KR20140130135A - 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치 - Google Patents

경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치 Download PDF

Info

Publication number
KR20140130135A
KR20140130135A KR1020147023470A KR20147023470A KR20140130135A KR 20140130135 A KR20140130135 A KR 20140130135A KR 1020147023470 A KR1020147023470 A KR 1020147023470A KR 20147023470 A KR20147023470 A KR 20147023470A KR 20140130135 A KR20140130135 A KR 20140130135A
Authority
KR
South Korea
Prior art keywords
mass
group
parts
component
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020147023470A
Other languages
English (en)
Korean (ko)
Inventor
마코토 요시타케
료스케 야마자키
Original Assignee
다우 코닝 도레이 캄파니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 코닝 도레이 캄파니 리미티드 filed Critical 다우 코닝 도레이 캄파니 리미티드
Publication of KR20140130135A publication Critical patent/KR20140130135A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020147023470A 2012-02-02 2013-02-01 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치 Withdrawn KR20140130135A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012021280A JP2013159671A (ja) 2012-02-02 2012-02-02 硬化性シリコーン組成物、その硬化物、および光半導体装置
JPJP-P-2012-021280 2012-02-02
PCT/JP2013/052965 WO2013115416A1 (en) 2012-02-02 2013-02-01 Curable silicone composition, cured product thereof, and optical semiconductor device

Publications (1)

Publication Number Publication Date
KR20140130135A true KR20140130135A (ko) 2014-11-07

Family

ID=47750001

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147023470A Withdrawn KR20140130135A (ko) 2012-02-02 2013-02-01 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치

Country Status (7)

Country Link
US (1) US9045641B2 (enExample)
EP (1) EP2809727A1 (enExample)
JP (1) JP2013159671A (enExample)
KR (1) KR20140130135A (enExample)
CN (1) CN104136545A (enExample)
TW (1) TW201333119A (enExample)
WO (1) WO2013115416A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10005906B2 (en) 2014-06-03 2018-06-26 Dow Corning Toray Co., Ltd. Curable silicone composition, and optical semiconductor device

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI557183B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
KR101409537B1 (ko) * 2011-11-25 2014-06-19 주식회사 엘지화학 경화성 조성물
TWI577737B (zh) * 2012-07-27 2017-04-11 Ｌｇ化學股份有限公司 可固化組成物
KR102320575B1 (ko) * 2014-06-18 2021-11-02 신에쓰 가가꾸 고교 가부시끼가이샤 기재 밀착성이 우수한 실리콘 점착제 조성물 및 점착성 물품
JP6590445B2 (ja) * 2014-09-10 2019-10-16 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
DE102015101748A1 (de) * 2015-02-06 2016-08-11 Osram Opto Semiconductors Gmbh Elektronisches Bauelement mit einem Werkstoff umfassend Epoxysilan-modifiziertes Polyorganosiloxan
DE102015102517B4 (de) * 2015-02-23 2025-07-03 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Fahrzeug mit einem Ladesystem für eine Batterie
JP6348446B2 (ja) * 2015-04-15 2018-06-27 信越化学工業株式会社 分岐状オルガノポリシロキサン及びその製造方法
JP6313722B2 (ja) * 2015-04-15 2018-04-18 信越化学工業株式会社 付加硬化型シリコーン組成物および半導体装置
EP3350554A4 (en) * 2015-09-18 2019-06-12 Slantrange, Inc. SYSTEMS AND METHOD FOR DETERMINING STATISTICS OF PLANT STOCKS BASED ON OPTICAL OVERHEAD MEASUREMENTS
EP3473675A1 (en) 2015-12-22 2019-04-24 Shin-Etsu Chemical Co., Ltd. Addition-curable silicone resin composition and a semiconductor device
WO2017143508A1 (en) 2016-02-23 2017-08-31 Dow Corning Corporation Curable high hardness silicone composition and composite articles made thereof
US11028266B2 (en) 2016-08-12 2021-06-08 Wacker Chemie Ag Curable organopolysiloxane composition, encapsulant and semiconductor device
JP2018165348A (ja) * 2017-03-29 2018-10-25 信越化学工業株式会社 高耐熱性付加硬化型シリコーン樹脂組成物
WO2018236127A1 (en) * 2017-06-19 2018-12-27 Dow Silicones Corporation LIQUID SILICONE COMPOSITION FOR TRANSFER OR INJECTION MOLDING OF OPTICAL PARTS, OPTICAL PARTS MADE THEREFROM, AND CORRESPONDING PROCESS
JP7130316B2 (ja) * 2017-07-05 2022-09-05 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 硬化性ポリオルガノシロキサン組成物
JP7457450B2 (ja) * 2017-10-20 2024-03-28 信越化学工業株式会社 シリコーン組成物、シリコーンゴム硬化物、及び電力ケーブル
JP7021049B2 (ja) * 2018-10-30 2022-02-16 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物、その硬化物、及び光半導体装置
CN113614174B (zh) 2019-03-29 2023-04-04 陶氏东丽株式会社 固化性有机硅组合物、其固化物及其制造方法
CN110903695B (zh) * 2019-12-23 2022-06-24 江门市阪桥电子材料有限公司 一种具有高反射性能的硅胶油墨
JP7820893B2 (ja) 2020-03-30 2026-02-26 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
US12139634B2 (en) * 2020-04-14 2024-11-12 Shin-Etsu Chemical Co., Ltd. Silylated isocyanurate compound, metal corrosion inhibitor, curable organosilicon resin composition, and semiconductor apparatus
KR102467690B1 (ko) * 2020-08-19 2022-11-17 주식회사 케이씨씨실리콘 광학용 폴리실록산 조성물 및 이를 포함하는 광학 반도체용 반사 재료
CN118995044A (zh) * 2024-08-19 2024-11-22 宁波杭州湾新材料研究院 一种富硅抗反射涂层树脂及其制备方法、富硅抗反射涂层

