KR20150039690A - 도포 장치 - Google Patents

도포 장치 Download PDF

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Publication number
KR20150039690A
KR20150039690A KR20140131436A KR20140131436A KR20150039690A KR 20150039690 A KR20150039690 A KR 20150039690A KR 20140131436 A KR20140131436 A KR 20140131436A KR 20140131436 A KR20140131436 A KR 20140131436A KR 20150039690 A KR20150039690 A KR 20150039690A
Authority
KR
South Korea
Prior art keywords
slit nozzle
coating
substrate
speed
coating material
Prior art date
Application number
KR20140131436A
Other languages
English (en)
Korean (ko)
Inventor
다카유키 이시이
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20150039690A publication Critical patent/KR20150039690A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
KR20140131436A 2013-10-03 2014-09-30 도포 장치 KR20150039690A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013208526 2013-10-03
JPJP-P-2013-208526 2013-10-03
JP2014108493A JP2015091569A (ja) 2013-10-03 2014-05-26 塗布装置
JPJP-P-2014-108493 2014-05-26

Publications (1)

Publication Number Publication Date
KR20150039690A true KR20150039690A (ko) 2015-04-13

Family

ID=52775922

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20140131436A KR20150039690A (ko) 2013-10-03 2014-09-30 도포 장치

Country Status (4)

Country Link
US (1) US20150096492A1 (zh)
JP (1) JP2015091569A (zh)
KR (1) KR20150039690A (zh)
TW (1) TW201529182A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190038242A (ko) * 2017-09-29 2019-04-08 쥬가이로 고교 가부시키가이샤 기판의 도포 방법 및 기판의 도포 장치

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6272138B2 (ja) * 2014-05-22 2018-01-31 東京エレクトロン株式会社 塗布処理装置
JP2018043200A (ja) * 2016-09-15 2018-03-22 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
JP7500992B2 (ja) 2020-02-25 2024-06-18 東レ株式会社 塗布装置及び塗布方法
JP2023042870A (ja) * 2021-09-15 2023-03-28 株式会社Ｓｃｒｅｅｎホールディングス 基板塗布装置および基板塗布方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4005879B2 (ja) * 2002-08-30 2007-11-14 株式会社東芝 現像方法、基板処理方法、及び基板処理装置
JP5327238B2 (ja) * 2011-01-20 2013-10-30 東京エレクトロン株式会社 塗布処理装置、塗布処理方法及び記憶媒体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190038242A (ko) * 2017-09-29 2019-04-08 쥬가이로 고교 가부시키가이샤 기판의 도포 방법 및 기판의 도포 장치

Also Published As

Publication number Publication date
US20150096492A1 (en) 2015-04-09
TW201529182A (zh) 2015-08-01
JP2015091569A (ja) 2015-05-14

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