KR20150024208A - Heat Treatment Chamber of Substrate with Easy Maintenance, and Heat Treatment Apparatus and Method of Substrate Having the Same - Google Patents

Abstract

Disclosed are a heat treatment chamber of a substrate with easy maintenance, and a heat treatment apparatus and a method thereof. A heat treatment chamber of a substrate according to the present invention includes a heat treatment chamber housing; and first, second upper and lower part moving plate housings detachable from the heat treatment chamber housing by a sliding method. The heat treatment chamber housing and the first, second upper and lower part moving plate housings form a heat treatment space for performing a thermal process on a substrate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate heat treatment chamber that can be easily maintained,

The present invention relates to a substrate heat treatment chamber that is easy to maintain, and a substrate heat treatment apparatus and method having the chamber.

More specifically, the present invention relates to a heat treatment chamber for providing a plurality of heat treatment chambers, and a pair of movable plate housings, each of which is detachably mounted on a lamp unit including a plurality of lamps, By mounting the substrate on the pair of movable plate housings, thermal interference between the plurality of lamp heaters is eliminated, and maintenance such as a cleaning process such as fume removal and a replacement process when a plurality of lamps is broken occurs maintenance can be carried out very easily and maintenance space can be ensured and accordingly a relatively small installation space is required for the whole installation, and ultimately the manufacturing cost of the substrate is reduced. Particularly, in the plate housing having the divided structure A substrate heat treatment chamber in which the possibility of damage is greatly reduced due to dispersion of stress concentration on the substrate, It relates to a substrate heat treatment apparatus and method provided.

An annealing apparatus used for manufacturing semiconductors, flat panel displays, and solar cells is an apparatus for performing heat treatment necessary for crystallization, phase change, and the like on a predetermined film deposited on a substrate such as a silicon wafer or glass .

A typical annealing apparatus is a silicon crystallization apparatus for crystallizing amorphous silicon deposited on a glass substrate into polysilicon when a liquid crystal display or a thin film crystalline silicon solar cell is manufactured.

In order to perform such a crystallization process, a heat treatment apparatus capable of heating a substrate on which a predetermined thin film (hereinafter referred to as a "film") is formed must be provided. For example, for crystallization of amorphous silicon, a temperature of at least 550 to 600 DEG C is required.

Generally, a heat treatment apparatus includes a single-wafer type in which heat treatment can be performed on one substrate, and a batch type in which heat treatment can be performed on a plurality of substrates. There is a merit of simple configuration of the apparatus, but there is a disadvantage that the productivity is low, and the batch formula is getting popular for the mass production in recent years.

FIG. 1 is a perspective view showing a configuration of a batch type heat treatment apparatus according to the prior art, FIG. 2 (a) is a perspective view showing a configuration of a chamber of a batch type heat treatment apparatus according to the prior art shown in FIG. 1, Fig. 5 is a perspective view showing the arrangement of the substrate, the main heater unit, and the auxiliary heater unit of the batch type heat treatment apparatus according to the first embodiment. Such a batch heat treatment apparatus according to the prior art is filed in Korean Patent Application No. 10-2008-0069329, entitled " Batch Heat Treatment Apparatus ", filed July 16, 2008 by Huh, Are described in detail in Korean Patent No. 10-1016048, filed on February 11,

1 to 2B, a batch type thermal processing apparatus 1 according to the related art includes a chamber 100 having a rectangular parallelepiped shape for providing a heat treatment space and a frame 110 for supporting the chamber 100, do.

A door 140 is installed at one side of the chamber 100 to open and close the chamber 100 in order to load the substrate 10 into the chamber 100. The substrate 10 can be loaded into the chamber 100 by using a substrate loading device (not shown) such as a transfer arm in a state where the door 140 is opened. On the other hand, after the heat treatment is completed, the substrate 10 may be unloaded from the chamber 100 through the door 140.

A cover 160 is provided on the upper side of the chamber 100 for repairing and replacing the boats 120, the gas supply pipes 300 and the gas discharge pipes 320 installed in the chamber 100 .

A main heater unit 200 for directly heating the substrate 10 in the chamber 100, an auxiliary heater unit 220 for preventing heat loss in the chamber 100, A cooling pipe 250 for rapidly cooling the inside of the cooling pipe 100 is installed.

Referring to FIGS. 2A and 2B, the main heater unit 200 includes a unit main heater 210 having a predetermined interval in parallel with the short side direction of the substrate 10. The unit main heater 210 is a unitary body that constitutes a main heater unit 200 having a long cylindrical heater and having a heating element inserted into a quartz tube and generating external heat by receiving external power through terminals provided at both ends .

A plurality of main heater units 200 are arranged at regular intervals along the stacking direction of the substrates 10. The substrate 10 is disposed between a plurality of main heater units 200.

As described above, in the batch type thermal processing apparatus 1 according to the related art, a main heater unit 200 (hereinafter, referred to as " main heater ") 200 composed of a unit main heater 210 capable of covering the entire surface of the substrate 10, The substrate 10 is uniformly heated from the unit main heater 210 to uniformly heat the entire surface thereof.

2A and 2B, the auxiliary heater unit 220 includes a first auxiliary heater unit 220a disposed parallel to the short side direction of the substrate 10 and a second auxiliary heater unit 220b disposed along the long side direction of the substrate 10 And a second auxiliary heater unit 220b. The first auxiliary heater unit 220a includes a plurality of first unit auxiliary heaters 230a disposed on both sides of the main heater unit 200 in parallel with the unit main heaters 210. [

Further, in the prior art, a boat 120 for supporting a plurality of substrates 10 is used.

