WO2020004761A1

WO2020004761A1 - Brush device

Info

Publication number: WO2020004761A1
Application number: PCT/KR2019/001264
Authority: WO
Inventors: 한복우; 조윤기
Original assignee: 제너셈(주)
Priority date: 2018-06-29
Filing date: 2019-01-30
Publication date: 2020-01-02
Also published as: KR20200002181A; KR102085118B1

Abstract

Disclosed is a brush device. The brush device comprises: a brush part including a planar brush structure and a roll brush structure; and a first holding part for holding a semiconductor package and contacting the held semiconductor package with at least one of the planar brush structure and the roll brush structure, wherein each the planar brush structure and the roll brush structure vibrate for a predetermined time when making contact with the semiconductor package.

Description

Brush device

The present application relates to a brush device.

The semiconductor package manufacturing system includes a cutting process of cutting a semiconductor package cut into strips in which a plurality of semiconductor packages are formed, a washing process of washing the semiconductor package cut in the cutting process, a drying process of drying the cleaned semiconductor package in the washing process, and a drying process. The semiconductor package inspection process for inspecting the completed semiconductor package for defects and the offload process for classifying the semiconductor package that passed the defect inspection and the semiconductor package that did not pass according to the inspection result are sequentially performed. Individual semiconductor packages can be manufactured.

However, in the conventional semiconductor package manufacturing system, even when the semiconductor package is washed and dried, foreign matters such as burrs may remain on the surface of the semiconductor package, and an error may occur during the inspection process.

Background art of the present application is disclosed in Korea Patent Publication No. 10-0904496.

An object of the present invention is to provide a brush device that can effectively remove foreign substances such as burrs on the surface of a semiconductor package before the inspection process of the semiconductor package.

However, the technical problem to be achieved by the embodiments of the present application is not limited to the technical problems as described above, and other technical problems may exist.

As a technical means for achieving the above technical problem, a brush device according to an embodiment of the present application, a brush unit including a planar brush structure and a roll brush structure; And a first gripping portion for holding the semiconductor package and contacting the held semiconductor package with at least one of the planar brush structure and the roll brush structure, wherein each of the planar brush structure and the roll brush structure is in contact with the semiconductor package. When the vibration can be a predetermined time.

According to one embodiment of the present application, the planar brush structure, the base portion; And a plurality of brush units protruding upward from the base part and disposed along a length direction and a width direction of the base part, wherein the first holding part contacts the held semiconductor package with the brush unit.

According to one embodiment of the present application, the planar brush structure, the vibration in the longitudinal direction, the vibration in the width direction and the vibration in the circumferential direction of the axis in the vertical direction is possible.

According to one embodiment of the present application, when the planar brush structure vibrates in the longitudinal direction, the first grip portion is in the width direction so that the gripped semiconductor package in contact with the planar brush structure vibrates in the width direction. When the flat brush structure vibrates in the width direction, the gripped semiconductor package vibrates in the longitudinal direction so as to vibrate in the longitudinal direction, and when the flat brush structure vibrates with movement in the circumferential direction. The gripped semiconductor package may vibrate to rotate in a direction opposite to the movement direction of the planar brush structure.

According to an embodiment of the present application, the brush unit comprises: a first linear drive unit for moving the base unit in the longitudinal direction; A second linear drive unit which moves the base part in the width direction; And a rotating unit rotating the base part in the circumferential direction.

According to one embodiment of the present application, the roll brush structure, the shaft portion is disposed so that the longitudinal direction is parallel to the longitudinal direction of the base portion; And including a brush unit extending in a spiral form along the circumference of the shaft portion, it may be provided at the rear of the flat brush structure.

According to one embodiment of the present application, further comprising an alignment portion on which the semiconductor package is completed contact with at least one of the flat brush structure and the roll brush structure is loaded, the alignment portion is formed recessed downward from the upper surface, The first gripper may include a recessed portion in which the semiconductor package held by the first gripper is individually stacked.

According to an exemplary embodiment of the present disclosure, the inner side surface of the recess may include an inclined surface that is inclined so that the semiconductor package placed into the recess is shifted to the bottom surface to be offset from the bottom surface of the recess.

The brush device according to the exemplary embodiment of the present disclosure may further include a second gripping part which grips the semiconductor package separately loaded on the alignment part and transfers the semiconductor package to the vision inspection part.

