material P when it rubs up and down the semiconductor material P, Foreign matter can be effectively removed. In this case, the left-right direction and the up-and-down direction of the semiconductor material P mean the direction on the plane with reference to the bottom surface of the semiconductor material P.

For this purpose, the unit picker 100 may be provided so as to be rotatable in the xy plane direction about the z axis. The unit picker 100 is rotated by 90 degrees so that the four brushes 51 can be used to frictionally grasp the four sides of the semiconductor material P in the left-right direction and the up-down direction.

In the present invention, the unit picker may be reciprocated on the fixed cleaning unit, but the brush of the cleaning unit may reciprocate or rotate to clean the semiconductor material while the unit picker is fixed. The number of times the unit picker, the brush or the like is reciprocated during the washing is preferably one or more times.

FIG. 8 is a view showing a semiconductor material cutting apparatus according to another embodiment of the present invention, and FIG. 9 is a bottom view showing a unit picker 100 according to another embodiment of the present invention.

The cleaning unit 50 of the semiconductor material cutting apparatus according to another embodiment of the present invention is fixed in a moving region of the unit picker 100 and is moved in the direction of the movement of the unit picker 100, A fixed cleaning portion 54 on which the semiconductor pick-up member 51 is rubbed and a fixed cleaning portion 54 which is provided so as to be movable in a moving direction of the unit picker 100 in a moving region of the unit picker 100, And a moving cleaning portion 55 in which the cleaning portion 55 is rubbed. The degree of intersection between the movement direction of the movement cleaning section 55 and the movement direction of the unit picker 100 may be vertical. The movable cleaning portion 55 can move along the rails.

Referring to FIG. 8, the unit picker 100 reciprocates on the stationary cleaning part 54, and the left and right edges of the semiconductor material P rub against the brush 51 to remove debris or foreign matter. The upper and lower edges of the semiconductor material P are rubbed against the brush 51 while the unit cleaner unit 100 stops on the moving region of the movable cleaning unit 55 and the movable cleaning unit 55 moves up and down. Therefore, all the four directional edges of the semiconductor material P are rubbed by the brush 51, so that debris or foreign matter can be effectively removed.

The combination of the unit picker 100 rotatable by 90 degrees described above and the fixed washing section 54 and the moving washing section 55 described in the foregoing description are all provided in the right and left and upper and lower four directions of the semiconductor material P, ) Are common in that they have relative motion. The unit picker 100 shown in Fig. 9 is provided such that the dam member 120 surrounds the outer periphery of the semiconductor material P so that the brush 51 can be pressed against the semiconductor material P even if the brush 51 enters in any direction. The dam member 120 is prevented from damaging it first.

10: on-loader section, 11: cutting device,
12: alignment part, 20: material picker,
21: gripper, 22: inlet rail,
30: conveying rail, 40: cutting portion,
41: chuck table, 42: cutting blade,
43: cutting rail, 44: conveyor belt,
50: washing section, 51: brush,
52: wash water hole, 53: wash water supply part,
54: fixed cleaning unit, 55: moving cleaning unit,
100: unit picker, 110: absorption part,
111: body portion, 120: dam member

Claims (9)

A cutting unit for cutting the semiconductor material into individual units;
A unit picker for picking up and moving the semiconductor material cut by the cutting unit; And
And a cleaning unit disposed in a moving region where the unit picker moves and having cleaning means for rubbing the semiconductor material adsorbed by the unit picker to remove foreign matter,
The unit-
The semiconductor device according to any one of claims 1 to 3, further comprising: a body portion; a suction portion positioned at a lower portion of the body portion to absorb the semiconductor material; And a dam member protruding from the suction portion. The method according to claim 1,
Wherein the cleaning means is a brush, a sponge, an ethylene-vinyl acetate copolymer (EVA) material, or a combination thereof. 3. The method of claim 2,
Wherein the brush is provided with a plurality of strands successively disposed thereon and rubbing the semiconductor material through the dam member sequentially from a strand adjacent to the semiconductor material by the dam member provided between the strand and the semiconductor material when approaching the semiconductor material, Semiconductor material cutting equipment for cleaning materials. The method according to claim 1,
Wherein the dam members are provided on both outer sides of the adsorbing portion in the forward and backward directions with respect to the advancing direction of the unit picker. The method according to claim 1,
Wherein the dam member is provided both in the forward, backward, left and right directions of the adsorption unit with respect to the advancing direction of the unit picker. The method according to claim 1,
And the dam member is detachably coupled to the body portion or the suction portion. The method according to claim 1,
And the dam member is integrally formed and protruded at an end of the suction unit. 3. The method according to claim 1 or 2,
The unit picker being rotatable on an xy plane about a z-axis,
Wherein the dam member is provided so as to surround an outer periphery of the semiconductor material, and the dam member is in primary contact with the cleaning means even when the unit picker is rotated. 3. The method according to claim 1 or 2,
The unit picker moves along a conveying rail,
The cleaning unit includes a stationary cleaning unit that is fixed in a moving region of the unit picker and in which the semiconductor material and the brush are rubbed by the motion of the unit picker, And a movement cleaning part provided so as to be movable in a direction intersecting with the semiconductor material and the cleaning part,
Wherein the dam member includes a first dam member located on both outer sides of the semiconductor material with respect to the advancing direction of the brush of the fixed washing section and a second dam located on both outer sides of the semiconductor material with respect to the traveling direction of the washing means of the moving washing section, Wherein the semiconductor device is a semiconductor device.

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