More specifically, FIGS. 3A and 3B are a perspective view and a cross-sectional view showing a configuration of a boat used in a batch type heat treatment apparatus according to the prior art.

Referring to FIGS. 3A and 3B, a boat 120 for supporting a substrate 10 loaded into a chamber 100 is installed in a chamber 100. The boat 120 is preferably installed to support the long side of the substrate 10.

Further, the substrate 10 is preferably loaded on the boat 120 while being mounted on the holder 12. When the heat treatment temperature reaches the softening temperature of the plurality of substrates 10 during the heat treatment process, the substrate may be warped downward due to the weight of the substrate itself. In particular, It becomes a big problem. In order to solve such a problem, in the prior art, the substrate 10 is mounted on the holder 12 and the heat treatment proceeds.

The above-described batch type thermal processing apparatus 1 according to the related art can achieve heat treatment at the same time on a plurality of substrates loaded in the chamber, thereby achieving the effect of improving the productivity of the substrate, but still has the following problems.

1. Both the main heater unit 200 for heating the substrate 10 and the auxiliary heater unit 220 for preventing heat loss inside the chamber 100 are provided across the chamber 100 and the main heater unit 200 200 and the auxiliary heater unit 220 are both protruded to the outside of the chamber 100. In this state, fumes generated in the film on the substrate 10 and the substrate 10 are deposited on the main heater unit 200 and the auxiliary heater unit 220 by the heat treatment. As a result, the thermal efficiency of the main heater unit 200 and the auxiliary heater unit 220 significantly decreases with time. Therefore, in order to maintain the thermal efficiency of the main heater unit 200 and the auxiliary heater unit 220, the fume must be removed. To this end, both ends of the main heater unit 200 and the auxiliary heater unit 220 protruded and coupled to the outside of the chamber 100 are released, and then the fume is removed. Should be tightened. Generally, the size of the chamber 100 is considerably large in the order of several meters in width, height, and height, and a plurality of unit main heaters 210, which constitute the main heater unit 200 and the auxiliary heater unit 220, And the length of the plurality of first unit auxiliary heaters 230a is also considerably long as several meters so that the operator enters the inside of the chamber 100 and the plurality of unit main heaters 210 and the plurality of first unit auxiliary heaters 230a Release, fume removal, and re-tightening processes should be performed. In addition, when the operator enters the inside of the chamber 100 and releases the plurality of unit main heaters 210 and the plurality of first unit auxiliary heaters 230a, the presence of the boat 120 mounted in the chamber 100 The unit main heater 210 and the first unit auxiliary heater 230a, which have not failed during the release process, may be damaged. To prevent this, a great deal of attention is required by the operator.

therefore. The overall process time and cost due to the fume cleaning are greatly increased.

2. When a failure occurs in one or more of the plurality of unit main heaters 210 and the plurality of first unit auxiliary heaters 230a constituting the main heater unit 200 and the auxiliary heater unit 220, In order to replace the generated unit main heater 210 or the first unit auxiliary heater 230a, the releasing, replacing, and re-fastening processes must be performed as described above. At this time, if the unit main heater 210 or the first unit auxiliary heater 230a in which the failure occurs is located inside the chamber 100 with respect to the door, The unit main heater 210 or the first unit auxiliary heater 230a in the steady state between the one unit auxiliary heaters 230a must be released, replaced, and re-tightened. Accordingly, the time required for the replacement process due to the occurrence of one or more of the plurality of unit main heaters 210 and the plurality of first unit auxiliary heaters 230a becomes excessively long, which increases the overall process time and cost.

3. Also, the batch heat treatment apparatus 1 of the prior art has a structure in which the boat 120 is loaded and unloaded in the chamber 100 in one direction.

3C is a view schematically showing that a boat used in a batch type heat treatment apparatus of the prior art is loaded and unloaded into a chamber, and FIG. 3D is a schematic view of a conventional batch heat treatment apparatus FIG. 2 is a view schematically showing an arrangement interval between a boat and a chamber when a plurality of vessels are used.

Referring to FIGS. 3C and 3D, with reference to FIGS. 1 to 3B, in the batch type thermal processing apparatus 1 of the prior art, the boat 120 is slidably loaded in the chamber 100 in one direction of the chamber 100 And unloaded (see FIG. 3C). In this case, when it is necessary to perform maintenance such as loading / unloading operation of the substrate 10 or replacement due to occurrence of failure of the unit main heater 210 or the first unit auxiliary heater 230a in the chamber 100, Lt; RTI ID = 0.0 > (L) < / RTI > Therefore, when two first and second chambers 100a and 100b are used in a tandem arrangement type, the distance between the first chamber 100a and the second chamber 100b is equal to the distance between the first chamber 100a and the first chamber 100a, L + M1 corresponding to the total width L of the storage area 120 + the width M1 of the maintenance area Ma is required. If a chamber 100 of n (where n is a natural number of three or more) chambers is used as a batch type, a region corresponding to the length of nx (L + M1) is required, It becomes a dead region which can not be used. Therefore, in order for the user to enter the chamber 100 for maintenance such as replacement of the unit main heater 210 or the first unit auxiliary heater 230a due to the occurrence of a failure, And ultimately the manufacturing cost of the substrate is increased.