Brush apparatus according to an embodiment of the present application may further include a dust collector provided on the lower side of the flat brush structure and the roll brush structure to suck the falling foreign matter.

The above-mentioned means for solving the problems are merely exemplary and should not be construed as limiting the present application. In addition to the above-described exemplary embodiments, additional embodiments may exist in the drawings and detailed description of the invention.

According to the aforementioned problem solving means of the present application, the semiconductor package may be brushed by one or more vibrations of the planar brush structure and the roll brush structure. Accordingly, foreign matter such as burrs on the surface of the semiconductor package can be removed by brushing, so that inspection can be performed accurately and easily during the inspection process.

1 is a perspective view of a brush device according to one embodiment of the present application in which a part of the configuration of the brush part is omitted so that the inside of the brush part is shown.

2 is a perspective view of a brush part of the brush device according to an exemplary embodiment of the present disclosure, in which a part of the brush part is omitted so that the inside of the brush part is shown.

3 is a side view viewed from an oblique angle of a brush part of the brush device according to an exemplary embodiment of the present disclosure, in which a part of the brush part is not illustrated so that the inside of the brush part is shown.

4 is a schematic cross-sectional view of a gripping portion of a brush device according to an embodiment of the present application in which the position of the held semiconductor package is in a fixed position.

5 is a schematic cross-sectional view of a gripping portion of a brush device according to an embodiment of the present application in which the position of the held semiconductor package is out of position.

6 is a schematic cross-sectional view of an alignment of the brush device according to an embodiment of the present application on which the semiconductor package is placed.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present disclosure. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted for simplicity of explanation, and like reference numerals designate like parts throughout the specification.

Throughout this specification, when a portion is "connected" to another portion, this includes not only "directly connected" but also "electrically connected" with another element in between. do.

Throughout this specification, when a member is said to be located on another member "on", "upper", "top", "bottom", "bottom", "bottom", this means that any member This includes not only the contact but also the presence of another member between the two members.

Throughout this specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding the other components unless specifically stated otherwise.

In addition, in the description of the embodiments of the present application, terms related to directions or positions (upper, lower, front, rear, etc.) are set based on the arrangement state of each component shown in the drawings. For example, as shown in FIG. 1, the 12 o'clock direction is generally higher, the 6 o'clock direction is generally lower, the 4 o'clock is generally forward, and the 10 o'clock is generally backward.

The present application relates to a brush device.

Hereinafter, a brush device (hereinafter referred to as a 'bone brush device') according to an embodiment of the present application will be described.

The brush device can be applied to a semiconductor package cutting and inspection device. For example, the brush device may be provided to be brushed by the brush device before the semiconductor package is transferred to the inspection apparatus, for example, between the drying process after the cleaning process and the inspection process.

1 is a perspective view of a brush device according to an embodiment of the present application in which the illustration of a portion of the brush portion is omitted so that the inside of the brush portion is shown, and FIG. 3 is a perspective view of the brush part of the brush device according to an embodiment of the present invention, and FIG. 4 is a schematic cross-sectional view of a gripping portion of a brush device according to an embodiment of the present application in which the position of the held semiconductor package is in a correct position, and FIG. 5 is a state in which the position of the held semiconductor package is out of position. 6 is a schematic cross-sectional view of a gripping portion of a brush device according to one embodiment of the present invention, and FIG. Exemplary is a schematic cross-section aligned portion of the brush device according to the example.

Referring to FIG. 1, the brush device includes a brush unit 1. The brush portion 1 includes a planar brush structure 11 and a roll brush structure 12. 2 and 3, the planar brush structure 11 protrudes upward from the base portion 112 and the base portion 112 and is disposed along the longitudinal and width directions of the base portion 112. Unit 111 may be included. As will be described later, the brush unit 111 of the planar brush structure 11 may contact the semiconductor package P to brush the semiconductor package P. FIG. Therefore, the brush unit 111 of the planar brush structure 11 may be made of a material that does not damage the semiconductor package P when brushing the semiconductor package P.

In addition, referring to FIG. 3, the roll brush structure 12 may be provided at the rear of the planar brush structure 11, and the shaft part 121 may be disposed such that the longitudinal direction thereof is parallel to the longitudinal direction of the base part 112. It may include a brush unit 122 extending in the form of a spiral along the circumference of the shaft portion (121). The brush unit 122 of the roll brush structure 12 may brush the semiconductor package P while rotating about the shaft 121. Therefore, the brush unit 122 of the roll brush structure 12 may be made of a material that does not damage the semiconductor package P when brushing the semiconductor package P.

4, the brush device includes a first gripping portion 3. The first gripping portion 3 grips the semiconductor package P. The first holding part 3 is a device for holding a plurality of dried semiconductor packages P from a predetermined table provided in the semiconductor package cutting device and moving the upper portion of the brush device. The first gripper 3 may grip and transfer the semiconductor package P, release the grip, and load the semiconductor package P. For example, the first gripping portion 3 may grasp the semiconductor package P by vacuum suction. In addition, the first gripping portion 3 can release the gripping by releasing the vacuum suction to the semiconductor package P. FIG. In addition, the first gripper 3 may grip and transfer or release a plurality of semiconductor packages P (for example, eight) individually.

In addition, the first holding part 3 may hold the semiconductor package P, which has been dried. As described above, the brush device may be used to brush the semiconductor package P between the drying process and the inspection process. Accordingly, the semiconductor package P held by the first gripper 3 may be a semiconductor package P transferred to an inspection apparatus for an inspection process after a drying process.

In addition, the first gripping portion 3 may hold at least one of the planar brush structure 11 and the roll brush structure 12 that hold the semiconductor package P (the portion including at least a portion of the lower surface of the semiconductor package P). Contact with. In other words, the first gripper 3 grips (adsorbs) the dried semiconductor package P, and then moves to the top of the planar brush structure 11 and the roll brush structure 12 to planar brush structure 11. And one or more of the roll brush structures 12 for a predetermined time. For reference, the contact of the semiconductor package P held by the first holding part 3 to the planar brush structure 11 may be a contact between the semiconductor package P and the brush unit 111 of the planar brush structure 11. Can mean. Also, contact of the semiconductor package P held by the first gripper 3 with the roll brush structure 12 means contact between the semiconductor package P and the brush unit 122 of the roll brush structure 12. can do.

In addition, the first holding part 3 may hold the semiconductor package P and make contact with the brush unit 111 of the planar brush structure 11 for a predetermined time, and then move the alignment part 2 to be described later. Alternatively, the first gripper 3 may grip the semiconductor package P to contact the brush unit 122 of the roll brush structure 12 for a predetermined time, and then move it to the alignment unit 2 to be described later. Alternatively, the first gripper 3 grips the semiconductor package P and makes contact with the brush unit 111 of the planar brush structure 11 for a predetermined time, and then uniformly contacts the brush unit 122 of the roll brush structure 12. Time contact (or contact the brush unit 122 of the roll brush structure 12 for a predetermined time, and then contact the brush unit 111 of the planar brush structure 11 for a predetermined time) to move to the alignment unit 2 to be described later. You can.

Each of the planar brush structure 11 and the roll brush structure 12 vibrates for a predetermined time when the semiconductor package is in contact. Each of the planar brush structure 11 and the roll brush structure 12 may vibrate while the semiconductor package P is in contact with each other, thereby removing foreign matters such as burrs on the surface of the semiconductor package P. Accordingly, the term “predetermined time” may mean a time set by a user so that foreign matter on the surface of the semiconductor package P may be removed by each of the planar brush structure 11 and the roll brush structure 12. Since each of the planar brush structure 11 and the roll brush structure 12 may vibrate for a predetermined time when the semiconductor package P is in contact, the first gripping portion 3 may move the semiconductor package P to the brush portion at a predetermined time. 1) can be set to a predetermined time or less.

For example, the planar brush structure 11 can vibrate in the longitudinal direction (the longitudinal direction of the base portion 112). Referring to FIG. 3, the brush part 1 may include a first linear driving unit 113 which vibrates the base part 112 in the longitudinal direction. The first linear drive unit 113 may include a first linear drive guide 1132 connected to the base part 112 and a first linear drive guide 1132 to move in the longitudinal direction of the base part 112. 1 may include a guide rail 1131. The first guide rail 1131 may extend in a direction parallel to the longitudinal direction of the base portion 112, and the first linear driving guide 1132 may reciprocate on the first guide rail 1131. Accordingly, the base portion 112 may reciprocate in its longitudinal direction and oscillate in its longitudinal direction, and the brush unit 111 may reciprocate in the longitudinal direction of the base portion 112 and oscillate. As such, when the semiconductor package P is in contact, the planar brush structure 11 vibrates in the longitudinal direction of the base portion 112 so that the bottom surface of the semiconductor package P held by the upper side of the brush unit 111 is held. Alternatively, foreign matter on the side may be removed.

For reference, referring to FIG. 3, the first linear driving guide 1132 may be connected to the base portion 112 by the auxiliary plate 1133. In other words, the lower portion of the base portion 112 and the auxiliary plate 1133 are connected, and the lower portion of the auxiliary plate 1133 is connected to the first linear drive guide 1132, and the first linear drive guide 1132. May be connected to the base portion 112. Alternatively, as another example, the first linear driving guide 1132 may be directly connected to the base portion 112. In addition, the first linear driving guide 1132 and the first guide rails 1131 may be paired. Referring to FIG. 3, the pair may be provided in plural in the length direction of the base part 112. In exemplary embodiments, two pairs of the first linear driving guide 1132 and the first guide rail 1131 may be provided at intervals.

In addition, when the planar brush structure 11 vibrates in the longitudinal direction as described above, the first grip part 3 holds the semiconductor package P held in contact with the planar brush structure 11 in the width direction. It can vibrate in the width direction so as to vibrate in the (width direction of the base portion 112). In other words, the semiconductor package P may vibrate in the width direction perpendicular to the longitudinal direction when the planar brush structure 11 vibrates in the longitudinal direction while being in contact with the planar brush structure 11. As described above, the semiconductor package P is also perpendicular to the longitudinal direction by the first holding part 3 in a situation in which foreign matter on the surface of the semiconductor package P is removed due to vibration in the longitudinal direction of the planar brush structure 11. Since it may vibrate with respect to the planar brush structure 11 in the width direction, the effect of removing foreign substances on the surface of the semiconductor package P may be improved.

In addition, the planar brush structure 11 may vibrate in the width direction (the width direction of the base portion 112). Referring to FIG. 3, the brush part 1 may include a second linear driving unit 114 which vibrates the base part 112 in the width direction of the base part 112. The second linear drive unit 114 includes a second linear drive guide 1142 and a second linear drive guide 1142 connected to the base part 112 to move in the width direction of the base part 112. It may include a guide rail 1141. The second guide rail 1141 may be provided to extend in a direction parallel to the width direction of the base portion 112, and the second linear drive guide 1142 may reciprocate on the second guide rail 1141. Accordingly, the base portion 112 may reciprocate in its longitudinal direction and vibrate in the width direction thereof, and the brush unit 111 may reciprocate in the width direction of the base portion 112 and vibrate. As such, when the semiconductor package P is in contact with each other, the planar brush structure 11 may vibrate in the width direction of the base portion 112 to remove foreign substances on the semiconductor package P.

For reference, the second linear driving unit 114 may be provided below the first linear driving unit 113. For example, the second linear drive guide 1142 of the second linear drive unit 114 may be connected to the lower portion of the plate 1143 provided with the first guide rail 1131. According to this, as described above, the first linear drive unit 113 is connected to the base portion 112 through the auxiliary plate 1133, and the second linear drive unit 114 is connected to the first through the plate 1143. In the form of being connected to the linear drive unit 113, the second linear drive guide 1142 may be connected to the base portion 112. In this case, when the second linear drive guide 1142 moves on the second guide rail 1141, the first linear drive unit 113 and the first linear drive unit 1114 and the second linear drive guide 1142 are connected to each other through the plate 1143. The base 112 connected to the first linear drive unit 113 may be moved together, and thus, the first linear drive unit 113 and the planar brush structure during the widthwise reciprocation by the second linear drive unit 114. 11 can be moved together in the width direction.

In addition, referring to FIG. 3, the second linear driving guide 1142 and the second guide rail 1141 may be paired, and a plurality of such pairs may be provided in the longitudinal direction of the base part 112. For example, two pairs of the second linear driving guide 1142 and the second guide rail 1141 may be provided at intervals.

In addition, although not shown in detail in the drawings, the first linear drive unit 113 may include a motor that provides power for linear movement of the first linear drive guide 1132. In addition, the second linear drive unit 114 may include a motor that provides power for linear movement of the second linear drive guide 1142. In addition, according to another embodiment, a motor that provides a common movement power to the first linear drive unit 113 and the second linear drive unit 114 may be included. As such, each of the first linear drive guide 1132 and the second linear drive guide 1142 may be linearly moved by receiving power from a motor.

In addition, when the planar brush structure 11 vibrates in the width direction as described above, the first gripper 3 holds the semiconductor package P held in contact with the planar brush structure 11 in the longitudinal direction. It may vibrate in the longitudinal direction so as to vibrate in the (length direction of the base portion 112). In other words, the semiconductor package P may vibrate in the longitudinal direction perpendicular to the width direction when the flat brush structure 11 vibrates in the width direction while being in contact with the planar brush structure 11. As described above, the semiconductor package P is also perpendicular to the width direction by the first holding part 3 in a situation in which foreign matter on the surface of the semiconductor package P is removed due to vibration in the width direction of the planar brush structure 11. Since it may vibrate with respect to the planar brush structure 11 in the longitudinal direction, the effect of removing foreign substances on the surface of the semiconductor package P may be improved.

In addition, the planar brush structure 11 may rotate in the circumferential direction of the axis in the vertical direction. Referring to FIG. 3, the brush part 1 may include a rotation unit 115 that rotates the base part 112 in the circumferential direction of the axis in the vertical direction.

For example, the rotating unit 115 may include a rotating part 1153 which receives rotational force from a motor and an auxiliary rotating axis extending upward from the rotating part 1153 (in FIG. 3, the auxiliary rotating axis may be accommodated inside the housing 1151). And a main rotation shaft 1152 extending upwardly from the auxiliary rotation shaft and connected to the base portion 112. The primary axis of rotation 1152 may be provided such that its center is eccentric with respect to the center of the secondary axis of rotation. Accordingly, when the auxiliary rotation shaft is rotated, the main rotation shaft 1152 can move in the circumferential direction of the auxiliary rotation shaft. Accordingly, the main rotation axis 1152 may move in a circle along the circumferential direction of the axis in the vertical direction, and the planar brush structure 11 in which the base portion 112 is connected to the main rotation axis 1152 may move in a circle. have. As such, the planar brush structure 11 may vibrate by moving in a circle. For example, the main axis of rotation 1152 can move in a circle with a circumference of 4π mm. Accordingly, the planar brush structure 11 may move in a circle having a circumference of 4π mm. For reference, referring to FIG. 3, when the brush unit 1 includes the first linear driving unit 113, the second linear driving unit 114, and the rotating unit 115, the rotating unit 1153 and the auxiliary rotating shaft are provided. May be positioned below the first and second linear drive units 113 and 114, and the main axis of rotation 1152 is the first and second linear drive units 113 and 114 to ensure a moving path that draws a circle thereof. Passing through it may be connected to the lower side of the base portion (112).

In addition, when the planar brush structure 11 vibrates according to the rotational movement in the circumferential direction as described above, the first gripper 3 holds the held semiconductor package in a state of being in contact with the planar brush structure 11 ( P) may be oscillated to rotate in the reverse direction of the moving direction of the planar brush structure 11. For example, the planar brush structure 11 may move in a circle as described above. In this process, the planar brush structure 11 may move by drawing a clockwise or counterclockwise direction of the circle in a moving direction to draw a circle. The first gripping portion 3 may rotate to rotate the semiconductor package P in the reverse direction (counterclockwise or clockwise) of the movement direction (clockwise or counterclockwise) of the planar brush structure 11 as described above. Can be. Alternatively, as another example, the first gripping portion 3 may be formed in the first gripping portion 3 in the reverse direction (counterclockwise or clockwise) of the movement direction (clockwise or counterclockwise) of the planar brush structure 11. Can be vibrated by driving the central axis of and the semiconductor package P held therein to move in a circle.

In addition, according to one embodiment of the present application, the planar brush structure 11 may vibrate in the vertical direction. In this case, the planar brush structure 11 may include a vertical driving unit for vertically moving the vertical portion 112 (vertically up and down).

In addition, referring to FIG. 3, the brush part 1 may include a rotation force transmission structure 123 that transmits a rotational force to the shaft part 121 so that the roll brush structure 12 is rotated. The rotational force transmission structure 123 may include an external force receiving unit 1232, which receives an external force from the motor, and a belt structure 1231 that converts the rotational force of the external force receiving unit 1232 into the rotational force of the shaft 121. The axis of rotation of the external force receiving unit 1232 may be parallel to the shaft portion 121.