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438094A (en) * 1993-07-06 1995-08-01 Shin-Etsu Chemical Co., Ltd. Adhesive silicone compositions
JP3687738B2 (ja) * 2001-01-16 2005-08-24 信越化学工業株式会社 硬化性組成物
CA2483510A1 (en) * 2002-04-26 2003-11-06 Kaneka Corporation Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product
JP4557136B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
US20070219312A1 (en) * 2006-03-17 2007-09-20 Jennifer Lynn David Silicone adhesive composition and method for preparing the same
JP4514058B2 (ja) * 2006-08-30 2010-07-28 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP4519869B2 (ja) * 2007-03-05 2010-08-04 株式会社東芝 半導体装置
JP5283346B2 (ja) * 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP2009021394A (ja) 2007-07-12 2009-01-29 Nitto Denko Corp 光半導体素子収納用実装パッケージ用樹脂組成物およびそれを用いて得られる光半導体発光装置
US8017246B2 (en) * 2007-11-08 2011-09-13 Philips Lumileds Lighting Company, Llc Silicone resin for protecting a light transmitting surface of an optoelectronic device
JP2009120437A (ja) * 2007-11-14 2009-06-04 Niigata Univ シロキサンをグラフト化したシリカ及び高透明シリコーン組成物並びに該組成物で封止した発光半導体装置
JP5233325B2 (ja) * 2008-02-29 2013-07-10 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP2009256400A (ja) * 2008-04-11 2009-11-05 Shin Etsu Chem Co Ltd 半導体素子用シリコーン接着剤
JP5507059B2 (ja) * 2008-05-27 2014-05-28 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電子装置
JP5972512B2 (ja) 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2011140550A (ja) * 2010-01-06 2011-07-21 Shin-Etsu Chemical Co Ltd 光学素子ケース成形用付加硬化型シリコーン樹脂組成物及び光半導体装置
JP2012021280A (ja) 2010-07-12 2012-02-02 Lixil Suzuki Shutter Corp 袖扉の閉鎖方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10005906B2 (en) 2014-06-03 2018-06-26 Dow Corning Toray Co., Ltd. Curable silicone composition, and optical semiconductor device

Also Published As

Publication number Publication date
CN104136545A (zh) 2014-11-05
US9045641B2 (en) 2015-06-02
EP2809727A1 (en) 2014-12-10
WO2013115416A1 (en) 2013-08-08
US20150001569A1 (en) 2015-01-01
TW201333119A (zh) 2013-08-16
JP2013159671A (ja) 2013-08-19

Similar Documents

Publication Publication Date Title
US9045641B2 (en) Curable silicone composition, cured product thereof, and optical semiconductor device
JP5912600B2 (ja) 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6046395B2 (ja) 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
US9048406B2 (en) Curable silicone composition, cured product thereof, and optical semiconductor device
KR101939408B1 (ko) Ｌｅｄ의 리플렉터용 열경화성 실리콘 수지 조성물, 및 이를 이용한 ｌｅｄ용 리플렉터 및 광반도체 장치
JP2011140550A (ja) 光学素子ケース成形用付加硬化型シリコーン樹脂組成物及び光半導体装置
WO2014200112A1 (ja) 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
JP6302902B2 (ja) 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
JP5931767B2 (ja) 光反射材料用硬化性樹脂組成物、該組成物の硬化物、該組成物の硬化物からなるリフレクター及びこれを用いた光半導体デバイス
CN110862802B (zh) 加成固化型有机硅组合物及半导体装置

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20140822

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid