KR20140142726A - 전자 부품의 제조 방법 - Google Patents

전자 부품의 제조 방법 Download PDF

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Publication number
KR20140142726A
KR20140142726A KR1020147029164A KR20147029164A KR20140142726A KR 20140142726 A KR20140142726 A KR 20140142726A KR 1020147029164 A KR1020147029164 A KR 1020147029164A KR 20147029164 A KR20147029164 A KR 20147029164A KR 20140142726 A KR20140142726 A KR 20140142726A
Authority
KR
South Korea
Prior art keywords
solder
wiring pattern
substrate
wiring board
terminal
Prior art date
Application number
KR1020147029164A
Other languages
English (en)
Korean (ko)
Inventor
요시히사 카쿠다
히데시 토미타
타카시 스즈키
마사미치 나츠메
Original Assignee
닛신보 홀딩스 가부시키 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛신보 홀딩스 가부시키 가이샤 filed Critical 닛신보 홀딩스 가부시키 가이샤
Publication of KR20140142726A publication Critical patent/KR20140142726A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020147029164A 2012-03-19 2013-03-15 전자 부품의 제조 방법 KR20140142726A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012062054A JP5893455B2 (ja) 2012-03-19 2012-03-19 電子部品の製造方法
JPJP-P-2012-062054 2012-03-19
PCT/JP2013/058459 WO2013141392A1 (ja) 2012-03-19 2013-03-15 電子部品の製造方法

Publications (1)

Publication Number Publication Date
KR20140142726A true KR20140142726A (ko) 2014-12-12

Family

ID=49222837

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147029164A KR20140142726A (ko) 2012-03-19 2013-03-15 전자 부품의 제조 방법

Country Status (5)

Country Link
JP (1) JP5893455B2 (ja)
KR (1) KR20140142726A (ja)
CN (1) CN104170535A (ja)
TW (1) TW201406248A (ja)
WO (1) WO2013141392A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160089005A (ko) * 2015-01-16 2016-07-27 현대모비스 주식회사 차량용 abs의 제조장치 및 제조방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6273897B2 (ja) * 2014-02-26 2018-02-07 日亜化学工業株式会社 接着剤塗布方法および実装基板製造方法
JP2016015383A (ja) * 2014-07-01 2016-01-28 大日本印刷株式会社 チップオン基板及びそれを用いた電子装置の製造方法
JP6528620B2 (ja) * 2015-09-15 2019-06-12 株式会社オートネットワーク技術研究所 回路構成体および電気接続箱
DE102015013495B4 (de) * 2015-10-16 2018-04-26 Mühlbauer Gmbh & Co. Kg Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser
KR101816291B1 (ko) * 2016-10-20 2018-01-08 크루셜머신즈 주식회사 3차원 구조물을 위한 레이저 본딩장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948981A (ja) * 1982-09-14 1984-03-21 株式会社東芝 高密度印刷配線基板
JPH0715122A (ja) * 1993-06-23 1995-01-17 Matsushita Electric Ind Co Ltd 接合用フィルム構体および電子部品実装方法
JPH1187896A (ja) * 1997-09-10 1999-03-30 Canon Inc プリント配線板
JP2003031937A (ja) * 2001-07-18 2003-01-31 Sony Corp 表面実装部品の半田付け用ランド構造
JP2006303357A (ja) * 2005-04-25 2006-11-02 Ricoh Microelectronics Co Ltd 電子部品実装方法
JP4675667B2 (ja) * 2005-04-25 2011-04-27 リコーマイクロエレクトロニクス株式会社 電子部品実装方法
JP2006303356A (ja) * 2005-04-25 2006-11-02 Ricoh Microelectronics Co Ltd 電子部品実装方法
JP5807145B2 (ja) * 2010-05-20 2015-11-10 パナソニックＩｐマネジメント株式会社 実装構造体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160089005A (ko) * 2015-01-16 2016-07-27 현대모비스 주식회사 차량용 abs의 제조장치 및 제조방법

Also Published As

Publication number Publication date
CN104170535A (zh) 2014-11-26
JP2013197273A (ja) 2013-09-30
TW201406248A (zh) 2014-02-01
WO2013141392A1 (ja) 2013-09-26
JP5893455B2 (ja) 2016-03-23

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