KR101431564B1 - Improved Chamber for Heat Treatment of Substrates and Heat Treatment Apparatus of Substrate Having the Same - Google Patents

Abstract

The present invention discloses an improved chamber for heat treatment of substrates and a heat treatment device including the same. According to the present invention, the heat treatment device includes an upper housing and a lower housing providing a heat treatment space for a single substrate; multiple upper window plates or lower window plates separated from an inner upper surface of the lower housing or inner lower surface of the upper housing to divide the heat treatment space and an upper heating space or the heat treatment space and a lower heating space; a boat loading and supporting the single substrate into the heat treatment space and unloading the single substrate in the heat treatment space; a gas supply device connected to supply gas into the heat treatment space and the upper heating space or the heat treatment space and the lower heating space; and a vacuum pumping device facing the gas supply device to exhaust gas, oxygen, and foreign substances in the heat treatment space and the upper heating space or the heat treatment space and the lower heating space. One or both of the upper housing and the lower housing include multiple heat sources.

Description

TECHNICAL FIELD [0001] The present invention relates to an improved chamber for heat treatment of a substrate,

The present invention relates to an improved substrate heat treatment chamber and a substrate heat treatment apparatus having the same.

More specifically, the present invention provides a method of providing a plurality of chambers having upper and lower housings for receiving substrates, wherein each chamber provides a plurality of heat sources within the upper and / or lower housing, By providing a plurality of upper and / or lower window plates for dividing the heating space and the heat treatment space at the inner surface of the housing, and heat treating the substrate and the film coated on the substrate by a radiation method absorbing a near-infrared wavelength emitted from the heat source, Since the influence of the fume generated in the substrate and the film applied on the substrate is substantially eliminated in the heat treatment process, the heat source has a good thermal efficiency and the fume washing process is substantially unnecessary. The output power of the plurality of heat sources output power can be controlled individually or in a group manner, the temperature uniformity of the substrate can be improved, It is possible to control the oxygen concentration in the heat treatment space to minimize foreign matter generation and / or substrate damage due to the reaction of the substrate and oxygen. The generation of a pressure difference between the heating space and the heat treatment space is prevented to prevent breakage of the upper and / or lower window plates, and since a plurality of window plates are provided, heat treatment of a plurality of substrates provided on a large- To an improved substrate heat treatment chamber capable of individually processing a plurality of chambers and capable of individual maintenance of a plurality of chambers, and to a substrate heat treatment apparatus having the chamber.

An annealing apparatus used for manufacturing semiconductors, flat panel displays and solar cells can be applied to a predetermined film (organic material and / or organic material) deposited on a flexible substrate (hereinafter collectively referred to as "substrate") such as a silicon wafer, Inorganic substance), which is necessary for a process such as crystallization and phase change.

A typical annealing apparatus is a silicon crystallization apparatus for crystallizing amorphous silicon deposited on a glass substrate into polysilicon when a liquid crystal display or a thin film crystalline silicon solar cell is manufactured.

In order to perform such a crystallization process (heat treatment process), a heat treatment apparatus capable of heating a substrate on which a predetermined thin film (hereinafter referred to as "film") is formed must be provided. For example, for crystallization of amorphous silicon, a temperature of at least 550 to 600 DEG C is required.

Generally, a heat treatment apparatus includes a single-wafer type in which heat treatment can be performed on one substrate, and a batch type in which heat treatment can be performed on a plurality of substrates. There is a merit of simple configuration of the apparatus, but there is a disadvantage that the productivity is low, and the batch formula is getting popular for the mass production in recent years.

2 is a perspective view showing the configuration of a chamber of a batch type heat treatment apparatus according to the prior art shown in FIG. 1, and FIG. 3 is a cross-sectional view of a conventional batch heat treatment apparatus Fig. 5 is a perspective view showing the arrangement of the substrate, the main heater unit, and the auxiliary heater unit of the batch type heat treatment apparatus according to the first embodiment. Such a batch heat treatment apparatus according to the prior art is filed in Korean Patent Application No. 10-2008-0069329, entitled " Batch Heat Treatment Apparatus ", filed July 16, 2008 by Huh, Are described in detail in Korean Patent No. 10-1016048, filed on February 11,

1 to 3, a batch type thermal processing apparatus 1 according to the related art includes a chamber 100 having a rectangular parallelepiped shape for providing a heat treatment space and a frame 110 for supporting the chamber 100, do.

A door 140 is installed at one side of the chamber 100 to open and close the substrate 10 in a vertical direction to load the substrate 10 into the chamber 100. After the heat treatment is completed, the boat 120 may be transferred to the outside of the chamber 100 through the door 140, and then the substrate 10 may be unloaded on the boat 120.

A cover 160 is provided on the upper side of the chamber 100 for repairing and replacing the boats 120, the gas supply pipes 300 and the gas discharge pipes 320 installed in the chamber 100 .

A main heater unit 200 for directly heating the substrate 10 in the chamber 100, an auxiliary heater unit 220 for preventing heat loss in the chamber 100, A cooling pipe 250 for rapidly cooling the inside of the cooling pipe 100 is installed.

Referring to FIGS. 2 and 3, the main heater unit 200 includes a unit main heater 210 having a predetermined interval in parallel with the short side direction of the substrate 10. The unit main heater 210 is a conventional cylindrical heater having a long length and constitutes a main heater unit 200 in which a heating element is inserted into a quartz tube and external power is applied through terminals provided at both ends to generate heat Lt; / RTI >

A plurality of main heater units 200 are arranged at regular intervals along the stacking direction of the substrates 10. The substrate 10 is disposed between a plurality of main heater units 200. It is preferable that the substrate 10 is disposed at the center between the main heater units 200.

As described above, in the batch type thermal processing apparatus 1 according to the related art, a main heater unit 200 (hereinafter, referred to as " main heater ") 200 composed of a unit main heater 210 capable of covering the entire surface of the substrate 10, The substrate 10 is uniformly heated from the unit main heater 210 to uniformly heat the entire surface thereof.

2 and 3, the auxiliary heater unit 220 includes a first auxiliary heater unit 220a disposed parallel to the short side direction of the substrate 10 and a second auxiliary heater unit 220b disposed along the long side direction of the substrate 10 And a second auxiliary heater unit 220b. The first auxiliary heater unit 220a includes a plurality of first unit auxiliary heaters 230a disposed on both sides of the main heater unit 200 in parallel with the unit main heaters 210. [

The above-described batch type thermal processing apparatus 1 according to the related art can achieve heat treatment at the same time on a plurality of substrates in the chamber 100, thereby achieving an effect of improving the productivity of the substrate, but still has the following problems.

1. Both the main heater unit 200 for heating the substrate 10 and the auxiliary heater unit 220 for preventing heat loss in the chamber 100 are both provided inside the chamber 100, Fumes generated in the film on the substrate 10 and the substrate 10 are deposited on the main heater unit 200 and the auxiliary heater unit 220. [ As a result, the thermal efficiency of the main heater unit 200 and the auxiliary heater unit 220 significantly decreases with time. Therefore, in order to maintain the thermal efficiency of the main heater unit 200 and the auxiliary heater unit 220, the fume must be removed, which greatly increases the overall process time and cost due to the fume cleaning.