In addition, referring to FIG. 3, the external force receiving unit 1232 of the roll brush structure 12 may share an external force of a motor for rotating the rotating part 1153 of the planar brush structure 11. For example, referring to FIG. 3, the brush unit 1 extends from the motor to transmit the external force of the belt 1239 for rotating the rotating unit 1153 to the external force receiving unit 1232. It may include. The auxiliary external force receiving unit 1243 may have its axis of rotation parallel to the axis of rotation of the rotating part 1153, and the belt 1239 extending from the motor rotates through the rotating part 1153 and the auxiliary external force receiving unit 1234 and rotates the rotating part ( 1153 and the auxiliary external force receiving unit 1234 may be rotated. The rotational force of the auxiliary external force receiving unit 1234 may be transmitted to the external force receiving unit 1232 through a gear 1233 provided in the external force receiving unit 1232 and engaged with the auxiliary external force receiving unit 1234. The external force of the motor transmitted by the belt 1239 extending from the motor may be transmitted to the external force receiving unit 1232 via the auxiliary external force receiving unit 1234 and the gear 1233, and to the external force receiving unit 1232. The transmitted external force may rotate the shaft 121.

In addition, referring to FIG. 3, the brush device may include a dust collector 13 provided at a lower side of the planar brush structure 11 and the roll brush structure 12 to suck foreign substances that fall. The dust collector 13 may include an accommodating part 131 for dropping foreign matters and a suction part 132 for sucking foreign matters falling on the accommodating part. The receiving part 131 may have a hole connected to the suction part 132 so that foreign matter may be sucked by the suction part 132. For example, the hole may be formed in the bottom surface of the receiving portion 131.

The brush device may also include an alignment unit 2. The alignment unit 2 may be located at one side of the brush unit 1 in the semiconductor package cutting and inspection apparatus. The alignment unit 2 may be loaded with a semiconductor package P in which contact with the brush unit 1 is completed, that is, contact with one or more of the planar brush structure 11 and the roll brush structure 12 is completed. have.

As described above, the first gripper 3 may grip the semiconductor package P through adsorption. Referring to FIG. 4 and FIG. 5, the first gripper 3 may grip the semiconductor in the brushing process by the brush 1. The package P may have shifted outwardly (see FIG. 5) from the home position (initial position) (see FIG. 4) it had before brushing. However, when the semiconductor package P is moved to the vision inspection apparatus in a state in which the semiconductor package P is deviated from the initial position, the efficiency and accuracy of the inspection process may be degraded due to the misaligned position of the semiconductor package P. In order to prevent this, the brush device includes a semiconductor in which contact with the brush part 1 is completed so that the state in which the semiconductor package P, which is moved to the upper part of the vision inspection apparatus after brushing, is held in the grip part can be aligned. The semiconductor package P may be aligned by loading the package P into the alignment unit 2.

For example, referring to FIG. 6, the alignment part 2 is recessed downwardly from an upper surface thereof, such that the recessed part 21 in which the semiconductor package P held by the first holding part 3 is individually loaded is provided. It may include. In other words, the first gripper 3 holds the grip on the semiconductor package P such that each of the plurality of semiconductor packages P held by the first gripper 3 is seated inside each of the plurality of recesses 21 of the alignment unit 2. Can be released individually. As described above, the first gripping portion 3 may transfer the plurality of semiconductor packages P, and the number of the recesses 21 is the number of the semiconductor packages P that the first gripping portion 3 transfers. It may be equal to or greater than the number.

In addition, referring to FIG. 6, the inner surface of the recess 21 may include an inclined surface inclined so that the semiconductor package P placed in the recess 21 may be shifted to the bottom of the recess 21. For example, the semiconductor package P in a state of being gripped by the first gripper 3 at a position offset from the initial position described above may be placed in a position that is offset from the bottom of the recess 21 when placed in the recess 21. . By the way, according to this brush apparatus, since the inner side surface of the recessed part 21 may include the inclined surface, even if the semiconductor package P is located in the position which shifted from the bottom face of the recessed part 21, it moves along a sloped surface. (Eg, slide movement) to be seated on the bottom surface of the depression 21.

In addition, a part of the bottom of the recess 21 (for example, a center of the bottom of the recess 21) may be formed with a vacuum passage 22 for applying or releasing a vacuum pressure. Therefore, when the semiconductor package P held by the gripper 3 is placed in the recess 21, the semiconductor package P is quickly recessed by a vacuum pressure applied from the bottom of the recess 21. Can be placed in the position of (21).