4. Also, in the batch heat treatment apparatus 1 of the prior art, the boat 120 to be loaded and unloaded in the chamber 100 has a single structure. In this case, as the substrate 10 becomes larger in size, the size of the chamber 100 and the boat 120 must also be increased. Thereby, damage to the boat 120 due to relatively more stress concentration due to thermal expansion and contraction in the enlarged boat 120 due to the high temperature environment created in the chamber 100 for the heat treatment of the substrate 10 Which causes the contamination in the chamber 100 to occur.

Therefore, there is a need for a new method for solving the problems of the above-described conventional techniques.

Korean Patent No. 10-1016048

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the prior art, and it is an object of the present invention is to provide a heat treatment chamber housing that provides a plurality of heat treatment chambers, a pair of movable plate housings a movable plate housing is fastened in a sliding manner. By mounting a substrate on a pair of movable plate housings, heat interference between the plurality of lamp heaters is eliminated, and a cleaning process such as fume removal, Maintenance such as the replacement process can be performed very easily, maintenance space can be secured, and accordingly, a relatively small installation space is required for the entire facility, which ultimately reduces the manufacturing cost of the substrate. Particularly, There is a high possibility of damage due to the dispersion of the stress concentration on the plate housing having the divided structure The charge is to provide a substrate heat treatment chamber, and a substrate having the same heat treatment apparatus and method.

A substrate heat treatment chamber according to a first aspect of the present invention includes a heat treatment chamber housing; And a first and a second upper and lower movable plate housings removably mounted to the heat treatment chamber housings, respectively, wherein the heat treatment chamber housing and the first and second upper and lower movable plate housings comprise a substrate Thereby forming a heat treatment space for heat treatment.

A substrate heat treatment apparatus according to a second aspect of the present invention includes a plurality of substrate heat treatment chambers, each of the plurality of substrate heat treatment chambers comprising: a heat treatment chamber housing; An upper fixation plate housing fixedly mounted on the upper portion of the heat treatment chamber housing; And a plurality of first and second lower movable plate housings provided at a lower portion of the upper fixing plate housing and detachably mounted to the thermal processing chamber housing in a sliding manner, respectively, wherein the heat processing chamber housing, The housing, and the plurality of first and second movable plate housings form heat treatment spaces for heat-treating the substrate, respectively.

A substrate heat treatment method according to a third aspect of the present invention comprises the steps of a) an upper fixation plate housing fixedly mounted on a top of a heat treatment chamber housing, and a plurality of heat dissipation plate housings detachably mounted on the heat treatment chamber housing in a lower portion of the upper fixation plate housing, Providing a plurality of substrate heat treatment chambers having a plurality of heat treatment spaces by a plurality of first and second lower movable plate housings; b) mounting a substrate on a plurality of lift pins provided on top of each of said plurality of first and second lower movable plate housings; And c) heating each of the substrates using a plurality of lamp heaters detachably mounted along a plurality of cut-off portions formed at regular intervals in the upper and lower fixed plate housings and the plurality of first and second movable lower plate plates, respectively, Wherein when maintenance of the plurality of lamp heaters is required, the maintenance operation is performed after part or all of the plurality of lower movable plate housings are detached from the heat treatment chamber housing.

A substrate heat treatment method according to a fourth aspect of the present invention comprises the steps of: a) an upper fixation plate housing fixedly mounted on a top of a heat treatment chamber housing; and a plurality of heat dissipation plate housings mounted on the heat treatment chamber housing in a sliding manner, Providing a plurality of substrate heat treatment chambers having a plurality of heat treatment spaces by a plurality of first and second lower movable plate housings; b) mounting a substrate on a plurality of lift pins provided on top of each of said plurality of first and second lower movable plate housings; And c) heating each of the substrates using a plurality of lamp heaters detachably mounted along a plurality of cut-off portions formed at regular intervals in the upper and lower fixed plate housings and the plurality of first and second movable lower plate plates, respectively, Wherein when maintenance of the plurality of lamp heaters is required, the maintenance operation is performed after part or all of the plurality of lower movable plate housings are detached from the heat treatment chamber housing.

INDUSTRIAL APPLICABILITY By using the substrate heat treatment chamber and the substrate heat treatment apparatus and method having the same which are easy to maintain according to the present invention, the following effects can be achieved.

1. Heat interference between the plurality of lamp heaters is eliminated, and the temperature uniformity inside the heat treatment chamber is greatly improved.

2. It is very convenient and easy to perform the fume removal process and the replacement process when a plurality of lamps fail.

3. Since a pair of plate housings are fastened in a sliding manner, it is possible to secure a maintenance space for the operator.

4. A relatively small installation space is required for the entire installation, which ultimately reduces the manufacturing cost of the substrate.

5. Particularly, the possibility of damage is greatly reduced due to the dispersion of the stress concentration on the plate housing with the divided structure.

Further advantages of the present invention can be clearly understood from the following description with reference to the accompanying drawings, in which like or similar reference numerals denote like elements.