2. The unit main heater 210 constituting the main heater unit 200 is a cylindrical heater in which a heating element is inserted in a quartz tube and receives external power through terminals provided at both ends to generate heat. Since the heat generated in the main heater unit 200 constituted by the unit main heaters 210 is transferred to the substrate 10 by conduction or convection, the heat transfer efficiency of the heat treatment energy of the substrate 10 is greatly reduced And it is relatively difficult to uniformly transfer heat to the substrate 10. [

3. When a failure occurs in a part of the main heater unit 200 and the auxiliary heater unit 220 provided in the chamber 100, the plurality of substrates 10 in the chamber 100 are uniformly heated So that defects may occur in the entirety of the plurality of substrates 10.

4. When a failure occurs in some of the main heater unit 200 and the auxiliary heater unit 220 provided in the chamber 100, the batch type heat treatment apparatus 1 The heat treatment operation of itself must be stopped. Thus, the total heat treatment process time (tact time) increases.

5. In the prior art, when a flexible substrate such as a plastic substrate is used, due to the opening of the door 140 due to the transfer of the substrate 10 into and out of the chamber 100 for high temperature heat treatment, oxygen Is introduced into the chamber (100). Oxygen introduced into the chamber 100 reacts with the flexible substrate 10 heated to a high temperature by a heat treatment process to generate foreign matter or damage the substrate itself.

Therefore, there is a need for a new method for solving the problems of the chamber and the batch type heat treatment apparatus used in the batch type heat treatment apparatus of the prior art described above.

Korean Patent No. 10-1016048

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a refrigerator having a plurality of chambers each having an upper and a lower housing for accommodating a substrate, each chamber providing a plurality of heat sources in the upper and / And / or a plurality of upper and / or lower window plates for dividing the heating space and the heat treatment space at the inner surface of the lower housing, so that the film coated on the substrate and the substrate absorbs the near-infrared wavelength emitted from the heat source By the heat treatment, since the influence of the fume generated in the film applied on the substrate and the substrate in the heat treatment process of the heat source is substantially eliminated, the thermal efficiency of the heat source is excellent and the fume cleaning process is substantially unnecessary, The output power of the substrate can be controlled individually or in a group manner, The uniformity is improved, and can be adjusted in the oxygen concentration in the heat treatment space, and minimize the foreign body occurs and / or a substrate damage due to the reaction of the substrate and oxygen. The generation of a pressure difference between the heating space and the heat treatment space is prevented to prevent breakage of the upper and / or lower window plates, and since a plurality of window plates are provided, heat treatment of a plurality of substrates provided on a large- An object of the present invention is to provide an improved substrate heat treatment chamber capable of individually processing a plurality of chambers and capable of individual maintenance of a plurality of chambers, and a substrate heat treatment apparatus having the chambers.

A substrate heat treatment chamber according to a first aspect of the present invention includes: an upper housing and a lower housing that provide a heat treatment space of a single substrate therein; A plurality of upper window plates or a plurality of lower window plates spaced apart from the inner lower surface of the upper housing or the inner upper surface of the lower housing to divide the heat treatment space and the upper heating space or the heat treatment space and the lower heating space; A boat loading and supporting the single substrate into the heat treatment space and unloading the single substrate within the heat treatment space; A gas supply device connected to supply gas into the heat treatment space and the upper heating space or into the heat treatment space and the lower heating space; And a vacuum pumping device opposed to the gas supply device to exhaust the gas, oxygen and foreign substances present in the heat treatment space and the upper heating space or the heat treatment space and the lower heating space, wherein the upper housing and the lower One or both of the housings are characterized by having a plurality of heat sources.

The substrate heating chamber according to the second aspect of the present invention includes an upper housing and a lower housing each having a plurality of heat sources and providing a heat treatment space of the pair of substrates; A plurality of upper and lower window plates spaced apart from the inner lower surface of the upper housing and the inner upper surface of the lower housing to divide the heat treatment space and the upper heating space and the heat treatment space and the lower heating space, respectively; A boat loading and supporting the pair of substrates into the heat treatment space and unloading the pair of substrates in the heat treatment space; A gas supply device connected to supply gas into the heat treatment space, the upper heating space, and the lower heating space; And a vacuum pumping device which is connected to the gas supply device so as to exhaust the gas, oxygen, and foreign substances existing in the heat treatment space, the upper heating space, and the lower heating space.

A substrate heat treatment apparatus according to a third aspect of the present invention includes: a plurality of chambers each providing a heat treatment space of a single substrate; A frame in which the plurality of chambers are detachably supported; And a plurality of doors provided on a front surface of each of the plurality of chambers, wherein the plurality of chambers each include an upper housing and a lower housing that provide a heat treatment space of a single substrate in each of the chambers; A plurality of upper window plates or a plurality of lower window plates spaced apart from the inner lower surface of the upper housing or the inner upper surface of the lower housing to divide the heat treatment space and the upper heating space or the heat treatment space and the lower heating space; A boat loading and supporting the single substrate into the heat treatment space and unloading the single substrate within the heat treatment space; A gas supply device connected to supply gas into the heat treatment space and the upper heating space or into the heat treatment space and the lower heating space; And a vacuum pumping device that is connected to the gas supply device to face the gas supply device to exhaust the gas, oxygen, and foreign substances present in the heat treatment space and the upper heating space or the heat treatment space and the lower heating space, One or both of the housings has a plurality of heat sources, and the single substrate in the plurality of chambers is individually heat-treated.

A substrate heat treatment apparatus according to a fourth aspect of the present invention includes: a plurality of chambers each providing a heat treatment space of a pair of substrates; A frame in which the plurality of chambers are detachably supported; And a plurality of chambers provided in front of each of the plurality of chambers, wherein each of the plurality of chambers includes a plurality of heat sources, each of the chambers comprising: an upper housing and a lower housing providing a heat treatment space of the pair of substrates; A plurality of upper and lower window plates spaced apart from the inner lower surface of the upper housing and the inner upper surface of the lower housing to divide the heat treatment space and the upper heating space and the heat treatment space and the lower heating space, respectively; A boat loading and supporting the pair of substrates into the heat treatment space and unloading the pair of substrates in the heat treatment space; A gas supply device connected to supply gas into the heat treatment space, the upper heating space, and the lower heating space; And a vacuum pumping device, which is connected to the gas supply device so as to exhaust the gas, oxygen, and foreign substances existing in the heat treatment space, the upper heating space, and the lower heating space, And heat treatment of the pair of substrates is performed individually.

The following effects can be achieved by using the substrate heat treatment chamber and the substrate heat treatment apparatus having the same according to the present invention.