In addition, the brush device may include a second gripping portion. The second gripper may hold the semiconductor package P, which is individually stacked on the alignment unit 2 and aligned, and may be transferred to the inspection apparatus. Therefore, the shape and the area of the bottom surface of the recess 21 are such that the semiconductor package P is in the correct position (for example, when the second gripper grips the semiconductor package P on the bottom of the recess 21). The semiconductor package P may be formed to be gripped by the second gripper with a position that can be inspected by the inspection apparatus while being held by the second gripper. In addition, the second gripping portion may hold a plurality of semiconductor packages P, for example, may hold eight semiconductor packages P. FIG.

As described above, according to the present brush apparatus, the first holding part 3 grips a plurality of semiconductor packages P having a drying process completed from a predetermined table, and the semiconductor package P is brushed through brushing of the brush part 1. ), But the gripping position of the first gripping portion (3) can be shifted in the brushing process, the vision due to the position recognition error of the semiconductor package (P) of the vision inspection device The accuracy of the test is reduced. Therefore, the brush device does not perform the vision inspection immediately after the brushing process, and in order to align the gripping positions of the gripping parts, the plurality of brushed semiconductor packages P are placed in the alignment part 2 and then the second The gripping portion may move the upper portion of the vision inspection device by holding the semiconductor package in place.

1, in the brush apparatus, the brush part 1 is movable. To this end, the brush device may include a rail portion 5 for guiding the movement of the brush portion 1. Therefore, the brush part 1 moves along the rail part 5 while the plurality of semiconductor packages P are held by the first holding part 3, thereby brushing the bottom and side surfaces of the semiconductor package P. Can be.

The above description of the present application is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present application. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present application is indicated by the following claims rather than the above description, and it should be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present application.

Claims

A brush device applicable to a semiconductor package inspection device,

A brush unit including a planar brush structure and a roll brush structure; And

A first holding part for holding a semiconductor package and contacting the held semiconductor package with at least one of the planar brush structure and the roll brush structure,

And each of the planar brush structure and the roll brush structure vibrate a predetermined time when the semiconductor package is in contact.
The method of claim 1,

The flat brush structure,

A base portion; And

A plurality of brush units protruding upward from the base part and disposed along a length direction and a width direction of the base part,

And the first gripping portion contacts the gripping semiconductor package with the brush unit.
The method of claim 2,

The brush device of the planar brush structure, the vibration in the longitudinal direction, the vibration in the width direction and the vibration in the circumferential direction of the axis in the vertical direction is possible.
The method of claim 3,

The first gripping portion,

When the planar brush structure vibrates in the longitudinal direction, the gripped semiconductor package in contact with the planar brush structure vibrates in the width direction so as to vibrate in the width direction,

When the planar brush structure vibrates in the width direction, the gripped semiconductor package vibrates in the longitudinal direction to vibrate in the longitudinal direction,

And when the planar brush structure vibrates with movement in the circumferential direction, the gripping semiconductor package vibrates so as to rotate in a direction opposite to the moving direction of the planar brush structure.
The method of claim 3,

The brush unit,

A first linear drive unit which moves the base part in the longitudinal direction;

A second linear drive unit which moves the base part in the width direction; And

And a rotating unit for rotating the base portion in the circumferential direction.
The method of claim 1,

The roll brush structure,

An axis portion disposed such that a longitudinal direction thereof is parallel to a longitudinal direction of the base portion; And

Including a brush unit extending in the form of a spiral along the circumference of the shaft,

Will be provided in the rear of the flat brush structure, the brush device.
The method of claim 1,

The semiconductor device may further include an alignment unit in which a semiconductor package having contact with at least one of the planar brush structure and the roll brush structure is loaded.

And the alignment portion is recessed downward from an upper surface thereof, and includes a recess in which the semiconductor package held by the first grip portion is individually stacked.
The method of claim 7, wherein

The inner side surface of the recessed portion, the brush device comprising a slanted inclined surface so as to move the semiconductor package placed in the recessed portion to the bottom surface to deviate from the bottom surface of the recessed portion.
The method of claim 7, wherein

And a second gripping part for gripping and transporting the semiconductor packages individually stacked on the alignment part to the vision inspection part.
The method of claim 1,

And a dust collector provided under the planar brush structure and the roll brush structure to suck foreign matter falling.