1 is a perspective view showing a configuration of a batch type heat treatment apparatus according to the prior art.
FIG. 2A is a perspective view showing a configuration of a chamber of the batch type heat treatment apparatus according to the prior art shown in FIG. 1. FIG.
FIG. 2B is a perspective view showing the arrangement of the substrate, the main heater unit, and the auxiliary heater unit of the batch type heat treatment apparatus according to the related art.
FIGS. 3A and 3B are a perspective view and a sectional view showing a configuration of a boat used in a batch type heat treatment apparatus according to the related art.
3C is a view schematically showing how a boat used in the batch heat treatment apparatus of the prior art is loaded and unloaded into the chamber.
FIG. 3D is a view schematically showing an arrangement interval between a boat and a chamber when a plurality of batch heat treatment apparatuses of the prior art shown in FIG. 3C are used.
4A is a partial cutaway perspective view of a substrate heat treatment apparatus having a substrate heat treatment chamber according to an embodiment of the present invention.
4B is a schematic cross-sectional view of the substrate heat treatment chamber and substrate heat treatment apparatus according to an embodiment of the present invention shown in FIG. 4A.
4C is a schematic plan view of a substrate heat treatment chamber according to an embodiment of the present invention shown in FIG. 4B.
FIG. 4D is a view showing a specific embodiment of the plate housing of the substrate heat treatment chamber according to an embodiment of the present invention shown in FIG. 4C.
FIG. 4E is an enlarged cross-sectional view of portion B cut along AA line in a specific embodiment of the plate housing according to an embodiment of the present invention shown in FIG. 4D.
FIG. 4F is a schematic view illustrating a plate housing used in a heat treatment apparatus according to an exemplary embodiment of the present invention, which is loaded into and unloaded from a chamber.
FIG. 4G is a view schematically showing an arrangement interval between the plate housing and the chamber when a plurality of heat treatment apparatuses according to an embodiment of the present invention shown in FIG. 4F are used.
5A is a flowchart showing a substrate heat treatment method according to the first embodiment of the present invention.
5B is a flowchart showing a substrate heat treatment method according to the second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to embodiments and drawings of the present invention.

FIG. 4A is a partially cutaway perspective view of a substrate heat treatment apparatus having a substrate heat treatment chamber according to an embodiment of the present invention, FIG. 4B is a cross-sectional perspective view of a substrate heat treatment chamber according to an embodiment of the present invention shown in FIG. 4C is a schematic plan view of a substrate heat treatment chamber according to an embodiment of the present invention shown in FIG. 4B, and FIG. 4D is a cross-sectional view of the substrate heat treatment chamber shown in FIG. FIG. 4E is a cross-sectional view of a plate heat exchanger according to an embodiment of the present invention; FIG. 4E is a cross-sectional view taken along the line AA in a specific embodiment of the plate housing according to an embodiment of the present invention shown in FIG. Fig. 5 is an enlarged cross-sectional view of a portion B cut along the line A-B in Fig.

4A through 4E, a substrate thermal processing chamber 400 according to an embodiment of the present invention includes a thermal processing chamber housing 470; And first and second upper and lower movable plate housings (420a, 420b) detachably mounted to the heat treatment chamber housing (470) in a sliding manner, respectively, the heat treatment chamber housing (470) The second upper and lower movable plate housings 420a and 420b form a heat treatment space 472 for heat treating the substrate 10.

The first and second upper and lower movable plate housings 420a and 420b of the substrate thermal processing chamber 400 according to an embodiment of the present invention includes a plurality of cut-offs 422 formed at regular intervals, A heater unit 410 including a plurality of lamp heaters 412 detachably mounted along the lamp unit 412; And a plurality of first and second lift pins 424a and 424b for mounting the substrate 10, respectively, provided on upper portions of the pair of lower movable plate housings 420a and 420b.

In the substrate heat treatment chamber 400 according to an embodiment of the present invention, when the maintenance of the plurality of lamp heaters 412 is required, the first and second lower movable plate housings 420a and 420b may be heat- After the chamber housing 470 is detached, the maintenance operation is performed.

The maintenance operation described above may include either or both of an operation of cleaning the plurality of lamp heaters 412 and an operation of replacing a lamp heater in which a failure occurs among the plurality of lamp heaters 412. [

In the substrate heat treatment chamber 400 according to the embodiment of the present invention described above, the first and second upper and lower movable plate housings 420a and 420b and the first and second lower movable plate housings 420a and 420b Are all implemented in the same movable plate housing.

The first and second upper and lower movable plate housings 420a and 420b used in the substrate heat treatment chamber 400 according to an embodiment of the present invention may have a handle attaching portion 426 and And may include a handle portion 428 mounted on the handle portion mounting portion 426.

The first and second upper and lower movable plate housings 420a and 420b of the substrate heat treatment chamber 400 according to an embodiment of the present invention may include a plurality of body portions 420a and 420b provided between the plurality of cut- A portion 421; A plurality of cooling holes (486) formed through the inside of the plurality of body portions (421); An inlet hole (482) connected to one end of the plurality of cooling holes (486) and through which the cooling medium flows; And a discharge hole 484 connected to the other end of the plurality of cooling holes 486 and through which the cooling medium is discharged.

Meanwhile, the substrate heating apparatus 401 according to an embodiment of the present invention includes a plurality of substrate heat treatment chambers 400, the plurality of substrate heat treatment chambers 400 each including a heat treatment chamber housing 470; An upper fixing plate housing 420 fixedly mounted on the upper portion of the thermal processing chamber housing 470; And a plurality of first and second lower movable plate housings (420a, 420b) provided at a lower portion of the upper fixed plate housing (420) and detachably mounted to the heat treatment chamber housing (470) The heat treatment chamber housing 470, the upper fixing plate housing 420 and the plurality of first and second lower movable plate housings 420a and 420b are provided with a heat treatment space for heat treatment of the substrate 10, (472).