1. Since the plurality of heat sources of the present invention are provided outside the processing space in the chamber, the fumes generated by the heat treatment are not deposited on the plurality of heat sources. Accordingly, even if the time passes, the effect of the fume can be substantially eliminated, the excellent heat efficiency of the plurality of heat sources can be maintained, and the fume washing process is substantially unnecessary, so that the whole process time and cost are greatly reduced.

2. The direct heating method of heat-treating a substrate by using a plurality of reflectors provided on the back surface of a plurality of heat sources of the present invention is excellent in heat treatment transfer efficiency of the substrate, Is relatively easy.

3. The output power of a plurality of near-infrared lamp heaters can be controlled individually or in a group manner, thereby improving the temperature uniformity of the substrate.

4. It is possible to control the oxygen concentration in the heat treatment space to minimize foreign matter generation and / or substrate damage due to reaction of the substrate and oxygen.

5. The occurrence of a pressure difference between the heating space and the heat treatment space is prevented to prevent breakage of the upper and / or lower window plate.

6. Since a plurality of window plates are provided, heat treatment of a large-area substrate or a plurality of substrates provided in parallel can be performed, thereby greatly increasing the heat treatment efficiency of the substrate.

7. Even if a failure or the like occurs in a plurality of heat sources provided in each of the plurality of chambers, normal heat treatment of the substrate is possible in a chamber in which no failure has occurred. That is, the plurality of chambers are capable of individual processing, thereby substantially eliminating the possibility of occurrence of defects for a plurality of substrates in a plurality of chambers.

8. When a failure or the like occurs in a plurality of heat sources provided in each of the plurality of chambers, only the corresponding chambers need to be repaired or replaced, so that the remaining chambers in which no failure has occurred can normally operate. That is, individual maintenance of a plurality of chambers is possible. Therefore, the total heat treatment process time (tact time) is greatly reduced since the heat treatment operation for the remaining chambers in the substrate heat treatment apparatus does not need to be interrupted.

Further advantages of the present invention can be clearly understood from the following description with reference to the accompanying drawings, in which like or similar reference numerals denote like elements.

1 is a perspective view showing a configuration of a batch type heat treatment apparatus according to the prior art.
2 is a perspective view showing a configuration of a chamber of the batch type thermal processing apparatus according to the prior art shown in FIG.
3 is a perspective view showing the arrangement of the substrate, the main heater unit, and the auxiliary heater unit of the batch type heat treatment apparatus according to the related art.
4A is a front sectional view showing a configuration of a chamber for heat treatment of a substrate according to an embodiment of the present invention.
4B is an enlarged view of part A of the substrate heat treatment chamber according to an embodiment of the present invention shown in FIG. 4A.
4C is a cross-sectional side view schematically illustrating a first embodiment of a substrate heat treatment chamber according to an embodiment of the present invention shown in FIG. 4A.
FIG. 4D is a side cross-sectional view schematically illustrating a second embodiment of the substrate heat treatment chamber according to an embodiment of the present invention shown in FIG. 4A.
4E is a side cross-sectional view schematically illustrating a modified embodiment of the second embodiment of the substrate heat treatment chamber according to an embodiment of the present invention shown in FIG. 4D.
FIG. 4F is a perspective view illustrating a substrate thermal processing apparatus according to an embodiment of the present invention, which includes a plurality of chambers for substrate thermal processing according to an embodiment of the present invention shown in FIG. 4A.
FIG. 4G is a side cross-sectional view schematically showing a first embodiment of a plurality of substrate heat treatment chambers used in the substrate heat treatment apparatus according to the embodiment of the present invention shown in FIG. 4F.
4H is a side cross-sectional view schematically showing a modified embodiment of the first embodiment of the plurality of substrate heat treatment chambers of the present invention shown in Fig. 4G.
FIG. 4I is a side cross-sectional view schematically showing a second embodiment of a plurality of substrate heat treatment chambers used in the substrate heat treatment apparatus according to an embodiment of the present invention shown in FIG. 4F.
4J is a side cross-sectional view schematically illustrating a modified embodiment of the second embodiment of the plurality of substrate heat treatment chambers of the present invention shown in FIG. 4I.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described with reference to embodiments and drawings of the present invention.

FIG. 4A is a front sectional view showing a configuration of a chamber for heat treatment of a substrate according to an embodiment of the present invention, and FIG. 4B is an enlarged view of an A portion of a chamber for heat treatment of a substrate according to an embodiment of the present invention shown in FIG. And FIG. 4C is a side cross-sectional view schematically showing a first embodiment of a substrate heat treatment chamber according to an embodiment of the present invention shown in FIG. 4A.

4A, a pair of substrates 10 are mounted and used on a boat 420 in an exemplary embodiment of a substrate thermal processing chamber 400. However, those skilled in the art It will be appreciated that a single substrate 10 can be used. A plurality of single substrates 10 or a plurality of pairs of substrates 10 are arranged in parallel on a boat 420 in a substrate thermal processing chamber 400 according to an embodiment of the present invention, As shown in FIG.

4A to 4C, a substrate thermal processing chamber 400 according to the first embodiment of the present invention includes an upper housing (not shown) for providing a heat process space 472 of a single substrate 10, A lower housing 470a and a lower housing 470b; The inner lower surface of the upper housing 470a or the inner upper surface of the lower housing 470b to divide the heat treatment space 472 and the upper heating space 472u or the heat treatment space 472 and the lower heating space 472d, A plurality of upper window plates 474a or a plurality of lower window plates 474b provided to be spaced apart from each other; A boat 420 for loading and supporting the single substrate 10 into the heat treatment space 472 and unloading the single substrate 10 within the heat treatment space 472; A gas supply device 480 connected to supply gas into the heat treatment space 472 and the upper heating space 472u or into the heat treatment space 472 and the lower heating space 472d; And the gas supply device 480 to exhaust the gas, oxygen, and foreign substances present in the heat treatment space 472 and the upper heating space 472u or the heat treatment space 472 and the lower heating space 472d. And one or both of the upper housing 470a and the lower housing 470b are provided with a plurality of heat sources 410. The vacuum pumping device 490 includes a plurality of heat sources 410, It should be noted here that a single substrate 10 can be used as a single substrate 10 or a plurality of single substrates 10 mounted in parallel on a boat 420 can be used.

In the following description, the foreign object includes all foreign substances, such as a solution of a solvent generated as a result of heat treatment of a film (organic and inorganic) applied on a single substrate 10. Also, the gas is a purge gas such as nitrogen. Hereinafter, a single substrate 10 and a pair of substrates 10 to be described later will be referred to as a substrate 10 when necessary.

The vacuum pumping device 490 may further include a separate object processing device (not shown) for processing the foreign object. In this case, a foreign substance treatment apparatus (not shown) may be provided integrally with the vacuum pumping apparatus 490 or may be provided separately.

The substrate heat treatment chamber 400 according to the first embodiment of the present invention may include the heat treatment space 472 and the upper heating space 472u or the heat treatment space 472 and the lower heating space 472d, A first flow control valve 482 provided on a supply pipe 481 connecting the gas supply device 480 and the gas supply device 480 and regulating the gas supply flow rate; Is provided on an exhaust pipe 483 connecting the heat treatment space 472 and the upper heating space 472u or the heat treatment space 472 and the lower heating space 472d to the vacuum pumping device 490, A second flow regulating valve 486 for regulating the flow rate; And a pressure gauge 484 disposed between the second flow control valve 486 and the substrate heat treatment chamber 400 on the exhaust pipe 483. When the pressure gauge 484 confirms the pressure difference between the heat treatment space 472 and the upper heating space 472u or the pressure difference between the heat treatment space 472 and the lower heating space 472d, The pressure in the heat treatment space 472 and the pressure in the upper heating space 472u or the pressure in the heat treatment space 472 and the pressure in the lower heating space 472d are kept the same by the operation of the first flow control valve 486 and the second flow control valve 486, The pressure in the upper heating space 472u or the pressure in the lower heating space 472d is controlled to be slightly higher than the space 472. [ 4B, fine gaps or gaps 476 may be formed in the portions where the plurality of upper window plates 474a or the plurality of lower window plates 474b are in contact with each other. However, in the present invention, The foreign matter generated in the heat treatment space 472 due to the heat treatment of the single substrate 10 by the pressure of the gas supplied into the lower heating space 472u or the lower heating space 472d flows through the minute gap or gap 476 into the upper heating space 472, The lower heating plate 472u or the lower heating space 472d as well as the breakage of the plurality of upper or the plurality of lower window plates 474a and 474b can be prevented.

FIG. 4D is a side cross-sectional view schematically illustrating a second embodiment of the substrate heat treatment chamber according to an embodiment of the present invention shown in FIG. 4A.

4A, 4B and 4D, a substrate thermal processing chamber 400 according to a second embodiment of the present invention includes a plurality of heat sources 410, An upper housing 470a and a lower housing 470b that provide a space 472; The inner lower surface of the upper housing 470a and the inner lower surface of the lower housing 470b are divided so as to divide the heat treatment space 472 and the upper heating space 472u and the heat treatment space 472 and the lower heating space 472d, A plurality of upper and lower window plates (474a, 474b) provided separately from the upper surface; A boat 420 for loading and supporting the pair of substrates 10 into the heat treatment space 472 and unloading the pair of substrates 10 in the heat treatment space 472; A gas supply device 480 connected to supply gas into the heat treatment space 472, the upper heating space 472u, and the lower heating space 472d; And a vacuum connected to the gas supply device 480 to exhaust the gas, oxygen, and foreign substances present in the heat treatment space 472, the upper heating space 472u, and the lower heating space 472d. And a pumping device 490. It should be noted here that a pair of substrates 10 may be used either as a pair of substrates 10 or a plurality of pairs of substrates 10 mounted in parallel on a boat 420 shall.

The vacuum pumping device 490 may further include a separate object processing device (not shown) for processing the foreign object. In this case, a foreign substance treatment apparatus (not shown) may be provided integrally with the vacuum pumping apparatus 490 or may be provided separately.

The substrate heat treatment chamber 400 according to the second embodiment of the present invention may further include the heat treatment space 472, the upper heating space 472u, and the lower heating space 472d, A first flow control valve 482 provided on a supply pipe 481 for connecting the first and second flow control valves 480 and 480 and regulating the gas supply flow rate; Is provided on an exhaust pipe (483) connecting the heat treatment space (472), the upper heating space (472u), and the lower heating space (472d) with the vacuum pumping device (490) 2 flow control valve 486; And a pressure gauge 484 provided between the second flow control valve 486 and the substrate heat treatment chamber 400 on the exhaust pipe 483. When the pressure difference between the heat treatment space 472 and the upper heating space 472u and the pressure difference between the heat treatment space 472 and the lower heating space 472d are confirmed by the pressure gauge 484, The pressure between the heat treatment space 472 and the upper heating space 472u and the pressure within the heat treatment space 472 and the lower heating space 472d are kept the same by the operation of the first flow rate control valve 486 and the second flow rate control valve 486, The pressure in the upper heating space 472u and the pressure in the lower heating space 472d is controlled to be slightly higher than the space 472. The foreign matter generated in the heat treatment space 472 due to the heat treatment of the pair of substrates 10 due to the pressure of the gas supplied into the upper heating space 472u and the lower heating space 472d can be prevented from flowing through the minute gaps or gaps Not only is prevented from being introduced into the upper and lower heating spaces 472u and 472d through the opening 476 (see FIG. 4B), but also prevents the breakage of the plurality of upper or the plurality of lower window plates 474a and 474b .

4E is a side cross-sectional view schematically illustrating a modified embodiment of the second embodiment of the substrate heat treatment chamber according to an embodiment of the present invention shown in FIG. 4D.

4E, a first flow control valve 482 provided on a supply pipe 481 connecting the upper heating space 472u and the lower heating space 472d and the gas supply device 480, A second flow control valve 486 provided on the exhaust pipe 483 connecting the upper heating space 472u and the lower heating space 472d to the vacuum pumping device 490 and a second flow control valve 486 on the exhaust pipe 483, 4D except that only one pressure gauge 484 is provided between the valve 486 and the substrate heat treatment chamber 400. In this embodiment, 400 in the second embodiment.

In the first and second embodiments of the present invention described above, a plurality of upper window plates 474a and / or a plurality of lower window plates 474b are usually made of quartz or neo ceramic ) Material. In this case, due to material limitations, the usable manufacturing size of one upper window plate 474a and / or one lower window plate 474b has a certain limit, and one upper window plate 474a, And / or the maximum size of one lower window plate 474b is approximately 1600 mm x 1900 mm. Thus, when the size of a single substrate 10 is a large area substrate larger than the maximum size of one upper window plate 474a and / or one lower window plate 474b, or mounted in parallel on the boat 420 When a plurality of substrates 10 are used, it is impossible to configure the substrate thermal processing chamber 400 using only one upper window plate 474a or one lower window plate 474b. Accordingly, in the present invention, by using a plurality of upper window plates 474a or a plurality of lower window plates 474b, a plurality of substrates 10 mounted in parallel on the large-area substrate 10 or the boat 420 It is possible to realize the substrate thermal processing chamber 400 capable of performing the thermal processing of such a substrate even when it is used, and as a result, the heat treatment efficiency of the substrate is greatly increased.

In addition, in the first and second embodiments of the present invention shown in Figs. 4A to 4E, a plurality of heat sources 410 provided in one or both of the upper and lower housings 470a and 470b And a plurality of upper and / or lower window plates 474a and 474b for reflecting thermal energy emitted from the plurality of heat sources 410 to a backside thereof and transferring heat energy to the substrate 10 in a radiant manner It is preferable to have a reflecting portion 412.

Hereinafter, the detailed configuration and operation of the substrate thermal processing chamber 400 according to the first and second embodiments of the present invention will be described in detail.

4A to 4C, a substrate thermal processing chamber 400 according to the first embodiment of the present invention includes upper and lower housings 470a and 470b. The upper and lower housings 470a and 470b provide a heat treatment space 472 of a single substrate 10 therein.

