KR20150043996A - 열가소성 성형 조성물 - Google Patents

열가소성 성형 조성물 Download PDF

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Publication number
KR20150043996A
KR20150043996A KR20140138258A KR20140138258A KR20150043996A KR 20150043996 A KR20150043996 A KR 20150043996A KR 20140138258 A KR20140138258 A KR 20140138258A KR 20140138258 A KR20140138258 A KR 20140138258A KR 20150043996 A KR20150043996 A KR 20150043996A
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KR
South Korea
Prior art keywords
weight
thermoplastic molding
molding composition
polyamide
sterically hindered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR20140138258A
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English (en)
Korean (ko)
Inventor
토비아스 베니가우스
데틀레프 요아히미
리차트 바이더
올리버 볼프
Original Assignee
란세스 도이치란트 게엠베하
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=49382289&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20150043996(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 란세스 도이치란트 게엠베하 filed Critical 란세스 도이치란트 게엠베하
Publication of KR20150043996A publication Critical patent/KR20150043996A/ko
Ceased legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02Organic and inorganic ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005Stabilisers against oxidation, heat, light, ozone
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06Polyamides derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/014Additives containing two or more different additives of the same subgroup in C08K
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR20140138258A 2013-10-15 2014-10-14 열가소성 성형 조성물 Ceased KR20150043996A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP13188758.0 2013-10-15
EP13188758.0A EP2862894B1 (de) 2013-10-15 2013-10-15 Thermoplastische Formmassen

Publications (1)

Publication Number Publication Date
KR20150043996A true KR20150043996A (ko) 2015-04-23

Family

ID=49382289

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20140138258A Ceased KR20150043996A (ko) 2013-10-15 2014-10-14 열가소성 성형 조성물

Country Status (8)

Country Link
US (1) US20150105506A1 (enExample)
EP (2) EP2862894B1 (enExample)
JP (2) JP6501480B2 (enExample)
KR (1) KR20150043996A (enExample)
CN (1) CN104559144B (enExample)
ES (2) ES2662019T3 (enExample)
PL (2) PL2862894T3 (enExample)
SI (1) SI2862895T1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190028419A (ko) * 2016-07-07 2019-03-18 메드트로닉 바스큘러, 인크. 의료 기기 및 가소화된 나일론 재료

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HUE043312T2 (hu) * 2014-03-27 2019-08-28 Lanxess Deutschland Gmbh Égésgátló poliamid kompozíciók
EP3047084B1 (en) 2014-06-20 2020-06-24 3M Innovative Properties Company Hole repair device and kit
JP5991445B2 (ja) * 2014-07-18 2016-09-14 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
CN104927349B (zh) * 2015-05-26 2017-12-19 徐菊红 一种包装绳用pa复合材料的制备方法
DE102016105525A1 (de) * 2016-03-24 2017-09-28 Blanco Gmbh + Co Kg Aushärtbare Gießmasse für die Herstellung von Kunststoffformteilen und deren Verwendung
CN107236289A (zh) * 2017-06-20 2017-10-10 东莞市佳乾新材料科技有限公司 一种汽车零件用聚酰胺复合材料及其制备方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833534A (en) 1969-12-24 1974-09-03 Monsanto Co Reinforced polyamide compositions and process of preparation thereof
JPS5620018A (en) * 1979-07-30 1981-02-25 Koode Kk Flame-proof polyurethane foam and production thereof
DE2931738A1 (de) 1979-08-04 1981-02-26 Basf Ag Gefuellte polyamidformmasse
JPH0745622B2 (ja) 1986-03-31 1995-05-17 三菱瓦斯化学株式会社 導電性ポリアミド樹脂組成物
US5500473A (en) * 1993-04-30 1996-03-19 E. I. Du Pont De Nemours And Company Mineral filled copolyamide compositions
US6228288B1 (en) 2000-04-27 2001-05-08 Cts Corporation Electrically conductive compositions and films for position sensors
JP2003165904A (ja) 2001-11-29 2003-06-10 Toray Ind Inc 強化熱可塑性樹脂組成物
DE10161882A1 (de) 2001-12-17 2003-10-02 Siemens Ag Wärmeleitfähige thermoplastische Compounds und Verwendung dazu
JP2004059638A (ja) 2002-07-25 2004-02-26 Kuraray Co Ltd ポリアミド組成物
EP1386940A1 (en) 2002-07-30 2004-02-04 Alberto Stoppa Multipurpose additive for polymeric materials
DE10260098A1 (de) 2002-12-19 2004-07-01 Basf Ag Elektrisch isolierende und wärmeleitfähige Polyesterformmassen
JP2005112908A (ja) 2003-10-03 2005-04-28 Totoku Electric Co Ltd 無機フィラー分散絶縁塗料および絶縁電線
CN101006136B (zh) * 2004-07-01 2011-08-31 索维高级聚合物股份有限公司 芳族聚酰胺组合物和由其制造的制品
JP4681373B2 (ja) 2005-07-06 2011-05-11 帝人化成株式会社 熱可塑性樹脂組成物
EP1754733A1 (en) * 2005-07-26 2007-02-21 Huntsman Advanced Materials (Switzerland) GmbH Composition
DE102007037316A1 (de) 2007-08-08 2009-02-12 Lanxess Deutschland Gmbh Thermisch leitfähige und elektrisch isolierende thermoplastische Compounds
WO2009156342A1 (de) 2008-06-27 2009-12-30 Basf Se Wärmeleitfähige polyamide mit diatomeenerde
JP2013001802A (ja) * 2011-06-16 2013-01-07 Unitika Ltd 熱伝導性樹脂組成物およびそれからなる成形体
EP2760925B1 (fr) * 2011-09-27 2018-07-18 Rhodia Operations Composition polyamide de forte conductivite thermique
DE102011084519A1 (de) 2011-10-14 2013-04-18 Evonik Industries Ag Verwendung einer Mehrschichtfolie für die Herstellung photovoltaischer Module
TWI541278B (zh) 2012-12-18 2016-07-11 夸茲沃克公司 導熱性塑膠材料
EP2816082B1 (de) * 2013-06-19 2018-09-19 3M Innovative Properties Company Durch thermoplastische Verarbeitung von Polymer-Bornitrid-Compounds hergestellte Bauteile, Polymer-Bornitrid-Compounds zur Herstellung solcher Bauteile sowie deren Verwendung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190028419A (ko) * 2016-07-07 2019-03-18 메드트로닉 바스큘러, 인크. 의료 기기 및 가소화된 나일론 재료

Also Published As

Publication number Publication date
EP2862894B1 (de) 2017-12-27
PL2862895T3 (pl) 2018-07-31
US20150105506A1 (en) 2015-04-16
CN104559144B (zh) 2018-09-25
ES2662019T3 (es) 2018-04-05
EP2862894A1 (de) 2015-04-22
JP2019090060A (ja) 2019-06-13
JP2015078368A (ja) 2015-04-23
EP2862895A1 (de) 2015-04-22
PL2862894T3 (pl) 2018-06-29
JP6501480B2 (ja) 2019-04-17
SI2862895T1 (en) 2018-05-31
CN104559144A (zh) 2015-04-29
ES2663043T3 (es) 2018-04-10
EP2862895B1 (de) 2018-01-31

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