ES2662019T3 - Masas de moldeo termoplásticas - Google Patents

Masas de moldeo termoplásticas Download PDF

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Publication number
ES2662019T3
ES2662019T3 ES13188758.0T ES13188758T ES2662019T3 ES 2662019 T3 ES2662019 T3 ES 2662019T3 ES 13188758 T ES13188758 T ES 13188758T ES 2662019 T3 ES2662019 T3 ES 2662019T3
Authority
ES
Spain
Prior art keywords
polyamide
use according
weight
products
thermoplastic molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES13188758.0T
Other languages
English (en)
Spanish (es)
Inventor
Tobias Benighaus
Detlev Joachimi
Richard Weider
Oliver Wolff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lanxess Deutschland GmbH
Original Assignee
Lanxess Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=49382289&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2662019(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lanxess Deutschland GmbH filed Critical Lanxess Deutschland GmbH
Application granted granted Critical
Publication of ES2662019T3 publication Critical patent/ES2662019T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
ES13188758.0T 2013-10-15 2013-10-15 Masas de moldeo termoplásticas Active ES2662019T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP13188758.0A EP2862894B1 (de) 2013-10-15 2013-10-15 Thermoplastische Formmassen

Publications (1)

Publication Number Publication Date
ES2662019T3 true ES2662019T3 (es) 2018-04-05

Family

ID=49382289

Family Applications (2)

Application Number Title Priority Date Filing Date
ES13188758.0T Active ES2662019T3 (es) 2013-10-15 2013-10-15 Masas de moldeo termoplásticas
ES14187300.0T Active ES2663043T3 (es) 2013-10-15 2014-10-01 Masas de moldeo termoplásticas

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES14187300.0T Active ES2663043T3 (es) 2013-10-15 2014-10-01 Masas de moldeo termoplásticas

Country Status (8)

Country Link
US (1) US20150105506A1 (enExample)
EP (2) EP2862894B1 (enExample)
JP (2) JP6501480B2 (enExample)
KR (1) KR20150043996A (enExample)
CN (1) CN104559144B (enExample)
ES (2) ES2662019T3 (enExample)
PL (2) PL2862894T3 (enExample)
SI (1) SI2862895T1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HUE043312T2 (hu) * 2014-03-27 2019-08-28 Lanxess Deutschland Gmbh Égésgátló poliamid kompozíciók
MX372896B (es) 2014-06-20 2020-04-07 3M Innovative Properties Company Dispositivo, kit y método de reparación de agujero.
US11161979B2 (en) 2014-07-18 2021-11-02 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board
CN104927349B (zh) * 2015-05-26 2017-12-19 徐菊红 一种包装绳用pa复合材料的制备方法
DE102016105525A1 (de) * 2016-03-24 2017-09-28 Blanco Gmbh + Co Kg Aushärtbare Gießmasse für die Herstellung von Kunststoffformteilen und deren Verwendung
JP6987836B2 (ja) * 2016-07-07 2022-01-05 メドトロニック ヴァスキュラー インコーポレイテッド 医療装置と可塑化ナイロン材料
CN107236289A (zh) * 2017-06-20 2017-10-10 东莞市佳乾新材料科技有限公司 一种汽车零件用聚酰胺复合材料及其制备方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833534A (en) 1969-12-24 1974-09-03 Monsanto Co Reinforced polyamide compositions and process of preparation thereof
JPS5620018A (en) * 1979-07-30 1981-02-25 Koode Kk Flame-proof polyurethane foam and production thereof
DE2931738A1 (de) 1979-08-04 1981-02-26 Basf Ag Gefuellte polyamidformmasse
JPH0745622B2 (ja) 1986-03-31 1995-05-17 三菱瓦斯化学株式会社 導電性ポリアミド樹脂組成物
US5500473A (en) * 1993-04-30 1996-03-19 E. I. Du Pont De Nemours And Company Mineral filled copolyamide compositions
US6228288B1 (en) 2000-04-27 2001-05-08 Cts Corporation Electrically conductive compositions and films for position sensors
JP2003165904A (ja) 2001-11-29 2003-06-10 Toray Ind Inc 強化熱可塑性樹脂組成物
DE10161882A1 (de) 2001-12-17 2003-10-02 Siemens Ag Wärmeleitfähige thermoplastische Compounds und Verwendung dazu
JP2004059638A (ja) 2002-07-25 2004-02-26 Kuraray Co Ltd ポリアミド組成物
EP1386940A1 (en) 2002-07-30 2004-02-04 Alberto Stoppa Multipurpose additive for polymeric materials
DE10260098A1 (de) 2002-12-19 2004-07-01 Basf Ag Elektrisch isolierende und wärmeleitfähige Polyesterformmassen
JP2005112908A (ja) 2003-10-03 2005-04-28 Totoku Electric Co Ltd 無機フィラー分散絶縁塗料および絶縁電線
KR20070046797A (ko) * 2004-07-01 2007-05-03 솔베이 어드밴스트 폴리머스 엘.엘.씨. 방향족 폴리아미드 조성물 및 이로부터 제조된 제품
JP4681373B2 (ja) 2005-07-06 2011-05-11 帝人化成株式会社 熱可塑性樹脂組成物
EP1754733A1 (en) * 2005-07-26 2007-02-21 Huntsman Advanced Materials (Switzerland) GmbH Composition
DE102007037316A1 (de) 2007-08-08 2009-02-12 Lanxess Deutschland Gmbh Thermisch leitfähige und elektrisch isolierende thermoplastische Compounds
EP2294120B1 (de) 2008-06-27 2012-04-25 Basf Se Wärmeleitfähige polyamide mit diatomeenerde
JP2013001802A (ja) * 2011-06-16 2013-01-07 Unitika Ltd 熱伝導性樹脂組成物およびそれからなる成形体
WO2013045426A1 (fr) * 2011-09-27 2013-04-04 Rhodia Operations Composition polyamide de forte conductivite thermique
DE102011084519A1 (de) 2011-10-14 2013-04-18 Evonik Industries Ag Verwendung einer Mehrschichtfolie für die Herstellung photovoltaischer Module
TWI541278B (zh) * 2012-12-18 2016-07-11 夸茲沃克公司 導熱性塑膠材料
EP2816082B1 (de) * 2013-06-19 2018-09-19 3M Innovative Properties Company Durch thermoplastische Verarbeitung von Polymer-Bornitrid-Compounds hergestellte Bauteile, Polymer-Bornitrid-Compounds zur Herstellung solcher Bauteile sowie deren Verwendung

Also Published As

Publication number Publication date
SI2862895T1 (en) 2018-05-31
KR20150043996A (ko) 2015-04-23
JP2019090060A (ja) 2019-06-13
EP2862895B1 (de) 2018-01-31
JP2015078368A (ja) 2015-04-23
EP2862894A1 (de) 2015-04-22
US20150105506A1 (en) 2015-04-16
CN104559144A (zh) 2015-04-29
EP2862894B1 (de) 2017-12-27
CN104559144B (zh) 2018-09-25
ES2663043T3 (es) 2018-04-10
JP6501480B2 (ja) 2019-04-17
EP2862895A1 (de) 2015-04-22
PL2862894T3 (pl) 2018-06-29
PL2862895T3 (pl) 2018-07-31

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