The substrate heating chamber 400 according to the first embodiment of the present invention includes a plurality of upper window plates 470a spaced apart from an inner lower surface of the upper housing 470a or an inner upper surface of the lower housing 470b, (474a) or a plurality of lower window plates (474b). The plurality of upper window plates 474a divides the heat treatment space 472 and the upper heating space 472u and the plurality of lower window plates 474b divides the heat treatment space 472 and the lower heating space 472d. In the first embodiment of the present invention, only one of the plurality of upper window plates 474a and the plurality of lower window plates 474b is used, so that the heat treatment space 472 and the upper heating space 472u or the heat treatment It should be noted that only one of the space 472 and the lower heating space 472d is used.

The substrate thermal processing chamber 400 according to the first embodiment of the present invention also includes a substrate processing chamber 472 for loading and supporting a single substrate 10 into the thermal processing space 472 and for unloading a single substrate 10 within the thermal processing space 472 And a boat 420 for loading. In this case, opening of the door (not shown) of the substrate heat treatment chamber 400 is required for loading and unloading of the single substrate 10 by the boat 420, so that external oxygen is supplied to the substrate heat treatment chamber (400). The introduced oxygen is used as a single substrate 10, for example, when a plastic substrate and a flexible substrate are used, reacts with a flexible substrate heated to a high temperature by a heat treatment process to generate foreign substances or damage the substrate itself. The substrate thermal processing chamber 400 according to the first embodiment of the present invention is formed by using the vacuum pumping device 490 to heat the heat treatment space 472 and the upper heating space 472u or the heat treatment space 472 and By maintaining the lower heating space 472d in a vacuum state, it becomes possible to adjust the oxygen concentration in the chamber 400 for heat treatment of the substrate.

The substrate heating chamber 400 according to the first embodiment of the present invention may further include a heat treatment space 472 and an upper heating space 472u or one side of the heat treatment space 472 and the lower heating space 472d, And a vacuum pumping device 490 connected to the gas supply device 480 and the vacuum pumping device 490, respectively. The gas supply device 480 and the vacuum pumping device 490 supply the gas into the heat treatment space 472 and the upper heating space 472u or the heat treatment space 472 and the lower heating space 472d, And exhausts the foreign object.

It should be noted that in the substrate thermal processing chamber 400 according to the first embodiment of the present invention, a plurality of heat sources 410 are provided in one or both of the upper housing 470a and the lower housing 470b do.

4A, 4B, 4D, and 4E, the substrate thermal processing chamber 400 according to the second embodiment of the present invention includes upper and lower housings 470a and 470b. The upper and lower housings 470a and 470b provide a heat treatment space 472 of a pair of substrates 10 therein.

In addition, the substrate heating chamber 400 according to the second embodiment of the present invention includes a plurality of upper and lower portions provided on the inner lower surface of the upper housing 470a and the inner upper surface of the lower housing 470b, respectively, And lower window plates 474a and 474b. A plurality of upper and lower window plates 474a and 474b divide the upper and lower heating spaces 472u and 472d above and below the heat treatment space 472, respectively.

The substrate thermal processing chamber 400 according to the second embodiment of the present invention further includes a heat treatment chamber 472 for loading and supporting a pair of substrates 10 into the heat treatment space 472, 10). ≪ / RTI > Opening of the door (not shown) of the chamber 400 for heat treatment of the substrate is required for loading and unloading the pair of substrates 10 by the boat 420 so that external oxygen is supplied to the chamber for heat- 400). The introduced oxygen reacts with the flexible substrate heated to a high temperature by the heat treatment process, for example, when a plastic substrate and a flexible substrate are used as the pair of substrates 10, thereby generating foreign matter or damaging the substrate itself. The substrate heating chamber 400 according to the second embodiment of the present invention uses the vacuum pumping device 490 to heat the heat treatment space 472, the upper heating space 472u, and the lower heating space 472d ) In a vacuum state, it becomes possible to adjust the oxygen concentration in the chamber 400 for heat treatment of the substrate.

The substrate heat treatment chamber 400 according to the second embodiment of the present invention further includes a gas supply unit 472 connected to one side surface and opposite side surfaces of the heat treatment space 472, the upper heating space 472u, and the lower heating space 472d, Device 480 and a vacuum pumping device 490. As shown in FIG. The gas supply device 480 and the vacuum pumping device 490 supply gas into the heat treatment space 472, the upper heating space 472u, and the lower heating space 472d and also exhaust gas, oxygen, and foreign matter .

It should be noted that in the substrate thermal processing chamber 400 according to the second embodiment of the present invention, a plurality of heat sources 410 are provided in both the upper housing 470a and the lower housing 470b.

The upper and lower housings 470a and 470b used in the substrate thermal processing chamber 400 according to the first and second embodiments of the present invention may be formed of aluminum (Al) 410 may each be implemented with a near-infrared lamp heater. In this case, the near-infrared lamp heater is a film heater for heating the substrate 10 made of SiO ₂ and the film (not shown) coated on the substrate 10 to a near infrared ray in a wavelength band in the range of about 1 to 5 μm suitable for drying and firing It is preferable to release it. In addition, the output power of the plurality of heat sources 410 may be controlled individually or in a group manner. Here, the group method is a method in which a plurality of heat sources 410 provided in the upper housing 470a are controlled as a first heat source group and a plurality of heat sources 410 provided in the lower housing 470b are controlled by a second heat source Group may be controlled simultaneously. It is possible to uniformly control the temperature of the substrate 10 by individual control of the output power of the plurality of heat sources 410 or group type control. Accordingly, since the temperature uniformity of the substrate 10 is improved, the possibility of occurrence of defects of the substrate 10 is greatly reduced.

In addition, the plurality of upper and / or lower lower window plates 474a and 474b may include near-infrared rays in a wavelength band ranging from approximately 1 to 5 占 퐉 emitted from a plurality of heat sources 410 implemented by, for example, a near- While the bands other than the wavelength band are cut off. Accordingly, the plurality of heat sources 410 directly transfer heat energy to the substrate 10 through the plurality of upper and / or lower window plates 474a and 474b in a radiant manner, (Not shown) (for example, polyimide (PI)) applied on the upper surface of the substrate 10 is heat-treated.

The upper and / or lower housings 470a and 470b may include a plurality of reflectors 412 provided on the rear surface of the plurality of heat sources 410, respectively. The plurality of reflectors 412 reflect the thermal energy emitted from the plurality of heat sources 410 and transmit the thermal energy to the substrate 10 through a plurality of upper and / or lower window plates 474a and 474b Transfer by copy method. The energy transferred by the radiation method directly heats the substrate 10 to heat it. Therefore, the heat transfer efficiency of the substrate 10 is superior to that of the conventional conduction or convection method, and uniform heat transfer to the substrate 10 is relatively easy.

FIG. 4F is a perspective view illustrating a substrate heat treatment apparatus according to an embodiment of the present invention including a plurality of chambers for heat treatment of a substrate according to an embodiment of the present invention shown in FIG. 4A. FIG. 4G is a cross- Sectional view schematically showing a first embodiment of a plurality of substrate heat treatment chambers used in a substrate heat treatment apparatus according to an embodiment of the present invention.

Referring to FIG. 4G, with reference to FIGS. 4A through 4C and 4F, a substrate thermal processing apparatus 1 according to a first embodiment of the present invention includes a plurality of (not shown) Chambers 400a, 400b, 400c400d, and 400e; A frame 410 to which the plurality of chambers 400a, 400b, 400c, 400d, and 400e are detachably supported; And a plurality of doors (not shown) provided on the front surfaces of the plurality of chambers 400a, 400b, 400c, 400d, and 400e, wherein the plurality of chambers 400a, 400b, 400c, 400d, And the heat treatment of the single substrate 10 is performed individually. Here, the plurality of chambers 400a, 400b, 400c400d, and 400e are each implemented as a substrate heat treatment chamber 400 according to the first embodiment of the present invention shown in FIGS. 4A to 4C.

More specifically, the substrate thermal processing apparatus 1 according to the first embodiment of the present invention includes a plurality of chambers 400a, 400b, 400c400d, and 400e. The plurality of chambers 400a, 400b, 400c400d, and 400e each include an upper housing 470a and a lower housing 470b that provide a heat process space 472 of a single substrate 10; The inner lower surface of the upper housing 470a or the inner upper surface of the lower housing 470b to divide the heat treatment space 472 and the upper heating space 472u or the heat treatment space 472 and the lower heating space 472d, A plurality of upper window plates 474a or a plurality of lower window plates 474b provided to be spaced apart from each other; A boat 420 for loading and supporting the single substrate 10 into the heat treatment space 472 and unloading the single substrate 10 within the heat treatment space 472; A gas supply device 480 connected to supply gas into the heat treatment space 472 and the upper heating space 472u or into the heat treatment space 472 and the lower heating space 472d; And the gas supply device 480 to exhaust the gas, oxygen, and foreign substances present in the heat treatment space 472 and the upper heating space 472u or the heat treatment space 472 and the lower heating space 472d. And one or both of the upper housing 470a and the lower housing 470b are provided with a plurality of heat sources 410. The vacuum pumping device 490 includes a plurality of heat sources 410,

Each of the vacuum pumping apparatuses 490 may further include a separate foreign object processing apparatus (not shown) for processing the foreign object. In this case, a foreign substance treatment apparatus (not shown) may be provided integrally with the vacuum pumping apparatus 490 or may be provided separately.

The plurality of chambers 400a, 400b, 400c400d, and 400e used in the substrate heat treatment apparatus 1 according to the first embodiment of the present invention may include the heat treatment space 472 and the upper heating space 472u, A first flow control valve 482 provided on the supply pipe 481 connecting the heat treatment space 472 and the lower heating space 472d and the gas supply unit 480 and regulating the gas supply flow rate; Is provided on an exhaust pipe 483 connecting the heat treatment space 472 and the upper heating space 472u or the heat treatment space 472 and the lower heating space 472d to the vacuum pumping device 490, A second flow regulating valve 486 for regulating the flow rate; And a pressure gauge 484 provided between the second flow control valve 486 and the substrate heat treatment chamber 400 on the exhaust pipe 483. By the operation of the pressure gauge 484, the first flow rate regulating valve 482 and the second flow rate regulating valve 486, foreign matter generated in each heat treatment space 472 flows through the minute gaps or gaps 476 Not only is prevented from being introduced into each of the upper heating spaces 472u or each of the lower heating spaces 472d through the lower heating plate 472a, but also breakage of each of the plurality of upper or each of the plurality of lower window plates 474a, 474b is prevented .

4H is a side cross-sectional view schematically showing a modified embodiment of the first embodiment of the plurality of substrate heat treatment chambers of the present invention shown in Fig. 4G.

Referring to FIG. 4H, in the first embodiment of the plurality of substrate heat treatment chambers of the present invention shown in FIG. 4G, the heat treatment space 472 and the upper heating space 472 of the plurality of chambers 400a, 400b, 400c400d, Each of the gas supply devices 480 and each vacuum pumping device 490 connected to the heat treatment space 472 and the lower heating space 472d are connected to one gas supply device 480 and one vacuum Is similar to the first embodiment of the plurality of substrate heat treatment chambers of the present invention shown in Fig. 4G, except that it is implemented as a pumping device 490. [

FIG. 4I is a side cross-sectional view schematically showing a second embodiment of a plurality of substrate heat treatment chambers used in the substrate heat treatment apparatus according to an embodiment of the present invention shown in FIG. 4F.

Referring to FIG. 4I, with reference to FIGS. 4A, 4B, 4D, 4E, and 4F, the substrate heat treatment apparatus 1 according to the second embodiment of the present invention includes a pair of substrates 10, A plurality of chambers (400a, 400b, 400c, 400d, 400e) providing a space (472); A frame 410 to which the plurality of chambers 400a, 400b, 400c, 400d, and 400e are detachably supported; And a plurality of doors (not shown) provided on the front surfaces of the plurality of chambers 400a, 400b, 400c, 400d, and 400e, wherein the plurality of chambers 400a, 400b, 400c, 400d, And the heat treatment of the pair of substrates 10 is performed individually. Here, the plurality of chambers 400a, 400b, 400c400d, and 400e may include a plurality of chambers 400a, 400b, 400c400d, and 400e, respectively, according to the second embodiment of the present invention shown in FIGS. 4a, 4b, And a heat treatment chamber 400.

More specifically, the substrate thermal processing apparatus 1 according to the second embodiment of the present invention includes a plurality of chambers 400a, 400b, 400c400d, and 400e. The plurality of chambers 400a, 400b, 400c400d, and 400e each include an upper housing 470a and a lower housing 470b that are provided with a plurality of heat sources 410 and provide a heat treatment space 472 of the pair of substrates 10 470b); The inner lower surface of the upper housing 470a and the inner lower surface of the lower housing 470b are divided so as to divide the heat treatment space 472 and the upper heating space 472u and the heat treatment space 472 and the lower heating space 472d, A plurality of upper and lower window plates (474a, 474b) provided separately from the upper surface; A boat 420 for loading and supporting the pair of substrates 10 into the heat treatment space 472 and unloading the pair of substrates 10 in the heat treatment space 472; A gas supply device 480 connected to supply gas into the heat treatment space 472, the upper heating space 472u, and the lower heating space 472d; And a vacuum connected to the gas supply device 480 to exhaust the gas, oxygen, and foreign substances present in the heat treatment space 472, the upper heating space 472u, and the lower heating space 472d. And a pumping device 490.

Each of the vacuum pumping apparatuses 490 may further include a separate foreign object processing apparatus (not shown) for processing the foreign object. In this case, a foreign substance treatment apparatus (not shown) may be provided integrally with the vacuum pumping apparatus 490 or may be provided separately.

The plurality of chambers 400a, 400b, 400c400d, and 400e used in the substrate heat treatment apparatus 1 according to the second embodiment of the present invention includes the heat treatment space 472, the upper heating space 472u, A first flow control valve 482 for regulating the gas supply flow rate on the supply pipe 481 connecting the lower heating space 472d and the gas supply device 480, respectively; A second flow rate control device for controlling the gas exhaust flow rate on the exhaust pipe 483 connecting the heat treatment space 472, the upper heating space 472u, and the lower heating space 472d to the vacuum pumping device 490, Valve 486; And a pressure gauge 484 provided between the second flow control valve 486 and the substrate heat treatment chamber 400 on the exhaust pipe 483. By the operation of the pressure gauge 484, the first flow rate regulating valve 482 and the second flow rate regulating valve 486, foreign matter generated in each heat treatment space 472 flows through the minute gaps or gaps 476 Not only is prevented from flowing into the respective upper and lower heating spaces 472u and 472d through the upper and lower window plates 474a and 474b, but also breakage of each of the plurality of upper and lower window plates 474a and 474b can be prevented.

4J is a side cross-sectional view schematically illustrating a modified embodiment of the second embodiment of the plurality of substrate heat treatment chambers of the present invention shown in FIG. 4I.

Referring to FIG. 4J, in the second embodiment of the plurality of substrate heat treatment chambers of the present invention shown in FIG. 4I, the heat treatment spaces 472, the upper heating spaces (not shown) of the plurality of chambers 400a, 400b, 400c400d, Each of the gas supply devices 480 and each of the vacuum pumping devices 490 connected to the lower heating space 472u and the lower heating space 472u are connected to one gas supply device 480 and one vacuum pumping device 490 Except that it is implemented in the same manner as the second embodiment of the plurality of substrate heat treatment chambers of the present invention shown in Fig. 4I.

4I and 4J, each of the upper heating spaces 472u and each of the lower heating spaces 472d and the respective gas supply devices 480 are connected to each other via a supply pipe 481 Each of the first flow control valve 482, each of the upper heating spaces 472u and each of the lower heating spaces 472d and each of the exhaust pipes 483 connecting the respective vacuum pumping devices 490 Provided on each of the second flow control valves 486 and the respective substrate heat treatment chambers 400 on each of the exhaust pipes 483, It will be apparent to those skilled in the art that the first and second electrodes 484 may be used individually, as shown in FIG.

4f to 4j, the plurality of chambers 400a, 400b, 400c, 400d, and 400e in the substrate thermal processing apparatus 1 according to the first and second embodiments of the present invention are mounted on the frame 410, As shown in Fig. A plurality of doors (not shown) are provided on the front surfaces of the plurality of chambers 400a, 400b, 400c, 400d, and 400e. A plurality of doors (not shown) may be used to load the substrate 10 into the heat treatment space 472 provided in each of the plurality of chambers 400a, 400b, 400c, 400d, and 400e, 400b, 400c, 400d, 400e of the chamber 400a, 400b, 400c, 400d, 400e.

In the substrate heat treatment apparatus 1 according to the first and second embodiments of the present invention, a part of the plurality of heat sources 410 provided in the plurality of chambers 400a, 400b, 400c, 400d, Etc. may occur. For example, in the embodiment of FIG. 4F, even if some of the plurality of heat sources 410 in the chamber 400a among the plurality of chambers 400a, 400b, 400c, 400d and 400e occurs, the remaining chambers 400b , 400c, 400d, and 400e can be subjected to normal heat treatment. Accordingly, in the present invention, the individual processing of the plurality of chambers 400a, 400b, 400c, 400d, and 400e is enabled, and thus the entire processing of each of the substrates 10 in the plurality of chambers 400a, 400b, 400c, 400d, The possibility of occurrence of defects is substantially eliminated.

In the substrate heat treatment apparatus 1 according to the first and second embodiments of the present invention, a part of the plurality of heat sources 410 provided in the plurality of chambers 400a, 400b, 400c, 400d, It is only necessary to repair or replace the chamber 400a in which the failure occurs in the above example and the remaining chambers 400b, 400c, 400d, and 400e can operate normally. That is, in the embodiment of the present invention, individual maintenance of the plurality of chambers 400a, 400b, 400c, 400d, and 400e is possible. Therefore, it is not necessary to interrupt the heat treatment operation of the remaining chambers 400b, 400c, 400d, 400e except for the chamber 400a in which the failure occurs during use of the substrate heat treatment apparatus 1, so that the total heat treatment process time tact time .

Various modifications may be made by those skilled in the art without departing from the spirit and scope of the invention as defined by the following claims. It is not. Accordingly, the scope of the present invention should not be limited by the above-described exemplary embodiments, but should be determined only in accordance with the following claims and their equivalents.

1: Batch type / substrate heat treatment apparatus 10: substrate 120, 420: boat
400, 400a, 400b, 400c, 400d, 400e: chambers 110, 410: frame
140: Door 160: Cover 200: Main heater unit
210: unit main heater 220, 220a, 220b: auxiliary heater unit
230a: first unit auxiliary heater 250: cooling pipe
300,481: (gas) supply pipe 320,483: (gas) exhaust pipe
410: heat source 412: reflector 470a, 470b: housing
472: heat treatment space 472u, 472d: heating space
474a, 474b: window plate 480: gas supply device
482,486: Flow regulating valve 484: Pressure gauge
490: Vacuum pumping device

Claims (20)