The upper fixing plate housing 420 and the plurality of first and second lower movable plate housings 420a and 420b of the substrate thermal processing apparatus 401 according to an embodiment of the present invention may have a plurality A heater unit 410 including a plurality of lamp heaters 412 arranged along a cut-off portion 422 of the heater 410; And a plurality of lift pins 424 provided on top of each of the first and second lower movable plate housings 420a and 420b for mounting the substrate 10. [

In the substrate heating apparatus 401 according to the embodiment of the present invention, when maintenance of the plurality of lamp heaters 412 is required, the first and second movable plate housings 420a and 420b The maintenance operation is performed after some or all of them are detached from the heat treatment chamber housing 470. Here, the maintenance operation may include one or both of an operation of cleaning the plurality of lamp heaters 412 and an operation of replacing a lamp heater in which a failure occurs among the plurality of lamp heaters 412.

The plurality of first and second movable plate housings 420a and 420b used in the substrate thermal processing apparatus 401 according to an embodiment of the present invention may include a handle attaching portion 426), and a handle portion 428 mounted on the handle portion mounting portion 426 (see Fig. 4A).

The plurality of first and second lower movable plate housings 420a and 420b used in the substrate heat treatment apparatus 401 according to an embodiment of the present invention may be used between the plurality of cutoff portions 422 A plurality of body portions 421; A plurality of cooling holes (486) formed through the inside of the plurality of body portions (421); An inlet hole (482) connected to one end of the plurality of cooling holes (486) and through which the cooling medium flows; And a discharge hole (484) connected to the other end of the plurality of cooling holes (486) and through which the cooling medium is discharged.

The power outputs of the heater unit 410 constituted by the plurality of lamp heaters 412 used for the upper fixing plate housing 420 and the plurality of first and second lower movable plate housings 420a and 420b are respectively (Group control method), or individually controlled for each of the lamp heaters 412 (individual control method).

Hereinafter, the detailed configuration and operation of the substrate thermal processing chamber 400 and the substrate thermal processing apparatus 401 according to an embodiment of the present invention will be described in detail.

4A to 4E, the substrate thermal processing chamber 400 according to an embodiment of the present invention includes first and second upper and lower movable bodies 440 and 460, respectively, which are detachably mounted to the thermal processing chamber housing 470 in a sliding manner, Plate housings 420a and 420b. Since the first and second upper and lower movable plate housings 420a and 420b are all implemented as the same movable plate housing, they will be collectively referred to below as the first and second movable plate housings 420a and 420b do.

A plurality of cut-off portions 422 are formed at regular intervals in the first and second movable plate housings 420a and 420b (see FIGS. 4A and 4C). A plurality of lamp heaters 412 are detachably mounted along the plurality of cutoff portions 422. The plurality of lamp heaters 412 constitute a heater unit 410 mounted along the plurality of cutoff portions 422 of the first and second movable plate housings 420a and 420b.

Further, a plurality of cooling holes 486 are formed through the plurality of body portions 421 provided between the plurality of cut-off portions 422. One end of the plurality of cooling holes 486 is connected to the inlet hole 482 and the other end is connected to the outlet hole 484, respectively. The cooling medium flowing into the inlet port 481 of the inlet hole 482 is dispersed through the plurality of the cooling holes 486, collected into the outlet hole 484, and then discharged through the outlet port 483. Here, the cooling medium may be, for example, water or nitrogen.

Further, a plurality of lift pins 424 are provided on the upper portions of the first and second movable plate housings 420a and 420b, respectively. On the plurality of lift pins 424, a substrate 10 is mounted.

The first and second upper and lower movable plate housings 420a and 420b (in the case of the substrate heat treatment chamber 400) and the heat treatment chamber housing 470, the upper fixing plate housing 420 And the first and second lower movable plate housings 420a and 420b (in the case of the substrate heat treatment apparatus 401) form a heat treatment space 472 for heat-treating the substrate 10, respectively.

The substrate heat treatment chamber 400 according to an embodiment of the present invention is provided on an edge in the long side direction of the substrate 10 and is provided on the edge of the substrate 10 in a direction perpendicular to the plurality of lamp heaters 412 And may further include one or more auxiliary lamp heaters 414 detachably mounted under the first and second upper movable plate housings 420a and 420b, respectively.

Also, a substrate heat treatment chamber 400 according to an embodiment of the present invention is provided inside the heat treatment chamber housing 470, and includes an air supply member 490a for supplying gas into the heat treatment space 472; And an exhaust member 490b for exhausting the gas from the heat treatment space 472, provided inside the heat treatment chamber housing 470 in the rear direction.

The first and second movable plate housings 420a and 420b may be made of aluminum and the plurality of lamp heaters 412 and one or more auxiliary lamp heaters 414 may be formed of infrared Lamp heater.

Referring to FIGS. 4A and 4B, a substrate thermal processing apparatus 401 according to an embodiment of the present invention includes a plurality of substrate thermal processing chambers 400. Each of the plurality of substrate heat treatment chambers 400 includes a heat treatment chamber housing 470. A plurality of first and second lower movable plate housings 420a and 420b are installed at the lower portion of the upper fixed plate housing 420. The upper and lower movable plate housings 420a and 420b are fixed to the heat treatment chamber housing 470, And is detachably mounted to the housing 470 in a sliding manner. In this case, the first and second lower movable plate housings 420a and 420b can be moved in the left and right directions (L direction) as shown in FIG. 4C, while the substrate 10 is moved in the left and right directions And is movable in a vertical direction (H direction in Fig. 4C).

A plurality of cutoff portions 422 are formed at predetermined intervals in the upper fixed plate housing 420 and the plurality of first and second lower movable plate housings 420a and 420b, respectively (see FIGS. 4D and 4E) . The plurality of lamp heaters 412 are detachably mounted along the plurality of cut-off portions 422, respectively. A plurality of lamp heaters 412 mounted along the plurality of cutoff portions 422 constitute a heater unit 410. A plurality of cooling holes 486 are formed through the inside of the plurality of body portions 421 provided between the plurality of cut-off portions 422. One end of the plurality of cooling holes 486 is connected to the inlet hole 482 and the other end is connected to the outlet hole 484, respectively. The cooling medium flowing into the inlet port 481 of the inlet hole 482 is dispersed through the plurality of the cooling holes 486, collected into the outlet hole 484, and then discharged through the outlet port 483.

It should be noted that a plurality of lift pins 424 are not provided at the upper portion of the upper fixing plate housing 420. On the other hand, a plurality of lift pins 424 are provided on upper portions of the plurality of first and second lower movable plate housings 420a and 420b, respectively. The substrate 10 is mounted on the lift pins 424 provided on top of each of the first and second movable lower plate housings 420a and 420b.

The first and second lower movable plate housings 420a and 420b and the first and second adjacent movable plate housings 470 and 470 adjacent to each other in the vertical direction with the heat treatment chamber housing 470 and the upper fixing plate housing 420 and the uppermost first and second lower movable plate housings 420a and 420b, The two lower movable plate housings 420a and 420b form a heat treatment space 472 for heat-treating the substrate 10, respectively.

The substrate heating apparatus 401 according to an embodiment of the present invention is provided on an edge in the long side direction of the substrate 10 and is provided along the direction perpendicular to the plurality of the lamp heaters 412 Further includes one or more auxiliary lamp heaters 414 detachably mounted on the lower portion of each of the upper fixing plate housing 420 and the plurality of first and second lower movable plate housings 420a and 420b .

The substrate heat treatment apparatus 401 according to an embodiment of the present invention is provided inside the heat treatment chamber housing 470 and includes a plurality of supply members 471 for supplying gas into the plurality of heat treatment spaces 472 490a); And a plurality of exhaust members 490b provided inside the rear of the heat treatment chamber housing 470 for exhausting the respective gases from the plurality of heat treatment spaces 472 (see FIG. 4B).

The upper fixing plate housing 420 and the plurality of first and second lower movable plate housings 420a and 420b according to an embodiment of the present invention may be formed of aluminum (Al) The heater 412 may be implemented as an infrared (IR) lamp heater, respectively.

In the substrate heat treatment chamber 400 and the substrate heat treatment apparatus 401 according to an embodiment of the present invention described above, a plurality of lamp heaters 412 are respectively disposed on the upper fixing plate housing 420 and the plurality of first and second And is detachably provided in a plurality of cutoff portions 422 formed in the movable plate housings 420a and 420b, respectively. In this case, thermal interference between the plurality of lamp heaters 412 is eliminated by a plurality of body portions 421 provided between the plurality of cut-off portions 422, and an upper fixing plate housing (not shown) 420 and the plurality of first and second lower movable plate housings 420a, 420b reflect the heat energy emitted from the plurality of lamp heaters 412, respectively, so that the heating efficiency for the substrate 10 is increased. Further, since the cooling medium is provided through the plurality of cooling holes 486 immediately after the heat treatment process of the substrate 10 by the plurality of lamp heaters 412 is completed, the cooling efficiency is improved.

FIG. 4F is a schematic view illustrating the plate housing used in the heat treatment apparatus according to the embodiment of the present invention being loaded into and unloaded from the chamber. FIG. 4G is a cross- FIG. 3 is a view schematically showing the arrangement interval between the plate housing and the chamber when a plurality of heat treatment apparatuses are used. FIG.

Referring to Figures 4F and 4G with Figures 4A through 4E, in the substrate thermal processing chamber 400 and the substrate thermal processing apparatus 401 according to an embodiment of the present invention, the first and second upper and lower movable plate housings The first and second lower movable plate housings 420a and 420b or the first and second movable plate housings 420a and 420b are collectively referred to as the heat treatment chamber housings 420a and 420b, 470 in a sliding manner. To this end, the first and second movable plate housings 420a, 420b additionally include a grip portion 426 on each outer surface and a grip portion 428 mounted on the grip portion mounting portion 426 (See FIG. 4A). Therefore, when maintenance such as the case where the fumes deposited on the plurality of lamp heaters 412 are removed (cleaned) or a part of the plurality of lamp heaters 412 is broken and needs to be replaced is required, A part or all of the first and second movable plate housings 420a and 420b may be detached from the heat treatment chamber housing 470 in a sliding manner to remove the fume (cleaning process) Only the generated lamp heater can be replaced. Accordingly, unlike the prior art, the maintenance work can be performed very easily outside the substrate heat treatment chamber 400 without the operator having to enter the substrate heat treatment chamber 400. Particularly, in the present invention, since the plurality of lift pins 424 provided on the upper portions of the first and second movable plate housings 420a and 420b are used instead of the conventional arrangement type boat 120, The occurrence of troubles such as breakage of the lamp heater is minimized or eliminated.

Further, in the present invention, when the fumes deposited on the plurality of lamp heaters 412 are removed (cleaned) or maintenance is required such as a case where a failure occurs in a part of the plurality of lamp heaters 412 and replacement is required, It is sufficient if the lengths of the first and second movable plate housings 420a and 420b are respectively unloaded from the heat treatment chamber housing 470 by L /

More specifically, referring again to FIG. 4g, when two first and second heat treatment chamber housings 470a and 470b are used, the distance between the first chamber 470a and the second chamber 470b The distance is required to be L / 2 + M2 corresponding to the width (L / 2) of the second movable plate housing 420b of the first chamber 470a plus the width M2 of the maintenance area Ma. In this case, the width L / 2 of the second movable plate housing 420b1 of the first chamber 470a is 1/2 of the entire width L of the conventional boat 120 shown in FIG. 3D , M2 is relatively narrower than M1 of the prior art shown in Fig. 3d (i.e. M1 > M2 so that M2 with a narrower width also allows the second movable plate housing 420b1 of the first chamber 470a) Maintenance is possible). Particularly, when maintenance of the first movable plate housing 420a1 of the second chamber 470b is required, the first movable plate housing 420a1 is moved in the maintenance area Mb direction, Maintenance is possible. Therefore, the area corresponding to the length of L / 2 + M2 corresponds to the joint maintenance maintenance of the second movable plate housing 420b1 of the first chamber 470a and the first movable plate housing 420a1 of the second chamber 470b When two first and second heat treatment chamber housings 470a and 470b are used in the present invention. The dead region that the user can not use becomes L / 2 + M2. If a chamber housing 470 of n (where n is a natural number of 3 or more) is used as a batch type, a region corresponding to the length of nx (L / 2 + M2) is required. The maintenance area is remarkably reduced as compared with the conventional technology, and the installation space for the entire equipment is remarkably reduced, which ultimately reduces the manufacturing cost of the substrate.

Particularly, in the present invention, since the movable plate housing has the divided structure of the first and second movable plate housings 420a and 420b, it is possible to prevent damage due to the dispersion of the stress concentration on the first and second movable plate housings 420a and 420b The probability of occurrence is greatly reduced.

5A is a flowchart showing a substrate heat treatment method according to the first embodiment of the present invention.

Referring to FIG. 5A, with reference to FIGS. 4A through 4G, a substrate thermal processing method 500 according to a first embodiment of the present invention includes a) a first and a second thermal processing chamber, respectively, which are removably mounted in a thermal processing chamber housing 470, Forming (510) a heat treatment space (472) by the second upper and lower movable plate housings (420a, 420b); b) mounting (520) the substrate (10) on a plurality of lift pins (424) provided on top of the first and second lower movable plate housings (420a, 420b), respectively; And c) a plurality of lamp heaters 412 detachably mounted on the first and second upper and lower movable plate housings 420a and 420b along a plurality of cut-off portions 422 formed at regular intervals And heating and heating the substrate 10 to heat the first and second movable plate housings 420a and 420b when the plurality of lamp heaters 412 need maintenance, After the heat treatment chamber housing 470 is detached, the maintenance operation is performed.

In the substrate heating method 500 according to the first embodiment of the present invention, the maintenance operation may include an operation of cleaning the plurality of lamp heaters 412 and an operation of cleaning the plurality of lamp heaters 412 And an operation of replacing the heater, or both of them.

5B is a flowchart showing a substrate heat treatment method according to the second embodiment of the present invention.

Referring to FIG. 5B, with reference to FIGS. 4A through 4G, a substrate thermal processing method 500 according to a second embodiment of the present invention includes a) an upper fixing plate housing 420 fixedly mounted on a top of a thermal processing chamber housing 470, And a plurality of first and second lower movable plate housings (420a, 420b) detachably mounted to the heat treatment chamber housing (470) in a sliding manner from a lower portion of the upper fixing plate housing (420) Providing (510) a plurality of substrate thermal processing chambers (400) having a space (472); b) mounting (520) the substrate (10) on a plurality of lift pins (424) provided on top of each of the plurality of first and second lower movable plate housings (420a, 420b); And c) a plurality of detachably mounted cut-off portions 422 formed at predetermined intervals in the upper and lower fixed plate housings 420 and 420a and 420b, respectively, (530) heating and heating the respective substrates (10) by using a lamp heater (412) of a plurality of lamp heaters (412), wherein when maintenance of the plurality of lamp heaters (412) After the part or all of the two lower movable plate housings 420a and 420b are detached from the heat treatment chamber housing 470, the maintenance operation is performed.

In the substrate heating method 500 according to the second embodiment of the present invention, the maintenance operation may include an operation of cleaning the plurality of lamp heaters 412 and a cleaning operation of the plurality of lamp heaters 412 And an operation of replacing the heater, or both of them.

Various modifications may be made by those skilled in the art without departing from the spirit and scope of the invention as defined by the following claims. It is not. Accordingly, the scope of the present invention should not be limited by the above-described exemplary embodiments, but should be determined only in accordance with the following claims and their equivalents.