In the substrate heat treatment chamber,
An upper housing and a lower housing for providing a heat treatment space of a single substrate therein;
A plurality of upper window plates or a plurality of lower window plates spaced apart from the inner lower surface of the upper housing or the inner upper surface of the lower housing to divide the heat treatment space and the upper heating space or the heat treatment space and the lower heating space;
A boat loading and supporting the single substrate into the heat treatment space and unloading the single substrate within the heat treatment space;
A gas supply device connected to supply gas into the heat treatment space and the upper heating space or into the heat treatment space and the lower heating space;
Oxygen and foreign substances present in the heat treatment space and the upper heating space or in the heat treatment space and the lower heating space, and a vacuum pumping device
, ≪ / RTI &
Either or both of the upper housing and the lower housing have a plurality of heat sources
Chamber for substrate heat treatment. The method according to claim 1,
The substrate heat treatment chamber
A first flow control valve provided on a supply pipe connecting the heat treatment space and the upper heating space or the heat treatment space and the lower heating space with the gas supply device, the gas flow rate control valve adjusting the gas supply flow rate;
A second flow regulating valve provided on the exhaust pipe connecting the heat treatment space and the upper heating space or the heat treatment space and the lower heating space with the vacuum pumping device and regulating the gas exhaust flow rate; And
And a pressure gauge provided between the second flow rate control valve and the substrate heat treatment chamber on the exhaust pipe
Further comprising: a substrate; The method according to claim 1,
Wherein the plurality of heat sources are each implemented as a near infrared lamp heater,
The output power of the plurality of heat sources may be controlled individually or in a group manner
Chamber for substrate heat treatment. 4. The method according to any one of claims 1 to 3,
Wherein the single substrate is a single substrate or a plurality of single substrates mounted in parallel on the boat. In the substrate heat treatment chamber,
An upper housing and a lower housing each having a plurality of heat sources and providing a heat treatment space of the pair of substrates;
A plurality of upper and lower window plates spaced apart from the inner lower surface of the upper housing and the inner upper surface of the lower housing to divide the heat treatment space and the upper heating space and the heat treatment space and the lower heating space, respectively;
A boat loading and supporting the pair of substrates into the heat treatment space and unloading the pair of substrates in the heat treatment space;
A gas supply device connected to supply gas into the heat treatment space, the upper heating space, and the lower heating space; And
And a vacuum pumping device connected to the gas supply device to exhaust the gas, oxygen, and foreign substances present in the heat treatment space, the upper heating space, and the lower heating space,
And a heat treatment chamber for heating the substrate. 6. The method of claim 5,
The substrate heat treatment chamber
A first flow control valve provided on a supply pipe connecting the gas supply device to the heat treatment space, the upper heating space, and the lower heating space, respectively, and regulating a gas supply flow rate;
A second flow control valve provided on an exhaust pipe connecting the heat treatment space, the upper heating space, and the lower heating space with the vacuum pumping device, respectively, and regulating the gas exhaust flow rate; And
And a pressure gauge provided between the second flow rate control valve and the substrate heat treatment chamber on the exhaust pipe
Further comprising: a substrate; The method according to claim 6,
The upper heating space, the upper heating space, and the exhaust pipe connecting the lower heating space and the vacuum pumping device, which are provided on the supply pipe connecting the lower heating space and the gas supply device, And the pressure gauge provided between the second flow rate control valve and the substrate heat treatment chamber on the exhaust pipe are used only one at a time. 6. The method of claim 5,
Wherein the plurality of heat sources are each implemented as a near infrared lamp heater,
The output power of the plurality of heat sources may be controlled individually or in a group manner
Chamber for substrate heat treatment. 9. The method according to any one of claims 5 to 8,
Wherein the pair of substrates are each a pair of substrates or a pair of substrates mounted in parallel on the boat. In the substrate heat treatment apparatus,
A plurality of chambers each providing a heat treatment space of a single substrate;
A frame in which the plurality of chambers are detachably supported; And
A plurality of doors provided on a front surface of each of the plurality of chambers
, ≪ / RTI &
The plurality of chambers
An upper housing and a lower housing for providing a heat treatment space of a single substrate therein;
A plurality of upper window plates or a plurality of lower window plates spaced apart from the inner lower surface of the upper housing or the inner upper surface of the lower housing to divide the heat treatment space and the upper heating space or the heat treatment space and the lower heating space;
A boat loading and supporting the single substrate into the heat treatment space and unloading the single substrate within the heat treatment space;
A gas supply device connected to supply gas into the heat treatment space and the upper heating space or into the heat treatment space and the lower heating space;
Oxygen and foreign substances present in the heat treatment space and the upper heating space or in the heat treatment space and the lower heating space, and a vacuum pumping device
Lt; / RTI >
Either or both of the upper housing and the lower housing have a plurality of heat sources,
Wherein the heat treatment of the single substrate in the plurality of chambers is performed individually
Substrate heat treatment apparatus. 11. The method of claim 10,
The substrate heat treatment chamber
A first flow control valve provided on a supply pipe connecting the heat treatment space and the upper heating space or the heat treatment space and the lower heating space with the gas supply device, the gas flow rate control valve adjusting the gas supply flow rate;
A second flow regulating valve provided on the exhaust pipe connecting the heat treatment space and the upper heating space or the heat treatment space and the lower heating space with the vacuum pumping device and regulating the gas exhaust flow rate; And
And a pressure gauge provided between the second flow rate control valve and the substrate heat treatment chamber on the exhaust pipe
Further comprising a substrate heating device for heating the substrate. 11. The method of claim 10,
Wherein the plurality of heat sources are each implemented as a near infrared lamp heater,
The output power of the plurality of heat sources may be controlled individually or in a group manner
Substrate heat treatment apparatus. 13. The method according to any one of claims 10 to 12,
Wherein the single substrate is a single substrate or a plurality of single substrates mounted in parallel on the boat. 13. The method according to any one of claims 10 to 12,
Wherein the gas supply device, the exhaust device, and the vacuum pumping device are each implemented as one gas supply device, one exhaust device, and one vacuum pumping device. In the substrate heat treatment apparatus,
A plurality of chambers each providing a heat treatment space of the pair of substrates;
A frame in which the plurality of chambers are detachably supported; And
A plurality of doors provided on a front surface of each of the plurality of chambers
, ≪ / RTI &
The plurality of chambers
An upper housing and a lower housing each having a plurality of heat sources and providing a heat treatment space of the pair of substrates;
A plurality of upper and lower window plates spaced apart from the inner lower surface of the upper housing and the inner upper surface of the lower housing to divide the heat treatment space and the upper heating space and the heat treatment space and the lower heating space, respectively;
A boat loading and supporting the pair of substrates into the heat treatment space and unloading the pair of substrates in the heat treatment space;
A gas supply device connected to supply gas into the heat treatment space, the upper heating space, and the lower heating space; And
And a vacuum pumping device connected to the gas supply device to exhaust the gas, oxygen, and foreign substances present in the heat treatment space, the upper heating space, and the lower heating space,
Lt; / RTI >
The heat treatment of the pair of substrates in the plurality of chambers is performed individually
Substrate heat treatment apparatus. 16. The method of claim 15,
The substrate heat treatment chamber
A first flow control valve provided on a supply pipe connecting the gas supply device to the heat treatment space, the upper heating space, and the lower heating space, respectively, and regulating a gas supply flow rate;
A second flow control valve provided on an exhaust pipe connecting the heat treatment space, the upper heating space, and the lower heating space with the vacuum pumping device, respectively, and regulating the gas exhaust flow rate; And
And a pressure gauge provided between the second flow rate control valve and the substrate heat treatment chamber on the exhaust pipe
Further comprising a substrate heating device for heating the substrate. 17. The method of claim 16,
The upper heating space, the upper heating space, and the exhaust pipe connecting the lower heating space and the vacuum pumping device, which are provided on the supply pipe connecting the lower heating space and the gas supply device, And the pressure gauge provided between the second flow rate control valve and the chamber for heat-treating the substrate on the exhaust pipe are respectively used for only one of the pressure gauges. 16. The method of claim 15,
Wherein the plurality of heat sources are each implemented as a near infrared lamp heater,
The output power of the plurality of heat sources may be controlled individually or in a group manner
Substrate heat treatment apparatus. 19. The method according to any one of claims 15 to 18,
Wherein the pair of substrates are each a pair of substrates or a pair of substrates mounted in parallel on the boat. 19. The method according to any one of claims 15 to 18,
Wherein the gas supply device, the exhaust device, and the vacuum pumping device are each implemented as one gas supply device, one exhaust device, and one vacuum pumping device.

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