1.401: substrate heat treatment apparatus 10: substrate 12: holder 100, 400: chamber
110: frame 120: boat 140: door 160: cover 122: support member
200: main heater unit 210: unit main heater
220, 220a, 220b: auxiliary heater unit 230a: first unit auxiliary heater
250: cooling pipe 300: gas supply pipe 320: gas discharge pipe
410: heater unit 412: lamp heater 414: auxiliary lamp heater
420: stationary plate housing 420a, 420b: movable plate housing
421: body portion 422: cut-off portion 424: lift pin
426: handle portion mounting portion 428: handle portion 470: chamber housing
472: heat treatment space 481: inlet port 482: inlet hole 483:
484: exhaust hole 486: cooling hole 490a: air supply member 490b: exhaust member

Claims (14)

In the substrate heat treatment chamber,
A heat treatment chamber housing; And
The first and second upper and lower movable plate housings, which are detachably mounted on the heat treatment chamber housing in a sliding manner,
/ RTI >
The heat treatment chamber housing and the first and second upper and lower movable plate housings form a heat treatment space for heat treating the substrate
Substrate heat treatment chamber. The method according to claim 1,
Wherein the first and second upper and lower movable plate housings are detachably mounted along a plurality of cut-off portions formed at regular intervals, respectively; And
A plurality of lift pins for mounting the substrate, each of the lift pins being provided on top of the first and second lower movable plate housings,
And a heat treatment chamber. The method according to claim 1,
Wherein when the maintenance of the plurality of lamp heaters is required, the maintenance operation is performed after the first and second lower movable plate housings are detached from the heat treatment chamber housing. The method of claim 3,
Wherein the maintenance operation includes either or both of an operation of cleaning the plurality of lamp heaters and an operation of replacing a lamp heater in which a failure occurs among the plurality of lamp heaters. 5. The method according to any one of claims 1 to 4,
The first and second upper and lower movable plate housings
A handle attaching portion on each outer surface; And
The handle portion mounting portion
Further comprising a substrate heating chamber. In the substrate heat treatment apparatus,
A plurality of substrate heat treatment chambers,
The plurality of substrate heat treatment chambers
A heat treatment chamber housing;
An upper fixation plate housing fixedly mounted on the upper portion of the heat treatment chamber housing; And
A plurality of first and second lower movable plate housings provided on a lower portion of the upper fixed plate housing and detachably mounted on the heat treatment chamber housings respectively in a sliding manner,
/ RTI >
The heat treatment chamber housing, the upper fixing plate housing, and the plurality of first and second lower movable plate housings respectively form a heat treatment space for heat-treating the substrate
Substrate heat treatment apparatus. The method according to claim 6,
Wherein the upper fixing plate housing and the plurality of first and second lower movable plate housings are composed of a plurality of lamp heaters arranged along a plurality of cut-off portions formed at regular intervals, respectively; And
A plurality of lift pins provided on respective upper portions of the plurality of first and second lower movable plate housings for mounting the substrate,
And a substrate heating device for heating the substrate. 8. The method of claim 7,
Wherein when maintenance of the plurality of lamp heaters is required, the maintenance operation is performed after part or all of the first and second lower movable plate housings are detached from the heat treatment chamber housing. 9. The method of claim 8,
Wherein the maintenance operation includes either or both of an operation of cleaning the plurality of lamp heaters and an operation of replacing a lamp heater in which a failure occurs among the plurality of lamp heaters. 10. The method according to any one of claims 6 to 9,
The plurality of movable plate housings
A handle attaching portion on each outer surface; And
The handle portion mounting portion
Further comprising a substrate heating device for heating the substrate. In the substrate heat treatment method,
a) forming a heat treatment space by first and second upper and lower movable plate housings, each of which is detachably mounted on a heat treatment chamber housing in a sliding manner;
b) mounting a substrate on a plurality of lift pins provided on top of the first and second lower movable plate housings, respectively; And
c) heating and heat-treating the substrate using a plurality of lamp heaters detachably mounted on the first and second upper and lower movable plate housings along a plurality of cut-off portions formed at regular intervals,
, ≪ / RTI &
Wherein when the maintenance of the plurality of lamp heaters is required, the lower movable plate housing is detached from the heat treatment chamber housing and then the maintenance operation is performed
A method for heat treatment of a substrate. 12. The method of claim 11,
Wherein the maintenance operation includes either or both of an operation of cleaning the plurality of lamp heaters and an operation of replacing a lamp heater in which a failure occurs among the plurality of lamp heaters. In the substrate heat treatment method,
a) an upper fixed plate housing fixedly mounted on the upper portion of the heat treatment chamber housing, and a plurality of first and second lower movable plate housings detachably mounted on the heat treatment chamber housing from the lower portion of the upper fixed plate housing, Providing a plurality of substrate heat treatment chambers having a plurality of heat treatment spaces;
b) mounting a substrate on a plurality of lift pins provided on top of each of said plurality of first and second lower movable plate housings; And
c) heating each of the substrates using a plurality of lamp heaters detachably mounted on the upper fixed plate housing and the plurality of first and second lower movable plate housings along a plurality of cutoff portions formed at regular intervals, step
, ≪ / RTI &
When maintenance of the plurality of lamp heaters is required, part or all of the plurality of lower movable plate housings are detached from the heat treatment chamber housing and then the maintenance operation is performed
A method for heat treatment of a substrate. 14. The method of claim 13,
Wherein the maintenance operation includes either or both of an operation of cleaning the plurality of lamp heaters and an operation of replacing a lamp heater in which a failure occurs among the plurality of lamp heaters.

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